CN215824558U - Silicon wafer cutting machine capable of collecting cutting dust - Google Patents

Silicon wafer cutting machine capable of collecting cutting dust Download PDF

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Publication number
CN215824558U
CN215824558U CN202121561909.6U CN202121561909U CN215824558U CN 215824558 U CN215824558 U CN 215824558U CN 202121561909 U CN202121561909 U CN 202121561909U CN 215824558 U CN215824558 U CN 215824558U
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fixedly connected
silicon wafer
shell
bottom plate
dust
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CN202121561909.6U
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周伟
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Suzhou Pufengxin Electronic Technology Co ltd
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Suzhou Pufengxin Electronic Technology Co ltd
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Abstract

The utility model discloses a silicon wafer cutting machine capable of collecting cutting dust, which comprises a bottom plate, wherein the top of the bottom plate is fixedly connected with a shell, fans are arranged on two sides of the top of the bottom plate in a penetrating mode, a placing plate is arranged on the top of the bottom plate and positioned at the bottom of an inner cavity of the shell, a groove is formed in the top of the placing plate, and through holes are formed in two sides of the top of the placing plate and positioned right above the fans. The silicon wafer cutting machine has the advantages of collecting cutting dust through the matched use of the bottom plate, the placing plate, the pressing and holding plate, the fixing frame, the shell, the flat pipe, the purifying box, the dust collection fan, the hydraulic cylinder, the groove, the fan, the dust collection cover, the coarse filter screen, the active carbon screen plate, the HEPA filter screen and the limiting baffle, solves the problems that the existing silicon wafer cutting machine can generate dust and a large amount of smoke dust in the cutting process, toxic gas is carried in the silicon wafer cutting machine, the collection is inconvenient, and the damage to a human body can be caused when the silicon wafer cutting machine is inhaled by the human body.

Description

Silicon wafer cutting machine capable of collecting cutting dust
Technical Field
The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer cutting machine capable of collecting cutting dust.
Background
The silicon element with the content of 25.8 percent in the crust provides an inexhaustible source for the production of monocrystalline silicon, and as the silicon element is one of the elements with the most abundant reserves in the crust, for the products of solar cells which are destined to enter the large-scale market, the reserve advantage is also one of the reasons for the silicon to become the main material of photovoltaic.
The silicon wafer cutting machine needs to be cut in the process of processing the silicon wafer, dust and a large amount of smoke and dust can be generated in the cutting process of the existing silicon wafer cutting machine, toxic gas is carried in the silicon wafer cutting machine, the silicon wafer cutting machine is inconvenient to collect, and the silicon wafer cutting machine is inhaled by a human body and can cause harm to the human body.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a silicon wafer cutting machine capable of collecting cutting dust, which has the advantage of collecting cutting dust, solves the problems that the existing silicon wafer cutting machine can generate dust and a large amount of smoke dust in the cutting process, and is inconvenient to collect because toxic gas is carried in the silicon wafer cutting machine, and can cause harm to human bodies because the toxic gas is inhaled by the human bodies.
In order to achieve the purpose, the utility model provides the following technical scheme: a silicon wafer cutting machine capable of collecting cutting dust comprises a bottom plate, wherein a shell is fixedly connected to the top of the bottom plate, fans are installed on two sides of the top of the bottom plate in a penetrating mode, a placing plate is arranged on the top of the bottom plate and located at the bottom of an inner cavity of the shell, a groove is formed in the top of the placing plate, through holes are formed in two sides of the top of the placing plate and located right above the fans, fixing frames are fixedly connected to four corners of the top of the placing plate, a hydraulic cylinder is fixedly connected to the bottom of one side of each fixing frame, a pressing and holding plate is fixedly connected between bottoms of the hydraulic cylinders on the front side and the rear side, opposite to each other, servo motors are fixedly connected to two sides of the back surface of the shell, the front side of the output end of each servo motor penetrates through the inner cavity of the shell and is fixedly connected with a threaded rod, a threaded sleeve is sleeved on the surface of the threaded rod, and a linear motor is fixedly connected between one side, which is opposite to the two threaded sleeves, linear motor's removal end fixedly connected with laser cutting head, the rear side fixedly connected with dust absorption fan at shell top, the play end intercommunication of dust absorption fan has the purifying box, the inner chamber of purifying box is from last to lower fixedly connected with coarse filtration net, active carbon otter board and HEPA filter screen in proper order, dust absorption fan's the end intercommunication that advances has flat pipe, the bottom intercommunication of flat pipe has the suction hood, the bottom of suction hood runs through to shell inner chamber's top.
Preferably, the four corners of the bottom plate are fixedly connected with supporting legs, the bottom of each supporting leg is fixedly connected with a supporting seat, and the front surface of the shell is provided with a protective door.
Preferably, the both sides of placing the board bottom are the equal fixedly connected with slider, the both sides at bottom plate top just are located the slider and have seted up the spout under, the bottom of slider extends to the inner chamber of spout and is sliding contact rather than the inner wall.
Preferably, one side of the front surface of the bottom plate, which is located on the sliding groove, is movably connected with a limiting baffle through a rotating shaft, the front side of the sliding block and the front side of the bottom plate are located on the same plane, and the rear side of the limiting baffle is in contact with the front side of the bottom plate.
Preferably, the left and right sides of shell just is located the equal fixedly connected with backup pad of front side of threaded rod, the front side of threaded rod passes through the front side swing joint of bearing and backup pad.
Preferably, the top of laser cutting head is provided with the power cord, and the top of power cord runs through to the top of shell, and the top of shell runs through to be seted up with the round hole that the power cord cooperation was used, the positive surface of purifying box is provided with sealing door.
Preferably, the bottom of the left side of the purifying box is communicated with an air outlet pipe, and the outlet end of the dust collection fan is communicated with the top of the right side of the purifying box.
Compared with the prior art, the utility model has the following beneficial effects:
1. the silicon wafer cutting machine has the advantages of collecting cutting dust through the matched use of the bottom plate, the placing plate, the pressing and holding plate, the fixing frame, the shell, the flat pipe, the purifying box, the dust collection fan, the hydraulic cylinder, the groove, the fan, the dust collection cover, the coarse filter screen, the active carbon screen plate, the HEPA filter screen and the limiting baffle, solves the problems that the existing silicon wafer cutting machine can generate dust and a large amount of smoke dust in the cutting process, toxic gas is carried in the silicon wafer cutting machine, the collection is inconvenient, and the damage to a human body can be caused when the silicon wafer cutting machine is inhaled by the human body.
2. The silicon wafer cutting device has the advantages that the groove is used, the space can be reserved for cutting a silicon wafer, the placing plate can be conveniently placed to slide through the use of the sliding block and the sliding groove, the sliding block can be fixed in the inner cavity of the sliding groove through the use of the limiting baffle plate to fix the placing plate, the threaded rod can be supported through the use of the supporting plate, the stability of the silicon wafer during rotation is improved, the wind blown out by the fan can be conveniently enabled to pass through the placing plate through the use of the through hole, and the silicon wafer can be pressed and held through the use of the hydraulic cylinder and the pressing and holding plate, so that the stability of the silicon wafer during cutting is improved.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of the mounting plate of the present invention;
FIG. 3 is a perspective view of the fan of the present invention;
FIG. 4 is a perspective view of the dust hood of the present invention;
FIG. 5 is a perspective view of the linear motor of the present invention;
fig. 6 is a perspective view of the purification box of the present invention.
In the figure: 1 bottom plate, 2 spouts, 3 place the board, 4 sliders, 5 press and hold board, 6 mounts, 7 backup pads, 8 shells, 9 threaded rods, 10 flat pipes, 11 laser cutting heads, 12 purifying boxes, 13 dust absorption fans, 14 linear motors, 15 hydraulic cylinders, 16 through holes, 17 grooves, 18 fans, 19 dust hoods, 20 servo motors, 21 coarse filter screens, 22 active carbon screen boards, 23HEPA filter screens, 24 limit baffles, 25 thread bushings.
Detailed Description
Referring to fig. 1-6, a silicon wafer cutting machine capable of collecting cutting dust comprises a base plate 1, a shell 8 is fixedly connected to the top of the base plate 1, fans 18 are installed on both sides of the top of the base plate 1 in a penetrating manner, a placing plate 3 is arranged on the top of the base plate 1 and located at the bottom of an inner cavity of the shell 8, a groove 17 is formed in the top of the placing plate 3, a space can be reserved for cutting a silicon wafer by using the groove 17, through holes 16 are formed in both sides of the top of the placing plate 3 and located right above the fans 18, air blown out by the fans 18 can conveniently pass through the placing plate 3 by using the through holes 16, fixing frames 6 are fixedly connected to four corners of the top of the placing plate 3, the fixing frames 6 are L-shaped plates, hydraulic cylinders 15 are fixedly connected to the bottom of one side of the fixing frames 6, the silicon wafer can be pressed and held by using the hydraulic cylinders 15 and the pressing plates 5, and the stability of the silicon wafer during cutting is improved, the bottom of a hydraulic cylinder 15 on two opposite sides in the front and back is fixedly connected with a pressing plate 5, two sides of the back surface of a shell 8 are fixedly connected with a servo motor 20, the model of the servo motor 20 is CM1-C-23L20C, the front side of the output end of the servo motor 20 penetrates into the inner cavity of the shell 8 and is fixedly connected with a threaded rod 9, the surface thread of the threaded rod 9 is sleeved with a threaded sleeve 25, a linear motor 14 is fixedly connected between the two opposite sides of the threaded sleeves 25, the moving end of the linear motor 14 is fixedly connected with a laser cutting head 11, the back side of the top of the shell 8 is fixedly connected with a dust collection fan 13, the outlet end of the dust collection fan 13 is communicated with a purifying box 12, the inner cavity of the purifying box 12 is fixedly connected with a coarse filter screen 21, an active carbon screen plate 22 and a HEPA filter screen 23 from top to bottom in sequence, the inlet end of the dust collection fan 13 is communicated with a flat pipe 10, the bottom of the flat pipe 10 is communicated with a dust collection cover 19, the number of the dust hoods 19 is four, the dust hoods are uniformly distributed at the bottoms of the flat tubes 10, and the bottoms of the dust hoods 19 penetrate through the top of the inner cavity of the shell 8;
supporting legs are fixedly connected to four corners of the bottom plate 1, supporting seats are fixedly connected to the bottoms of the supporting legs, a protective door is arranged on the front surface of the shell 8, through the use of the protective door, the injury to workers during cutting can be avoided, and sealing treatment is performed between the protective door and the edge of the front side of the shell 8;
the two sides of the bottom of the placing plate 3 are fixedly connected with sliding blocks 4, sliding grooves 2 are formed in the two sides of the top of the bottom plate 1 and are located right below the sliding blocks 4, the bottoms of the sliding blocks 4 extend to the inner cavity of the sliding grooves 2 and are in sliding contact with the inner walls of the sliding grooves 2, and the placing plate 3 can conveniently slide through the use of the sliding blocks 4 and the sliding grooves 2;
a limit baffle 24 is movably connected to one side, located on the sliding chute 2, of the front surface of the bottom plate 1 through a rotating shaft, the front side of the sliding block 4 and the front side of the bottom plate 1 are located on the same plane, the rear side of the limit baffle 24 is in contact with the front side of the bottom plate 1, and the sliding block 4 can be fixed in the inner cavity of the sliding chute 2 through the use of the limit baffle 24, so that the placing plate 3 is fixed;
the supporting plates 7 are fixedly connected to the left side and the right side of the shell 8 and located in front of the threaded rod 9, the front side of the threaded rod 9 is movably connected with the front side of the supporting plate 7 through a bearing, and the threaded rod 9 can be supported through the supporting plate 7, so that the stability of the threaded rod 9 in rotation is improved;
the top of the laser cutting head 11 is provided with a power line, the top of the power line penetrates to the top of the shell 8, a round hole matched with the power line is formed in the top of the shell 8 in a penetrating mode, a sealing door is arranged on the front surface of the purifying box 12, the filtering component in the purifying box 12 can be conveniently cleaned and replaced through the sealing door, and the sealing door and the edge of the front side of the purifying box 12 are subjected to sealing treatment;
the bottom of the left side of the purifying box 12 is communicated with an air outlet pipe, a dustproof filter screen is arranged inside the air outlet pipe, and the outlet end of the dust collection fan 13 is communicated with the top of the right side of the purifying box 12;
through bottom plate 1, place board 3, press and hold board 5, mount 6, shell 8, flat pipe 10, purifying box 12, dust absorption fan 13, pneumatic cylinder 15, recess 17, fan 18, suction hood 19, coarse filtration net 21, active carbon otter board 22, HEPA filter screen 23 and limit baffle 24's cooperation is used, possess the advantage that can collect the cutting dust, it can produce dust and a large amount of smoke and dust at the in-process of cutting to have solved current silicon chip cutting machine, wherein still carrying toxic gas, inconvenient collection, it can also cause harm to the human body to inhale by the human body.
When the silicon wafer cutting machine is used, a silicon wafer is placed on the top of a placing plate 3, the silicon wafer is pushed into a shell 8 through the sliding of a sliding block 4 in a sliding groove 2 until the silicon wafer is completely pushed in, a limiting baffle plate 24 is rotated to the front of the sliding block 4 through a rotating shaft and limited in the sliding groove 2 to achieve the effect of fixing the placing plate 3, a pressing plate 5 is driven to descend through the extension of a hydraulic cylinder 15 until the bottom of the limiting baffle plate is tightly contacted with the top of the silicon wafer to achieve the fixing effect, a laser cutting head 11 is started, the left-right moving position of the laser cutting head 11 is controlled through a linear motor 14, a threaded rod 9 is driven to rotate through the output end of a servo motor 20, so that a threaded sleeve 25 moves back and forth on the surface of the threaded sleeve to achieve the adjustment of the front-back position of the laser cutting head 11, the laser cutting is carried out on the silicon wafer through the laser cutting head 11, and air is blown upwards through a fan 18 in the cutting process, make wind upwards blow the smoke and dust through-hole 16, simultaneously, dust absorption fan 13 convulsions, loop through suction hood 19 with the inside smoke and dust of shell 8, flat pipe 10, dust absorption fan 13 advances to hold and goes out to hold and get into purifying box 12 in, and loop through coarse filtration net 21, active carbon otter board 22 and HEPA filter screen 23 and filter the absorption to granule and harmful gas in the smoke and dust, and finally through going out tuber pipe exhaust gas purification, reach purifying effect, and the granule in the smoke and dust remains and collects on filtering component.
In summary, the following steps: this can collect silicon chip cutting machine of cutting dust, through bottom plate 1, place board 3, press and hold board 5, mount 6, shell 8, flat pipe 10, purifying box 12, dust absorption fan 13, pneumatic cylinder 15, recess 17, fan 18, suction hood 19, coarse filtration net 21, active carbon otter board 22, HEPA filter screen 23 and limit baffle 24's cooperation is used, it can produce dust and a large amount of smoke and dust at the in-process of cutting to have solved current silicon chip cutting machine, wherein still carrying toxic gas, inconvenient collection, it can also cause harm to the human body to be inhaled by the human body.

Claims (7)

1. The utility model provides a can collect silicon chip cutting machine of cutting dust which includes bottom plate (1), its characterized in that: the top of the bottom plate (1) is fixedly connected with a shell (8), fans (18) are installed on two sides of the top of the bottom plate (1) in a penetrating mode, a placing plate (3) is arranged on the top of the bottom plate (1) and located at the bottom of an inner cavity of the shell (8), a groove (17) is formed in the top of the placing plate (3), through holes (16) are formed in two sides of the top of the placing plate (3) and located right above the fans (18), fixing frames (6) are fixedly connected to four corners of the top of the placing plate (3), a hydraulic cylinder (15) is fixedly connected to the bottom of one side of each fixing frame (6), a pressing and holding plate (5) is fixedly connected between bottoms of the hydraulic cylinders (15) on two opposite sides in the front and back direction, servo motors (20) are fixedly connected to two sides of the back surface of the shell (8), and threaded rods (9) are fixedly connected to the front sides of output ends of the servo motors (20), the surperficial screw thread cover of threaded rod (9) is equipped with thread bush (25), fixedly connected with linear electric motor (14) between one side that two thread bushes (25) are relative, the removal end fixedly connected with laser cutting head (11) of linear electric motor (14), rear side fixedly connected with dust absorption fan (13) at shell (8) top, the play end intercommunication of dust absorption fan (13) has purifying box (12), the inner chamber of purifying box (12) is from last to lower fixedly connected with coarse filtration net (21), active carbon otter board (22) and HEPA filter screen (23) in proper order, the end intercommunication that advances of dust absorption fan (13) has flat pipe (10), the bottom intercommunication of flat pipe (10) has suction hood (19), the top to shell (8) inner chamber is run through to the bottom of suction hood (19).
2. The silicon wafer cutting machine capable of collecting cutting dust according to claim 1, wherein: the all fixedly connected with supporting legs in four corners of bottom plate (1) bottom, the bottom fixedly connected with supporting seat of supporting leg, the positive surface of shell (8) is provided with the guard gate.
3. The silicon wafer cutting machine capable of collecting cutting dust according to claim 1, wherein: the novel multifunctional table is characterized in that sliders (4) are fixedly connected to two sides of the bottom of the placing plate (3), sliding grooves (2) are formed in two sides of the top of the bottom plate (1) and located under the sliders (4), and the bottoms of the sliders (4) extend to inner cavities of the sliding grooves (2) and are in sliding contact with the inner walls of the sliding grooves.
4. The silicon wafer cutting machine capable of collecting cutting dust according to claim 3, wherein: the front surface of the bottom plate (1) and one side of the bottom plate, which is positioned on the sliding groove (2), are movably connected with a limit baffle (24) through a rotating shaft, the front side of the sliding block (4) and the front side of the bottom plate (1) are positioned on the same plane, and the rear side of the limit baffle (24) is contacted with the front side of the bottom plate (1).
5. The silicon wafer cutting machine capable of collecting cutting dust according to claim 1, wherein: the left and right sides of shell (8) just are located equal fixedly connected with backup pad (7) of front side of threaded rod (9), the front side of threaded rod (9) passes through the front side swing joint of bearing and backup pad (7).
6. The silicon wafer cutting machine capable of collecting cutting dust according to claim 1, wherein: the top of laser cutting head (11) is provided with the power cord, and the top of power cord runs through to the top of shell (8), and the top of shell (8) runs through and sets up the round hole that uses with the power cord cooperation, the positive surface of purifying box (12) is provided with sealing door.
7. The silicon wafer cutting machine capable of collecting cutting dust according to claim 1, wherein: the bottom on the left side of the purifying box (12) is communicated with an air outlet pipe, and the outlet end of the dust collection fan (13) is communicated with the top on the right side of the purifying box (12).
CN202121561909.6U 2021-07-09 2021-07-09 Silicon wafer cutting machine capable of collecting cutting dust Active CN215824558U (en)

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Application Number Priority Date Filing Date Title
CN202121561909.6U CN215824558U (en) 2021-07-09 2021-07-09 Silicon wafer cutting machine capable of collecting cutting dust

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Application Number Priority Date Filing Date Title
CN202121561909.6U CN215824558U (en) 2021-07-09 2021-07-09 Silicon wafer cutting machine capable of collecting cutting dust

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Publication Number Publication Date
CN215824558U true CN215824558U (en) 2022-02-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116851936A (en) * 2023-08-09 2023-10-10 合肥市强联磁电科技有限公司 High-precision cutting device for Ru-Fe-B magnet production and processing and use method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116851936A (en) * 2023-08-09 2023-10-10 合肥市强联磁电科技有限公司 High-precision cutting device for Ru-Fe-B magnet production and processing and use method

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