CN209897360U - Compatible type circuit board of two kinds of compatible communication module - Google Patents
Compatible type circuit board of two kinds of compatible communication module Download PDFInfo
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- CN209897360U CN209897360U CN201920211837.9U CN201920211837U CN209897360U CN 209897360 U CN209897360 U CN 209897360U CN 201920211837 U CN201920211837 U CN 201920211837U CN 209897360 U CN209897360 U CN 209897360U
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Abstract
The utility model discloses a compatible type circuit board of two kinds of compatible communication module, it includes MCU, MEMS sensor, first NB-IOT module and second NB-IOT module, use the MCU is the connection center, MEMS sensor, first NB-IOT module and second NB-IOT module respectively with the MCU electricity is connected, first NB-IOT module and the second NB-IOT module are connected different NB module screens respectively, NB module screens contains SIM cassette and eSIM paster card; when the first NB-IOT module is connected with an SIM card socket or an eSIM patch card, the second NB-IOT module is connected with the eSIM patch card or the SIM card socket. The utility model discloses all contain two kinds of NB module screens on the market, conveniently select or switch to can be general, facilitate the use, reduce extravagantly.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to compatible type circuit board of two kinds of compatible communication module.
Background
The existing circuit board generally only has one communication module and corresponds to one card position, so that different communication modules are difficult to switch, and inconvenience in use is caused. The new communication module or the card can not be used, the original circuit board can not be used, and the circuit board can be abandoned, so that the waste of resources is caused.
SUMMERY OF THE UTILITY MODEL
In view of the above, in order to solve the above technical problems, an object of the present invention is to provide a compatible circuit board compatible with two communication modules, which is versatile and convenient to use, and reduces waste.
The adopted technical scheme is as follows:
a compatible circuit board compatible with two communication modules comprises an MCU, an MEMS sensor, a first NB-IOT module and a second NB-IOT module, wherein the MCU is used as a connection center, the MEMS sensor, the first NB-IOT module and the second NB-IOT module are respectively and electrically connected with the MCU, the first NB-IOT module and the second NB-IOT module are respectively connected with different NB module clamping positions, and the NB module clamping position comprises an SIM card seat and an eSIM patch card; when the first NB-IOT module is connected with an SIM card socket or an eSIM patch card, the second NB-IOT module is connected with the eSIM patch card or the SIM card socket.
Further, the MEMS sensor is an ADXL345 low power consumption tri-axial MEMS sensor.
Further, the MEMS sensor is a gyroscope sensor and/or a temperature sensor.
Further, the MCU is an ARM Cortex-M0+ ultra-low power consumption MCU.
Further, the system also comprises a GPS positioning module.
The beneficial effects of the utility model reside in that:
through setting up first NB-IOT module and second NB-IOT module, first NB-IOT module and second NB-IOT module correspond one kind of NB module screens respectively again, SIM cassette or the SMD card of eSIM, two kinds of NB module screens on the market all contain in this compatible type circuit board like this, conveniently select or switch to can be general, facilitate the use, it is extravagant to reduce.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic circuit block diagram of a compatible circuit board compatible with two communication modules in embodiment 1.
Fig. 2 is a schematic structural diagram of a compatible circuit board compatible with two communication modules in embodiment 1.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only preferred embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Example 1
Referring to fig. 1 and 2, a compatible circuit board compatible with two communication modules includes an MCU 1, an MEMS sensor 2, a first NB-IOT module 3, and a second NB-IOT module 4, where the MCU 1 is used as a connection center, the MEMS sensor 2, the first NB-IOT module 3, and the second NB-IOT module 4 are electrically connected to the MCU respectively, for example, the MEMS sensor and the MCU are connected through I2C or SPI, where I2C is a two-wire serial bus developed by PHILIPS corporation for connecting the microcontroller and its peripheral devices. It is a serial bus consisting of a data line SDA and a clock SCL, which can send and receive data. SPI is an abbreviation for Serial Peripheral Interface (Serial Peripheral Interface). The SPI is a high-speed, full-duplex and synchronous communication bus, only four wires are occupied on pins of a chip, the pins of the chip are saved, and meanwhile, convenience is brought to space saving in the layout of a PCB.
The MEMS sensor, as a key device for acquiring information, has a great push to the miniaturization of various sensing devices, and has been widely used in the fields of electronic products and the like. Common MEMS sensors are pressure sensors, acceleration sensors, temperature sensors, humidity sensors, gyroscope sensors, inertial sensors, and the like.
As a specific implementation, the MEMS sensor of this embodiment is an ADXL345 low power consumption three-axis MEMS sensor, and the ADXL345 is a three-axis, digital acceleration sensor, which can measure X, Y, Z acceleration in three directions, and can measure static gravitational acceleration in tilt detection applications, and can also measure dynamic acceleration caused by motion or impact.
The MCU is a micro control unit, as a specific implementation mode, the MCU of the embodiment is an ARM Cortex-M0+ ultra-low power consumption MCU, and the Cortex-M0 is an M0 series in a Cortex-M family. The most important characteristic is the design of low power consumption. The ARMCortex-M0+ MCU provides a low pin count for basic microcontroller applications that saves space.
The MCU 1 can send AT commands to the first NB-IOT module 3 and the second NB-IOT module 4 to implement connection and communication. The first NB-IOT module 3 and the second NB-IOT module 4 are respectively connected with different NB module clamps, and the NB module clamps comprise an SIM card holder 5 and an eSIM patch card 6; for example, when the first NB-IOT module 3 is connected to the SIM card socket 5, the second NB-IOT module 4 is connected to the eSIM patch card 6.
Therefore, the compatible circuit board can be compatible with two communication modules, and the connection of the plug-in communication card can be realized through the SIM card seat; and the connection of the surface mount type communication card can be realized through the eSIM surface mount card. Two kinds of NB module screens commonly used in the market all contain in this compatible type circuit board, conveniently select or switch to can be general, facilitate the use, reduce extravagantly.
Example 2
Referring to embodiment 1, unlike embodiment 1, the MEMS sensor is a gyro sensor, in which the gyro sensor can be used to detect an inclination angle, so that the present compatible circuit board can be applied to measurement of a communication tower inclination, a power tower inclination, a tree inclination, a high-rise building inclination, an industrial chimney inclination, a street lamp inclination, a crisis inclination, and the like.
Example 3
Referring to embodiment 1, unlike embodiment 1, the MEMS sensor is a temperature sensor. A gyroscope sensor may be used to detect ambient temperature.
Example 4
Referring to embodiment 2, on the basis of embodiment 2, the compatible circuit board further includes a GPS positioning module, which can perform a further positioning function.
The above detailed description is only for the purpose of illustrating the practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. A compatible circuit board compatible with two communication modules is characterized by comprising an MCU, an MEMS sensor, a first NB-IOT module and a second NB-IOT module, wherein the MCU is taken as a connection center, the MEMS sensor, the first NB-IOT module and the second NB-IOT module are respectively and electrically connected with the MCU, the first NB-IOT module and the second NB-IOT module are respectively connected with different NB module clamping positions, and the NB module clamping positions comprise an SIM card seat and an eSIM patch card; when the first NB-IOT module is connected with an SIM card socket or an eSIM patch card, the second NB-IOT module is connected with the eSIM patch card or the SIM card socket.
2. The compatible circuit board of claim 1, wherein the MEMS sensor is an ADXL345 low power consumption three-axis MEMS sensor.
3. The circuit board of claim 1, wherein the MEMS sensor is a gyroscope sensor and/or a temperature sensor.
4. The compatible circuit board of claim 1, wherein the MCU is ARM Cortex-M0+ ultra-low power consumption MCU.
5. The compatible circuit board of claim 1, further comprising a GPS positioning module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920211837.9U CN209897360U (en) | 2019-02-19 | 2019-02-19 | Compatible type circuit board of two kinds of compatible communication module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920211837.9U CN209897360U (en) | 2019-02-19 | 2019-02-19 | Compatible type circuit board of two kinds of compatible communication module |
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| Publication Number | Publication Date |
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| CN209897360U true CN209897360U (en) | 2020-01-03 |
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| CN201920211837.9U Expired - Fee Related CN209897360U (en) | 2019-02-19 | 2019-02-19 | Compatible type circuit board of two kinds of compatible communication module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113489504A (en) * | 2021-07-05 | 2021-10-08 | 深圳市商汤科技有限公司 | Circuit board, electronic equipment, signal processing method and device |
-
2019
- 2019-02-19 CN CN201920211837.9U patent/CN209897360U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113489504A (en) * | 2021-07-05 | 2021-10-08 | 深圳市商汤科技有限公司 | Circuit board, electronic equipment, signal processing method and device |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200103 |
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| CF01 | Termination of patent right due to non-payment of annual fee |