CN209881885U

CN209881885U - Lens assembly, photosensitive assembly and camera module

Info

Publication number: CN209881885U
Application number: CN201822222747.8U
Authority: CN
Inventors: 褚水佳; 诸海江
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2018-12-28
Filing date: 2018-12-28
Publication date: 2019-12-31
Anticipated expiration: 2028-12-28

Abstract

The utility model provides a camera lens subassembly, photosensitive assembly and camera module and assembly method thereof. The camera lens subassembly is suitable for and a sensitization subassembly equipment one camera module, includes: the optical lens group is arranged in the lens barrel to form a lens; the lens barrel is fixed on the inner side of the support piece through dispensing in two opposite first areas between the lens barrel and the support piece, wherein the first areas correspond to long edge areas of a photosensitive chip of the photosensitive assembly so as to limit deviation in the sensitive X direction.

Description

Lens assembly, photosensitive assembly and camera module

Technical Field

The utility model relates to a module field of making a video recording, more specifically relate to a camera lens subassembly, photosensitive assembly and the module of making a video recording to reduce the deformation of toasting in-process glue and to the influence of formation of image.

Background

In recent years, in order to meet the demand of people for photographing, a camera has become one of necessary accessories of terminal equipment such as a mobile phone. Moreover, as the requirement of people on shooting is continuously improved, the demand is more and more diversified, and a multi-array shooting module is also produced, for example, an array module with wide-angle and long focus is obtained.

Currently, most camera modules include a lens assembly, a lens holder, a color filter, a photosensitive device, and a circuit board. The assembly process of the camera module generally electrically connects and attaches the photosensitive chip to the circuit board, the lens holder is attached to the circuit board, and the color filter is attached to the lens holder, thereby forming a photosensitive assembly. In a fixed focus camera module, the lens assembly is generally assembled by an optical lens assembly, a lens barrel and a support. In the auto-focusing camera module, the lens assembly is generally supported by an actuator as the support of the lens barrel. The lens assembly is supported on the top side of the photosensitive assembly to finally form the camera module. In the assembling process, all the components are mostly exposed and fixed in a dispensing mode.

In the actual assembly process, the assembly tolerance of each component is accumulated continuously along with the stacking of each component. In order to realize good matching of the lens assembly and the photosensitive chip, during assembly, the support piece of the lens assembly is arranged on the top side of the photosensitive assembly, and then an AA (advanced extensible) process is adopted to assemble a lens (namely the lens cone provided with the optical lens assembly) and the support piece so as to reduce tolerance. That is, by lighting the photosensitive chip, the photosensitive assembly is fixed, the mechanical arm clamping lens is adjusted, and a standard target is photographed and opened. And obtaining the optimal assembly position of the lens and the support piece by operating the defocusing curve, and fixing the relative positions of the lens and the support piece by dispensing, curing and fixing.

In the prior art, the photosensitive chip and a photosensitive area thereof are both rectangular, and an imaging surface of an optical system of the lens assembly is circular. In order to improve the utilization rate of the photosensitive area of the photosensitive chip, the light area of the optical system reaching the photosensitive area needs to cover the photosensitive area completely, as shown in fig. 1. It can be seen that the deviatable value of the imaging surface of the optical system in the long side direction (X direction) of the photosensitive chip is smaller than that in the wide side direction (Y direction). Slight shift and tilt in the X direction may cause the imaging surface of the optical system to not cover the photosensitive area well, resulting in image blur. In other words, the photosensitive area is more sensitive to the shift or tilt of the photosensitive chip in the X direction.

In order to enhance the fixing strength between the lens and the supporting member, four-point dispensing methods with uniform and symmetrical distribution are generally adopted in the prior art. After AA adjustment is carried out, and the optimal position of the lens relative to the support piece is subjected to dispensing and curing, the camera module needs to be baked in a back-end process. In the baking process, the glue can deform due to temperature rise and the like, and the lens is stressed in all directions due to the thermal expansion and the cold contraction of the lens assembly. The variation of different glue quantities in the same environment is different, the pulling force applied to the lens is different, and the lens is stressed unevenly, so that the lens deviates from the original assembly position. In some cases, the glue is pulled to crack at the place where the adhesive force of the glue is relatively small because the deformation of each glue dispensing position is different.

When the four-point dispensing mode is adopted, the lens and the supporting piece are dispensed in the corresponding areas of the two long side directions and the corresponding areas of the two short side directions of the photosensitive chip. At this moment, the positions for four-point dispensing are inconsistent in dispensing amount due to uneven dispensing, so that deformation and inconsistency of the dispensing positions in the baking process are caused, and even glue cracks are caused. As shown in fig. 2A and 2B, the positions indicated by the arrows are four-point dispensing positions commonly used in the prior art when the lens and the supporting member are mounted.

The glue cracking and deformation inconsistency can cause that the glue recovers the original state due to temperature reduction in the subsequent cooling process, the restoring force applied to the lens is different from the pulling force in the baking process, the lens cannot return to the original position, the lens deviates relative to the position of the supporting piece, the optical system deviates relative to the position of the photosensitive area, the two parts are in poor fit, and the imaging is unclear. Especially in the X direction of the photosensitive chip, which is sensitive to tilt and offset, the influence on the image formation is more severe.

Especially when glue breaks, the camera lens does not stick with glue, and naturally, in the process of cooling and recovering, the camera lens cannot be subjected to the restoring force from the glue. Therefore, during the baking process, the lens which is pushed to be deviated by the pulling force cannot be restored to the original position during the cooling process because the lens is not subjected to the corresponding restoring force, so that the lens and the support member in the final product are deviated.

This effect is more serious in the wide-angle camera module. On the one hand, the wide-angle camera module the photosensitive area is bigger than the common camera module, and the deviant value in the X direction is smaller. On the other hand, the deviation direction that the glue warp and lead to is inconsistent, can lead to the optical axis nonparallel of two modules in the array module or deviate from the calibration coordinate for two image matching degree of difficulty increase.

Similar problems exist between components that are combined by four-point glue dispensing except that the lens and the supporting member are offset due to deformation of glue, such as between the supporting member and the lens holder, between the lens holder and the circuit board, and between the photosensitive chip and the circuit board. Deformation of the glue between these components can shift the position of the optical imaging surface and the photosensitive area, thereby affecting the imaging quality.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a camera lens subassembly, photosensitive assembly and module of making a video recording, wherein the point of adopting between each subassembly of the module of making a video recording is glued the scheme and can be toasted the in-process and the cooling process, reduces the possibility that an optical system of avoiding the camera lens subassembly and photosensitive assembly's a sensitization chip produced the skew even, improves the product yield.

An object of the utility model is to provide a camera lens subassembly, sensitization subassembly and module of making a video recording, wherein the point that adopts between each subassembly of the module of making a video recording is glued the scheme and can be toasted the in-process and cooling process, reduces and avoid even optical system with sensitization chip produces the skew in the sensitive X direction of skew, improves the product yield.

Another object of the present invention is to provide a lens module, a photosensitive module and a camera module, wherein the glue between a supporting member of the lens module and a lens barrel allows both to produce the offset in the Y direction, and limits both to produce the offset in the X direction, thereby reducing the influence of the offset between the optical system and the photosensitive chip on the imaging.

Another object of the present invention is to provide a lens assembly, photosensitive assembly and camera module, wherein the supporting member and the glue between the lens barrel is set up between the two, with the long edge region correspondence of photosensitive chip, two relative first regions to allow both to produce the skew in the Y direction, restrict both to produce the skew in the X direction.

Another object of the present invention is to provide a lens module, a photosensitive module and a camera module, wherein the supporting member and the glue between the lens barrels are opposite, the first region of the coating region and the center of the lens module are substantially straight lines, and the straight lines are substantially overlapped in the Y direction.

Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module, wherein between the supporting member and the lens barrel, two opposite first regions are coated with glue with strong bonding force, so as to enhance the bonding strength between the two regions; and the second area corresponding to the short side area of the photosensitive chip is coated with glue with low bonding force or low deformation so as to achieve the dustproof effect.

Another object of the utility model is to provide a lens subassembly, photosensitive assembly and module of making a video recording, wherein support piece with glue between the lens cone is set up respectively in between the two, adjacent a set of first region and second region, makes support piece with only unilateral atress in X direction and Y direction between the lens cone, avoid among the prior art four point glue to glue the emergence of dragging the phenomenon each other, reduce the influence of glue deformation to the skew, avoid the emergence of glue fracture.

Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module, wherein the supporting member and the glue between the lens barrels are respectively disposed between the two, adjacent to each other, in the middle of the first region and the second region, so as to reduce and avoid the possibility of the occurrence of the offset.

Another object of the utility model is to provide a lens subassembly, photosensitive assembly and camera module, wherein support piece with glue between the photosensitive assembly allows both to produce the skew in the Y direction, and restriction both produce the skew in the X direction to reduce the influence that the skew caused formation of image between the optical system of lens subassembly and photosensitive assembly's the photosensitive chip.

Another object of the present invention is to provide a lens assembly, photosensitive assembly and camera module, wherein the supporting member and the glue between the photosensitive assembly is set up in between the two, two relative first regions to allow both to produce the skew in the Y direction, restrict both to produce the skew in the X direction.

Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module, wherein between the supporting member and the photosensitive assembly, two opposite first regions are coated with glue with strong bonding force, so as to enhance the bonding strength between the two regions; and the second area is coated with glue with low bonding force or low deformation to achieve the dustproof effect.

Another object of the utility model is to provide a lens subassembly, photosensitive component and module of making a video recording, wherein support piece with glue between the photosensitive component is set up respectively in between the two, adjacent a set of first region and second region, makes support piece with only unilateral atress in X direction and Y direction between the photosensitive component avoids pulling the emergence of phenomenon each other in four point glue is glued among the prior art, reduces the influence of glue deformation to the skew, avoids the emergence of glue fracture.

Another object of the present invention is to provide a lens module, photosensitive assembly and camera module, wherein the glue between a circuit board of photosensitive assembly and a lens holder allows both to produce the skew in the Y direction, and both are restricted to produce the skew in the X direction, thereby reducing the influence of the skew between the optical system of lens module and the photosensitive chip of photosensitive assembly on imaging.

Another object of the present invention is to provide a lens assembly, photosensitive assembly and camera module, wherein the circuit board and glue between the lens base is set up in between the two, two relative first regions to allow both to produce the skew in the Y direction, restrict both to produce the skew in the X direction.

Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module, wherein two opposite first regions are coated with glue with strong bonding force between the circuit board and the lens holder to enhance the bonding strength between the two regions; and the second area is coated with glue with low bonding force or low deformation to achieve the dustproof effect.

Another object of the utility model is to provide a lens subassembly, photosensitive assembly and module of making a video recording, wherein the circuit board with glue between the microscope base is set up respectively in between the two, adjacent a set of first region and second region, makes the circuit board with only unilateral atress in X direction and Y direction between the microscope base, avoid among the prior art four point glue in the emergence of dragging the phenomenon each other, reduce the influence of glue deformation to the skew, avoid the emergence of glue fracture.

Another object of the utility model is to provide a lens subassembly, photosensitive assembly and camera module, wherein the photosensitive assembly photosensitive chip with glue between the circuit board allows both to produce the skew in the Y direction, and restriction both produce the skew in the X direction to reduce the influence that the skew caused formation of image between the photosensitive chip to the optical system of lens subassembly and photosensitive assembly.

Another object of the present invention is to provide a lens assembly, photosensitive assembly and camera module, wherein the photosensitive chip and glue between the circuit boards are set up in between the two, two relative first regions to allow both to produce the skew in the Y direction, restrict both to produce the skew in the X direction.

Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module, wherein two opposite first regions are coated with glue with strong bonding force between the photosensitive chip and the circuit board to enhance the bonding strength between the two regions; and the second area is coated with glue with low bonding force or low deformation to achieve the dustproof effect.

Another object of the utility model is to provide a lens subassembly, photosensitive assembly and module of making a video recording, wherein the photosensitive chip with glue between the circuit board is set up respectively in between the two, adjacent a set of first region and second region, makes the photosensitive chip with only unilateral atress in X direction and Y direction between the circuit board avoids pulling the emergence of phenomenon each other in four point glue is glued among the prior art, reduces the influence of glue deformation to the skew, avoids the emergence of glue fracture.

Another object of the utility model is to provide a camera lens subassembly, photosensitive assembly and module of making a video recording, wherein to a array camera module, especially the array camera module of wide angle extension burnt combination, adopt between its each subassembly the utility model discloses a point is glued the scheme and can be toasted the in-process, reduces and avoids its optical system and the photosensitive chip that corresponds to produce the skew in the more sensitive X direction of skew than ordinary camera module even, improves the product yield.

Another object of the utility model is to provide a camera lens subassembly, photosensitive component and module of making a video recording, wherein to a array camera module, especially the array camera module of wide angle extension burnt combination, adopt between its each subassembly the utility model discloses a point is glued the scheme and can be reduced and avoid glue to warp the skew that leads to and match between each image and produce the influence even.

Another object of the present invention is to provide a lens module, a photosensitive assembly and a camera module, wherein the supporting member and between the lens barrels, when the relative first region is coated with glue, the region that the second region corresponds has a dustproof glue coated thereon, for preventing the dust from entering inside the camera module.

Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module, wherein the supporting member and the dustproof glue between the lens barrels only contact with the outer side wall of the lens barrel, or only contact with the inner side wall of the supporting member, thereby bonding the dust in the gap between the outer side wall of the lens barrel and the inner side wall of the supporting member.

Another object of the present invention is to provide a lens module, a photosensitive assembly and a camera module, wherein the supporting member and the dustproof glue between the lens barrels are filled in the at least one dustproof groove of the inner side wall of the supporting member, and the distance between the outer side wall of the lens barrels is preset to bond the outer side wall of the lens barrels and the dust in the gap between the inner side walls of the supporting member.

Another object of the present invention is to provide a lens module, a photosensitive module and a camera module, wherein the supporting member and the dustproof glue between the lens barrels are filled in the at least one dustproof groove of the outer side wall of the lens barrel, and the distance between the inner side walls of the supporting member is preset, and the supporting member is bonded to the outer side wall of the lens barrel and the dust in the gap between the inner side walls of the supporting member.

Another object of the utility model is to provide a camera lens subassembly, photosensitive assembly and camera module, wherein support piece with photosensitive assembly between the microscope base, when relative first region is scribbled glue, the second region is scribbled and is had dustproof gluey for prevent that the dust from getting into inside the camera module.

Another object of the utility model is to provide a camera lens subassembly, photosensitive assembly and camera module, wherein be in the circuit board with between the microscope base, when relative first region is scribbled glue, the second region is scribbled there is dustproof gluey for prevent that the dust from getting into inside the camera module.

Another object of the present invention is to provide a lens module, a photosensitive module and a camera module, wherein the circuit board and between the photosensitive chips, when the relative first region is coated with glue, the second region is covered with a dustproof glue for preventing dust from entering inside the camera module.

Another object of the utility model is to provide a lens subassembly, photosensitive assembly and module of making a video recording, wherein support piece with between the lens cone, when relative first region is scribbled glue, adopt crisscross bellied structure, extension dust entering in the second region make a video recording the route of module to prevent that the dust from influencing the formation of image of photosensitive chip.

Another object of the utility model is to provide a lens subassembly, photosensitive assembly and module of making a video recording, wherein support piece with between the microscope base, when relative first region is scribbled glue, adopt crisscross bellied structure in the second region, the extension dust gets into the route of module of making a video recording to prevent that the dust from influencing the formation of image of photosensitive chip.

Another object of the utility model is to provide a camera lens subassembly, photosensitive assembly and module of making a video recording, wherein support piece with between the lens cone, only in the space is glued in the first region reservation point relative, seals the second region, avoids the dust to get into.

Another object of the utility model is to provide a camera lens subassembly, photosensitive assembly and module of making a video recording, wherein the point that adopts between each subassembly of the module of making a video recording scheme improves on not changing original design basis, both guarantees the camera lens with support piece's good combination guarantees the imaging quality of the module of making a video recording again.

According to an aspect of the utility model, the utility model discloses a lens subassembly is further provided, be suitable for and assemble into a camera module with a photosensitive assembly, include:

an optical lens group;

the optical lens group is arranged in the lens barrel to form a lens; and

and the lens barrel is fixed on the inner side of the support piece through two opposite first area glue dispensing between the lens barrel and the support piece so as to limit the lens barrel and the support piece from shifting in the X direction, wherein the first area corresponds to a long edge area of a photosensitive chip of the photosensitive assembly.

According to an embodiment of the present invention, the glue between the support member and the lens barrel is coated in the middle area of the first area opposite to the middle area between the support member and the lens barrel, respectively.

According to an embodiment of the present invention, the lens assembly further includes a dustproof glue, wherein the dustproof glue is coated on the lens barrel and two opposite second regions between the supporting members, wherein the second regions correspond to a short side region of a photosensitive chip of the photosensitive assembly.

According to an embodiment of the present invention, in at least two in one of the second regions, at least one dustproof slot is set up in support piece's inside wall, wherein dustproof glue is filled in dustproof slot, wherein dustproof glue the surface with the lateral wall interval of lens cone predetermines the distance, bonds the lateral wall of lens cone with the dust in clearance between support piece's the inside wall.

According to an embodiment of the present invention, in at least two in one of the second region, at least one dustproof slot is set up in the lateral wall of lens cone, wherein dustproof glue is filled in and is located the lateral wall the dustproof slot in, with support piece's inside wall interval default distance bonds the lateral wall of lens cone with the dust in clearance between support piece's the inside wall.

According to an embodiment of the present invention, in at least two in one of the second areas, the lateral wall of the lens barrel with the inside wall of the support member is provided with mutually staggered and mutually matched protrusions, forming a staggered protrusion structure, so as to extend the dust into the path of the camera module.

According to an embodiment of the present invention, the lens assembly further has a space for two-point glue, wherein two of the glue spaces are respectively formed in the lens barrel and the two opposite first regions between the supporting members, and the two opposite second regions are sealed.

According to the utility model discloses an on the other hand, the utility model discloses a lens subassembly is further provided, is suitable for and assembles into a camera module with a photosensitive assembly, include:

an optical lens group;

the optical lens group is arranged in the lens barrel to form a lens; and

and a support member, wherein the lens barrel is fixed on the inner side of the support member by dispensing a group of first areas and second areas between the lens barrel and the support member so as to limit the displacement of the lens barrel and the support member, wherein the first areas correspond to long side areas of a photosensitive chip of the photosensitive assembly, and the second areas correspond to short side areas of the photosensitive chip of the photosensitive assembly.

According to an embodiment of the present invention, the glue between the supporting member and the lens barrel is applied to a set of adjacent middle areas of the first area and the second area, respectively.

According to an embodiment of the present invention, the lens assembly further includes a dustproof glue, wherein the dustproof glue is coated on the first region and the second region adjacent to each other between the lens barrel and the supporting member.

According to an embodiment of the present invention, in at least another group adjacent the first region with one of the second regions, at least one dustproof groove is set in the inside wall of the supporting member, wherein the dustproof glue is filled in the dustproof groove, wherein the surface of the dustproof glue and the outside wall interval of the lens cone preset distance, bond the outside wall of the lens cone with the dust in the gap between the inside walls of the supporting member.

According to an embodiment of the present invention, in at least another group adjacent first region with one of the second region, at least one dustproof groove is set up in the lateral wall of lens cone, wherein dustproof glue is filled in and is located the lateral wall the dustproof inslot, with support piece's inside wall interval default distance, bond the lateral wall of lens cone with the dust in clearance between support piece's the inside wall.

According to an embodiment of the present invention, in at least another group adjacent the first region with the second region, the lateral wall of the lens cone with the inside wall of the support piece is provided with mutually staggered and mutually matched protrusions, forming a staggered protrusion structure, so as to prolong the dust entering the path of the camera module.

According to an embodiment of the present invention, the lens assembly further has a space for two-point glue, wherein two spaces for two-point glue are respectively formed between the lens barrel and the supporting member, one group of adjacent spaces are formed between the first region and the second region, and the other group of adjacent spaces are formed between the first region and the second region.

According to the utility model discloses an on the other hand, the utility model discloses a camera module is further provided, include:

a lens assembly as described above; and

a photosensitive assembly, wherein the photosensitive assembly comprises a photosensitive chip, a lens base and a circuit board, wherein

Sensitization chip electricity ground connection is in the circuit board, wherein the microscope base encircles sensitization chip, and attached in the circuit board, wherein the microscope base has an optical window, corresponding to sensitization chip's photosensitive area, wherein support piece supports the camera lens, corresponding to the optical window, wherein support piece by the microscope base extends.

According to an embodiment of the present invention, the support member is fixed to the mirror base top side by dispensing in two opposite first areas between the mirror base and the support member.

According to an embodiment of the invention, the support piece and the glue between the mirror base are coated along two long edges of the mirror base, respectively.

According to an embodiment of the present invention, the support member is fixed to the lens base top side by a set of adjacent first region and second region between the lens base and the support member.

According to an embodiment of the invention, the mirror base with between the support piece, be located one the glue of first region is followed the long limit coating of mirror base, and be located adjacent the glue of second region is followed the short edge coating of mirror base.

According to the utility model discloses an embodiment, the module of making a video recording further includes the dustproof glue, wherein the dustproof glue be coated in the microscope base with between the support piece, two relative second regions.

According to an embodiment of the present invention, the camera module further comprises a dustproof glue, wherein the dustproof glue is coated on the first region and the second region between the lens holder and the support member, which are adjacent to each other.

According to the utility model discloses an embodiment, at least one dustproof recess and the dustproof arch rather than matching set up in the microscope base with support piece, wherein dustproof arch is fixed in dustproof recess to prevent that the dust from getting into the inner space.

According to the utility model discloses an embodiment, through the microscope base with between the circuit board, two relative first region point glues, fixes the microscope base in the circuit board.

According to the utility model discloses an embodiment, the microscope base with glue between the circuit board is followed respectively the coating of two long limits of microscope base.

According to the utility model discloses an embodiment, through the microscope base with between the circuit board, a set of adjacent first region with the regional point of second is glued, fixes the microscope base in the circuit board.

According to the utility model discloses an embodiment, the microscope base with between the circuit board, be located one first regional glue is followed the long limit coating of microscope base, and is located adjacently the glue of second region is followed the minor face coating of microscope base.

According to the utility model discloses an embodiment, through sensitization chip with between the circuit board, two relative first region point glues, fixes sensitization chip in the circuit board.

According to the utility model discloses an embodiment, the sensitization chip with glue between the circuit board is followed respectively the coating of two long limits of sensitization chip.

According to the utility model discloses an embodiment, through sensitization chip with between the circuit board, a set of adjacent first region with the regional point of second is glued, fixes sensitization chip in the circuit board.

According to the utility model discloses an embodiment, the sensitization chip with between the circuit board, be located one first regional glue is followed the long limit coating of sensitization chip, and is located adjacently the glue of second region is followed the minor face coating of sensitization chip.

According to the utility model discloses an on the other hand, the utility model discloses a further array module of making a video recording is provided, include:

at least two lens assemblies as described above; and

at least two photosensitive chips;

an integrated lens base; and

a circuit board, wherein sensitization chip is attached in correspondingly and electric connection ground the circuit board, wherein integral type microscope base encircles every all sides of sensitization chip, and attached in the circuit board, wherein integral type microscope base has two at least optical windows, corresponding to sensitization chip's photosensitive area, wherein support piece supports the camera lens, corresponding to the optical window, wherein support piece by integral type microscope base extends.

at least two lens assemblies as described above; and

at least two photosensitive chips;

at least two lens holders; and

a circuit board, wherein sensitization chip is attached in correspondingly and electric connection ground the circuit board, wherein every the microscope base encircles and corresponds all sides of sensitization chip, and attached in the circuit board, wherein the microscope base has an optical window, corresponding to the sensitization region of sensitization chip, wherein support piece supports the camera lens, corresponding to the optical window, wherein support piece is by corresponding the microscope base extends.

According to the utility model discloses an on the other hand, the utility model discloses a photosensitive assembly is further provided, include:

a photosensitive chip;

the photosensitive chip is electrically connected and attached to the circuit board; and

a lens base, wherein two opposite first areas between the circuit board and the lens base are glued,

it is fixed the microscope base in the circuit board, wherein the microscope base encircles all sides of sensitization chip, wherein the microscope base has an at least optical window, corresponding to the sensitization region of sensitization chip, wherein first region with the long limit region of a sensitization chip of sensitization subassembly corresponds.

a photosensitive chip;

a microscope base, wherein through the circuit board with between the microscope base, a set of adjacent first region with the second region point is glued, fixes the microscope base in the circuit board, wherein the microscope base encircles all sides of sensitization chip, wherein the microscope base has an at least optical window, corresponding to the sensitization region of sensitization chip, wherein first region with the long limit region of a sensitization chip of sensitization subassembly corresponds, wherein the second region with a sensitization chip minor face region of sensitization subassembly corresponds.

a photosensitive chip;

the circuit board is characterized in that the photosensitive chip is electrically connected and attached to the circuit board through two opposite first area glue dispensing between the circuit board and the photosensitive area, wherein the first area corresponds to a long edge area of the photosensitive chip of the photosensitive assembly; and

a lens base, wherein the lens base is fixed in the circuit board, wherein the lens base encircles all sides of sensitization chip, wherein the lens base has an at least optical window, corresponding to sensitization region of sensitization chip.

a photosensitive chip;

the circuit board is characterized in that the photosensitive chip is electrically connected and attached to the circuit board through a group of adjacent first area and second area adhesive dots between the circuit board and the photosensitive area, wherein the first area corresponds to a long-edge area of the photosensitive chip of the photosensitive assembly, and the second area corresponds to a short-edge area of the photosensitive chip of the photosensitive assembly; and

According to another aspect of the present invention, the utility model discloses a camera module's assembly method is further provided, include:

(a) assembling a group of optical lenses and a lens cone to form a lens;

(b) attaching a supporting piece to a reserved position of the top side of a photosensitive assembly; and

(c) through two opposite first regions respectively between the support and the barrel

And dispensing in the middle area, and fixing the support piece and the lens barrel, wherein the lens corresponds to a photosensitive path of the photosensitive assembly, and the first area corresponds to a long edge area of a photosensitive chip of the photosensitive assembly.

According to an embodiment of the present invention, the step (b) further includes:

(b1) the supporting piece and the photosensitive assembly are fixed through two opposite first areas between the supporting piece and the photosensitive assembly respectively and along two long edge glue points of a lens base of the photosensitive assembly.

(b2) through be in respectively support piece with one between the sensitization subassembly first region is followed the long limit point of the microscope base of sensitization subassembly is glued, and one between the two the second region is followed the short side point of the microscope base of sensitization subassembly is glued.

According to an embodiment of the present invention, the step (c) further includes:

(c1) the method comprises the steps of dispensing along two long edges of a photosensitive chip through two opposite first areas between the photosensitive chip and a circuit board respectively, and attaching the photosensitive chip to the circuit board in an electrified mode.

(c2) through a microscope base respectively with two relative first areas between the circuit board are followed two long limit point glues of microscope base, are fixed the microscope base in the circuit board, wherein the microscope base encircles the sensitization chip, have with a light window that the sensitization region of sensitization chip corresponds.

(c3) through one between a sensitization chip and a circuit board respectively first region is followed the long limit point of sensitization chip is glued, and one between the two the second region is followed the short side point of sensitization chip is glued, is attached with the circular telegram ground sensitization chip in the circuit board.

(c4) through a microscope base respectively with one between the circuit board first region is followed the long limit point of microscope base is glued, and one between the two the second region is followed the minor face point of microscope base is glued, is fixed the microscope base in the circuit board, wherein the microscope base encircles sensitization chip has with a light window that the sensitization region of sensitization chip corresponds.

According to an embodiment of the invention, the assembly method further comprises the steps of:

(d) and coating dustproof glue on two opposite second areas between the support and the lens barrel so as to prevent dust, wherein the second areas correspond to short edge areas of a photosensitive chip of the photosensitive assembly.

(A) assembling a group of optical lenses and a lens cone to form a lens;

(C) the supporting piece and the lens barrel are fixed through dispensing in the middle area of a group of first areas and the middle area of a group of second areas between the supporting piece and the lens barrel respectively, wherein the lens corresponds to a photosensitive path of the photosensitive assembly, and the first areas correspond to long edge areas of a photosensitive chip of the photosensitive assembly.

According to an embodiment of the invention, the assembly method further comprises the step of:

(D) dust is prevented by coating dust-proof glue on another set of the first area and the second area between the support and the lens barrel.

Drawings

FIG. 1 is a diagram of an optical system and a photosensitive chip of a lens assembly.

Fig. 2A and 2B are schematic diagrams of dispensing positions of a lens assembly in the prior art.

Fig. 3 is an exploded view of a camera module according to a preferred embodiment of the present invention.

Fig. 4 is a perspective view of the camera module according to the above preferred embodiment of the present invention.

Fig. 5 is a top view of the camera module according to the above preferred embodiment of the present invention.

Fig. 6A is a sectional view of the camera module a-a according to the above preferred embodiment of the present invention.

Fig. 6B is a sectional view of the camera module in the direction of B-B according to the above preferred embodiment of the present invention.

Fig. 7A is a top view of a camera module according to an embodiment of the present invention.

Fig. 7B is a sectional view of the camera module C-C according to the above embodiment of the present invention.

Fig. 7C is a cross-sectional view of the camera module in the direction of D-D according to the above embodiment of the present invention.

Fig. 8A is a partial schematic view of a lens assembly according to an embodiment of the present invention.

Fig. 8B is a partial schematic view of a lens assembly according to an embodiment of the present invention.

Fig. 9 is a top view of a camera module according to an embodiment of the present invention.

Fig. 10A is a top view of a camera module according to an embodiment of the present invention.

Fig. 10B is a sectional view of the camera module E-E according to the above embodiment of the present invention.

Fig. 10C is a sectional view of the camera module F-F according to the above embodiment of the present invention.

Fig. 11 is a top view of a photosensitive assembly according to an embodiment of the present invention.

Fig. 12A and 12B are different direction cross-sectional views of a camera module according to an embodiment of the present invention.

Fig. 13A is a partial schematic view of a camera module according to an embodiment of the present invention.

Fig. 13B is a partial schematic view of a camera module according to an embodiment of the present invention.

Fig. 13C is a partial schematic view of a camera module according to an embodiment of the present invention.

Fig. 13D is a partial schematic view of a camera module according to an embodiment of the present invention.

Fig. 14A is a top view of an array camera module according to an embodiment of the present invention.

Fig. 14B is a sectional view of the array camera module according to the above embodiment of the present invention in the G-G direction.

Fig. 14C is a sectional view of the array camera module according to the embodiment of the present invention in the H-H direction.

Fig. 14D is a sectional view of the I-I direction of the array camera module according to the above embodiment of the present invention.

Fig. 15A is a top view of a camera module according to a second embodiment of the present invention.

Fig. 15B is a J-J cross-sectional view of the camera module according to the second embodiment of the present invention.

Fig. 15C is a cross-sectional view of the imaging module according to the second embodiment of the present invention.

Fig. 16A and 16B are sectional views of the camera module according to another embodiment of the present invention, in different directions.

Fig. 17A is a top view of an array camera module according to the second embodiment of the present invention.

Fig. 17B is a sectional view of the array camera module according to the second embodiment of the present invention in the L-L direction.

Fig. 17C is a cross-sectional view of the array camera module according to the second embodiment of the present invention in the M-M direction.

Fig. 17D is a cross-sectional view of the array camera module according to the second embodiment of the present invention in the N-N direction.

Fig. 18A is a top view of a camera module according to an embodiment of the present invention.

Fig. 18B is a top view of an array camera module according to another embodiment of the present invention.

Fig. 19 is a flow chart of a method for assembling a camera module according to the present invention.

Fig. 20 is a flow chart of a method for assembling a photosensitive assembly according to the present invention.

FIG. 21 is a flow chart of another method for assembling a photosensitive assembly according to the present invention.

Fig. 22A to 22C are sectional views of another array camera module according to the present invention at different positions.

Fig. 23A to 23C are sectional views of another array camera module according to the present invention at different positions.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purpose of limitation.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 3 to 14D, a lens assembly, a photosensitive assembly and a camera module according to a preferred embodiment of the present invention are illustrated to provide a dispensing scheme different from the prior art, so that an optical system of the lens assembly and a photosensitive chip of the photosensitive assembly can be reduced or even avoided during the baking process, thereby improving the yield of products. The camera module 300 includes the lens assembly 100 and the photosensitive assembly 200. The lens assembly 100 is supported on the top side of the photosensitive assembly 200, corresponding to the photosensitive path of the photosensitive assembly 200.

The utility model discloses in, with a long side direction of sensitization chip 210 of sensitization subassembly 200 is the X direction, with sensitization chip 210's minor face direction is the Y direction, explains the explanation. In order to ensure that a photosensitive area 211 of the photosensitive chip 210 is fully utilized, the center of the photosensitive area 211 is aligned with the optical axis of the optical system of the lens assembly 100, an overlapping central axis is defined, and the radius of the imaging surface of the optical system should be larger than the diagonal radius of the photosensitive area 211. Correspondingly, the intersection point of each horizontal section with the overlapped middle axis is the center position of the corresponding horizontal plane.

In the prior art, the photosensitive chip 210 and the photosensitive area 211 are both rectangular, and an imaging surface of an optical system of the lens assembly 100 is circular, as shown in fig. 1. It can be seen that the optical system has an image plane whose deviatable value in the X direction is smaller than that in the Y direction. Slight shift and tilt in the X direction may cause the imaging surface of the optical system to not cover the photosensitive area well, resulting in image blur. In other words, the photosensitive region is more sensitive to shifts or tilts in the X direction.

The lens assembly 100 includes an optical lens assembly 110, a lens barrel 120 for accommodating the optical lens assembly 110, and a support 130. The optical lens assembly 110 includes single or multiple optical lenses. When assembled, the optical lens assembly 110 is mounted in the lens barrel 120 to form a lens, and then the supporting member 130 carries the lens and is mounted on the top side of the photosensitive assembly 200, so that the optical lens assembly 110 corresponds to the photosensitive path of the photosensitive assembly 200.

As described above, in the prior art, the assembly of the lens and the supporting member 130 is fixed by four-point dispensing, that is, the regions corresponding to the X direction and the Y direction between the inner sidewall 131 of the supporting member 130 and the outer sidewall 121 of the lens barrel 120 are fixed by glue. However, the four-point dispensing method easily causes the lens to shift in the shift-sensitive X direction, so that the positions of an imaging surface and a photosensitive area of an optical system of the lens assembly 100 shift, which affects the yield of the product.

In a preferred embodiment of the present invention, the glue 400 on the inner sidewall 131 of the supporting member 130 and the outer sidewall 121 of the lens barrel 120 allows the two to shift in the Y direction, and limits the two to shift in the X direction, so as to reduce the influence of the shift between the optical system of the lens assembly and the photosensitive chip of the photosensitive assembly on the imaging. That is, in the present invention, the supporting member 130 and the lens barrel 120 are inhibited from being shifted in the X direction as much as possible, thereby improving the product yield.

In the preferred embodiment of the present invention, the supporting member 130 and the glue 400 between the lens barrels 120 are disposed in two opposite first regions 140 corresponding to the long edge regions of the photosensitive chips, so that the component force in the X direction is offset as much as possible during the baking deformation and the subsequent cooling recovery process, thereby avoiding the offset in the X direction, as shown in fig. 5 and 6A. The long side area of the photosensitive chip refers to an area irradiated by connecting the center of the photosensitive area 211 and two end points of the long side of the photosensitive chip 210, as shown in fig. 5. And a first region 140 between the support 130 and the barrel 120 is an extension of the long side region of the photo-sensing chip between the support 130 and the barrel 120 in the Z direction. It is understood that the long side regions of the photo sensor chip formed corresponding to the two opposite long sides of the photo sensor chip are also two opposite regions, and correspondingly, the first region 140 between the support 130 and the lens barrel 120 is also two opposite regions.

At this time, since no glue is applied to the two opposite second regions 150 between the supporting member 130 and the lens barrel 120 and corresponding to the short side regions of the photo sensor chip, the baking second regions 150 are not subjected to a pulling force, and are not subjected to a restoring force in a subsequent cooling process, thereby reducing the possibility of X-direction deviation, as shown in fig. 5 and 6B. The short side area of the photosensitive chip is an area irradiated by connecting the center of the photosensitive area 211 with two end points of the short side of the photosensitive chip 210. And a second region 150 between the support 130 and the barrel 120 is an extension of the short side region of the photo-sensing chip in the Z direction between the support 130 and the barrel 120. It is understood that the short side regions of the photo-sensing chip formed corresponding to the two opposite short sides of the photo-sensing chip are also two opposite regions, and correspondingly, the second region 150 between the support 130 and the lens barrel 120 is also two opposite regions.

Preferably, in order to prevent the lens barrel 120 from being deflected by the component force in the X direction as much as possible, the glue 400 between the support 130 and the lens barrel 120 is applied to the middle region of the first region 140 therebetween. That is, between the supporter 130 and the lens barrel 120, the coating regions 141 of the two first regions 140 facing each other are substantially straight lines with the corresponding center positions, and the straight lines are substantially overlapped in the Y direction. At this time, the effect of the force centers offsetting each other in the X direction is better.

In order to ensure the bonding strength between the lens and the supporting member 130, the lens and the supporting member 130 are prevented from falling off when the camera module is subjected to impact force. In the preferred embodiment of the present invention, between the supporting member 130 and the lens barrel 120, the coating region 141 of the first region 140 is coated with a glue 400 having a strong bonding force, so as to satisfy the strength requirement of the glue, such as thermosetting glue.

Further, in the conventional lens and the supporting member, if only the dispensing hole on the first region 140 is used, the dispensing hole of the second region 150 exists, and a dustproof process is required to prevent external dust from entering the camera module through the reserved dispensing hole, thereby affecting imaging. In the preferred embodiment of the present invention, between the lens and the supporting member 130, the second region 150 is coated with glue with low bonding force or low variation as the dustproof glue 152, so as to achieve the dustproof effect, such as UV glue (photosensitive glue, Ultraviolet Rays), as shown in fig. 7A to 7C.

Specifically, in an embodiment of the present invention, in the second region 150, the inner sidewall 131 of the supporting member 130 is recessed to form at least one dustproof groove 151, the dustproof glue 152 is filled in the inner sidewall 131 of the dustproof groove 151, and a distance between a top outer surface of the dustproof glue 152 and the outer sidewall 121 of the lens barrel 120 is a predetermined distance, so as to bond dust in a gap between the outer sidewall 121 of the lens barrel 120 and the inner sidewall 131 of the supporting member 130, as shown in fig. 8A.

In another embodiment of the present invention, in the second region 150, at least one dustproof groove 151 is formed on the outer sidewall 121 of the lens barrel 120, and is formed by recessing the outer sidewall 121 of the lens barrel 120. The dust-proof adhesive 152 is filled in the dust-proof groove 151 of the outer sidewall 121, and is spaced from the inner sidewall 131 of the support 130 by a predetermined distance, so as to adhere dust in a gap between the outer sidewall 121 of the lens barrel 120 and the inner sidewall 131 of the support 130, as shown in fig. 8B.

That is, the dustproof glue 152 is only in contact with one of the outer sidewall 121 of the lens barrel 120 and the inner sidewall 131 of the support 130, and is only used for preventing dust, so as to prevent the second region 150 from generating a bonding force.

In another embodiment of the present invention, a staggered and protruding structure is adopted in the second region between the supporting member 130 and the lens barrel 120 to prolong the dust entering the path of the camera module, thereby preventing the dust from affecting the imaging of the photosensitive chip, as shown in fig. 10A to 10C. Specifically, the outer sidewall 121 of the lens barrel 120 and the inner sidewall 131 of the support 130 are provided with mutually staggered and mutually matched protrusions. That is, the protrusion of the outer sidewall 121 of the lens barrel 120 abuts against the bottom of the corresponding groove of the inner sidewall 131 of the support 130, or abuts against the top surface of the inner sidewall 131 of the support 130, which is not a groove; meanwhile, the protrusion of the inner sidewall 131 of the support 130 abuts against the bottom of the corresponding groove of the outer sidewall 121 of the lens barrel 120, or abuts against the non-groove top surface of the outer sidewall 121 of the lens barrel 120. It will be appreciated by those skilled in the art that fig. 10C is merely an example for explaining the structure of the staggered protrusions, and the structure of the staggered protrusions of the present invention can be formed by reducing or increasing the number of the staggered protrusions, which is not limited by the present invention.

In another embodiment of the present invention, the structure of the lens barrel 120 is changed to reserve the dispensing space 160 only in the first area 140, but not in the second area 150, so as to prevent dust from entering. Comparing fig. 2A and fig. 2B, in the prior art, the lens barrel 120 reserves a dispensing space in each direction, that is, is in a petal shape. In this embodiment, the lens barrel 120 only reserves a dispensing space in the first region 140, and corresponding to the dispensing method of the present invention, the dispensing is only performed in the first region 140 between the supporting member 130 and the lens barrel 120, and other gaps can be avoided to allow dust to enter the inner space, as shown in fig. 9.

Further, the above dispensing scheme for the long side areas on both sides may also be applied to bond between the supporting member 130 and the photosensitive element 200, so as to prevent the supporting member 130 from deviating from the original assembly position with the lens, as shown in fig. 11 to 13D.

The photosensitive assembly 200 includes the photosensitive chip 210, a lens holder 220 and a circuit board 230. The photosensitive chip 210 is electrically connected and attached to the circuit board 230. The lens holder 220 surrounds the photosensitive chip 210 and is attached to the circuit board 230. The lens holder 220 has an optical window 221 corresponding to the photosensitive region 211 of the photosensitive chip 210. The supporting member 130 supports the lens corresponding to the light window 221. The support 130 is bonded to the top surface 222 of the mirror mount 220.

In a preferred embodiment of the present invention, the glue 400 on the bottom surface 132 of the supporting member 130 and the top surface 222 of the lens holder 220 allows the displacement in the Y direction, and limits the displacement in the X direction, so as to reduce the influence of the displacement between the optical system of the lens assembly 100 and the photosensitive chip 210 on the image formation. That is, in the present invention, the supporting member 130 and the lens holder 220 are prevented from shifting in the X direction as much as possible, thereby improving the yield of products.

The glue 400 between the supporting member 130 and the mirror base 220 is disposed in two opposite first regions 140 corresponding to the long side regions of the photo-sensing chip, so that the component forces in the X direction are offset as much as possible during the baking deformation and the subsequent cooling recovery process, thereby avoiding the offset in the X direction. The first region 140 between the support 130 and the mirror mount 220 corresponds to the long side region of the photo chip, which is the extension of the long side region of the photo chip in the Z direction between the support 130 and the mirror mount 220, as shown in fig. 11 and 12A.

Similarly, at this time, the two opposite second regions 150 corresponding to the short side regions of the photo sensor chip and between the supporting member 130 and the mirror base 220 are not dispensed, so that the second regions 150 are not subjected to a pulling force during baking, and are not subjected to a restoring force during a subsequent cooling process, thereby reducing the possibility of X-direction deviation. The second region 150 between the support 130 and the mirror mount 220 corresponds to the short side region of the photo-sensing chip, which is the extension of the short side region of the photo-sensing chip in the Z direction between the support 130 and the mirror mount 220.

Preferably, since the mirror base structure is mostly rectangular in shape, between the support 130 and the mirror base 220, the coated regions 141 respectively at the two opposite first regions 140 are disposed at two long sides of the mirror base 220, i.e., extend along the long sides of the mirror base 220.

In order to ensure the bonding strength between the lens holder 220 and the supporting member 130, the lens holder 220 and the supporting member 130 are prevented from falling off when the image pickup module is subjected to an impact force. In the preferred embodiment of the present invention, between the supporting member 130 and the mirror base 220, the coating region 141 of the first region 140 is coated with a glue 400 having a strong bonding force, so as to satisfy the glue strength requirement, such as thermosetting glue.

Further, in order to prevent external dust from entering the camera module through the gap between the mirror base 220 and the support 130, thereby affecting the image formation. In the preferred embodiment of the present invention, between the lens holder 220 and the supporting member 130, the second region 150 is coated with glue with low bonding force or low variation as the dustproof glue 152, such as UV glue (Ultraviolet Rays), to achieve the dustproof effect, as shown in fig. 11, 12B and 13A.

In one embodiment of the present invention, in the second region 150, the top surface 222 of the mirror base 220 forms at least one dust-proof groove 151, as shown in fig. 13D. The dust-proof groove 151 is formed by recessing the top surface 222. The dust-proof adhesive 152 is filled into the dust-proof groove 151 on the top surface 222 at a predetermined distance from the bottom surface 132 of the supporter 130. The dust-proof adhesive 152 on the top surface 222 does not contact the bottom surface 132 of the supporter 130, but prevents dust from entering by using adhesion.

In another embodiment of the present invention, as shown in fig. 13C, in the second region 150, the top surface 222 of the lens holder 220 forms at least one dustproof groove 223, and correspondingly, the bottom surface of the bottom surface 132 of the supporting member 130 forms a matching dustproof protrusion 133. That is, in the second region 150, the lens holder 220 and the support 130 are fixed by the dust-proof groove 223 and the dust-proof protrusion 133 in a matching manner. At this time, the dust-proof protrusion 133 not only lengthens a path of dust entering the inner space but also blocks the dust from entering. Between the mirror base 220 and the support 130, the first region 140 is fixed by means of glue dispensing, and the second region 150 is protected from dust by a raised structure. Alternatively, the bottom surface 132 of the support 130 is provided with a dust-proof groove, and the top surface 222 of the mirror base 220 forms a corresponding dust-proof protrusion, which can also play a dust-proof role in cooperation with each other, and is not limited herein.

Further, between the mirror base 220 and the supporting member 130, in the second region 150, a protruding structure and the dust-proof glue 152 may be used in combination, as shown in fig. 13B. In an embodiment of the present invention, between the lens holder 220 and the supporting member 130, the relative outer side region of the second region 150 is coated with the dustproof glue 152, and the relative inner side region is provided with a protruding structure, thereby playing a dual dustproof role. For example, in the second region 150, the dust-proof glue 152 may be coated on the outer region of the top surface 222 of the mirror base 220, and at the same time, a dust-proof protrusion is formed on the inner side thereof, and a dust-proof groove is correspondingly formed on the bottom surface 132 of the supporting member 130. Those skilled in the art will appreciate that the combination is merely illustrative and not restrictive, and that the dust-proof adhesive 152 may be applied to the bottom surface 132 of the supporting member 130, combined with a protrusion structure, and the like.

Further, the above dispensing scheme for the long side areas on both sides can also be applied to bonding between the lens holder 220 and the circuit board 230, so as to prevent the lens holder 220 from deviating from the original assembly position with the lens. That is to say, when the lens holder 220 and the circuit board 230 are fixed by the glue 400, the technical solution of the present invention can be adopted, as shown in fig. 12A.

The glue 400 on the top surface 231 of the circuit board 230 and the bottom surface 223 of the lens holder 220 allows the two to shift in the Y direction, and limits the two to shift in the X direction, thereby reducing the influence on the imaging caused by the shift between the optical system of the lens assembly 100 and the photosensitive chip 210. That is, in the present invention, the offset between the circuit board 230 and the lens holder 220 in the X direction is prohibited as much as possible, thereby improving the yield of products.

The glue 400 between the circuit board 230 and the lens holder 220 is disposed in two opposite first regions 140 corresponding to the long side regions of the photosensitive chip, so that the component forces in the X direction are offset as much as possible during the baking deformation and the subsequent cooling recovery process, thereby avoiding the offset in the X direction. The first region 140 between the circuit board 230 and the mirror mount 220 corresponds to the long side region of the photo-sensing chip, which is the extension of the long side region of the photo-sensing chip in the Z direction between the circuit board 230 and the mirror mount 220, as shown in fig. 11 and 12A.

Similarly, at this time, the two opposite second regions 150 between the circuit board 230 and the lens holder 220 and corresponding to the short side regions of the photo-sensing chip are not dispensed, so that the second regions 150 are not subjected to pulling force during baking, and are not subjected to restoring force during subsequent cooling, thereby reducing the possibility of X-direction deviation. The second region 150 between the circuit board 230 and the mirror mount 220 corresponds to the short side region of the photo sensor chip, which is the extension of the short side region of the photo sensor chip in the Z direction between the circuit board 230 and the mirror mount 220.

Preferably, since the mirror base and the wiring board are mostly rectangular in shape, between the wiring board 230 and the mirror base 220, the coated regions 141 respectively at the two first regions 140 opposite to each other are disposed at two long sides of the mirror base 220, that is, extend along the long sides of the mirror base 220.

Further, in order to prevent external dust from entering the camera module through the gap between the lens holder 220 and the circuit board 230, thereby affecting imaging. In the preferred embodiment of the present invention, between the lens holder 220 and the circuit board 230, the second region 150 is coated with glue with low bonding force or low variation as the dustproof glue 152, so as to achieve the dustproof effect, such as UV glue (ultra violet Rays), as shown in fig. 11 and 12B.

Further, the above dispensing scheme for the long side areas on the two sides can also be applied to bonding between the photosensitive chip 210 and the circuit board 230, so as to prevent the photosensitive chip 210 from deviating from the original assembly position. That is to say, when the photosensitive chip 210 and the circuit board 230 are fixed by the glue 400, the technical solution of the present invention can be adopted, as shown in fig. 11 and 12A.

The glue 400 between the top surface 231 of the circuit board 230 and the photosensitive chip 210 allows the two to generate a deviation in the Y direction, and limits the two to generate a deviation in the X direction, thereby reducing the influence on the imaging caused by the deviation between the optical system of the lens assembly 100 and the photosensitive chip 210. That is, in the present invention, the offset between the circuit board 230 and the photo sensor chip 210 in the X direction is prohibited as much as possible, thereby improving the yield of products.

The glue 400 between the circuit board 230 and the photosensitive chip 210 is disposed in the two opposite first regions 140 corresponding to the long side regions of the photosensitive chip, so that the component forces in the X direction are offset as much as possible during the baking deformation and the subsequent cooling recovery process, thereby avoiding the offset in the X direction. The first region 140 between the circuit board 230 and the photo chip 210 corresponds to the long side region of the photo chip, which is the extension of the long side region of the photo chip between the circuit board 230 and the photo chip 210 in the Z direction.

Similarly, at this time, the two opposite second regions 150 between the circuit board 230 and the photosensitive chip 210 and corresponding to the short side regions of the photosensitive chip are not dispensed, so that the second regions 150 are not subjected to pulling force during baking, and are not subjected to restoring force during subsequent cooling, thereby reducing the possibility of X-direction deviation. The second region 150 between the circuit board 230 and the photo chip 210 corresponds to the short side region of the photo chip, which is the extension of the short side region of the photo chip between the circuit board 230 and the photo chip 210 in the Z direction.

Preferably, since the photosensitive chip is mostly rectangular, between the circuit board 230 and the photosensitive chip 210, the coating regions 141 respectively in the two opposite first regions 140 are disposed on two long sides of the photosensitive chip 210, that is, extend along the long sides of the photosensitive chip 210.

Further, in order to prevent external dust from entering the camera module through the gap between the photosensitive chip 210 and the circuit board 230, thereby affecting imaging. In the preferred embodiment of the present invention, between the photosensitive chip 210 and the circuit board 230, the second region 150 is coated with glue with low bonding force or low variation as the dustproof glue 152, so as to achieve the dustproof effect, such as UV glue (Ultraviolet Rays), as shown in fig. 11 and 12B.

Further, when the camera module 300 is implemented as an array camera module, the array camera module includes at least two lens assemblies 100, at least two photosensitive chips 210, an integrated lens holder 240 and a circuit board 230. Each of the photosensitive chips 210 is correspondingly and electrically attached to the circuit board 230. The integrated lens seat surrounds each peripheral side of the photosensitive chip and is attached to the circuit board. The integrated lens base is provided with at least two optical windows which respectively correspond to the photosensitive areas of the photosensitive chip. The supporting piece supports the lens and corresponds to the light window. The support extends from the integral mirror mount. As will be appreciated by those skilled in the art, in the array camera module, the circuit board 230 may be an integrated circuit board or a split circuit board, and is not limited in this case.

At this time, each of the photo-sensing chips 210 corresponds to two long side regions of the photo-sensing chip, and thus two opposite first regions 140, and two short side regions of the photo-sensing chip, and thus two opposite second regions 150. That is, in the array camera module, the first region 140 and the second region 150 of the array camera module are correspondingly disposed and distributed corresponding to the distribution and number of the photosensitive chips.

The array camera module also adopts the dispensing scheme of the present invention, and the dispensing scheme in the preferred embodiment can still be adopted between the lens barrel 120 of each lens assembly 100 and the supporting member 130, between each lens assembly 100 and the assembly of the integrated lens holder 240 of the array camera module, between the integrated lens holder 240 and the circuit board 230, and between each photo sensor chip 210 and the corresponding circuit board 230, and only dispensing is performed in the first area 140, as shown in fig. 14A to 14D. In addition, in the second region 150, dust can be prevented from entering the inner space by applying the dust-proof adhesive 152, the protruding structure or the staggered protruding structure, and a combination of the above methods.

Or when the camera module 300 is implemented as an array camera module, the array camera module includes at least two lens assemblies 100, at least two photosensitive chips 210, at least two lens mounts 220, and a circuit board 230. Each of the photosensitive chips 210 is correspondingly and electrically attached to the circuit board 230. Each lens base is provided with an optical window corresponding to the photosensitive area of the photosensitive chip. Each lens seat surrounds the periphery of the corresponding photosensitive chip and is attached to the circuit board. The supporting piece supports the lens and corresponds to the light window. The supporting piece extends from the corresponding lens base. As will be appreciated by those skilled in the art, in the array camera module, the circuit board 230 may be an integrated circuit board or a split circuit board, and is not limited in this case.

At this time, the array camera module may also adopt the dispensing scheme of the present invention, and the dispensing scheme in the preferred embodiment may still be adopted between the lens barrel 120 of each lens assembly 100 and the supporting member 130, between each lens assembly 100 and the corresponding lens mount 220 assembly, between each lens mount 220 and the circuit board 230, and between each photo sensor chip 210 and the corresponding circuit board 230 region, and only the dispensing is performed in the first region 140, as shown in fig. 22A to fig. 22C. In addition, in the second region 150, dust can be prevented from entering the inner space by applying the dust-proof adhesive 152, the protruding structure or the staggered protruding structure, and a combination of the above methods.

As shown in fig. 15A to 18B, the lens assembly 100, the photosensitive assembly 200, and the camera module 300 according to the second embodiment of the present invention are illustrated. Different from the above preferred embodiment, in the second embodiment, the glue 400A is coated on a group of the first region 140A and the second region 150A adjacent to each other between the lens barrel 120 and the supporting member 130, between the lens assembly 100 and the lens holder 220, between the lens holder 220 and the circuit board 230, or between the photosensitive chip 210 and the circuit board 230 for fixing, so that each component is only stressed on one side in the X direction and the Y direction, thereby avoiding the occurrence of mutual pulling phenomenon in four-point glue dispensing in the prior art, reducing the influence of glue deformation on offset, and avoiding the occurrence of glue cracking.

In the second embodiment, the first region 140A is still a region corresponding to the long side region of the photosensitive chip extending in the Z-axis. The second region 150A is still a region corresponding to the short side region of the photosensitive chip extending in the Z-axis. For convenience of explanation, adjacent one of the first regions 140A and one of the second regions 150A are referred to as a group.

Specifically, the glue 400A between the lens barrel 120 and the supporting member 130 is disposed in one of the first region 140A and the second region 150A, so that during the baking deformation and the subsequent cooling recovery process, the lens barrel 120 and the supporting member 130 are only subjected to unilateral stress in the X direction and the Y direction, and the other set of the first region 140A and the second region 150A opposite to each other is not limited by the glue 400A, and is relatively free, and no pulling force and restoring force are generated, thereby avoiding the occurrence of mutual pulling phenomenon in four-point glue dispensing in the prior art, as shown in fig. 15A to 15C.

Preferably, the glue 400A between the support 130 and the lens barrel 120 is applied between the two, and between the adjacent set of the first region 140A and the second region 150A, so as to reduce and avoid the possibility of the offset. That is, between the support 130 and the lens barrel 120, a straight line between the coating area of the first area 140A and the corresponding center position substantially overlaps in the Y direction; the coating area of the second area 150A substantially overlaps the line corresponding to the center position in the X direction.

Further, in order to prevent dust from entering the camera module from the redundant dispensing holes, in the second embodiment, another group of the first region 140A and the second region 150A, which are not coated with the adhesive, between the lens and the support 130 are coated with glue with low bonding force or low variation amount as the dust-proof glue 152A, so as to achieve the dust-proof effect, for example, UV glue (ultra violet Rays), as shown in fig. 15A to 15C.

It will be appreciated by those skilled in the art that the above-mentioned dustproof solutions in the preferred embodiment, such as providing dustproof grooves filled with dustproof glue, protruding structures or the like, may also be applied to another set of the first region 140A and the second region 150A that are not coated with adhesive glue to prevent dust from entering the interior, and will not be described herein again. Or by changing the structure of the lens barrel 120A, a dispensing space 160A is reserved only in one group of the first area 140A and the second area 150A, and a dispensing space is not reserved in the other group of the first area 140A and the second area 150A, so as to prevent dust from entering, as shown in fig. 18A and 18B.

Further, in the second embodiment, a dispensing scheme for a set of the first region 140A and the second region 150A may also be applied to bond between the supporting member 130 and the photosensitive element 200, so as to prevent the supporting member 130 from deviating from the original assembly position with the lens, as shown in fig. 16A and 16B.

Specifically, the glue 400A between the support 130 and the photosensitive member 200 is disposed between a set of the first region 140A and the second region 150A. Preferably, since the mirror base 120 has a rectangular structure, the glue 400A located in one of the first regions 140A is coated along the long side of the mirror base 120 between the supporting member 130 and the photosensitive assembly 200; and glue 400A located adjacent to the second region 150A is applied along the short side of the mirror base 120.

It can be appreciated by those skilled in the art that the dust-proof schemes of the above preferred embodiments, such as coating dust-proof glue, disposing dust-proof grooves to fill dust-proof glue, protruding structures, or a combination thereof, can also be applied to the other set of the first region 140A and the second region 150A between the supporting member 130 and the photosensitive assembly 200 of the second embodiment to prevent dust from entering the interior, and will not be described herein again.

Further, in the second embodiment, a set of dispensing schemes for the first region 140A and the second region 150A may also be applied to bond between the lens holder 220 and the circuit board 230, so as to prevent the lens holder 220 from deviating from the original assembly position with the lens, as shown in fig. 16A and 16B.

Specifically, the glue 400A between the mirror base 220 and the wiring board 230 is disposed between the two, and in a set of the first region 140A and the second region 150A. Preferably, since the lens holder 120 and the circuit board 230 are mostly rectangular structures, between the lens holder 220 and the circuit board 230, the glue 400A located in one of the first regions 140A is coated along the long side of the lens holder 120; and glue 400A located adjacent to the second region 150A is applied along the short side of the mirror base 120.

It can be appreciated by those skilled in the art that the dust-proof solutions in the above preferred embodiments, such as coating dust-proof glue, disposing dust-proof grooves to fill dust-proof glue, protruding structures, or a combination thereof, can also be applied to another set of the first region 140A and the second region 150A between the lens holder 220 and the circuit board 230 in the second embodiment to prevent dust from entering the interior, and will not be described herein again.

Further, in the second embodiment, a dispensing scheme for a group of the first region 140A and the second region 150A may also be applied to bond between the photo chip 210 and the circuit board 230, so as to prevent the photo chip from deviating from the original assembly position, as shown in fig. 16A and 16B.

Specifically, the glue 400A between the photosensitive chip 210 and the wiring board 230 is disposed between the two, and a set of the first region 140A and the second region 150A. Preferably, since most of the photosensitive chips 210 are rectangular, the glue 400A located in one of the first regions 140A is coated along the long side of the photosensitive chip 210 between the photosensitive chip 210 and the circuit board 230; and the glue 400A located adjacent to the second area 150A is coated along the short side of the photosensitive chip 210.

It can be known by those skilled in the art that the dust-proof schemes in the above preferred embodiments, such as coating dust-proof glue, disposing dust-proof grooves to fill dust-proof glue, protruding structures, or a combination thereof, can also be applied to another set of the first region 140A and the second region 150A between the photosensitive chip 210 and the circuit board 230 in the second embodiment to prevent dust from entering the interior, and will not be described herein again.

Further, when the camera module 300 is implemented as an array camera module, the dispensing scheme in the second embodiment may still be adopted between the lens barrel 120 and the support 130 of each lens assembly 100, between each lens assembly 100 and the integrated lens holder 240 of the array camera module, between the integrated lens holder 240 and the circuit board 230, and between each photo-sensing chip 210 and the corresponding circuit board 230 area, and dispensing is performed only in one set of the first area 140A and the second area 150A. In addition, glue can be dispensed on another set of the first area 140A and the second area 150A, and dust can be prevented from entering the inner space by applying dustproof glue, a protruding structure or a staggered protruding structure, a combination use and the like, as shown in fig. 17A to 17D.

Alternatively, when the array camera module adopts a split lens mount, the dispensing scheme in the second embodiment may still be adopted between the lens barrel 120 and the support 130 of each lens assembly 100, between each lens assembly 100 and the corresponding lens mount 220, between each lens mount 2200 and the circuit board 230, and between each photo-sensing chip 210 and the corresponding circuit board 230 region, and the dispensing is performed only in one set of the first region 140A and the second region 150A, as shown in fig. 23A to 23C.

According to another aspect of the present invention, the present invention further provides a method for assembling a camera module. The assembly method of the camera module can be applied to the assembly of the camera module 300, and at least one of the purposes and advantages of the present invention are achieved. Specifically, as shown in fig. 19, it is a flowchart of the camera module assembling method.

Step 410: a group of optical lenses and a lens barrel are assembled to form a lens.

Step 420: a supporting piece is attached to a reserved position of the top side of a photosensitive assembly.

Specifically, the step 420 may further include the steps of: the supporting piece and the photosensitive assembly are fixed through two opposite first areas between the supporting piece and the photosensitive assembly and two long edge glue points along a lens seat of the photosensitive assembly.

Or the step 420 may further include the steps of: through be in respectively support piece with one between the sensitization subassembly first region is followed the long limit point of the microscope base of sensitization subassembly is glued, and one between the two the second region is followed the minor face point of the microscope base of sensitization subassembly is glued, fixes support piece with sensitization subassembly.

It is to be understood that the order of the steps 410 and 420 is not limited.

Step 430: and fixing the supporting piece and the lens barrel through dispensing in the middle area of two opposite first areas between the supporting piece and the lens barrel respectively, wherein the lens corresponds to a photosensitive path of the photosensitive assembly.

Step 450: dust is prevented by coating dust-proof glue on two opposite second areas between the support and the lens barrel.

Or after the step 420, executing step 440: and fixing the support member and the lens barrel by respectively dispensing in the middle area of a group of first areas and the middle area of second areas between the support member and the lens barrel, wherein the lens corresponds to a photosensitive path of the photosensitive assembly.

Step 460: dust is prevented by coating dust-proof glue on another set of the first area and the second area between the support and the lens barrel.

As shown in fig. 20, it is a flowchart of the assembly method of the photosensitive assembly of the camera module according to the present invention.

Step 510: the method comprises the steps of dispensing along two long edges of a photosensitive chip through two opposite first areas between the photosensitive chip and a circuit board respectively, and attaching the photosensitive chip to the circuit board in an electrified mode.

Step 520: through respectively at a microscope base with two relative first areas between the circuit board, follow two long limit point glues of microscope base, fix the microscope base in the circuit board, wherein the microscope base encircles sensitization chip has with a light window that sensitization area of sensitization chip corresponds.

As shown in fig. 21, it is a flowchart of another assembly method of the photosensitive assembly of the camera module according to the present invention.

Step 610: through one between a sensitization chip and a circuit board respectively first region is followed the long limit point of sensitization chip is glued, and one between the two the second region is followed the short side point of sensitization chip is glued, is electriferously attached sensitization chip in the circuit board.

Step 620: fixing the microscope base on the circuit board by respectively dispensing along the long edge of the microscope base and the second area between the first area and the second area, wherein the first area is arranged between the microscope base and the circuit board, and the second area is arranged between the microscope base and the circuit board.

It will be appreciated by those skilled in the art that the dispensing location schemes between the various elements of the preferred and second embodiments can be combined or mixed, i.e., step 510 and step 620 can be combined, and step 610 and step 520 can be combined, as well as achieving at least one of the objects and advantages of the present invention.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims

1. A camera lens subassembly is suitable for and a sensitization subassembly equipment one camera module, its characterized in that includes:

an optical lens group;

the optical lens group is arranged in the lens barrel to form a lens; and

2. The lens assembly of claim 1, wherein glue between the support and the barrel is applied between the two, respectively, in an intermediate region of the first region that is opposite.

3. The lens assembly of claim 1 or 2, further comprising a dust-proof glue, wherein the dust-proof glue is applied to two opposite second regions between the lens barrel and the support member, wherein the second regions correspond to short side regions of a photosensitive chip of the photosensitive assembly.

4. The lens assembly of claim 3, wherein at least one dust-proof groove is disposed on an inner sidewall of the support member in one of the at least two second regions, wherein the dust-proof glue is filled in the dust-proof groove, wherein an outer surface of the dust-proof glue is spaced from an outer sidewall of the lens barrel by a predetermined distance, and dust adhering to a gap between the outer sidewall of the lens barrel and the inner sidewall of the support member is provided.

5. The lens assembly of claim 3, wherein at least one dust-proof groove is disposed on an outer sidewall of the lens barrel in one of the at least two second regions, wherein the dust-proof glue is filled in the dust-proof groove on the outer sidewall and spaced from an inner sidewall of the supporting member by a predetermined distance to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the supporting member.

6. The lens assembly of claim 3, wherein at least one of the second regions, the outer sidewall of the lens barrel and the inner sidewall of the supporting member have mutually staggered and matching protrusions to form a staggered protrusion structure, so as to extend the dust path into the camera module.

7. The lens assembly of claim 3, further comprising two glue dispensing spaces, wherein the two glue dispensing spaces are respectively formed in two opposite first regions between the lens barrel and the support member, and the two opposite second regions are closed.

8. A camera lens subassembly is suitable for and a sensitization subassembly equipment one camera module, its characterized in that includes:

an optical lens group;

the optical lens group is arranged in the lens barrel to form a lens; and

9. The lens assembly of claim 8, wherein glue between the support and the barrel is applied to a set of adjacent middle regions of the first region and the second region, respectively.

10. The lens assembly of claim 8 or 9, further comprising a dust-proof glue, wherein the dust-proof glue is applied to another set of adjacent first and second regions between the lens barrel and the support.

11. The lens assembly of claim 10, wherein at least one dust-proof groove is disposed on an inner sidewall of the support member in at least one other adjacent group of the first region and the second region, wherein the dust-proof glue is filled in the dust-proof groove, and wherein an outer surface of the dust-proof glue is spaced from an outer sidewall of the lens barrel by a predetermined distance to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the support member.

12. The lens assembly of claim 8 or 9, wherein at least another set of adjacent first and second regions, the outer sidewall of the lens barrel and the inner sidewall of the support member are provided with mutually staggered and matched protrusions to form a staggered protrusion structure, so as to prolong a path of dust entering the camera module.

13. The lens assembly of claim 8 or 9, further comprising two glue dispensing spaces, wherein the two glue dispensing spaces are respectively formed between the lens barrel and the support member in a set of adjacent first and second regions, and the other set of adjacent first and second regions is closed.

14. A camera module, comprising:

a lens assembly, wherein the lens assembly includes a lens barrel and a support, wherein the optical lens assembly is installed in the lens barrel to form a lens, wherein the lens barrel is fixed inside the support by dispensing in two opposite first areas between the lens barrel and the support to limit the displacement of the lens barrel and the support in the X direction, wherein the first areas correspond to long side areas of a photosensitive chip of the photosensitive assembly; and

a sensitization subassembly, wherein the sensitization subassembly includes a sensitization chip, a microscope base and a circuit board, wherein sensitization chip electricity is connected in addition in the circuit board, wherein the microscope base encircles the sensitization chip, and attached in the circuit board, wherein the microscope base has an optical window, corresponding to the sensitization region of sensitization chip, wherein support piece supports the camera lens, corresponding to the optical window, wherein support piece by the microscope base extends.

15. The camera module of claim 14, wherein glue between the support and the lens barrel is applied to a middle region of the first region opposite therebetween.

16. The camera module according to claim 14, further comprising a dust-proof adhesive, wherein the dust-proof adhesive is applied to two opposite second regions between the lens barrel and the support, wherein the second regions correspond to short side regions of a photosensitive chip of the photosensitive assembly.

17. The camera module according to claim 15, further comprising a dust-proof adhesive, wherein the dust-proof adhesive is applied to two opposite second regions between the lens barrel and the support, wherein the second regions correspond to short side regions of a photosensitive chip of the photosensitive assembly.

18. The camera module of claim 16, wherein at least one dust-proof slot is disposed on an inner sidewall of the support member in one of the at least two second regions, wherein the dust-proof glue is filled in the dust-proof slot, wherein an outer surface of the dust-proof glue is spaced from an outer sidewall of the lens barrel by a predetermined distance, and dust adhering to a gap between the outer sidewall of the lens barrel and the inner sidewall of the support member is provided.

19. The camera module of claim 16, wherein at least one dust-proof groove is disposed on an outer sidewall of the lens barrel in one of the at least two second regions, wherein the dust-proof glue is filled in the dust-proof groove on the outer sidewall and spaced from an inner sidewall of the supporting member by a predetermined distance to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the supporting member.

20. The camera module of claim 16, wherein at least one of the two second regions, the outer sidewall of the barrel and the inner sidewall of the support member have protrusions that are staggered and matched to each other to form a staggered protrusion structure, so as to extend the dust path into the camera module.

21. The camera module according to claim 16, further comprising two dispensing spaces, wherein the two dispensing spaces are respectively formed in two opposite first regions between the lens barrel and the support member, and the two opposite second regions are closed.

22. The camera module of any of claims 14-21, wherein the support member is secured to the top side of the lens holder by dispensing in two opposing first areas between the lens holder and the support member.

23. The camera module of claim 22, wherein glue between the support and the base is applied along two long sides of the base, respectively.

24. The camera module of claim 23, wherein glue between the support and the base is applied along two long sides of the base, respectively.

25. The camera module of any of claims 17-21, wherein the support member is secured to the top side of the lens mount by dispensing a set of adjacent first and second regions between the lens mount and the support member.

26. The camera module of claim 25, wherein between the base and the support, glue in one of the first regions is applied along a long side of the base and glue in an adjacent second region is applied along a short side of the base.

27. The camera module of claim 22, further comprising a dust-proof glue, wherein the dust-proof glue is applied to two opposing second regions between the lens mount and the support.

28. The camera module of claim 24, further comprising a dust-proof glue, wherein the dust-proof glue is applied to two opposing second regions between the lens mount and the support.

29. The camera module of claim 27, further comprising a dust-proof glue, wherein the dust-proof glue is applied to another set of adjacent first and second regions between the lens mount and the support.

30. The camera module of claim 23, wherein at least one dust-proof recess and a matching dust-proof protrusion are disposed on the lens holder and the support, wherein the dust-proof protrusion is fixed to the dust-proof recess to prevent dust from entering the interior space.

31. The camera module of any of claims 15-21, wherein the lens mount is secured to the circuit board by dispensing in two opposing first areas between the lens mount and the circuit board.

32. The camera module of claim 31, wherein glue between the lens holder and the circuit board is applied along each of two long sides of the lens holder.

33. The camera module of any of claims 17-21, wherein the lens mount is secured to the circuit board by dispensing a set of adjacent first and second regions between the lens mount and the circuit board.

34. The camera module of claim 33, wherein between the lens holder and the circuit board, glue in one of the first regions is applied along a long side of the lens holder, and glue in an adjacent second region is applied along a short side of the lens holder.

35. The camera module according to any of claims 15-21, wherein the photo-sensing chip is fixed to the top side of the circuit board by dispensing in two opposing first areas between the photo-sensing chip and the circuit board.

36. The camera module of claim 35, wherein glue between the photo-sensing die and the circuit board is applied along two long sides of the photo-sensing die, respectively.

37. The camera module of any of claims 17-21, wherein the photo-sensing chip is secured to the top side of the circuit board by a set of adjacent first and second areas between the photo-sensing chip and the circuit board.

38. The camera module of claim 37, wherein between the photo-sensing chips and the circuit board, the glue in one of the first regions is coated along a long side of the photo-sensing chip, and the glue in the adjacent second region is coated along a short side of the photo-sensing chip.

39. A camera module, comprising:

a lens assembly, wherein the lens assembly comprises:

an optical lens group;

the optical lens group is arranged in the lens barrel to form a lens;

a support member, wherein the lens barrel is fixed inside the support member by dispensing a group of first areas and second areas between the lens barrel and the support member to limit the displacement of the lens barrel and the support member, wherein the first areas correspond to long side areas of a photosensitive chip of the photosensitive assembly, and the second areas correspond to short side areas of the photosensitive chip of the photosensitive assembly; and

40. The camera module of claim 39, wherein the glue between the support and the barrel is applied to a set of adjacent middle regions of the first and second regions, respectively.

41. The camera module of claim 39, further comprising a dust-proof glue, wherein the dust-proof glue is applied to another set of adjacent first and second regions between the lens barrel and the support.

42. The camera module of claim 40, further comprising a dust-proof glue, wherein the dust-proof glue is applied to another set of adjacent first and second regions between the lens barrel and the support.

43. The camera module according to claim 41, wherein at least one dust-proof slot is formed in an inner sidewall of the supporting member in at least one of the other adjacent first and second regions, wherein the dust-proof glue is filled in the dust-proof slot, and wherein an outer surface of the dust-proof glue is spaced from an outer sidewall of the lens barrel by a predetermined distance to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the supporting member.

44. The camera module of claim 39, wherein in at least another set of adjacent first and second regions, the outer sidewall of the barrel and the inner sidewall of the support member have protrusions that are staggered and matched to each other to form a staggered protrusion structure, thereby prolonging the path of dust entering the camera module.

45. The camera module of claim 40, wherein in at least another set of adjacent first and second regions, the outer sidewall of the barrel and the inner sidewall of the support member have protrusions that are staggered and matched to each other to form a staggered protrusion structure, so as to extend the dust path into the camera module.

46. The camera module according to claim 39, further comprising two dispensing spaces, wherein the two dispensing spaces are respectively formed between the lens barrel and the support member in a set of adjacent first and second regions, and the other set of adjacent first and second regions is closed.

47. The camera module according to claim 40, further comprising two dispensing spaces, wherein the two dispensing spaces are respectively formed between the lens barrel and the support member in a set of adjacent first and second regions, and the other set of adjacent first and second regions is closed.

48. The camera module of any of claims 39-47, wherein the support member is secured to the top side of the lens holder by dispensing in two opposing first areas between the lens holder and the support member.

49. The camera module of claim 48, wherein glue between the support and the base is applied along each of the two long sides of the base.

50. The camera module of any of claims 39-47, wherein the support member is secured to the top side of the mirror base by dispensing a set of adjacent first and second regions between the mirror base and the support member.

51. The camera module of claim 50, wherein between the base and the support, glue in one of the first regions is applied along a long side of the base and glue in an adjacent second region is applied along a short side of the base.

52. The camera module of claim 48, further comprising a dust-proof glue, wherein the dust-proof glue is applied to two opposing second regions between the lens mount and the support.

53. The camera module of claim 50, further comprising a dust-proof glue, wherein the dust-proof glue is applied to another set of adjacent first and second regions between the lens mount and the support.

54. The camera module of claim 48, wherein at least one dust-proof recess and a matching dust-proof protrusion are disposed on the lens holder and the support, wherein the dust-proof protrusion is fixed to the dust-proof recess to prevent dust from entering the interior space.

55. The camera module of any of claims 39-47, wherein the lens holder is secured to the circuit board by dispensing in two opposing first areas between the lens holder and the circuit board.

56. The camera module of claim 55, wherein glue between the lens holder and the circuit board is applied along each of the two long sides of the lens holder.

57. The camera module of any of claims 39-47, wherein the lens mount is secured to the circuit board by dispensing a set of adjacent first and second regions between the lens mount and the circuit board.

58. The camera module of claim 55, wherein between the lens holder and the circuit board, glue in one of the first regions is applied along a long side of the lens holder, and glue in an adjacent second region is applied along a short side of the lens holder.

59. The camera module according to any one of claims 39 to 47, wherein the photosensitive chip is fixed to the top side of the circuit board by dispensing in two opposing first areas between the photosensitive chip and the circuit board.

60. The camera module according to claim 59, wherein glue between the photosensitive chip and the circuit board is applied along two long sides of the photosensitive chip respectively.

61. The camera module according to any one of claims 39 to 47, wherein the photosensitive chip is fixed to the top side of the circuit board by a set of adjacent first and second areas between the photosensitive chip and the circuit board.

62. The camera module of claim 61, wherein between the photosensitive chips and the circuit board, the glue in one of the first areas is coated along a long side of the photosensitive chip, and the glue in the adjacent second area is coated along a short side of the photosensitive chip.

63. An array camera module, a serial communication port, include:

at least two lens assemblies, wherein the lens assemblies comprise:

an optical lens group;

the optical lens group is arranged in the lens barrel to form a lens;

a support member, wherein the lens barrel is fixed on the inner side of the support member by dispensing in two opposite first areas between the lens barrel and the support member to limit the displacement of the lens barrel and the support member in the X direction, wherein the first areas correspond to long side areas of a photosensitive chip of the photosensitive assembly;

at least two photosensitive chips;

an integrated lens base; and

64. The array camera module of claim 63, wherein glue between the support and the lens barrel is applied to a middle region of the first region opposite thereto.

65. The array camera module of claim 63, further comprising a dust-proof glue, wherein the dust-proof glue is applied to two opposite second regions between the lens barrel and the support, wherein the second regions correspond to short side regions of a photosensitive chip of the photosensitive assembly.

66. The array camera module of claim 64, further comprising a dust-proof glue, wherein the dust-proof glue is applied to two opposite second regions between the lens barrel and the support, wherein the second regions correspond to short side regions of a photosensitive chip of the photosensitive assembly.

67. The array camera module of claim 65, wherein at least one dust-proof slot is disposed on an inner sidewall of the support member in at least one of the two second regions, wherein the dust-proof glue is filled in the dust-proof slot, wherein a predetermined distance is provided between an outer surface of the dust-proof glue and an outer sidewall of the lens barrel, so as to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the support member.

68. The array camera module of claim 65, wherein at least one dust-proof slot is disposed on an outer sidewall of the lens barrel in one of the at least two second regions, wherein the dust-proof glue is filled in the dust-proof slot on the outer sidewall and spaced from an inner sidewall of the supporting member by a predetermined distance to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the supporting member.

69. The array camera module of claim 63 or 64, wherein at least one of the two second regions, the outer sidewall of the barrel and the inner sidewall of the support member have mutually staggered and matching protrusions to form a staggered protrusion structure, so as to prolong the dust path into the camera module.

70. The array camera module of claim 63 or 64, further comprising two dispensing spaces, wherein the two dispensing spaces are respectively formed in two opposite first regions between the lens barrel and the support member, and the two opposite second regions are closed.

71. An array camera module, a serial communication port, include:

at least two lens assemblies, wherein the lens assemblies comprise:

an optical lens group;

the optical lens group is arranged in the lens barrel to form a lens;

a support member, wherein the lens barrel is fixed inside the support member by dispensing a group of first areas and second areas between the lens barrel and the support member to limit the displacement of the lens barrel and the support member, wherein the first areas correspond to long side areas of a photosensitive chip of the photosensitive assembly, and the second areas correspond to short side areas of the photosensitive chip of the photosensitive assembly; an integrated lens base; and

72. The lens assembly of claim 71, wherein glue between the support and the barrel is applied to a set of adjacent middle regions of the first region and the second region, respectively.

73. The array camera module of claim 71 or 72, further comprising a dust-proof glue, wherein the dust-proof glue is coated on another set of adjacent first and second regions between the lens barrel and the support member.

74. The array camera module of claim 73, wherein at least one dust-proof slot is disposed on an inner sidewall of the supporting member in at least one of the other adjacent first and second regions, wherein the dust-proof glue is filled in the dust-proof slot, and wherein an outer surface of the dust-proof glue is spaced from an outer sidewall of the lens barrel by a predetermined distance to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the supporting member.

75. The array camera module of claim 71 or 72, wherein in at least another set of adjacent first and second regions, the outer sidewall of the lens barrel and the inner sidewall of the support member are provided with mutually staggered and matched protrusions to form a staggered protrusion structure, so as to prolong the path of dust entering the camera module.

76. The array camera module according to claim 71 or 72, further comprising two glue dispensing spaces, wherein the two glue dispensing spaces are respectively formed between the lens barrel and the support member in a group of the first region and the second region adjacent to each other, and the other group of the first region and the second region adjacent to each other is closed.

77. A photosensitive assembly, comprising:

a photosensitive chip;

a microscope base, wherein through the circuit board with between the microscope base, two relative first region point glues, fixes the microscope base in the circuit board, wherein the microscope base encircles all sides of sensitization chip, wherein the microscope base has an at least optical window, corresponding to the sensitization region of sensitization chip, wherein first region with the long limit region of a sensitization chip of sensitization subassembly corresponds.

78. The photosensitive assembly of claim 77, wherein glue between the submount and the circuit board is applied along two long sides of the submount, respectively.

79. A photosensitive assembly, comprising:

a photosensitive chip;

80. The photosensitive assembly of claim 79, wherein glue between the stage and the circuit board, glue located in one of the first regions is applied along a long side of the stage, and glue located in an adjacent second region is applied along a short side of the stage.

81. A photosensitive assembly, comprising:

a photosensitive chip;

82. The photosensitive assembly of claim 81 wherein glue between said photosensitive chip and said circuit board is applied along two long sides of said photosensitive chip, respectively.

83. A photosensitive assembly, comprising:

a photosensitive chip;

84. The photosensitive assembly of claim 83, wherein glue between said photosensitive chips and said circuit board, glue in one of said first areas is applied along a long side of said photosensitive chip, and glue in an adjacent one of said second areas is applied along a short side of said photosensitive chip.

85. An array camera module, a serial communication port, include:

at least two lens assemblies, wherein the lens assemblies comprise:

an optical lens group;

the optical lens group is arranged in the lens barrel to form a lens;

a support member, wherein the lens barrel is fixed on the inner side of the support member by dispensing in two opposite first areas between the lens barrel and the support member to limit the displacement of the lens barrel and the support member in the X direction, wherein the first areas correspond to long side areas of a photosensitive chip of the photosensitive assembly; and

at least two photosensitive chips;

at least two lens holders; and a circuit board, wherein sensitization chip is attached in correspondingly and electric connection ground the circuit board, wherein every the microscope base encircles and corresponds all sides of sensitization chip, and attached in the circuit board, wherein the microscope base has an optical window, corresponding to the sensitization region of sensitization chip, wherein support piece supports the camera lens, corresponding to the optical window, wherein support piece is by corresponding the microscope base extends.

86. The array camera module of claim 85, wherein glue between the support and the lens barrel is applied to a middle region of the first region opposite thereto.

87. The array camera module of claim 85 or 86, further comprising a dust-proof glue, wherein the dust-proof glue is applied to two opposite second regions between the lens barrel and the support member, wherein the second regions correspond to short side regions of a photosensitive chip of the photosensitive assembly.

88. The array camera module of claim 87, wherein at least one dust-proof slot is disposed on an inner sidewall of the support member in at least one of the two second regions, wherein the dust-proof glue is filled in the dust-proof slot, wherein a predetermined distance is provided between an outer surface of the dust-proof glue and an outer sidewall of the lens barrel, so as to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the support member.

89. The array camera module of claim 87, wherein at least one dust-proof slot is disposed on an outer sidewall of the lens barrel in one of the at least two second regions, wherein the dust-proof glue is filled in the dust-proof slot on the outer sidewall and spaced from an inner sidewall of the supporting member by a predetermined distance to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the supporting member.

90. The array camera module of claim 85 or 86, wherein at least one of the two second regions, the outer sidewall of the lens barrel and the inner sidewall of the support member have mutually staggered and matched protrusions to form a staggered protrusion structure, so as to prolong the dust path into the camera module.

91. The array camera module according to claim 85 or 86, further comprising two dispensing spaces, wherein the two dispensing spaces are respectively formed in two opposite first regions between the lens barrel and the support member, and the two opposite second regions are closed.

92. An array camera module, a serial communication port, include:

at least two lens assemblies, wherein the lens assemblies comprise:

an optical lens group;

the optical lens group is arranged in the lens barrel to form a lens;

a support member, wherein the lens barrel is fixed inside the support member by dispensing a group of first areas and second areas between the lens barrel and the support member to limit the displacement of the lens barrel and the support member, wherein the first areas correspond to long side areas of a photosensitive chip of the photosensitive assembly, and the second areas correspond to short side areas of the photosensitive chip of the photosensitive assembly;

at least two photosensitive chips;

an integrated lens base; and

93. The array camera module of claim 92, wherein the glue between the support and the lens barrel is applied to a set of adjacent middle areas of the first area and the second area, respectively.

94. The array camera module of claim 92 or 93, further comprising a dust-proof glue, wherein the dust-proof glue is coated on another set of adjacent first and second regions between the lens barrel and the support member.

95. The array camera module of claim 94, wherein at least one dust-proof slot is disposed on an inner sidewall of the supporting member in at least one of the other adjacent first and second regions, wherein the dust-proof glue is filled in the dust-proof slot, and wherein an outer surface of the dust-proof glue is spaced from an outer sidewall of the lens barrel by a predetermined distance to adhere dust in a gap between the outer sidewall of the lens barrel and the inner sidewall of the supporting member.

96. The array camera module of claim 92 or 93, wherein at least another set of adjacent first and second regions, the outer sidewall of the lens barrel and the inner sidewall of the support member have mutually staggered and matched protrusions to form a staggered protrusion structure, so as to prolong the dust path into the camera module.

97. The array camera module according to claim 92 or 93, further comprising two glue dispensing spaces, wherein the two glue dispensing spaces are respectively formed between the lens barrel and the support member in a group of the first region and the second region adjacent to each other, and the other group of the first region and the second region adjacent to each other is closed.