CN209913443U - A high-efficient heat dissipation bus duct for big data - Google Patents

A high-efficient heat dissipation bus duct for big data Download PDF

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Publication number
CN209913443U
CN209913443U CN201921022869.0U CN201921022869U CN209913443U CN 209913443 U CN209913443 U CN 209913443U CN 201921022869 U CN201921022869 U CN 201921022869U CN 209913443 U CN209913443 U CN 209913443U
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CN
China
Prior art keywords
cover plate
heat dissipation
bus duct
lower cover
heat
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Expired - Fee Related
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CN201921022869.0U
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Chinese (zh)
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不公告发明人
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Yibin Baobao Network Technology Co Ltd
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Yibin Baobao Network Technology Co Ltd
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Priority to CN201921022869.0U priority Critical patent/CN209913443U/en
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Expired - Fee Related legal-status Critical Current
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Abstract

The utility model discloses a high-efficient heat dissipation bus duct for big data, including upper cover plate and lower cover plate, be provided with two metal sheets between upper cover plate and the lower cover plate, and two metal sheets symmetry set up, the metal sheet is the U-shaped structure, pass through rivet connection between upper cover plate and lower cover plate and the metal sheet, install the electrically conductive mother board between two metal sheets, install temperature sensor and controlling means on the lower cover plate, controlling means includes controller and signal transmitter, temperature sensor and controller electric connection, controller and signal transmitter electric connection, evenly be provided with heat dissipation piece one along vertical direction on the lateral wall that two metal sheets kept away from, the one end of a plurality of heat dissipation pieces one is provided with the heat-conducting plate; the utility model relates to a novelty, effectual dispels the heat to the bus duct, has increased heat-conduction, has reduced the heat loss, has prolonged the life of bus duct, and the heat-conducting plate is convenient for install and dismantle, has made things convenient for the inspection to maintain, is worth promoting.

Description

A high-efficient heat dissipation bus duct for big data
Technical Field
The utility model relates to a bus duct technical field specifically is a high-efficient heat dissipation bus duct for big data.
Background
The bus duct system is a power distribution device for efficiently transmitting current, and is particularly suitable for the needs of economic and reasonable wiring of high-rise buildings and large-scale factories. Because the bus duct is produced by segments in the generating process, each segment of the bus duct is required to be connected into a whole through a bus duct connector in the actual installation process, the bus duct connector generally comprises connector outer side plates at two ends and insulating partition plates arranged between the two connector outer side plates, the insulating partition plates comprise insulating outer partition plates and insulating inner partition plates, the two ends of each insulating outer partition plate are adjacent to the connector outer side plates, the insulating inner partition plates are arranged between the two insulating outer partition plates, connecting rows are arranged on two sides of each insulating inner partition plate and one side, facing the insulating inner partition plates, of each insulating outer partition plate, inserting grooves are formed between the two adjacent insulating inner partition plates and the insulating outer partition plates, and in order to ensure insulation, insulating spacer sleeves are connected on bolts in a penetrating mode.
However, the prior art is limited to the cross section of the conductor and the aspect ratio of the cross section of the conductor is changed, and the heat loss is serious, so that the service life is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-efficient heat dissipation bus duct for big data has solved the problem that proposes in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-efficiency heat dissipation bus duct for big data comprises an upper cover plate and a lower cover plate, wherein two metal plates are arranged between the upper cover plate and the lower cover plate and are symmetrically arranged, the metal plates are in a U-shaped structure, the upper cover plate, the lower cover plate and the metal plates are connected through rivets, a conductive bus bar is arranged between the two metal plates, a temperature sensor and a control device are arranged on the lower cover plate, the control device comprises a controller and a signal transmitter, the temperature sensor is electrically connected with the controller, the controller is electrically connected with the signal transmitter, heat dissipation blocks I are uniformly arranged on the far side walls of the two metal plates along the vertical direction, a heat conduction plate is arranged at one end of each heat dissipation block I, a heat dissipation block II is uniformly fixed on the far side wall of the heat conduction plate along the vertical direction, cooling pipes are arranged on the heat dissipation blocks II, and are fixed on the heat conduction, and the cooling tube is S type distribution on a plurality of radiating block two, the symmetrical welding has four dead levers on the lateral wall that two metal sheets kept away from mutually, the equal symmetrical welding in heat-conducting plate top and bottom has the fixed block, be provided with through-hole one on the fixed block, and through-hole one and dead lever size phase-match, be fixed with the installation piece on the lateral wall of fixed block, through-hole two has been seted up on the installation piece, swing joint has the fixed pin in the through-hole two, be connected with the extension spring on the fixed pin, the one end of extension spring is connected on the installation piece, the fixed orifices has been seted up to the one.
As a preferred embodiment of the utility model, the upper cover plate is the same and symmetrical arrangement with lower apron structure, and the upper cover plate is the aluminum alloy material with lower apron.
As a preferred embodiment of the present invention, the metal plate is made of an aluminum profile.
As an preferred embodiment of the present invention, the outer side of the conductive busbar is coated with an insulating paint layer.
As an optimal implementation manner of the utility model, the lateral wall that the heat-conducting plate is close to radiating block one evenly is provided with the slot along vertical direction, and a size phase-match of slot and radiating block.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a high-efficient heat dissipation bus duct for big data through radiating block one, heat-conducting plate, radiating block two, cooling tube, temperature sensor and controlling means isotructure, can effectually dispel the heat to the bus duct, has increased heat-conduction, has reduced the heat loss, has prolonged the life of bus duct.
2. The utility model discloses a high-efficient heat dissipation bus duct for big data through being provided with dead lever, fixed block, installation piece, fixed pin, installation piece and extension spring isotructure, can conveniently install the heat-conducting plate and dismantle, makes things convenient for the operation personnel to inspect it and maintain, guarantees that the radiating effect is normal, is worth promoting.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural diagram of a high-efficiency heat dissipation bus duct for big data according to the present invention;
fig. 2 is a side view of the high-efficiency heat dissipation bus duct for big data of the present invention;
fig. 3 is a schematic structural diagram of a heat conducting plate and a slot of the high-efficiency heat dissipation bus duct for big data according to the present invention;
fig. 4 is an enlarged view of a point a in fig. 1.
In the figure: 1 upper cover plate, 2 lower cover plates, 3 metal plates, 4 rivets, 5 conductive busbars, 6 temperature sensors, 7 control devices, 8 radiating block I, 9 heat-conducting plates, 10 radiating block II, 11 cooling pipes, 12 clamps, 13 fixing rods, 14 fixing blocks, 15 mounting blocks, 16 fixing pins and 17 tension springs.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1-4, the present invention provides a technical solution: a high-efficiency heat dissipation bus duct for big data comprises an upper cover plate 1 and a lower cover plate 2, wherein two metal plates 3 are arranged between the upper cover plate 1 and the lower cover plate 2, the two metal plates 3 are symmetrically arranged, the metal plates 3 are in a U-shaped structure, the upper cover plate 1, the lower cover plate 2 and the metal plates 3 are connected through rivets 4, a conductive bus bar 5 is arranged between the two metal plates 3, a temperature sensor 6 and a control device 7 are arranged on the lower cover plate 2, the control device 7 comprises a controller and a signal transmitter, the temperature sensor 6 is electrically connected with the controller, the controller is electrically connected with the signal transmitter, heat dissipation blocks I8 are uniformly arranged on the side walls, far away from the two metal plates 3, along the vertical direction, one end of each heat dissipation block I8 is provided with a heat conduction plate 9, heat dissipation blocks II 10 are uniformly fixed on the side walls, far away from the heat dissipation blocks I8, along the vertical direction, cooling pipes 11, cooling tube 11 passes through clamp 12 to be fixed on heat-conducting plate 9, and cooling tube 11 is S type distribution on two 10 a plurality of radiating block, the symmetrical welding has four dead levers 13 on the lateral wall that two metal sheet 3 kept away from mutually, the equal symmetrical welding in heat-conducting plate 9 top and bottom has fixed block 14, be provided with through-hole one on the fixed block 14, and through-hole one and dead lever 13 size phase-match, be fixed with installation piece 15 on the lateral wall of fixed block 14, through-hole two has been seted up on the installation piece 15, swing joint has fixed pin 16 in the through-hole two, be connected with extension spring 17 on the fixed pin 16, the one end of extension spring 17 is connected on installation piece 15, the fixed orifices has been seted up to the one end of fixed.
In this embodiment (please refer to fig. 1), the upper cover plate 1 and the lower cover plate 2 have the same structure and are symmetrically arranged, and the upper cover plate 1 and the lower cover plate 2 are both made of aluminum alloy, which has light weight and good heat dissipation effect.
In this embodiment (see fig. 1), the metal plate 3 is made of an aluminum profile.
In this embodiment (see fig. 1), the conductive bus bar 5 is coated with an insulating paint layer, so as to improve the insulating performance of the conductive bus bar 5 and prolong the service life thereof.
In this embodiment (please refer to fig. 3), the heat conducting plate 9 has slots uniformly formed along the vertical direction near the side wall of the first heat dissipating block 8, the slots are matched with the first heat dissipating block 8 in size, and the first heat dissipating block 8 is inserted into the slots, so as to facilitate the initial fixing of the heat conducting plate 9 and the installation.
It should be noted that the utility model relates to a high-efficient heat dissipation bus duct for big data, including 1 upper cover plate, 2 lower cover plate, 3 metal sheets, 4 rivets, 5 conductive bus bar, 6 temperature sensor, 7 control device, 8 heat dissipation block I, 9 heat-conducting plate, 10 heat dissipation block II, 11 cooling pipe, 12 clamps, 13 dead lever, 14 fixed block, 15 installation block, 16 fixed pin, 17 extension spring, the parts are all general standard parts or parts known by technicians in this field, the structure and principle of the parts can be known by technical manual or conventional test method, when in use, the heat generated during the work of conductive bus bar 5 is absorbed by heat dissipation block I8, heat absorbed by heat dissipation block I8 is transmitted to heat-conducting plate 9, heat is transmitted to heat dissipation block I8 by heat-conducting plate 9 again, when temperature sensor 6 detects that the temperature of conductive bus bar 5 is higher, the signal is transmitted to the control terminal through a controller and a signal transmitter in the control device 7, two ends of the cooling pipe 11 are connected with a water supply system, the controller controls water to flow through the cooling pipe 11, heat of the heat conduction plate 9 and the second radiating block 10 is absorbed, and the radiating effect is improved; when needs are dismantled, extract the fixed pin 16 can, during the installation align with the radiating block 8 with the slot on the heat-conducting plate 9 earlier and insert, in the fixed orifices that utilizes fixed pin 16 to insert dead lever 13, fix heat-conducting plate 9, it is convenient simple, the operating personnel of being convenient for detect and maintain, be worth promoting.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (5)

1. The utility model provides a high-efficient heat dissipation bus duct for big data, includes upper cover plate (1) and lower cover plate (2), its characterized in that: two metal plates (3) are arranged between the upper cover plate (1) and the lower cover plate (2), the two metal plates (3) are symmetrically arranged, the metal plates (3) are of a U-shaped structure, the upper cover plate (1), the lower cover plate (2) and the metal plates (3) are connected through rivets (4), a conductive bus bar (5) is arranged between the two metal plates (3), a temperature sensor (6) and a control device (7) are arranged on the lower cover plate (2), the control device (7) comprises a controller and a signal transmitter, the temperature sensor (6) is electrically connected with the controller, the controller is electrically connected with the signal transmitter, heat dissipation blocks I (8) are uniformly arranged on the side wall, far away from the two metal plates (3), of the side wall, far away from the heat dissipation blocks I (8), of the heat dissipation blocks II (10) are uniformly fixed on the side wall, far away from the heat dissipation blocks I (8), of the heat dissipation blocks II (10) along the vertical direction, a cooling pipe (11) is arranged on the second radiating block (10), the cooling pipe (11) is fixed on the heat conducting plate (9) through a hoop (12), the cooling pipes (11) are distributed on the second radiating blocks (10) in an S shape, four fixing rods (13) are symmetrically welded on the far side walls of the two metal plates (3), the top and the bottom of the heat conducting plate (9) are symmetrically welded with fixing blocks (14), the fixing blocks (14) are provided with first through holes, and through-hole one and dead lever (13) size phase-match, be fixed with installation piece (15) on the lateral wall of fixed block (14), seted up through-hole two on installation piece (15), swing joint has fixed pin (16) in the through-hole two, is connected with extension spring (17) on fixed pin (16), and the one end of extension spring (17) is connected on installation piece (15), and the fixed orifices has been seted up to the one end of dead lever (13), and fixed orifices and fixed pin (16) size phase-match.
2. An efficient heat dissipation bus duct for big data according to claim 1, characterized in that: the upper cover plate (1) and the lower cover plate (2) are identical in structure and are symmetrically arranged, and the upper cover plate (1) and the lower cover plate (2) are made of aluminum alloy materials.
3. An efficient heat dissipation bus duct for big data according to claim 1, characterized in that: the metal plate (3) is made of aluminum section.
4. An efficient heat dissipation bus duct for big data according to claim 1, characterized in that: the outer side of the conductive busbar (5) is coated with an insulating paint layer.
5. An efficient heat dissipation bus duct for big data according to claim 4, characterized in that: the side wall of the heat conducting plate (9) close to the first radiating block (8) is uniformly provided with inserting grooves in the vertical direction, and the inserting grooves are matched with the first radiating block (8) in size.
CN201921022869.0U 2019-07-03 2019-07-03 A high-efficient heat dissipation bus duct for big data Expired - Fee Related CN209913443U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921022869.0U CN209913443U (en) 2019-07-03 2019-07-03 A high-efficient heat dissipation bus duct for big data

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921022869.0U CN209913443U (en) 2019-07-03 2019-07-03 A high-efficient heat dissipation bus duct for big data

Publications (1)

Publication Number Publication Date
CN209913443U true CN209913443U (en) 2020-01-07

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ID=69050588

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921022869.0U Expired - Fee Related CN209913443U (en) 2019-07-03 2019-07-03 A high-efficient heat dissipation bus duct for big data

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114650670A (en) * 2020-12-18 2022-06-21 宏恒胜电子科技(淮安)有限公司 Circuit board with heat dissipation block and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114650670A (en) * 2020-12-18 2022-06-21 宏恒胜电子科技(淮安)有限公司 Circuit board with heat dissipation block and preparation method thereof
CN114650670B (en) * 2020-12-18 2024-03-12 宏恒胜电子科技(淮安)有限公司 Circuit board with heat dissipation block and preparation method thereof

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200107

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CF01 Termination of patent right due to non-payment of annual fee