CN209887913U - Cutting device for solar cell silicon wafer - Google Patents
Cutting device for solar cell silicon wafer Download PDFInfo
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- CN209887913U CN209887913U CN201920571279.7U CN201920571279U CN209887913U CN 209887913 U CN209887913 U CN 209887913U CN 201920571279 U CN201920571279 U CN 201920571279U CN 209887913 U CN209887913 U CN 209887913U
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Abstract
The utility model provides a cutting device of solar cell silicon chip belongs to solar cell silicon chip cutting technical field. The cutting device for the solar cell silicon wafer comprises a base, a bearing table, a shell, a material taking door, a fixing part, a cutter, a pushing part, an active carbon filter screen and an air blower. The utility model provides a plummer bears the weight of the silicon chip, the mounting is fixed the silicon chip on the plummer, the impeller promotes the cutter and cuts the silicon chip towards the direction motion that is close to the silicon chip so that the cutter, the impeller drives the cutter and moves towards the direction of keeping away from the silicon chip after having cut, the air-blower inhales the outside air and bloies the air towards the direction of silicon chip, can give the silicon chip cooling, the radiating efficiency is higher, blow to active carbon filter screen department with waste gas, the active carbon filter screen filters waste gas, the shell lid closes in the base, avoid waste gas to waft in the air, the polluted environment, after the cutting is accomplished, it takes out the silicon chip to open the bin gate of getting, and is easy and simple to handle.
Description
Technical Field
The utility model belongs to the technical field of solar cell silicon chip cutting, a cutting device of solar cell silicon chip is related to.
Background
The solar cell panel is a device which directly or indirectly converts solar radiation energy into electric energy through a photoelectric effect or a photochemical effect by absorbing sunlight, and most of the solar cell panels are made of silicon, but the manufacturing cost is high, so that the universal use of the solar cell panel has certain limitation. Currently, crystalline silicon materials (including polysilicon and monocrystalline silicon) are the most prominent photovoltaic materials, have a market share of 90% or more, and are still the mainstream materials of solar cells for a long period of time in the future. The existing solar cell silicon wafer can generate high temperature and smoke in the process of being cut, the silicon wafer can be damaged by continuous high temperature, and the smoke can also pollute the environment.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the above-mentioned problem that prior art exists, provide a cutting device of solar cell silicon chip, the utility model aims to solve the technical problem that: how to provide a solar cell silicon wafer cutting device which can cool and remove waste gas when cutting a silicon wafer.
The purpose of the utility model can be realized by the following technical proposal:
the utility model provides a cutting device of solar cell silicon chip, including the base, set up on the base, a plummer for bearing the weight of the silicon chip, a shell for covering the base, set up in getting the bin gate of shell one end, a mounting for fixing the silicon chip when the silicon chip is arranged in on the plummer, a cutter for cutting the silicon chip, a direction motion for promoting the cutter to move towards being close to the silicon chip, drive the cutter after the cutting and move towards the direction of keeping away from the silicon chip, set up in plummer one side, one end is connected in the shell, the other end is connected in the base, an active carbon filter screen for filtering the waste gas that produces by the cutter cutting silicon chip and an air-blower for inhaling the outside air and bloating the air towards the direction of silicon chip, the air-supply line of air-blower cup.
Preferably, the air blower and the activated carbon filter screen are symmetrically arranged on two sides of the cutter.
Preferably, the number of the fixing pieces is at least 2, and the fixing pieces are symmetrically arranged on two sides of the bearing table.
Preferably, the fixing part comprises a support arranged on the bearing table and a pressing block hinged to the top end of the support and used for applying pressure to the silicon wafer to fix the silicon wafer when the silicon wafer is placed on the bearing table.
Preferably, the pushing member comprises an air cylinder, a first supporting rod and a second supporting rod, wherein one end of the air cylinder is connected with the cutter and used for pushing the cutter to move towards the direction close to the silicon wafer and driving the cutter to move towards the direction away from the silicon wafer after cutting, one end of the first supporting rod is connected with the other end of the air cylinder, one end of the second supporting rod is connected with the base, and the other end of the second supporting rod is connected with the first supporting.
Preferably, the base is provided with a clamping groove, and the bottom end of the shell is provided with a clamping portion used for being clamped in the clamping groove.
Preferably, one end of the material taking door is hinged to the shell.
Preferably, a filtering area and an exhaust area are formed between the activated carbon filter screen and the casing, and the first vacuum pump is arranged on the casing and used for reducing the air pressure of the filtering area so that the gas in the exhaust area moves towards the direction close to the activated carbon filter screen until the gas passes through the activated carbon filter screen.
Preferably, the plummer level sets up, the cutter perpendicular to the plummer, first bracing piece is on a parallel with the plummer, second bracing piece perpendicular to plummer, the plummer welds in the base, the second bracing piece welds in the base.
Preferably, the first support rod is a telescopic rod.
The utility model provides a plummer bears the weight of the silicon chip, the mounting is fixed the silicon chip on the plummer, the impeller promotes the cutter and cuts the silicon chip towards the direction motion that is close to the silicon chip, the impeller drives the cutter and moves towards the direction of keeping away from the silicon chip after having cut, the air-blower inhales the outside air and bloies out the air towards the direction of silicon chip, can give the silicon chip cooling, the radiating efficiency is higher, simultaneously can blow waste gas to active carbon filter screen department, the active carbon filter screen filters waste gas, it is better to clear away the waste gas effect, the shell lid fits the base, avoid waste gas to fly away in the air, the polluted environment, after the cutting is accomplished, it takes out the silicon chip to open the access door, and is easy and simple to handle, and.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a schematic structural view of the base and the housing of the present invention when they are separated.
In the figure: 1-base, 11-clamping groove, 2-shell, 21-clamping part, 22-material taking door, 3-bearing table, 4-fixing piece, 41-pressing block, 42-support, 5-cutter, 6-pushing piece, 61-air cylinder, 62-first supporting rod, 63-second supporting rod, 7-air blower, 71-air inlet pipe, 8-activated carbon filter screen and 9-first vacuum pump.
Detailed Description
The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
Referring to fig. 1 and 2, the cutting apparatus for solar cell silicon wafer in this embodiment includes a base 1, a carrying platform 3 disposed on the base 1 for carrying the silicon wafer, a casing 2 for covering the base 1, a material taking door 22 disposed at one end of the casing 2, a fixing member 4 for fixing the silicon wafer when the silicon wafer is disposed on the carrying platform 3, a cutter 5 for cutting the silicon wafer, the silicon wafer cutting device comprises a pushing piece 6, an active carbon filter screen 8 and an air blower 7, wherein the pushing piece 6 is used for pushing a cutter 5 to move towards the direction close to a silicon wafer and driving the cutter 5 to move towards the direction far away from the silicon wafer after cutting, the active carbon filter screen 8 is arranged on one side of a bearing table 3, one end of the active carbon filter screen is connected to a shell 2, the other end of the active carbon filter screen is connected to a base 1 and used for filtering waste gas generated when the cutter 5 cuts the silicon wafer, the air blower 7 is used for sucking outside air and blowing the air.
Here, plummer 3 bears the weight of the silicon chip, mounting 4 fixes the silicon chip on plummer 3, impeller 6 promotes cutter 5 and moves towards the direction that is close to the silicon chip so that cutter 5 cuts the silicon chip, impeller 6 drives cutter 5 and moves towards the direction of keeping away from the silicon chip after cutting, air-blower 7 inhales the outside air and bloies out the air towards the direction of silicon chip, can cool down for the silicon chip, the radiating efficiency is higher, can blow waste gas to active carbon filter screen 8 department simultaneously, active carbon filter screen 8 filters waste gas, it is better to clear away the waste gas effect, shell 2 covers in base 1, avoid waste gas to waft scattered in the air, pollute the environment, after the cutting is accomplished, open and get bin gate 22 and take out the silicon chip, and is simple and convenient to operate, and has a simple structure.
The air blower 7 and the activated carbon filter screen 8 can be symmetrically arranged on two sides of the cutter 5, and the efficiency of blowing the waste gas to the activated carbon filter screen 8 by the air blower 7 is improved.
The number of the fixing pieces 4 can be at least 2, and the fixing pieces 4 can be symmetrically arranged on two sides of the bearing platform 3.
The fixing member 4 may include a support 42 disposed on the susceptor 3 and a pressing block 41 hinged to a top end of the support 42 to apply pressure to the silicon wafer when the silicon wafer is placed on the susceptor 3 to fix the silicon wafer.
The pushing member 6 may include a cylinder 61 having one end connected to the cutter 5 for pushing the cutter 5 to move toward the silicon wafer and moving the cutter 5 away from the silicon wafer after cutting, a first support rod 62 having one end connected to the other end of the cylinder 61, and a second support rod 63 having one end connected to the base 1 and the other end connected to the first support rod 62. The second support bar 63 may be welded to the base 1.
Referring to fig. 2, a slot 11 may be disposed on the base 1, and a clamping portion 21 for clamping the slot 11 is disposed at the bottom end of the housing 2.
The take-out door 22 may be hinged at one end to the housing 2.
A filtering area and an exhaust gas area can be formed between the activated carbon filter screen 8 and the shell 2, the filtering area is arranged between the activated carbon filter screen 8 and the shell 2 far away from one side of the air blower 7, the exhaust gas area is arranged between the activated carbon filter screen 8 and the shell 2 near one side of the air blower 7, and the air-pressure-reducing device can further comprise a first vacuum pump 9 which is arranged on the shell 2 and used for reducing the air pressure of the filtering area so that the gas in the exhaust gas area moves towards the direction near the activated carbon filter screen 8 until the gas passes through the activated carbon filter screen 8.
The plummer 3 can the level setting, and cutter 5 perpendicular to plummer 3, first bracing piece 62 are on a parallel with plummer 3, and second bracing piece 63 is perpendicular to plummer 3, and plummer 3 welds in base 1, and second bracing piece 63 welds in base 1.
The first support bar 62 may be a telescopic bar, so that the distance between the base 1 and the cutting knife 5 can be changed, and the position of the cutting knife 5 can be changed by extending and retracting the first support bar 62.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (10)
1. A cutting device for solar cell silicon wafers is characterized in that: comprises a base (1), a bearing platform (3) arranged on the base (1) and used for bearing a silicon wafer, a shell (2) used for covering the base (1), a material taking door (22) arranged at one end of the shell (2), a fixing piece (4) used for fixing the silicon wafer when the silicon wafer is arranged on the bearing platform (3), a cutter (5) used for cutting the silicon wafer, a pushing piece (6) used for pushing the cutter (5) to move towards the direction close to the silicon wafer and driving the cutter (5) to move towards the direction far away from the silicon wafer after cutting, an active carbon filter screen (8) arranged at one side of the bearing platform (3), one end of which is connected with the shell (2), the other end of which is connected with the base (1), and an air blower (7) used for sucking external air and blowing out the air towards the direction of the silicon wafer, an air inlet pipe (71) of the air blower (7) is sleeved on the shell (2).
2. The solar cell silicon wafer cutting device according to claim 1, wherein: the air blower (7) and the activated carbon filter screen (8) are symmetrically arranged on two sides of the cutter (5).
3. The solar cell silicon wafer dicing apparatus according to claim 1 or 2, wherein: the number of the fixing pieces (4) is at least 2, and the fixing pieces (4) are symmetrically arranged on two sides of the bearing platform (3).
4. The solar cell silicon wafer dicing apparatus according to claim 1 or 2, wherein: the fixing piece (4) comprises a support (42) arranged on the bearing table (3) and a pressing block (41) hinged to the top end of the support (42) and used for applying pressure to the silicon wafer to fix the silicon wafer when the silicon wafer is placed on the bearing table (3).
5. The solar cell silicon wafer dicing apparatus according to claim 1 or 2, wherein: the pushing piece (6) comprises an air cylinder (61) with one end connected with the cutter (5) and used for pushing the cutter (5) to move towards the direction close to the silicon wafer and driving the cutter (5) to move towards the direction far away from the silicon wafer after cutting, a first supporting rod (62) with one end connected with the other end of the air cylinder (61), and a second supporting rod (63) with one end connected with the base (1) and the other end connected with the first supporting rod (62).
6. The solar cell silicon wafer dicing apparatus according to claim 1 or 2, wherein: the base (1) is provided with a clamping groove (11), and the bottom end of the shell (2) is provided with a clamping portion (21) used for being clamped in the clamping groove (11).
7. The solar cell silicon wafer dicing apparatus according to claim 1 or 2, wherein: one end of the material taking door (22) is hinged to the shell (2).
8. The solar cell silicon wafer dicing apparatus according to claim 1 or 2, wherein: a filtering area and an exhaust area are formed between the activated carbon filter screen (8) and the shell (2), and the device also comprises a first vacuum pump (9) which is arranged on the shell (2) and used for reducing the air pressure of the filtering area so as to enable the gas in the exhaust area to move towards the direction close to the activated carbon filter screen (8) until the gas passes through the activated carbon filter screen (8).
9. The solar cell silicon wafer cutting device according to claim 5, wherein: plummer (3) level sets up, cutter (5) perpendicular to plummer (3), first bracing piece (62) are on a parallel with plummer (3), second bracing piece (63) perpendicular to plummer (3), plummer (3) weld in base (1), second bracing piece (63) weld in base (1).
10. The solar cell silicon wafer cutting device according to claim 5, wherein: the first support rod (62) is a telescopic rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920571279.7U CN209887913U (en) | 2019-04-25 | 2019-04-25 | Cutting device for solar cell silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920571279.7U CN209887913U (en) | 2019-04-25 | 2019-04-25 | Cutting device for solar cell silicon wafer |
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| Publication Number | Publication Date |
|---|---|
| CN209887913U true CN209887913U (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920571279.7U Active CN209887913U (en) | 2019-04-25 | 2019-04-25 | Cutting device for solar cell silicon wafer |
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| CN (1) | CN209887913U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109955397A (en) * | 2019-04-25 | 2019-07-02 | 浙江贝盛光伏股份有限公司 | A kind of cutter device of silicon chip of solar cell |
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2019
- 2019-04-25 CN CN201920571279.7U patent/CN209887913U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109955397A (en) * | 2019-04-25 | 2019-07-02 | 浙江贝盛光伏股份有限公司 | A kind of cutter device of silicon chip of solar cell |
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