CN209913869U

CN209913869U - Heat radiation module of 5G mobile phone

Info

Publication number: CN209913869U
Application number: CN201920724501.2U
Authority: CN
Inventors: 刘鉴; 张伟杰
Original assignee: Guangdong Lotu New Materials Co Ltd
Current assignee: Guangdong Lotu New Materials Co Ltd
Priority date: 2019-05-17
Filing date: 2019-05-17
Publication date: 2020-01-07
Anticipated expiration: 2029-05-17

Abstract

The utility model discloses a heat dissipation module of 5G cell-phone, including cell-phone main part and cell-phone back shell, cell-phone main part surface electric connection has the display screen, cell-phone back shell is installed at the back of cell-phone main part to the protection cell-phone main part back can not receive the damage easily, the inside electric connection of cell-phone main part has the cell-phone chip, and the cell-phone chip carries out electric connection with the display screen, the bottom electric connection of cell-phone chip has the battery, it has the heat conduction insulating piece to paste between battery and the cell-phone back shell, the surface mixing of heat conduction insulating piece is pasted with silver-colored nanometer line, utilizes high heat conduction insulating piece to derive the heat that 5G cell-phone chip and battery produced to shell and air heat transfer, cools off cell; the silver nanowires on the insulating sheet are used for shielding magnetic signals, so that the mobile phone antenna is prevented from being interfered by long-wave signals.

Description

Heat radiation module of 5G mobile phone

Technical Field

The utility model belongs to the technical field of the cell-phone and specifically relates to a heat dissipation module of 5G cell-phone is related to.

Background

The 5G mobile phone adopts shorter signal wavelength and higher frequency, so that the transmission speed is higher than that of the 4G mobile phone, and the 5G mobile phone is expected to open the era of interconnection of everything. In recent years, a plurality of mobile phone manufacturers lay out 5G mobile phones in a dispute, and take over the technical advancement. The processing capacity and the processing speed of the 5G mobile phone are dozens of times larger than those of the 4G mobile phone, so that the heating value of the 5G mobile phone is much larger than that of the 4G mobile phone, and the traditional heat dissipation scheme cannot meet the requirements of the 5G mobile phone, so that the heat dissipation module of the 5G mobile phone is provided.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an it is not enough to overcome above-mentioned condition, aims at providing the technical scheme that can solve above-mentioned problem.

The utility model provides a heat dissipation module of 5G cell-phone, includes cell-phone main part and cell-phone back shell, cell-phone main part surface electric connection has the display screen, cell-phone back shell is installed at the back of cell-phone main part to protection cell-phone main part back can not receive the damage easily, the inside electric connection of cell-phone main part has the cell-phone chip, and the cell-phone chip carries out electric connection with the display screen, the bottom electric connection of cell-phone chip has the battery, it has the heat conduction insulating piece to paste between battery and the cell-phone back shell, the surperficial mixture of heat conduction insulating piece is pasted with silver-.

Preferably, the heat conductivity coefficient of the heat-conducting insulation sheet is 5-8 W.m^-1·K^-1。

Compared with the prior art, the beneficial effects of the utility model are that: the heat generated by the 5G mobile phone chip and the battery is conducted out to the shell by utilizing the high-heat-conductivity insulating sheet to exchange heat with air, and the mobile phone chip and the battery are cooled; the silver nanowires on the insulating sheet are used for shielding magnetic signals, so that the mobile phone antenna is prevented from being interfered by long-wave signals.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a heat dissipation module of a 5G mobile phone;

fig. 2 is a schematic diagram of an internal structure of a heat dissipation module of a 5G mobile phone;

fig. 3 is a schematic structural view of the thermally conductive insulating sheet.

Shown in the figure: 1. the mobile phone comprises a mobile phone main body, 2 a display screen, 3 a mobile phone chip, 4 a battery, 5 a heat conduction insulation sheet, 6 a mobile phone back shell, 7 a silver nanowire.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, in an embodiment of the present invention, a heat dissipation module for a 5G mobile phone includes a mobile phone main body 1 and a mobile phone back shell 6.

1 surperficial electric connection of cell-phone main part has display screen 2, and display screen 2 can carry out touch work, cell-phone back shell 6 is installed at the back of cell-phone main part 1 to protection cell-phone main part 1 back can not receive the damage easily, the inside electric connection of cell-phone main part 1 has mobile chip 3, and mobile chip 3 carries out electric connection with display screen 2, the bottom electric connection of mobile chip 3 has battery 4, it has heat conduction insulating piece 5 to attach between battery 4 and the cell-phone back shell 6, and the coefficient of heat conductivity of heat conduction insulating piece 5 is 5-8W m^-1·K^-1The surface of the heat-conducting insulating sheet 5 is adhered with silver nanowires 7 in a mixed manner, the silver nanowires 7 have a magnetic shielding function, so that the heat-conducting insulating sheet 5 also has a magnetic shielding function, and the high heat-conducting capacity of the heat-conducting insulating sheet 5 rapidly conducts heat generated by the mobile phone chip 3 and the battery 4 to the back shell of the mobile phone, so that heat dissipation of the mobile phone main body is performed.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a heat dissipation module of 5G cell-phone, includes cell-phone main part and cell-phone back shell, its characterized in that, cell-phone main part surface electric connection has the display screen, cell-phone back shell is installed at the back of cell-phone main part to protection cell-phone main part back can not receive the damage easily, the inside electric connection of cell-phone main part has the cell-phone chip, and cell-phone chip and display screen carry out electric connection, the bottom electric connection of cell-phone chip has the battery, it has the heat conduction insulating piece to paste between battery and the cell-phone back shell, the surface mixing of heat conduction insulating piece is pasted with silver-colored nanometer line.

2. The heat dissipation module of claim 1, wherein the thermal conductivity of the thermally conductive insulating sheet is 5-8 w.m^-1·K^-1。