CN209879499U - Universal burning and testing device based on NO FLASH assembly module - Google Patents

Abstract

The utility model discloses a general burning and testing arrangement based on NO FLASH assembly module, include: the module burning and testing instrument is a model adapter plate connected with the module burning and testing instrument; the model keysets includes: the device comprises a tester interface, an assembly screen interface, a model identification circuit and a model storage module, wherein the assembly screen interface and the model identification circuit are respectively and electrically connected with the tester interface, and the model storage module is connected with the model identification circuit. The utility model obtains the model information of the NO FLASH assembly screen to be tested on the model pinboard through the module burning and testing instrument, and the NOFLASH assembly screen information is not required to be manually input, thus being simple and convenient; when the assembly screens of different models are tested, only the corresponding model adapter plate needs to be replaced, and errors are avoided.

Description

Universal burning and testing device based on NO FLASH assembly module

Technical Field

The utility model relates to a screen test technical field especially relates to a general burning and testing arrangement based on NO FLASH assembly module.

Background

The display drive IC on the display screen (assembly module) is used for driving the display screen to enable the screen to work normally; the touch driving IC on the touch screen is used to control the touch screen so that the screen works normally. In order to reduce the cost of the module and simplify the structure of the module, the TDDI driver IC (integrated touch driver and display driver chip) is almost used in the mainstream display screens in the market at present. However, the TDDI driver IC has a serious shortage of data storage space, and needs to mount a FLASH memory to store the driver data. Since the TDDI driver IC needs to mount a FLASH memory to store the driver data, it is common practice for module manufacturers to design the FLASH memory on the flexible layout of the display module. However, with the promotion of mobile phone manufacturers, such as china, the FLASH memory is gradually changed and mounted in the mobile phone motherboard, so that the driving data on the module is stored in the mobile phone motherboard, and we call the display module as an NO FLASH assembly module. Since NO FLASH assembly module does not mount FLASH, NO FLASH assembly module in single state will lose the driving data of module driver. In addition, the interface definition of the NO FLASH assembly module connector is different from the connector definition of the conventional module, the NO FLASH assembly module adopts the MIPI interface and the SPI interface to realize the external interaction of the data of the display data and the touch data, and the conventional display module adopts the MIPI interface and the IIC interface to realize the external interaction of the display and the touch.

The production of NO FLASH assembly modules can be roughly divided into two major steps. The front section is the assembling step of the NO FLASH assembly module, and the rear section is the burning and testing of the assembled NO FLASH assembly module. According to practical conditions, the back-end production test generally needs to go through three steps. The three steps are respectively the display driving data burning and the display function test and the touch function test. For the back-end production test of the NO FLASH module, a module manufacturer adopts a scheme of 'one step by one device'. When the burning module displays and drives, the burning machine is driven by the module display to produce; when the display and touch functions of the module are detected, the TDDI is adopted to drive the IC original factory test board and the computer to test the module touch, and the TDDI is adopted to drive the IC original factory test board, the computer and the module point display equipment to test the display function. The module back-end production test scheme of the 'one-step one-equipment' has the following defects. Firstly, a computer is required to be used for testing the module, which not only makes the NO FLASH module have high burning cost but also complicated and complicated operation. Secondly, the scheme of 'one step of equipment' results in that the NO FLASH assembly module needs to be pulled and inserted back and forth between the 3 pieces of equipment produced in the later stage to transfer each function in the production test, which not only easily causes the damage of the module, but also has low production efficiency. And thirdly, the narrow dust-free workshop is originally just small in size and gold in earth, production tools such as the computer, the recorder, the point display equipment and the test board need to be placed, and workshop space resources are greatly occupied.

Furthermore, in order to satisfy the requirement that one programming and testing instrument can test various types of existing programming and testing instruments, a query code table is generally adopted, after a code corresponding to a screen of an assembly to be tested is found, the code is input to a programming and testing instrument body, and the programming and testing programs are automatically switched by the testing instrument according to the code. This manual table lookup method has the following disadvantages.

The first point is as follows: the manual number input steps are too complex, and the screen of the large-scale production test assembly of an enterprise is not facilitated.

And a second point: it is easy to switch to the wrong test program to test the assembly screen, causing irreversible batch problems.

And a third point: the screen test equipment enterprise needs to spend huge energy to maintain the update of the code table in real time and provide a great deal of manpower to deal with the consultation and customer complaints of the user because the program can not be switched.

Accordingly, the prior art is deficient and needs improvement.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is: the universal burning and testing device based on the NO FLASH assembly module is provided, a special TDDI drive IC original factory test board is not needed, the display and touch test of the NO FLASH assembly module is realized, and the test efficiency is improved; the method simplifies the procedure of replacing the program of the screen manufacturing enterprise, does not need to manually switch the serial number by searching a complicated code table to switch the program, and realizes the switching of different screen test programs by replacing the model adapter plate. The problem of screen production caused by error code selection of a client is avoided, and meanwhile, the maintenance and after-sale cost of screen testing equipment enterprises on the equipment is greatly reduced.

The technical scheme of the utility model as follows: the utility model provides a general burning and testing arrangement based on NO FLASH assembly module, includes: the module burning and testing instrument is a model adapter plate connected with the module burning and testing instrument; the module burns record and tester includes: the system comprises a main control MCU, a storage unit and an FPGA which are respectively and electrically connected with the main control MCU, an SSD2828 bridging chip or an SSD2829 bridging chip which is respectively and electrically connected with the FPGA, three SD-RAM storages, an MIPI interface which is electrically connected with the SSD2828 bridging chip, and an SPI interface which is connected with the main control MCU; the model keysets includes: the tester interface comprises an assembly screen interface, a model identification circuit and a model storage module, wherein the assembly screen interface and the model identification circuit are respectively electrically connected with the tester interface; the model identification circuit includes: the single chip microcomputer chip is electrically connected with a serial port communication interface and a downloading interface respectively; the single chip microcomputer chip is electrically connected with the module burning and testing instrument and the model storage module respectively; the single chip microcomputer chip is electrically connected with the module burning and testing instrument through the serial port communication interface, and the model storage module is a storage IC or an ID identification interface comprising a plurality of pins; the MIPI interface and the SPI interface are electrically connected with a TDDI drive IC of the NO FLASH assembly module through the model adapter plate; the MIPI interface is used for transmitting display data to the TDDI driving IC of the NOFLASH assembly module, and the SPI interface is used for transmitting firmware data and touch coordinate data to the TDDI driving IC of the NOFLASH assembly module.

When the model storage module is a storage IC, the model of the assembly screen can be directly stored in the storage IC. The model storage module is an ID identification interface comprising a plurality of pins, the pins connected with the ID identification interface of the single chip microcomputer chip are in three states of pull-up, pull-down and suspension, the plurality of pins of the ID identification interface are set in different states, the NOFLASH assembly module model can be coded, and the single chip microcomputer chip acquires the state of the pins of the ID identification interface, so that the model of the NO FLASH assembly module corresponding to the type adapter plate is acquired. The model adapter plate is electrically connected with the module burning and testing instrument, the module burning and testing instrument can acquire the model of the NO FLASH assembly screen corresponding to the model adapter plate, and after the NO FLASH assembly screen is connected with the model adapter plate, the module burning and testing instrument can directly call corresponding driving data, and then the NO FLASH assembly screen is burned and tested.

The main control MCU transmits firmware data to the RAM of the TDDI driver IC through the SPI interface, then transmits an initialization display code (display driving data) required by the NO FLASH assembly module to the TDDI driver IC of the NO FLASH assembly module through the MIPI interface, and sends out 0X11 and 0X29 instructions to wake up and point the screen. When the display screen is lighted and no abnormity such as display missing line, color change, screen flashing and the like is found, the main control MCU writes the display drive data into the TDDI drive IC one by one according to the write flow specified by the TDDI drive IC. The NO FLASH assembly module with the recorded display driving data does not need to pre-load the display driving data to the NO FLASH assembly module when the module is used for displaying. In addition, since the NO FLASH assembly module has been burned with display driving data, the screen can be directly awakened and lighted up by adopting the commands of 0X11 and 0X 29.

The main control MCU transmits display data to the TDDI drive IC of the NO FLASH assembly module through the MIPI interface, so that the display test of the NO FLASH assembly module is completed; the main control MCU can transmit touch coordinate data to the TDDI drive IC of the NOFLASH assembly module through the SPI interface, so that touch test on the NO FLASH assembly module can be realized; therefore, the NOFLASH assembly module can be tested by displaying and touching, the cost is reduced, and the production efficiency is improved.

Further, the main control MCU is used for controlling the whole testing device, the FPGA is used for converting binary image data in the storage unit, the SSD2828 bridge chip is used for converting RGB data converted by the FPGA into MIPI data, the storage unit is used for storing the image data or an upgrade file of the testing device, and the three SD-RAMs are used for storing R, G, B data converted by the FPGA respectively.

Furthermore, the model storage module is an ID identification interface, and a pin of the ID identification interface is connected with the single chip microcomputer chip through an ESD electrostatic protection chip; the model of the single chip microcomputer chip is STM32F030F4P6, and the model of the ESD electrostatic protection chip is CH 412.

Further, the module burning and testing instrument further comprises: and the display screen is connected with the master control MCU.

Further, the display screen is an LCD display screen.

Further, the storage unit includes: and the SD card slot is electrically connected with the master control MCU and is arranged on the SD card slot. The SD card can be taken out of the SD card slot, so that picture data or an upgrade file of the testing device can be written conveniently.

Further, the main control MCU adopts STM32 series 32-bit single chip microcomputer, and the FPGA chip can adopt Xilinx or Altera or Intel or purple light co-created FPGA chip.

Further, the main control MCU is based onThe single chip microcomputer STM32F446 series products of the kernel, the FPGA adopts an Altera EP4CE6F17C 8-based chip.

Adopt above-mentioned scheme, the utility model provides a general burning and testing arrangement based on NO FLASH assembly module, the module burns and the tester interface connection of tester and model keysets, the assembly screen interface of model keysets is connected with the NO FLASH assembly module that corresponds the model, because the model information of NO FLASH assembly screen has been contained in the model keysets, after the module burns and the tester acquires the model of NO FLASH assembly screen, alright with call corresponding drive data, burn then, show the test, the touch test. The module burning tester is electrically connected with the TDDI drive IC of the NO FLASH assembly module through the MIPI interface and the SPI interface, so that the main control MCU can interact data with the NO FLASH assembly module through the MIPI interface and the SPI interface. The main control MCU transmits display data to the TDDI drive IC of the NO FLASH assembly module through the MIPI interface, so that the display test of the NO FLASH assembly module is completed; the main control MCU can transmit firmware data and touch coordinate data to the TDDI drive IC of the NO FLASH assembly module through the SPI interface, so that burning and touch testing of the NO FLASH assembly module can be realized; therefore, the display and touch of the NO FLASH assembly module can be tested together, the cost is reduced, and the production efficiency is improved. Moreover, the device can complete burning, display test and screen test, greatly saves workshop resources, and does not need to plug and unplug the NO FLASH assembly module for many times. The model information of the NO FLASH assembly screen to be tested is acquired on the model adapter plate by the module burning and testing instrument, so that the NO FLASH assembly screen information does not need to be manually input, and the model burning and testing instrument is simple and convenient; when the assembly screens of different models are tested, only the corresponding model adapter plate needs to be replaced, and errors are avoided.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a functional block diagram of a NO FLASH assembly module;

FIG. 3 is a functional block diagram of a conventional mainstream display module;

FIG. 4 is a schematic diagram of the connection of the embodiment of FIG. 1 to a NO FLASH assembly module;

FIG. 5 is a circuit schematic of the model identification circuit;

FIG. 6 is a schematic circuit diagram of an ID identification interface of the model patch panel of the embodiment of FIG. 1;

FIG. 7 is a schematic view of a touch line during testing of the NO FLASH assembly module.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1-7, the present invention provides a general burning and testing device based on NO FLASH assembly module, which includes: a module burning and testing instrument 100, a model adapter plate 200 connected with the module burning and testing instrument 100; the module burning and testing instrument 100 includes: the system comprises a main control MCU10, a storage unit and an FPGA30 which are respectively and electrically connected with the main control MCU10, an SSD2828 bridging chip 40 and three SD-RAM storages 50 which are respectively and electrically connected with the FPGA30, an MIPI (mobile industry processor interface) 60 which is electrically connected with the SSD2828 bridging chip 40, and an SPI 70 which is connected with the main control MCU 10; the model adaptor board 200 includes: the tester interface 210 comprises an assembly screen interface 220, a model identification circuit 230 and a model storage module, wherein the assembly screen interface 220 and the model identification circuit 230 are respectively electrically connected with the tester interface 210; the model identification circuit 230 includes: the single chip microcomputer chip 231 is respectively and electrically connected with the serial port communication interface 232 and the download interface 233 of the single chip microcomputer chip 231; the single chip 231 is electrically connected with the module burning and testing instrument 100 and the model storage module respectively; the single chip 231 is electrically connected with the module burning and testing instrument 100 through the serial port communication 232 interface, and the model storage module is an ID identification interface 240 comprising a plurality of pins; the MIPI interface 60 and the SPI interface 70 are electrically connected with a TDDI drive IC of the NO FLASH assembly module 300 through the model adapter plate 200; the MIPI interface 60 is used to transmit display data to the TDDI driver IC310 of the NO FLASH assembly module 300, and the SPI interface 70 is used to transmit firmware data and touch coordinate data to the TDDI driver IC310 of the NO FLASH assembly module 300. The download interface is used for program upgrading of the single chip microcomputer chip.

The pins connected with the ID identification interface 240 of the single chip 231 are in three states of pull-up, pull-down and suspension, different states are set for a plurality of pins of the ID identification interface 240, so that the model of the NO FLASH assembly module 300 can be encoded, and the single chip 231 acquires the model of the NO FLASH assembly module 300 corresponding to the model adapter plate 200 by acquiring the states of the pins of the ID identification interface 240. The model adapter plate 200 is electrically connected with the module burning and testing instrument 100, the module burning and testing instrument 100 can acquire the model of the NO FLASH assembly screen corresponding to the model adapter plate 200, and after the NO FLASH assembly screen is connected with the model adapter plate 200, the module burning and testing instrument 100 can directly call corresponding driving data, and then the NO FLASH assembly screen is burned and tested.

The pull-up state, the pull-down state and the floating state of the ID pin of the ID identification interface 240 are predefined as 1, 0 and 2, respectively. In the present embodiment, the number of ID pins for ID identification in the ID identification interface 240 is 8. For example, after a series of 3-system numbers 21021 and 3-input numbers 21021021 are converted into 10-system numbers according to the definition, the serial communication interface 232 transmits the 10-system numbers to the module burning and testing instrument 100 to obtain the specific code of the model adapter board 200. After the module burning and testing instrument 100 acquires the codes, the corresponding programs are automatically switched to realize automatic model identification of the adapter board 200 and switching of the burning and testing programs.

The main control MCU10 transmits firmware data to the RAM of the TDDI driver IC310 through the SPI interface 70, then transmits the initialization display code (display driving data) required by the NO FLASH assembly module 300 to the TDDI driver IC310 of the NOFLASH module through the MIPI interface 60, and issues 0X11 and 0X29 commands to wake up and click the screen. When the display screen is turned on and no display defects, color changes, screen flashes, etc. are found, the main control MCU10 writes the display driving data into the TDDI driver IC310 one by one according to the writing process specified by the TDDI driver IC 310. The NO FLASH assembly module 300 that has been programmed with the display driving data does not need to preload the display driving data to the NO FLASH assembly module 300 when the module is clicked for display. In addition, since the module has been burned with the display driving data, the screen can be directly woken up and lighted up by adopting the commands of 0X11 and 0X 29.

The main control MCU10 transmits display data to the TDDI driver IC310 of the NO FLASH assembly module 300 through the MIPI interface 60, thereby completing the display test of the NO FLASH assembly module 300; the main control MCU10 can transmit touch coordinate data to the TDDI driver IC310 of the NO FLASH assembly module 300 through the SPI interface 70, so that the touch test of the NO FLASH assembly module 300 can be realized; therefore, the NO FLASH assembly module 300 can be tested by displaying and touching, the cost is reduced, and the production efficiency is improved.

The main control MCU10 is used for controlling the whole testing device, the FPGA30 is used for converting binary image data in the storage unit, the SSD2828 bridge chip 40 is used for converting RGB data converted by the FPGA30 into MIPI data, the storage unit is used for storing image data or upgrade files of the testing device, and the three SD-RAM storages 50 are used for respectively storing R, G, B data converted by the FPGA 30.

The pin of the ID identification interface 240 is connected to the single chip 231 through the ESD protection chip 250; the model of the single chip 231 is STM32F030F4P6, and the model of the ESD electrostatic protection chip 250 is CH 412.

The module burning and testing instrument 100 further includes: and the display screen is connected with the master control MCU 10.

The display screen is an LCD display screen 80.

The memory cell includes: and the SD card slot 21 is electrically connected with the main control MCU10, and the SD card 22 is installed on the SD card slot 21. The SD card 22 can be taken out from the SD card slot 21, facilitating writing of picture data or an upgrade file of the test apparatus.

The main control MCU10 is based onThe single chip microcomputer STM32F446 series products of the kernel, the FPGA30 adopts an Altera EP4CE6F17C 8-based chip.

Further, the burning method and the touch and display test method are as follows.

S1: connecting the module burning and testing instrument 100 with a testing instrument interface 210 of a model adapter plate 200, and connecting an assembly screen interface 220 of the model adapter plate 200 with a NO FLASH assembly module 300 of a corresponding model, so that an MIPI (million Instructions interface) 60 and an SPI (serial peripheral interface) 70 of the module burning and testing instrument 100 are electrically connected with a TDDI (time delay and integration) driving IC310 of the NO FLASH assembly module 300 through the model adapter plate 200; and starting to burn and test.

S2: the main control MCU10 obtains the model data in the model adaptor board 200 and calls the driving data required by the model NO FLASH assembly module 300.

S4: the master MCU10 transmits the driving data required by the NO FLASH assembly module 300 to the RAM in the TDDI driving IC310 of the NO FLASH assembly module 300 through the SPI interface 70 for storage.

S5: the main control MCU10 takes out the binary picture data in the SD card and transmits the binary picture data to the FPGA 30.

S6: the FPGA30 converts the binary picture data into RGB format data and stores in 3 SD-RAM memories 50, respectively.

S7: the main control MCU10 extracts RGB data in the SD-RAM and converts the RGB data into MIPI format picture data through the SD2828 bridge chip 40.

S8: the main control MCU10 controls the SSD2828 bridge chip 40 to transfer the MIPI format picture data to the TDDI driver IC310 of the screen to be tested.

S9: the SSD2828 bridge chip 40 sends initialization code to preload the NO FLASH assembly module 300 and click the screen.

S10: and observing and judging whether the NO FLASH assembly module 300 has display abnormity, if not, directly entering S11, and if so, directly ending.

S11: the main control MCU10 writes display driving data into the TDDI driver IC310 via the MIPI interface 60 step by step according to the specific writing flow requirement of the TDDI driver IC 310. After the burning is finished, the screen is directly displayed through commands of 0X11 and 0X 29.

S12: and testing the display function, namely testing the display function of the screen to be tested by switching the picture of the NO FLASH assembly module 300.

S13: testing the touch function, displaying the square frame picture on the NO FLASH assembly module 300, and touching and drawing a line on the NO FLASH assembly module 300, so that the TDDI drive IC310 receives the corresponding coordinate and has a capacity value change; the main control MCU10 reads the TDDI driver IC310 in real time to obtain the x-axis and y-axis coordinate data of the touched position, and displays the "touched" coordinate position as a "thin point" on the corresponding coordinate position of the "NOFLASH assembly module 300". Then touching the circle on the NO FLASH assembly module 300 can display a circle on the NO FLASH assembly module 300.

S14: and drawing lines on the NO FLASH assembly module, fully drawing a square frame to be green, wherein the touch line drawing function of the screen is qualified, and if a certain part of squares on the screen cannot be fully drawn to be green, the part is abnormal in touch. Referring to fig. 7, a is a frame image displayed by the NO FLASH assembly module 300, B is a fine dot displayed by touching the NO FLASH assembly module 300, C is a continuous touch, the fine dots displayed by the NO FLASH assembly module 300 are connected to form a line, and D is a schematic diagram of a frame image fully drawn on the NO FLASH assembly module 300.

S15: and after the test is finished, cutting off the power supply of the NO FLASH assembly module 300, and finishing the test.

To sum up, the utility model provides a general burning and test device of burning based on NO FLASH assembly module, the module burns and the tester interface connection of tester and model keysets, and the assembly screen interface of model keysets is connected with the NO FLASH assembly module that corresponds the model, because contained the model information of NO FLASH assembly screen in the model keysets, after the module burns and tester 100 acquires the model of NO FLASH assembly screen, alright with call corresponding drive data, burn then, show the test, the touch test. The module burning tester is electrically connected with the TDDI drive IC of the NO FLASH assembly module through the MIPI interface and the SPI interface, so that the main control MCU can interact data with the NO FLASH assembly module through the MIPI interface and the SPI interface. The main control MCU transmits display data to the TDDI drive IC of the NO FLASH assembly module through the MIPI interface, so that the display test of the NO FLASH assembly module is completed; the main control MCU can transmit firmware data and touch coordinate data to the TDDI drive IC of the NO FLASH assembly module through the SPI interface, so that burning and touch testing of the NO FLASH assembly module can be realized; therefore, the display and touch of the NO FLASH assembly module can be tested together, the cost is reduced, and the production efficiency is improved. Moreover, the device can complete burning, display test and screen test, greatly saves workshop resources, and does not need to plug and unplug the NO FLASH assembly module for many times. The model information of the NO FLASH assembly screen to be tested is acquired on the model adapter plate by the module burning and testing instrument, so that the NOFLASH assembly screen information does not need to be manually input, and the method is simple and convenient; when the assembly screens of different models are tested, only the corresponding model adapter plate needs to be replaced, and errors are avoided.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (7)

1. A general burn and test device based on NO FLASH assembly module, which is characterized by comprising: the module burning and testing instrument is a model adapter plate connected with the module burning and testing instrument; the module burns record and tester includes: the system comprises a main control MCU, a storage unit and an FPGA which are respectively and electrically connected with the main control MCU, an SSD2828 bridging chip or an SSD2829 bridging chip which is respectively and electrically connected with the FPGA, three SD-RAM storages, an MIPI interface which is electrically connected with the SSD2828 bridging chip, and an SPI interface which is connected with the main control MCU; the model keysets includes: the tester interface comprises an assembly screen interface, a model identification circuit and a model storage module, wherein the assembly screen interface and the model identification circuit are respectively electrically connected with the tester interface; the model identification circuit includes: the single chip microcomputer chip is electrically connected with a serial port communication interface and a downloading interface respectively; the single chip microcomputer chip is electrically connected with the module burning and testing instrument and the model storage module respectively; the single chip microcomputer chip is electrically connected with the module burning and testing instrument through the serial port communication interface, and the model storage module is a storage IC or an ID identification interface comprising a plurality of pins; the MIPI interface and the SPI interface are electrically connected with a TDDI drive IC of the NO FLASH assembly module through the model adapter plate; the MIPI interface is used for transmitting display data to the TDDI driving IC of the NO FLASH assembly module, and the SPI interface is used for transmitting firmware data and touch coordinate data to the TDDI driving IC of the NO FLASH assembly module.

2. The universal burning and testing device based on the NO FLASH assembly module according to claim 1, wherein the model storage module is an ID identification interface, and a pin of the ID identification interface is connected with the singlechip chip through an ESD electrostatic protection chip; the model of the single chip microcomputer chip is STM32F030F4P6, and the model of the ESD electrostatic protection chip is CH 412.

3. The NO FLASH assembly module based universal burning and testing device of claim 1, wherein the module burning and testing instrument further comprises: and the display screen is connected with the master control MCU.

4. The universal burning and testing device based on the NO FLASH assembly module according to claim 3, wherein the display screen is an LCD display screen.

5. The universal burning and testing device based on NO FLASH assembly module of claim 1, wherein the storage unit comprises: and the SD card slot is electrically connected with the master control MCU and is arranged on the SD card slot.

6. The universal burning and testing device based on the NO FLASH assembly module as claimed in claim 1, wherein the main control MCU adopts STM32 series 32-bit single chip microcomputer, and the FPGA chip can adopt Xilinx or Altera or Intel or purple light co-created FPGA chip.

7. The NO FLASH assembly module-based universal burning and testing device according to claim 6, wherein the main control MCU is based onAn M4 kernel single chip microcomputer STM32F446 series product, wherein the FPGA adopts an Altera EP4CE6F17C8 chip.