CN209912897U - LED (light-emitting diode) glue sealing device - Google Patents
LED (light-emitting diode) glue sealing device Download PDFInfo
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- CN209912897U CN209912897U CN201920891361.8U CN201920891361U CN209912897U CN 209912897 U CN209912897 U CN 209912897U CN 201920891361 U CN201920891361 U CN 201920891361U CN 209912897 U CN209912897 U CN 209912897U
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- glue
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- bowl cup
- led
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- 239000003292 glue Substances 0.000 title claims abstract description 144
- 238000007789 sealing Methods 0.000 title claims abstract description 80
- 238000000465 moulding Methods 0.000 claims abstract description 15
- 238000012856 packing Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive effect Effects 0.000 claims 5
- 238000004026 adhesive bonding Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 3
- 206010033799 Paralysis Diseases 0.000 description 2
- 238000010073 coating (rubber) Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000012548 In-process support Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model relates to a LED production field discloses a LED molding equipment, including the tray, be located the glue mould of the glue of tray top and be located the sealing machine of gluing mould top, glue the mould and include the lower mould, place the support on the lower mould and place the last mould in the support top, be equipped with a plurality of bowls cups that are used for placing the LED chip on the support, go up the mould and correspond each bowl cup department and be equipped with into gluey through-hole, be equipped with packing element and broach on the sealing machine, be equipped with out the jiao kou on the packing element. The utility model discloses set up the push broach on the sealing machine to adopt and seal the glue mould with sealing machine matched with, can use the push broach to impel glue in the bowl cup on the support during the glue sealing, guarantee that the face of gluing in each bowl cup is equal to the push broach bottom surface, effectively controlled the uniformity of the volume of gluing in each bowl cup, the push broach motion can make glue fill up all bowl cups, improves and seals glue efficiency; the sealing operation can be performed under vacuum condition, and no air bubble is generated after sealing.
Description
Technical Field
The utility model belongs to the technical field of the LED production and specifically relates to a LED molding equipment is related to.
Background
The sealing glue for the LED is used for carrying out mechanical protection and stress release on the chip, is used as a light guide structure and is generally used in the field of LED production. In the prior art, when the LED is sealed, the LED chip is fixed in the support bowl cup, and then the pouring sealant is dispensed in the support bowl cup through the dispensing head on the dispenser, so that the physical protection of the LED chip is realized.
For example, in the chinese patent document, "an LED dispensing method and dispensing device", which is disclosed in the publication No. CN108906482A, the dispensing device includes a dispensing head, the dispensing head can form a conductive loop with a corresponding LED light source, the conductive loop includes a controller, a trigger power source, an LED gold wire and an LED substrate, and the controller is connected to a moving mechanism for driving the dispensing head. The dispensing method comprises the following steps: (1) the dispensing head vertically moves downwards to the upper part of the LED chip; (2) dispensing glue from the glue dispensing head; (3) the dispensing head moves transversely; (4) and resetting the dispensing head.
However, in the prior art, the dispensing amount of the dispensing mainly depends on the precision of the dispensing equipment, and there are many aspects affecting the precision of the dispenser, such as the stability of the air pressure, the sealing performance of the dispensing cavity, the change of the viscosity of the glue with the use time, the ambient temperature, and the like. Therefore, the situation of a lot of glue is easy to appear after the glue is dripped into the bowl cup, so that the glue surface of the bowl cup is uneven, and the performance and consistency of the LED chip are affected.
Meanwhile, in the traditional glue sealing process, the glue dispensing needle and the bowl cup are separated to dispense glue into the bowl cup, so that air is easily wrapped into the bowl cup by the glue in the process, and the problem of bubbles after baking is caused. When the LED lamp is used, under different environmental temperatures and humidity, and in addition, due to different differences of expansion with heat and contraction with cold and internal stress of each part, the internal bubbles can continuously influence the transmission of electrons, destroy the internal structure, finally make the whole light-emitting system paralyzed, and the leakage current phenomenon and the lamp death phenomenon occur.
In addition, in the conventional dispensing technology, the dispensing needle head moves up and down and back and forth in the left-right displacement stroke, one bowl can be dispensed by one needle head at a time, one dispensing machine can only carry 2 to 16 needle heads, and the dispensing process needs to be performed with glue pumping and air exhausting, so that the dispensing efficiency is relatively slow.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects that when the LED glue sealing device in the prior art is used for sealing glue, the glue amount in each bowl cup is difficult to control to be consistent, so that the glue surface is uneven, and the service performance and consistency of an LED chip are influenced; and in the traditional glue sealing operation, only one bowl cup can be dispensed by one needle head at a time, so that the problems of low glue sealing efficiency and poor glue sealing consistency are caused.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a LED molding equipment, includes the tray, is located the glue mould of sealing of tray top and is located the sealing machine of sealing the glue mould top, seals the glue mould and includes the lower mould, places the support on the lower mould and places the last mould in the support top, is equipped with a plurality of bowls cups that are used for placing the LED chip on the support, goes up the mould and corresponds each bowl cup department and be equipped with into gluey through-hole, is equipped with packing element and broach on the sealing machine, is equipped with out jiao kou on the packing element.
Use the utility model provides a glue sealing device seals the step when gluing as follows:
(A) placing a lower die on the tray, placing the bracket with the LED chip in the bowl cup on the lower die, and then placing an upper die above the bracket to complete the assembly of the sealing glue die;
(B) placing the LED glue sealing device in a closed space, and vacuumizing the closed space;
(C) after the vacuumizing is finished, the glue sealing machine is started, a glue cylinder on the glue sealing machine is lowered, and glue is coated on one side of the upper die along the width direction of the upper die;
(D) lifting the rubber cylinder, lowering the push broach to enable the push broach to be in contact with the surface of the upper die, moving the push broach and pushing the glue from one side of the upper die to the other side;
(E) after the upper die is removed, the lower die and the support are sent into a baking device for baking, and then the sealing glue is finished.
The utility model discloses set up the push broach on the sealing machine to adopt specific glue sealing mould, carry out the rubber coating back with the packing element along last mould width direction when sealing the glue, can push away in the bowl cup on the sword impels glue propulsion support, the action back is accomplished to the push away sword, and the face of gluing in each bowl cup can keep level with the push away sword bottom surface, has effectively controlled the uniformity of the volume of gluing in each bowl cup, has avoided using traditional molding equipment to glue the easy unevenness's of face phenomenon when sealing the glue.
In the glue sealing mould, the lower mould is used for fixing the support, the upper mould is used for providing a plane for glue to move under the action of the push broach, the glue cylinder coats the glue on one side of the upper mould along the width direction of the upper mould, when the glue is pushed to the glue inlet through hole on the upper mould by the push broach, the glue can enter and fill the bowl cup corresponding to the glue inlet through hole along the glue inlet through hole, and the rest glue is continuously pushed to advance by the push broach, so that the glue surface in each bowl cup can be leveled with the bottom surface of the push broach after the push broach completes the action, the consistency of the glue amount in each bowl cup is effectively controlled, and the uneven phenomenon of the glue surface is avoided.
The push broach is directly used for pushing the glue into the bowl cups on the bracket, and the push broach can move once to fill all the bowl cups with the glue, so that the glue dispensing head is prevented from moving up and down to and fro in a left-right displacement stroke, the glue sealing time is saved, and the glue sealing operation efficiency is improved; and a plurality of glue dispensing heads are not required to be arranged on the glue sealing device, so that the glue sealing device is simplified. (the point gum machine is the conventional device in the prior art, not the focus of the utility model.)
Can be with when sealing the glue the utility model discloses a sealing device puts into airtight space, to airtight space evacuation back, the rubber coating is carried out to reuse packing element to in impeling the bowl cup on the support with the broach with glue. Because no air exists in the glue coating and pushing processes, no air bubble is generated after glue sealing, the phenomenon that the air bubble inside the LED affects the transmission of electrons when the LED is used is effectively avoided, the internal structure is damaged, and finally the whole light-emitting system is paralyzed, and the phenomena of current leakage and lamp death occur.
Preferably, two support placing grooves are formed in the lower die, the support corresponds to the two support placing grooves and is respectively provided with a left bowl cup setting area and a right bowl cup setting area, a plurality of uniformly distributed bowl cups are respectively arranged in the left bowl cup setting area and the right bowl cup setting area, the part, below the plane of the support, of each bowl cup is located in the support placing groove in the lower die, the part, above the plane of the support, of each bowl cup is located in the glue inlet through hole in the upper die, and the upper side and the lower side of the part, outside the bowl cup setting area, of the support are respectively attached to the upper die and the.
Set up two support standing grooves on the lower mould, set up the bowl cup setting district of two correspondences on the support, through the partition wall between two support standing grooves, can set up the bowl cup bottom in the district to two bowl cups at the support middle part and carry out effectual spacing and fixed, make the atress at support both ends and middle part even, avoid pushing away to glue in-process support and take place the dislocation in the lower mould, influence final glue quality of sealing. The upper part of the bowl cup is fixed through the glue inlet through hole on the upper die, so that the bowl cup is effectively fixed, the opening of the bowl cup is positioned, and glue can smoothly enter the bowl cup.
Preferably, a chip placing groove and a glue sealing groove above the chip placing groove are arranged in the bowl cup, the top end of the glue sealing groove is flush with the upper surface of the upper die, and the size of an opening of the glue sealing groove is the same as that of an opening of a glue inlet through hole in the upper die. The chip standing groove is used for fixing the LED chip that needs to seal the glue, seals the glue groove and is used for holding glue, and glue gets into and fills up and seal the glue groove through advancing gluey through-hole on last mould. The top end of the glue sealing groove is flush with the upper surface of the upper die, the size of the opening of the glue sealing groove is the same as that of the opening of the glue inlet through hole in the upper die, glue can be guaranteed to completely enter the glue sealing groove, the glue overflowing phenomenon cannot occur, and the glue sealing quality is guaranteed.
Preferably, the push broach is arranged along the width direction of the upper die, the length of the push broach is the same as the width of the upper die, the moving path of the push broach can cover all bowl cups, and glue at each position can smoothly enter each bowl cup under the action of the push broach.
Preferably, a conveying device is arranged above the tray, and the sealing glue mold is placed above the conveying device. Set up conveyer, can convey the mould that seals to baking equipment in through conveyer, avoid sealing the mould and take in-process glue and spill.
Preferably, a constant temperature heating device is arranged below the tray, so that the tray can be heated at constant temperature, and the glue sealing process is in a constant temperature environment.
Preferably, the push broach is provided with a constant temperature heating device, so that the push broach can be heated at constant temperature, and the sealing operation can be carried out in a constant temperature state.
Therefore, the utility model discloses following beneficial effect has:
(1) the push knife is arranged on the glue sealing machine, the specific glue sealing mold is adopted, glue is coated along the width direction of the upper mold by the glue cylinder during glue sealing, the push knife can push the glue into the bowl cups on the support, after the push knife finishes the action, the glue surface in each bowl cup can be leveled with the bottom surface of the push knife, the consistency of the glue amount in each bowl cup is effectively controlled, and the phenomenon that the glue surface is easy to be uneven during glue sealing by using the traditional glue sealing device is avoided;
(2) the push broach moves once to fill all the bowls with the glue, so that the phenomenon that the glue dispensing head moves back and forth left and right in the traditional method is avoided, the glue sealing time is saved, the efficiency of glue sealing operation is improved, a plurality of glue dispensing heads are not required to be arranged on a glue sealing device, and the glue sealing device is simplified;
(3) the constant-temperature heating device is arranged below the tray or on the push broach, so that the glue sealing operation can be carried out in a constant-temperature state, the constancy of the environmental conditions in the operation process is guaranteed, the state and the property of the glue are kept constant, and the quality and the consistency of the glue sealing can be further improved.
Drawings
FIG. 1 is a top view of a lower die;
FIG. 2 is a front view of the lower die;
FIG. 3 is a top view of the bracket;
FIG. 4 is a front view of the bracket;
FIG. 5 is a top view of the upper die;
FIG. 6 is a front view of the upper die;
FIG. 7 is a schematic view of the structure of the glue cylinder after glue application;
fig. 8 is a schematic structural diagram of the push broach after pushing glue.
In the figure: 1 tray, 201 lower mould, 2011 support standing groove, 202 support, 203 go up the mould, 2031 advances gluey through-hole, 204 bowl cup, 2041 chip standing groove, 2042 seal gluey groove, 301 packing element, 302 play jiao kou, 303 push-type broach, 4 glues, 5 conveyer.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description.
Example (b):
as shown in fig. 7 and 8, an LED molding apparatus includes a tray 1, a molding die located above the tray, and a molding machine located above the molding die, wherein a conveying device 5 is disposed above the tray, the molding die is disposed above the conveying device, the conveying device is a conveyor belt, and a constant temperature heating device is disposed below the tray. The glue sealing mold comprises a lower mold 201, a support 202 placed on the lower mold and an upper mold 203 placed above the support, a glue barrel 301 and a push broach 303 are arranged on the glue sealing machine, a glue outlet 302 is arranged on the glue barrel, the push broach is arranged along the width direction of the upper mold, the length of the push broach is the same as the width of the upper mold, and a constant temperature heating device is arranged on the push broach.
As shown in fig. 1 and 2, the lower mold 201 is provided with two rack placement grooves 2011, as shown in fig. 3 and 4, the rack 202 forms a left and a right bowl setting areas corresponding to the two rack placement grooves, the left and the right bowl setting areas are respectively provided with 8 × 18 bowls in a rectangular array, and as shown in fig. 5 and 6, the upper mold 203 is provided with glue inlet through holes 2031 corresponding to the bowls.
The bowl cup is in the support standing groove that the part below the support place plane is located the lower mould, and the bowl cup is in the part above the support place plane and is located the gluey through-hole of advancing on the mould, is equipped with chip standing groove 2041 in the bowl cup and is located the gluey groove 2042 of gluing of chip standing groove top, seals gluey groove top and flushes with the upper surface of last mould, seals gluey groove opening size the same with the through-hole opening size of advancing on the mould. The upper side and the lower side of the part of the bracket outside the bowl cup setting area are respectively attached to the upper die and the lower die.
The steps of the glue sealing operation are as follows: placing a lower die above a transmission belt on a tray, placing a support with an LED chip in a bowl cup on the lower die, and then placing an upper die above the support to complete the assembly of the sealing glue die; placing the LED glue sealing device in the closed space, vacuumizing the closed space by using a vacuum pump, and starting a constant-temperature heating device below the tray; when the vacuum degree in the closed space is 99.2Pa and the temperature on the tray is 50 ℃, starting the glue sealing machine to enable a glue cylinder on the glue sealing machine to descend, and coating glue on the left side of the upper die along the width direction of the upper die; lifting the rubber cylinder, lowering the push broach to enable the push broach to be in contact with the surface of the upper die on the left side of the glue, moving the push broach and pushing the glue from the left side to the right side of the upper die; and after the upper die is removed, the lower die and the support are conveyed into a baking device through a conveying device, and the sealing glue is finished after the lower die and the support are baked for 40min at 120 ℃.
Adopt the utility model discloses a molding equipment seals to keep vacuum, homothermal operating condition, can not produce the bubble after sealing the glue and glue the crack rate low, the unevenness's phenomenon can not appear in the face of gluing.
Claims (7)
1. The utility model provides a LED molding equipment, characterized by, includes the tray, is located the glue mould of the sealing of tray top and is located the sealing machine of sealing the glue mould top, seal the glue mould and include the lower mould, place the support on the lower mould and place the last mould in the support top, be equipped with a plurality of bowls cups that are used for placing the LED chip on the support, it is equipped with into gluey through-hole to go up the mould and correspond each bowl cup department, be equipped with packing element and broach on the sealing machine, be equipped with out the jiao kou on the packing element.
2. The LED glue sealing device according to claim 1, wherein two bracket placement grooves are formed on the lower die, the bracket is respectively provided with a left bowl cup setting area and a right bowl cup setting area corresponding to the two bracket placement grooves, a plurality of evenly distributed bowl cups are respectively arranged in the left bowl cup setting area and the right bowl cup setting area, the part of the bowl cup below the plane of the bracket is positioned in the bracket placement groove on the lower die, the part of the bowl cup above the plane of the bracket is positioned in the glue inlet through hole on the upper die, and the upper side and the lower side of the part of the bracket outside the bowl cup setting areas are respectively attached to the upper die and the lower die.
3. The LED adhesive sealing device of claim 1, wherein a chip placing groove and an adhesive sealing groove above the chip placing groove are arranged in the bowl cup, the top end of the adhesive sealing groove is flush with the upper surface of the upper die, and the opening size of the adhesive sealing groove is the same as the opening size of the adhesive inlet through hole in the upper die.
4. The LED molding apparatus of claim 1, wherein the push-type broach is disposed along a width direction of the upper mold, and a length of the push-type broach is the same as a width of the upper mold.
5. The apparatus of claim 1, wherein a conveyor is disposed above the tray, and the molding die is disposed above the conveyor.
6. The LED molding apparatus of claim 1, wherein a constant temperature heating device is disposed below the tray.
7. The LED molding apparatus of claim 1, wherein the pusher is provided with a constant temperature heating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920891361.8U CN209912897U (en) | 2019-06-13 | 2019-06-13 | LED (light-emitting diode) glue sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920891361.8U CN209912897U (en) | 2019-06-13 | 2019-06-13 | LED (light-emitting diode) glue sealing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209912897U true CN209912897U (en) | 2020-01-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920891361.8U Active CN209912897U (en) | 2019-06-13 | 2019-06-13 | LED (light-emitting diode) glue sealing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209912897U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110369226A (en) * | 2019-06-13 | 2019-10-25 | 浙江英特来光电科技有限公司 | A kind of LED glue sealing method and device |
-
2019
- 2019-06-13 CN CN201920891361.8U patent/CN209912897U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110369226A (en) * | 2019-06-13 | 2019-10-25 | 浙江英特来光电科技有限公司 | A kind of LED glue sealing method and device |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhejiang Hongxi Technology Co.,Ltd. Assignor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Contract record no.: X2024330000207 Denomination of utility model: A LED sealing device Granted publication date: 20200107 License type: Common License Record date: 20240716 |