CN209914218U - Frock is rectified to circuit board perk - Google Patents
Frock is rectified to circuit board perk Download PDFInfo
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- CN209914218U CN209914218U CN201920595714.XU CN201920595714U CN209914218U CN 209914218 U CN209914218 U CN 209914218U CN 201920595714 U CN201920595714 U CN 201920595714U CN 209914218 U CN209914218 U CN 209914218U
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Abstract
The utility model provides a frock is rectified to circuit board perk, include: the bearing plate, the first bending plate and the second bending plate are matched with each other, one surface of the second bending plate, which is far away from the first bending plate, is provided with a plurality of fixing columns, the fixing columns are used for fixing the second bending plate, one surface of the first bending plate is provided with a plurality of connecting columns, one end of each connecting column is connected with the first bending plate, the other end of each connecting column is connected with one surface of the bearing plate, the plate which is subjected to buckling deformation is placed between the first bending plate and the second bending plate, the first bending plate applies force to the plate which is subjected to buckling deformation, so that the plate which is subjected to buckling deformation is corrected, so that even if the corrected plate exhibits a spring-back phenomenon, the amount of spring-back deformation is corrected due to the bending compensation action of the first and second bent plates, therefore, the influence of warpage of the corrected board after the SMT is on-line can be well avoided.
Description
Technical Field
The utility model relates to a tool field is rectified to the circuit board, especially relates to a frock is rectified to circuit board perk.
Background
The printed circuit board provides mechanical support for fixing and assembling various electronic components such as an integrated circuit and the like, and realizes wiring, electrical connection and electrical insulation among the various electronic components such as the integrated circuit and the like. In the production process of the printed circuit board, an important process is to laminate the copper foil, the film and the inner layer circuit board after the oxidation treatment into the printed circuit board. However, in the pressing process, the printed circuit board is easily warped and uneven, and the warping correction needs to be performed on the printed circuit board after the pressing. In the prior art, the internal stress of a plate with an asymmetric partial structure is not completely eliminated after being flattened, the rebound phenomenon can occur after the mechanical force is removed, and the larger the residual internal stress is, the larger the rebound is, so that the internal stress exceeds the standard accepted by a customer; at the moment, the pressing plate is required to be tilted again, so that quality defects such as plate deformation, ink color change and the like can be caused, and even the plate is scrapped; on the other hand, even if the PCB is flattened again, if the PCB cannot be completely corrected to be qualified, the PCB still needs to be scrapped and processed, and the warping of the PCB in some processing procedures is not over standard, and the PCB does not need to be flattened and corrected or is qualified after being flattened in a PCB factory (the rebound does not exceed the accepted standard), but when the whole PCB is subjected to high temperature action after being on line in the SMT, the board is warped; if the deformation is too large, the SMT mounting has abnormal quality.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the utility model adopts the following technical scheme: the utility model provides a frock is rectified to circuit board perk, includes: the bending degree of the first bending plate is the same as that of the second bending plate, the first bending plate and the second bending plate are matched with each other, and one surface, away from the first bending plate, of the second bending plate is provided with a plurality of fixing columns which are used for fixing the second bending plate;
be provided with a plurality of spliced poles on the one side of first crooked board, and a plurality of the one end of spliced pole with first crooked board is connected, the other end all with the one side of bearing plate is connected.
Furthermore, the first bending plate is provided with a plurality of positioning grooves, one surface of the second bending plate, which is far away from the fixing columns, is provided with a plurality of positioning columns, and each positioning column is movably inserted into one positioning groove.
Further, the bending degree of the first bending plate is 0.3% -0.7%.
Further, the bending degree of the second bending plate is 0.3% -0.7%.
Furthermore, a first rotating block and a first placing frame are arranged on one side face of the second bending plate, and the first placing frame is used for placing the first rotating block.
Furthermore, a second rotating block and a second placing frame are arranged on the other side face of the second bending plate, the second rotating block and the first rotating block are symmetrically arranged along the central axis of the second bending plate, the second placing frame and the first placing frame are symmetrically arranged along the central axis of the second bending plate, and the second placing frame is used for placing the second rotating block.
Furthermore, a first fixing block is arranged on one side face of the first bending plate, a first fixing hole is formed in the first fixing block, and the first rotating block is movably inserted into the first fixing hole.
Furthermore, a second fixing block is arranged on the other side face of the first bending plate, a second fixing hole is formed in the second fixing block, and the second rotating block is movably inserted into the second fixing hole.
Further, the first bending plate is a steel plate.
Further, the second bent plate is a steel plate.
The utility model has the advantages that: through will take place buckling deformation's board and put between first crooked board and the crooked board of second, carry out the application of force to taking place buckling deformation's board through first crooked board, let the board that has taken place buckling deformation obtain correcting, and because the crookedness of first crooked board and the crooked board of second for even resilience phenomenon appears in the board after the correction, also can be because the crooked compensation of first crooked board and the crooked board of second, make the volume of resilience deformation obtain correcting, consequently can avoid the board after the correction because the influence that takes place the warpage and produce well after SMT reaches the standard grade. Can effectively improve the problem of warping and deformation, reduce quality problems or scrap, and has obvious economic benefit.
Drawings
The figures further illustrate the invention, but the embodiments in the figures do not constitute any limitation of the invention.
Fig. 1 is a schematic direction diagram of a circuit board warpage calibration tool according to an embodiment;
fig. 2 is a schematic view of a direction of a circuit board warpage calibration fixture according to another embodiment;
fig. 3 is a schematic view of a direction of a circuit board warpage calibration tool according to another embodiment.
Detailed Description
The following will combine the drawings of the embodiments of the present invention to further describe the technical solution of the present invention, and the present invention is not limited to the following specific embodiments. It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
As shown in fig. 1, a tooling for correcting the warpage of a circuit board comprises: the bending degree of the first bending plate 100 is the same as that of the second bending plate 200, the first bending plate 100 and the second bending plate 200 are matched with each other, one surface, away from the first bending plate 100, of the second bending plate 200 is provided with a plurality of fixing columns 210, and the plurality of fixing columns 210 are used for fixing the second bending plate 200;
be provided with a plurality of spliced poles 110 on the one side of first crooked board 100, and a plurality of spliced pole 110's one end with first crooked board 100 is connected, the other end all with the one side of pressure-bearing plate 300 is connected.
Specifically, the first curved board 100 is a steel board, and the second curved board 200 is a steel board, when the board with warpage needs to be recovered, the board with warpage is placed between the first curved board 100 and the second curved board 200, specifically, the first curved board 100 is located above the second curved board 200, that is, the board with warpage is placed on the second curved board 200, then the first curved board 100 is placed above the board and the second curved board 200, the first curved board 100 abuts against the board with warpage, through the action of gravity, the first curved board 100 can apply force to the warpage surface of the board with warpage, then the first curved board 100 and the second curved board 200 are heated, and at the same time, the first curved board 100 and the second curved board 200 transmit heat to the circuit board with warpage to reach a certain temperature for a certain time, and naturally cooling, thereby enabling the circuit board subjected to warping deformation to restore to be flat. It is worth mentioning that when more circuit boards are placed between the first bending plate 100 and the second bending plate 200, a heavy object needs to be placed on the pressure bearing plate 300 to increase the overall gravity, that is, to increase the pressure applied to all the circuit boards, and then the first bending plate 100 and the second bending plate 200 are heated, and at the same time, the first bending plate 100 and the second bending plate 200 transfer heat to the circuit board which is subjected to buckling deformation, so that the circuit board reaches a certain temperature and lasts for a certain time, and then the circuit board is naturally cooled, thereby enabling the circuit board which is subjected to buckling deformation to recover to be flat.
Further, by placing the board with warpage between the first bending board 100 and the second bending board 200, the board with warpage is applied with force through the first bending board 100, so that the board with warpage is corrected, and due to the curvature of the first bending board 100 and the second bending board 200, even if the board after correction has a springback phenomenon, the springback deformation amount is corrected due to the bending compensation effect of the first bending board 100 and the second bending board 200, so that the influence of the corrected board after line feeding on the SMT due to warpage can be well avoided. Can effectively improve the problem of warping and deformation, reduce quality problems or scrap, and has obvious economic benefit. It is worth mentioning that the coefficients in the whole pressing process are shown in the table:
| temperature of the platen | Air pressure | Time of hot pressing | Time of cold pressing |
| 145±10℃ | 5-7㎏/㎝2 | 90±10min | ≥20min |
As shown in fig. 2, in an embodiment, the first curved plate 100 is provided with a plurality of positioning slots 120, a surface of the second curved plate 200 away from the fixing posts 210 is provided with a plurality of positioning posts 220, and each positioning post 220 is movably inserted into one of the positioning slots 120. That is to say, the number of the positioning slots 120 is specifically designed according to different requirements, the positions of the positioning slots 120 on the first bending plate 100 are specifically set according to different requirements, the number of the positioning posts 220 is the same as the number of the positioning slots 120, and the position of each positioning post 220 matches with the position of one positioning slot 120. By using the positioning columns 220 and the positioning grooves 120 in cooperation, the positions of the first curved plate 100 and the second curved plate 200 during pressing are more accurate. It should be noted that the positioning column 220 is specifically configured according to specific requirements, and the cross-sectional shape of the positioning groove 120 is the same as that of the positioning column 220. That is, the board with warpage is placed on the second curved board 200, then the first curved board 100 is placed above the board and the second curved board 200, the first curved board 100 abuts against the board with warpage, the positioning groove 120 and the positioning post 220 are matched, then the first curved board 100 can apply force to the warpage surface of the board with warpage under the action of gravity, then the first curved board 100 and the second curved board 200 are heated, meanwhile, the first curved board 100 and the second curved board 200 transfer heat to the circuit board with warpage, so that the circuit board with warpage reaches a certain temperature and lasts for a certain time, and then the circuit board with warpage is naturally cooled, so that the circuit board with warpage returns to be flat.
In one embodiment, the curvature of the first curved panel 100 is 0.3% to 0.7% and the curvature of the second curved panel 200 is 0.3% to 0.7%. Specifically, the tortuosity formula:
warp degree — hmax/(L × 2) × 100% (h is the maximum vertical height of bow, L is the diagonal) can be obtained:
when the degree of curvature is 0.3%,
when the degree of curvature is 0.5%,
when the degree of curvature is 0.7%,
that is, when the curvature fixing requirement is 0.5%, the size ratio of the first and second curved plates 100 and 200 is 4: 3 in length: width, that is, by fixing the curvature, the first and second curved plates 100 and 200 of each size can be designed, for example, as follows:
| long (cm) | 60 | 70 | 80 |
| Width (cm) | 45 | 52.5 | 60 |
| Degree of curvature | 0.5％ | 0.5％ | 0.5％ |
| Height max (cm) | 0.72 | 0.86 | 1 |
That is, the first and second curved plates 100 and 200 have a smaller size than a general flat steel plate, increasing the reliability of use.
As shown in fig. 3, in an embodiment, a first rotating block 230 and a first placing rack 240 are disposed on one side surface of the second bending plate 200, the first placing rack 240 is used for placing the first rotating block 230, a second rotating block (not shown) and a second placing rack (not shown) are disposed on the other side surface of the second bending plate 200, the second rotating block and the first rotating block 230 are symmetrically disposed along a central axis of the second bending plate 200, the second placing rack and the first placing rack 240 are symmetrically disposed along the central axis of the second bending plate 200, and the second placing rack is used for placing the second rotating block. Further, a first fixing block 130 is disposed on one side surface of the first bending plate 100, a first fixing hole 131 is formed in the first fixing block 130, and the first rotating block 230 is movably inserted into the first fixing hole 131. A second fixing block is arranged on the other side face of the first bending plate 100, a second fixing hole is formed in the second fixing block, and the second rotating block is movably inserted into the second fixing hole. That is, the first rotating block 230 and the second rotating block are disposed on two side surfaces of the second bending board 200, when the board subjected to warpage deformation is placed on the second bending board 200 and the first bending board 100 is located above the second bending board 200, the first rotating block 230 and the second rotating block are rotated to align the first rotating block 230 with the first fixing hole 131 and the second rotating block with the second fixing hole, after the alignment is completed, the first bending board 100 is placed on the board subjected to warpage deformation to abut against, the first bending board 100 can apply force to the warpage surface of the board subjected to warpage deformation under the action of gravity, then the first bending board 100 and the second bending board 200 are heated, and simultaneously the first bending board 100 and the second bending board 200 transfer heat to the circuit board subjected to warpage deformation to reach a certain temperature for a certain time and then cool naturally, thereby enabling the circuit board with the warping deformation to recover to be flat.
As described above, the above embodiments are not limiting embodiments of the present invention, and modifications or equivalent variations made by those skilled in the art based on the substance of the present invention are within the technical scope of the present invention.
Claims (10)
1. The utility model provides a frock is rectified to circuit board perk which characterized in that includes: the bending degree of the first bending plate is the same as that of the second bending plate, the first bending plate and the second bending plate are matched with each other, and one surface, away from the first bending plate, of the second bending plate is provided with a plurality of fixing columns which are used for fixing the second bending plate;
be provided with a plurality of spliced poles on the one side of first crooked board, and a plurality of the one end of spliced pole with first crooked board is connected, the other end all with the one side of bearing plate is connected.
2. The tooling of claim 1 for correcting the warping of the circuit board is characterized in that: the first bending plate is provided with a plurality of positioning grooves, one surface of the second bending plate, which is far away from the fixing columns, is provided with a plurality of positioning columns, and each positioning column is movably inserted into one positioning groove.
3. The tooling of claim 1 for correcting the warping of the circuit board is characterized in that: the bending degree of the first bending plate is 0.3% -0.7%.
4. The tooling of claim 1 for correcting the warping of the circuit board is characterized in that: the bending degree of the second bending plate is 0.3% -0.7%.
5. The tooling of claim 1 for correcting the warping of the circuit board is characterized in that: a first rotating block and a first placing frame are arranged on one side face of the second bending plate, and the first placing frame is used for placing the first rotating block.
6. The tooling of claim 5 for correcting the warping of the circuit board is characterized in that: set up second turning block and second rack on the another side of the crooked board of second, the second turning block with first turning block along the axis symmetry of the crooked board of second sets up, the second rack with first rack along the axis symmetry of the crooked board of second sets up, the second rack is used for placing the second turning block.
7. The tooling of claim 6 for correcting the warping of the circuit board is characterized in that: a first fixing block is arranged on one side face of the first bending plate, a first fixing hole is formed in the first fixing block, and the first rotating block is movably inserted into the first fixing hole.
8. The tooling of claim 7 for correcting the warping of the circuit board is characterized in that: and a second fixing block is arranged on the other side surface of the first bending plate, a second fixing hole is formed in the second fixing block, and the second rotating block is movably inserted in the second fixing hole.
9. The tooling of claim 1 for correcting the warping of the circuit board is characterized in that: the first bending plate is a steel plate.
10. The tooling of claim 1 for correcting the warping of the circuit board is characterized in that: the second bending plate is a steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920595714.XU CN209914218U (en) | 2019-04-27 | 2019-04-27 | Frock is rectified to circuit board perk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920595714.XU CN209914218U (en) | 2019-04-27 | 2019-04-27 | Frock is rectified to circuit board perk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209914218U true CN209914218U (en) | 2020-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920595714.XU Active CN209914218U (en) | 2019-04-27 | 2019-04-27 | Frock is rectified to circuit board perk |
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| Country | Link |
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| CN (1) | CN209914218U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109982513A (en) * | 2019-04-27 | 2019-07-05 | 宏俐（汕头）电子科技有限公司 | A kind of circuit board sticks up correcting tool |
| CN114630494A (en) * | 2022-05-12 | 2022-06-14 | 之江实验室 | Interconnection structure of wafer integrated system and top PCB and manufacturing method thereof |
-
2019
- 2019-04-27 CN CN201920595714.XU patent/CN209914218U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109982513A (en) * | 2019-04-27 | 2019-07-05 | 宏俐（汕头）电子科技有限公司 | A kind of circuit board sticks up correcting tool |
| CN114630494A (en) * | 2022-05-12 | 2022-06-14 | 之江实验室 | Interconnection structure of wafer integrated system and top PCB and manufacturing method thereof |
| CN114630494B (en) * | 2022-05-12 | 2022-08-09 | 之江实验室 | Interconnection structure of wafer integration system and top PCB and manufacturing method thereof |
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