CN209898330U - Air conditioning suit based on semiconductor refrigeration technology - Google Patents
Air conditioning suit based on semiconductor refrigeration technology Download PDFInfo
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- CN209898330U CN209898330U CN201920000662.7U CN201920000662U CN209898330U CN 209898330 U CN209898330 U CN 209898330U CN 201920000662 U CN201920000662 U CN 201920000662U CN 209898330 U CN209898330 U CN 209898330U
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Abstract
The utility model relates to an air conditioning clothes based on semiconductor refrigeration technology utilizes semiconductor refrigeration technology, uses it to the personnel on duty. The semiconductor air conditioning suit consists of a jacket, a semiconductor refrigerating sheet, a blower, a radiating fin, a water mist generator, a control circuit, a power supply and the like. The semiconductor refrigerating sheet is electrified for refrigerating, and the fan blows in air in the external environment and blows the air to the refrigerating sheet to take away cold energy from the cold end of the refrigerating sheet; one end of the main pipe is connected with a cold air outlet, the other end of the main pipe is connected with a reticular hose of the jacket, cold air is introduced into the reticular hose inside the jacket through the main pipe, and then the cold air is conveyed to each position of the jacket to cool the body surface; a part of wind blown out by the fan takes away heat from the hot end of the refrigerating sheet and is discharged to the external environment. The utility model has the advantages of simple structure, light device, high stability, good comfort level, low cost and the like.
Description
Technical Field
The utility model relates to a semiconductor refrigeration accuse temperature technical field, concretely relates to air conditioner clothes based on semiconductor refrigeration technology.
Background
With the influence of greenhouse effect, many cities become hotter in summer, are more sunny and fire-like, and more some cities continue to have high temperature of about 40 ℃. For the indoor workers, there are air conditioners or fans for cooling, but for the workers who work outdoors for a long time, such as the building workers, the duty sanitation workers, the traffic police, the mining workers and other people, because of the limitation and the requirement of the working conditions, the clothing needs to wear thicker special clothing, the air permeability of the clothing is poor, the outdoor temperature is too high, the heat dissipation and cooling cannot be carried out in time, and the working efficiency and the health of the workers are affected.
At present, the heatstroke prevention clothes in the market are not many, and few clothes with strong practicability exist. For example, the vortex tube type cooling vest needs a heavy compressor or a gas cylinder as a gas source, so that the vortex tube type cooling vest is heavy, inconvenient to move and large in size; an air-conditioning vest pushed out by secondary astronauts college II in 17 years and 7 months utilizes a compressor frequency conversion adjusting system, but the weight of the air-conditioning vest reaches 3.3 kilograms, only a power supply weighs 1 kilogram, and the vest can be refrigerated after running for 5 minutes, is heavy, cannot be heated and heated, and cannot meet the requirements.
SUMMERY OF THE UTILITY MODEL
Because the cooling air conditioner undershirt that exists in market has can not fine satisfy the person's demand of wearing, and refrigeration effect is relatively poor or too heavy scheduling problem, the utility model provides an air conditioner clothes based on semiconductor refrigeration technology
. The semiconductor air conditioning suit adopts a semiconductor refrigeration technology to control the temperature of the air conditioning suit, the semiconductor air conditioning suit is refrigerated in summer and heated in winter, the refrigerating sheet system is guaranteed to run efficiently to meet the comfort of a wearer, the weight of the semiconductor air conditioning suit only reaches 1.5 kg, and the problems of heaviness, large size and the like do not exist.
In order to achieve the above object, the present invention provides a semiconductor air conditioning vest, which has a sandwich structure, wherein a main pipe and a mesh-shaped hose connected with the main pipe are arranged in the sandwich structure, the main pipe is connected with an air supply port, and then the main pipe is conveyed to each part of a human body through the hose so as to achieve the purpose of cooling or heating.
The semiconductor refrigerating device comprises two semiconductor refrigerating pieces, a power supply, two cooling fins at the cold end and the hot end, a heat insulation piece, a water mist generator, a fan, a thermistor and an aluminum sheet.
The vest is provided with a breathable material at the inner side, reticular hoses are arranged between the inner layer and the outer layer and distributed at each part of the vest, the hoses are connected with the secondary pipes, and cold air or hot air is delivered to each part of a body from the air supply end of the thermoelectric refrigerating device.
The refrigerating device comprises two refrigerating sheets, and an upper channel and a lower channel are formed on two sides of each refrigerating sheet through heat insulation sheets; two sides of the upper channel and the lower channel are respectively provided with two radiating fins, and inlets of the radiating fins are connected with an air blowing outlet of the fan; the outlet of the upper channel is connected with the external environment to take the heat generated at the upper end of the refrigerating sheet out of the device; the outlet of the lower channel is connected with the main pipe, and the cold energy generated by the lower end of the refrigerating sheet is conveyed to the reticular hose through the main pipe.
Drawings
Fig. 1 is a front view of a thermoelectric cooling device for an air conditioning suit based on semiconductor cooling technology.
Fig. 2 is a left side view of a thermoelectric cooling device for an air conditioning suit based on semiconductor cooling technology.
Fig. 3 is a structure diagram of a heat sink on a single-sided refrigeration sheet.
Detailed Description
Specific embodiments of the present invention will be further described with reference to the accompanying drawings.
As shown in the schematic diagram 1, the air conditioning suit based on the semiconductor refrigeration technology comprises a vest 15 and a semiconductor refrigeration device; the vest 15 is internally provided with a main pipe and a reticular hose, one end of the main pipe is connected with the air inlet 11, the other end of the main pipe is connected with the reticular hose distributed at each part of the vest, and the hot air or the cold air supplied by the lower channel is delivered to each part of the vest.
The thermoelectric device comprises a fan 5, a fan air inlet 6, a water mist generator 7, a mist air outlet pipe 8, a radiating fin 9, a refrigerating fin 10, an aluminum sheet 16, a thermistor 17, a lower channel air outlet 11 and an upper ventilation opening 12.
As shown in the schematic diagram 2, which is a left side view of a thermoelectric refrigerating device on an air-conditioning suit based on semiconductor refrigeration technology, a fan 5 blows fresh air 20 from the external environment into a common air duct, the fresh air 20 is divided into two paths when reaching a refrigerating sheet, and one path blows to an upper path to form a flow direction 21 of upper path air. The other path blows to the lower channel to form the flow direction 22 of the lower channel wind.
The fan air inlet 6 is of a honeycomb structure and provides enough air supply quantity for the fan 5; the air outlet of the fan 5 is connected with the outlet of the water mist generator 7, and the air blows the mist generated in the water mist generator to the refrigerating sheet; the water mist generator 7 makes full use of the condensed water generated in the refrigerating device, so that the problem of the condensed water generated in the refrigerating process is solved, and the heat dissipation of the hot end is enhanced.
As shown in fig. 3, the semiconductor cooling plate 10 has heat dissipating fins 9 on both sides, similar to the louver fin structure, and the material is copper, which can greatly enhance the heat dissipation of the hot end of the cooling plate.
One end of the hot end heat sink is connected to the hot end of the cold plate, and an aluminum thin plate 16 is covered above the upper channel 18 to further enhance the heat dissipation of the hot end.
As shown in fig. 1, a thermistor 17 is installed inside the semiconductor chilling plate 10; when the temperature of the refrigeration piece is higher than a certain critical value, the thermistor plays a role in cutting off a circuit, so that the refrigeration piece is prevented from being damaged due to overhigh temperature when the fan 5 is damaged and stops running, and the function of protecting a wearer is played.
As shown in fig. 2, the semiconductor chilling plate 10 has an upper channel 18 and a lower channel 19 formed on both sides thereof and separated from each other by a heat insulation plate; the outlet of the upper channel 18 is connected with the external environment to take away the heat generated by the refrigerating sheet in the form of hot air; the inlet of the lower channel 19 is connected with the cold end of the refrigerating sheet, the outlet of the lower channel is connected with the main pipe, and the cold energy generated by the cold end of the refrigerating sheet is conveyed to the main pipe.
As shown in the figure, the power supply 11 is a rechargeable power supply and consists of a plurality of detachable lithium batteries and a battery housing; the power supply has the characteristics of explosion prevention and flame resistance, and can effectively and safely work at outdoor high temperature.
As shown in fig. 1, the control circuit board 2 has a cooling gear 3 and a heating gear 4, which respectively satisfy two requirements of cooling in summer and heating in winter, and the cooling gear 3 and the cooling gear 4 respectively have respective high and low gears to satisfy the requirements for the required cooling capacity and heating capacity, and the high and low gears are switched by changing voltage through gear control; the connection of the refrigeration device to the power supply and control circuit board is completed by the lead 13 of the circuit.
The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the invention, but all modifications and changes made by the contents of the present invention or directly used in other fields without departing from the spirit and scope of the present invention are encompassed in the claims of the present invention.
Claims (9)
1. An air conditioning suit based on semiconductor refrigeration technology, its characterized in that: heating or cooling by using a thermoelectric refrigerating device, and adjusting the temperature of air blown in by a fan; controlling the operation of the fan and the refrigerating device by using a control circuit; conveying condensed water generated in the refrigeration process to a water mist generator; two ends of the cooling fin are respectively provided with two cooling fins, and in order to strengthen heat dissipation of the hot end, the heat dissipation fins are bonded by heat-conducting silica gel or directly welded with a thin aluminum layer.
2. An air conditioning suit based on semiconductor refrigeration technology as claimed in claim 1, characterized in that: the thermoelectric refrigerating device comprises two semiconductor refrigerating pieces, a power supply, two cooling fins at the cold end and the hot end, a water mist generator, a fan, a thermistor and an aluminum sheet.
3. An air conditioning suit based on semiconductor refrigeration technology as claimed in claim 2, characterized in that: the two semiconductor refrigerating sheets are arranged in series according to the air direction, and a cold air channel and a hot air channel are respectively formed on two sides of each refrigerating sheet; the system controls the current direction of the circuit through the switch to realize the exchange of the cold end and the hot end of cold refrigeration and the exchange of the hot air channel and the cold air channel.
4. An air conditioning suit based on semiconductor refrigeration technology as claimed in claim 2, characterized in that: two channels are respectively formed on two sides of the semiconductor refrigeration sheet and are blown by a fan; when refrigeration is needed, the upper end of the refrigeration piece is a hot end, the lower end of the refrigeration piece is a cold end, the upper channel forms a heat dissipation channel, the lower channel forms a refrigeration channel, and the cold end and the hot end of the refrigeration piece are exchanged during heating, and the heat dissipation channel and the refrigeration channel are also exchanged; and the upper and lower passages are separated by the inlet heat-insulating sheet and the outlet heat-insulating sheet; when refrigeration is needed, in order to enhance the heat dissipation of the upper channel, the other end of the radiating fin is provided with a thin aluminum layer, the hose of the lower channel is connected with the main pipe connected with the vest, and the hot air outlet of the upper channel is directly connected to the external environment.
5. An air conditioning suit based on semiconductor refrigeration technology as claimed in claim 1, characterized in that: inlets of the upper channel and the lower channel are a shared air duct; the fan is positioned at the inlet of the common air channel, and the upper part of the fan is provided with a honeycomb-shaped ventilation opening to ensure that enough air inlet volume is provided.
6. An air conditioning suit based on semiconductor refrigeration technology as claimed in claim 1, characterized in that: the circuit is provided with an independent power supply which supplies power to the fan and the semiconductor chilling plate through voltage division.
7. An air conditioning suit based on semiconductor refrigeration technology as claimed in claim 1, characterized in that: the power supply consists of a plurality of rechargeable and detachable batteries and a heat dissipation shell for containing the batteries.
8. An air conditioning suit based on semiconductor refrigeration technology as claimed in claim 1, characterized in that: a water mist generator is arranged in a shared air channel between the fan and the refrigerating sheet, condensed water generated by refrigeration is drained to the water mist generator through a hose, and mist generated by the water mist generator is conveyed to the hot end of the refrigerating sheet through the hose, so that the problem of condensation is solved, and the heat dissipation effect of the hot end is enhanced.
9. An air conditioning suit based on semiconductor refrigeration technology as claimed in claim 2, characterized in that: the thermoelectric device and the matched power supply are both arranged on the back of the clothes, and the thermoelectric device and the matched power supply are arranged in the clothes, and only the control switch is arranged outside; and this control switch has two grades of height, realizes the size of refrigerating output through changing voltage to satisfy the demand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920000662.7U CN209898330U (en) | 2019-01-02 | 2019-01-02 | Air conditioning suit based on semiconductor refrigeration technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920000662.7U CN209898330U (en) | 2019-01-02 | 2019-01-02 | Air conditioning suit based on semiconductor refrigeration technology |
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| Publication Number | Publication Date |
|---|---|
| CN209898330U true CN209898330U (en) | 2020-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920000662.7U Active CN209898330U (en) | 2019-01-02 | 2019-01-02 | Air conditioning suit based on semiconductor refrigeration technology |
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| CN (1) | CN209898330U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111264921A (en) * | 2020-04-02 | 2020-06-12 | 河北大学附属医院 | Cooling and dehumidifying device and protective clothing using same |
| CN111436700A (en) * | 2020-04-02 | 2020-07-24 | 河北大学附属医院 | Split type cooling and dehumidifying device and protective clothing using same |
| CN112319325A (en) * | 2020-10-30 | 2021-02-05 | 广州塔祈巴那电器有限公司 | Blower with cooling and heating functions |
| WO2022160416A1 (en) * | 2021-01-29 | 2022-08-04 | 江苏大学 | Personal thermal comfort device based on peltier effect, and thermal management method |
-
2019
- 2019-01-02 CN CN201920000662.7U patent/CN209898330U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111264921A (en) * | 2020-04-02 | 2020-06-12 | 河北大学附属医院 | Cooling and dehumidifying device and protective clothing using same |
| CN111436700A (en) * | 2020-04-02 | 2020-07-24 | 河北大学附属医院 | Split type cooling and dehumidifying device and protective clothing using same |
| CN112319325A (en) * | 2020-10-30 | 2021-02-05 | 广州塔祈巴那电器有限公司 | Blower with cooling and heating functions |
| WO2022160416A1 (en) * | 2021-01-29 | 2022-08-04 | 江苏大学 | Personal thermal comfort device based on peltier effect, and thermal management method |
| GB2614682A (en) * | 2021-01-29 | 2023-07-12 | Univ Jiangsu | Personal thermal comfort device based on Peltier effect, and thermal management method |
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