CN209872344U - Automatic bonding machine - Google Patents
Automatic bonding machine Download PDFInfo
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- CN209872344U CN209872344U CN201920687681.1U CN201920687681U CN209872344U CN 209872344 U CN209872344 U CN 209872344U CN 201920687681 U CN201920687681 U CN 201920687681U CN 209872344 U CN209872344 U CN 209872344U
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Abstract
The utility model relates to an automatic separate bonding machine, its substrate adsorb heating device include the upper junction plate, set up in the last vacuum chuck of upper junction plate downside and set up in the welding bellows of side on the upper junction plate aerifys the back in the welding bellows, can drive the fixed top piece device motion of vacuum chuck to the substrate absorption that is close to under through the extension of welding bellows, go up the bonding substrate montage back on vacuum chuck and the fixed top piece device of substrate absorption, can organize the heating until making bonding substrate group to separate the bonding through last vacuum chuck to bonding substrate, the lower substrate that obtains after separating the bonding can adsorb on the fixed top piece device of substrate absorption, the upper substrate that obtains after separating the bonding can adsorb on last vacuum chuck. The utility model discloses compact structure can effectively ensure to separate the parallel between last vacuum chuck of bonding in-process and lower vacuum chuck, improves the success rate of separating the bonding, safe and reliable.
Description
Technical Field
The utility model relates to a solve the bonder, especially an automatic solve bonder belongs to micro-nano technical field.
Background
In the field of MEMS, debonding is a common processing method, and two substrates that have been glued together are separated again by thermal slip. The upper and lower suckers are always ensured to be parallel in the bonding process, otherwise, the substrate is cracked or cannot be separated, and the existing bonding machine is difficult to meet the requirements of the bonding process.
Disclosure of Invention
The utility model aims at overcoming the not enough of existence among the prior art, providing an automatic bonding machine of separating, its compact structure can effectively ensure to separate the bonding in-process middle and upper vacuum chuck and the parallel between lower vacuum chuck, improves the success rate of separating the bonding, safe and reliable.
According to the technical scheme provided by the utility model, the automatic bonding machine that separates, including the casing, set up the substrate that can adsorb bonding substrate group and adsorb fixed top piece device and the substrate that can heat bonding substrate group and adsorb heating device in the casing, the substrate adsorbs heating device and is located the upper portion in the casing, and the substrate adsorbs fixed top piece device and installs in the lower part in the casing through the manipulator, and the substrate adsorbs fixed top piece device passes through the manipulator and can move to under the substrate adsorbs heating device in the casing;
substrate adsorbs heating device includes the upper junction plate, set up in the last vacuum chuck of upper junction plate downside and set up in the welding bellows of side on the upper junction plate, aerify the back in the welding bellows, vacuum chuck adsorbs fixed top piece device motion to the substrate that is close to directly under can be driven through the extension of welding bellows, go up the bonding substrate group back on vacuum chuck and the fixed top piece device of substrate absorption, can organize the heating until making bonding substrate group break-bond through last vacuum chuck, the lower substrate that obtains after breaking-bond can adsorb on the fixed top piece device of substrate absorption, the last substrate that obtains after breaking-bond can adsorb on last vacuum chuck.
Still including the bellows guide post that can lead welding bellows motion, the one end of bellows guide post is connected with the top in the casing, and the other end of bellows guide post passes the upper junction plate, and the tip that the bellows guide post is located the upper junction plate below sets up the spacing end plate of guide post, and the cover is equipped with the guide post spring on the bellows guide post, the guide post spring is located between spacing end plate of guide post and the upper junction plate.
The upper connecting plate is provided with a plurality of push-pull air cylinders, piston rods of the push-pull air cylinders are provided with locking blocks, and the corresponding corrugated pipe guide columns can be locked through the push-pull air cylinders and the locking blocks.
The substrate adsorption and fixing top piece device comprises a support flange connected with a manipulator, a lower connecting plate positioned right above the support flange and a substrate jacking mechanism capable of jacking a lower substrate, wherein the lower connecting plate is supported on the support flange through a plurality of connecting plate support columns; the lower connecting plate is provided with a lower vacuum chuck, and the lower vacuum chuck is provided with a plurality of lower vacuum adsorption holes which are communicated with the lower vacuum chuck.
The substrate jacking mechanism comprises a thimble lifting cylinder arranged on the supporting flange and a plurality of elastic thimbles which can penetrate out of the lower vacuum chuck, and the elastic thimbles are in adaptive connection with a piston rod of the thimble lifting cylinder through thimble fixing blocks; the lower substrate can be jacked up from the lower vacuum chuck through the elastic thimble.
The machine shell comprises two symmetrically distributed vertical plates and a top plate fixedly connected with the vertical plates, the substrate adsorption heating device is installed on the inner side face of the top plate, and a corrugated pipe inflation and deflation interface capable of inflating the welding corrugated pipe is arranged on the top plate.
The casing supports on the support body, sets up embedded handle on the side board of support body, sets up a plurality of evenly distributed's support foot seat in the bottom of support body.
The front of the frame body is provided with a display screen, and a display screen shell of the display screen is connected with the frame body through a hinge.
The utility model has the advantages that: can drive the motion of the fixed top piece device of substrate absorption through the manipulator, the fixed top piece device of substrate absorption is located the substrate adsorption equipment directly under the back, make the extension of welding bellows through aerifing the welding bellows, after the extension of welding bellows, go up vacuum chuck and contact with bonding substrate group, thereby can heat bonding debonding to bonding substrate group through last vacuum chuck, the latch segment can be locked the bellows guide post under push-and-pull cylinder 25's effect, prevent welding bellows 23 and remove, and then keep going up the parallel state between vacuum chuck and the lower vacuum chuck, can improve the success rate of debonding, safety and reliability.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic diagram of the substrate adsorption heating device of the present invention.
Fig. 3 is a schematic view of the substrate adsorption and fixation top plate device of the present invention.
FIG. 4 is ~ FIG. 8 is a schematic diagram of the specific process of the present invention for bonding and debonding, wherein
Fig. 4 is a schematic view of the present invention placing a bonded substrate group on a lower vacuum chuck.
Fig. 5 is a schematic view showing that the substrate adsorption fixing top plate device of the present invention moves to a position right below the substrate adsorption heating device.
Fig. 6 is a schematic view illustrating the heating and debonding of the bonding substrate group according to the present invention.
Fig. 7 is a schematic diagram of the present invention, in which the lower substrate is away from the substrate adsorption heating device following the movement of the substrate adsorption fixing top plate device.
Fig. 8 is a schematic view illustrating the lower substrate being lifted up from the lower vacuum chuck according to the present invention.
Description of reference numerals: 1-top plate, 2-vertical plate, 3-frame top plate, 4-frame, 5-embedded handle, 6-side plate, 7-supporting footstand, 8-vacuum meter, 9-start button, 10-emergency stop button, 11-display screen, 12-display screen shell, 13-front door plate, 14-front door fixing plate, 15-manipulator, 16-substrate adsorption fixing top plate device, 17-lower vacuum chuck, 18-bonded substrate group, 19-substrate adsorption heating device, 20-guide post spring, 21-upper vacuum chuck, 22-corrugated pipe guide post, 23-welded corrugated pipe, 24-locking block, 25-push-pull cylinder, 26-elastic thimble, 27-lower connecting plate, 28-connecting plate supporting post, 29-an ejector pin lifting cylinder, 30-an ejector pin fixing block, 31-a supporting flange, 32-a corrugated pipe air charging and discharging interface, 33-a hinge, 34-an upper connecting plate and 35-a guide post limiting end plate.
Detailed Description
The invention is further described with reference to the following specific drawings and examples.
As shown in fig. 1, 2 and 3: in order to effectively ensure the parallelism between the upper vacuum chuck 21 and the lower vacuum chuck 17 in the bonding process and improve the success rate of bonding, the utility model discloses a casing, the substrate adsorption fixing top piece device 16 which can adsorb the bonding substrate group 18 and the substrate adsorption heating device 19 which can heat the bonding substrate group 18 are arranged in the casing, the substrate adsorption heating device 19 is arranged at the upper part in the casing, the substrate adsorption fixing top piece device 16 is arranged at the lower part in the casing through the mechanical arm 15, and the substrate adsorption fixing top piece device 16 can move to the position under the substrate adsorption heating device 19 in the casing through the mechanical arm 15;
the substrate adsorption heating device 19 comprises an upper connecting plate 34, an upper vacuum sucker 21 arranged on the lower side surface of the upper connecting plate 34 and a welding corrugated pipe 23 arranged on the upper side surface of the upper connecting plate 34, after the welding corrugated pipe 23 is inflated, the upper vacuum sucker 21 can be driven to move towards the substrate adsorption fixing top piece device 16 close to the right lower side through the extension of the welding corrugated pipe 23, after the upper vacuum sucker 21 is contacted with the bonding substrate group 18 on the substrate adsorption fixing top piece device 16, the bonding substrate group 18 can be heated through the upper vacuum sucker 21 until the bonding substrate group 18 is debonded, a lower substrate 38 obtained after debonding can be adsorbed on the substrate adsorption fixing top piece device 16, and an upper substrate 39 obtained after debonding can be adsorbed on the upper vacuum sucker 21.
Specifically, the bonded substrate group 18 includes two substrates fixedly bonded, the bonded substrate group 18 can be adsorbed and supported by the substrate adsorption fixing top sheet device 16, and the bonded substrate group 18 on the substrate adsorption fixing top sheet device 16 can be heated by the substrate adsorption heating device 19, so that the bonded substrate group 18 can be debonded. The embodiment of the utility model provides an in, substrate adsorbs heating device 19 and is located the fixed top piece device 16 top of substrate absorption, the fixed top piece device 16 of substrate absorption is installed on manipulator 15, can drive the fixed top piece device 16 of substrate absorption through manipulator 15 and move in the casing, before separating the bonding promptly, can adsorb fixed top piece device 16 with the substrate through manipulator 15 and carry to substrate adsorption heating device 19 under, and after separating the bonding, can adsorb fixed top piece device 16 with the substrate through manipulator 15 and carry to the initial position state. In specific implementation, the manipulator 15 may adopt a conventional linear motion driving form, for example, the manipulator 15 may adopt a matching form of a screw nut and the like, and a specific structural form of the manipulator 15 may be selected as required, which is known to those skilled in the art and is not described herein again.
The embodiment of the utility model provides an in, substrate adsorbs heating device 19 includes upper junction plate 34, goes up vacuum chuck 21 and is located upper junction plate 34 below and go up vacuum chuck 21 and upper junction plate 34 fixed, and welding bellows 23 is located upper junction plate 34, and welding bellows 23's one end and upper junction plate 34 fixed connection, the other end and the top in the casing of welding bellows 23 are connected. When the welding bellows 23 is inflated by gas, the welding bellows 23 can be extended, and the upper vacuum chuck 21 can be driven to move toward the rear substrate suction fixing top sheet device 16 by the extension of the welding bellows 23, so that the upper vacuum chuck 21 can contact with the bonding substrate group 18. After the upper vacuum chuck 21 contacts the bonding substrate group 18, the bonding substrate group 18 can be heated by a heater in the upper vacuum chuck 21, so that the bonding of the bonding substrate group 18 can be realized, and an upper substrate 39 and a lower substrate 38 can be obtained. In the whole de-bonding process, the lower substrate 38 can be always adsorbed on the substrate adsorption and fixation top piece device 16, and the adsorption force on the upper vacuum chuck 21 can adsorb the upper substrate 39 obtained after de-bonding on the upper vacuum chuck 21, so that the separation between the upper substrate 39 and the lower substrate 38 in the bonded substrate group 18 can be effectively realized. In specific implementation, in order to realize the suction of the upper substrate 39, the upper vacuum chuck 21 is further provided with a plurality of upper vacuum chuck vacuum suction holes, and the upper substrate 39 can be sucked on the upper vacuum chuck 21 through the matching of vacuum suction equipment and the upper vacuum chuck vacuum suction holes.
Further, the substrate adsorption and fixation top piece device 16 comprises a support flange 31 for connecting with the mechanical arm 15, a lower connecting plate 27 positioned right above the support flange 31 and a substrate jacking mechanism capable of jacking a lower substrate 38, wherein the lower connecting plate 27 is supported on the support flange 31 through a plurality of connecting plate support columns 28; the lower connecting plate 27 is provided with a lower vacuum chuck 17, and the lower vacuum chuck 17 is provided with a plurality of lower vacuum suction holes 37 penetrating the lower vacuum chuck 17.
In the embodiment of the utility model provides an in, can install whole substrate absorption fixed top piece device 16 on manipulator 15 through supporting flange 31, lower connecting plate 27 supports on supporting flange 31 through connecting plate support column 28, and the length direction of connecting plate support column 28 is perpendicular with the plane at lower connecting plate 27, supporting flange 31 place. The lower vacuum chuck 17 is mounted on the lower connecting plate 27, a plurality of lower vacuum suction holes 37 are formed in the lower vacuum chuck 17, and the bonding substrate group 18 and the lower substrate 38 can be fixed to the lower vacuum chuck 17 by suction force generated by the lower vacuum suction holes 37.
The substrate jacking mechanism comprises an ejector pin lifting cylinder 29 arranged on a supporting flange 31 and a plurality of elastic ejector pins 26 capable of penetrating out of the lower vacuum chuck 17, and the elastic ejector pins 26 are in adaptive connection with a piston rod of the ejector pin lifting cylinder 29 through ejector pin fixing blocks 30; the lower substrate 38 can be lifted from the lower vacuum chuck 17 by the elastic ejector pins 26.
The embodiment of the utility model provides an in, thimble lift cylinder 29 is located support flange 31, connecting plate support column 28 is located thimble lift cylinder 29's outer lane, thimble lift cylinder 29's piston rod passes through thimble fixed block 30 and is connected with elasticity thimble 26, thereby piston rod and thimble fixed block 30 cooperation through thimble lift cylinder 29, can be ejecting in the vacuum chuck 17 from down with elasticity thimble 26, after elasticity thimble 26 is worn out from vacuum chuck 17 down, can jack-up lower substrate 38 from lower vacuum chuck 17, be convenient for follow-up press from both sides the clamp of lower substrate 38.
Furthermore, the welding bellows 22 is characterized by further comprising a bellows guide post 22 capable of guiding the movement of the welding bellows 23, one end of the bellows guide post 22 is connected with the top end in the casing, the other end of the bellows guide post 22 penetrates through the upper connecting plate 34, a guide post limiting end plate 35 is arranged at the end part, located below the upper connecting plate 34, of the bellows guide post 22, a guide post spring 20 is sleeved on the bellows guide post 22, and the guide post spring 20 is located between the guide post limiting end plate 35 and the upper connecting plate 34.
The embodiment of the utility model provides an in, bellows guide post 22 is located the outer lane of welding bellows 23, and the length direction of bellows guide post 22 is unanimous with the extension direction of welding bellows 23. The bellows guide post 22 penetrates through the upper connecting plate 34, and the bellows guide post 22 and the upper connecting plate 34 can move relatively. When the welding bellows 23 is extended, the guide post spring 20 can be compressed by the upper connection plate 34, and when the gas inside the welding bellows 23 is released, the upper vacuum chuck 21 can be restored to the original position by the guide post spring 20.
In specific implementation, a plurality of push-pull air cylinders 25 are arranged on the upper connecting plate 34, locking blocks 24 are arranged on piston rods of the push-pull air cylinders 25, and the corresponding corrugated pipe guide columns 22 can be locked through the push-pull air cylinders 25 and the locking blocks 24.
The embodiment of the utility model provides an in, the quantity of push-and-pull cylinder 25 on the upper junction plate 34 can be consistent with the bellows guide post 22 quantity that passes upper junction plate 34, it cooperates to be the one-to-one between push-and-pull cylinder 25 and bellows guide post 22, it is flexible when the piston rod of push-and-pull cylinder 25, make latch segment 24 support on bellows guide post 22, at this moment, the direction of applying the locking force through push-and-pull cylinder 25 and latch segment 24 on bellows guide post 22 is perpendicular with the length direction of bellows guide post 22, thereby can realize dying bellows guide post 22 lock, thereby can place tissue welding bellows 23 and remove. The embodiment of the utility model provides an in, welding bellows 23 can make it extend the removal through aerifing to its inside, welding bellows 23 has fine flexibility and great deformation volume, can come automatic leveling to go up vacuum chuck 21 through self deformation, vacuum chuck 17 down, latch segment 24 can be under push-and-pull cylinder 25's effect to bellows guide post 22 locking, prevent welding bellows 23 to remove, and then keep the parallel state between vacuum chuck 21 and lower vacuum chuck 17, can improve the success rate of separating the bonding.
Further, the machine shell comprises two symmetrically distributed vertical plates 2 and a top plate 1 fixedly connected with the vertical plates 2, the substrate adsorption heating device 19 is installed on the inner side surface of the top plate 1, and a corrugated pipe inflation and deflation interface 32 capable of inflating the welding corrugated pipe 23 is arranged on the top plate 1.
The embodiment of the utility model provides an in, riser 2 is vertical distribution, can connect the upper end of riser 2 through roof 1, can form one side open-ended van-type structure through riser 2, roof 1, and the opening through the casing can make the substrate adsorb fixed top piece device 16 and expose to can be convenient for arrange bonding substrate group 18 in down on vacuum chuck 17, and will follow the lower substrate 38 of jack-up on vacuum chuck 17 and take away. The top plate 1 is provided with a bellows inflation/deflation interface 32, and the bellows inflation/deflation interface 32 can inflate the welding bellows 32 and release the gas in the welding bellows 32.
Further, the casing supports on support body 4, sets up embedded handle 5 on the side board 6 of support body 4, sets up a plurality of evenly distributed's support foot stool 7 in the bottom of support body 4.
The embodiment of the utility model provides an in, support body 4 is cabinet-shaped, and the casing supports on support body roof 3 of support body 4, sets up embedded handle 5 on side board 6 of support body 4, can conveniently be to the transportation of support body 4 through embedded handle 5. The support body 4 can be conveniently placed at a required position through the supporting foot seats 7.
In addition, a display screen 11 is arranged on the front surface of the frame body 4, and a display screen shell 12 of the display screen 11 is connected with the frame body 4 through a hinge 33. The embodiment of the utility model provides an in, door plant 13 before the positive lower part setting of support body 4 sets up, door plant 13 sets up qianmen fixed plate 14 directly over in the front, set up vacuum table 8 on door fixed plate 14 in the front, can observe vacuum chuck 21 through vacuum table 8, it is vertical to descend corresponding vacuum in the vacuum chuck 17, still set up start button 9 and emergency stop button 10 on display screen casing 12, can realize the emergency braking to manipulator 15 through emergency stop button 10, can control the whole live working of separating the bonding machine through start button 9. Certainly, during specific implementation, an air source adapted to the thimble lifting cylinder 29, an air source for inflating the welding bellows 23, and other required power supply devices may be specifically selected as needed in the frame body 4, as long as the requirement for the bonding process of bonding the bonding substrate group 18 is met, and details are not described again.
In operation, the bonded substrate group 18 is placed on the substrate suction fixing top sheet device 16, and the lower vacuum chuck 17 is brought into a vacuum suction state, so that the bonded substrate group 18 is sucked on the lower vacuum chuck 17, as shown in fig. 4. The substrate adsorption-fixing top sheet device 16 is transported by the robot 15 to just below the substrate adsorption-heating device 19, as shown in fig. 5. After the working position is reached, the welding corrugated pipe 23 is slowly inflated, the welding corrugated pipe 23 can slowly move downwards under the action of air pressure until the upper vacuum suction cup 21 is contacted with the bonding substrate group 18, then the locking block 24 locks the corrugated pipe guide column 22 under the action of the push-pull air cylinder 25, the welding corrugated pipe 23 is prevented from moving, and the upper vacuum suction cup 21 and the lower vacuum suction cup 17 are kept in a parallel state. The heating is turned on to heat the bonded substrate stack 18 to the debonding temperature, as shown in fig. 6, with the particular heating temperature being selected based on the specific needs of the debonding. The substrate adsorption and fixing top piece device 16 is slowly pulled out by the mechanical arm 15, so that the upper substrate 38 is completely separated from the lower substrate 39, as shown in fig. 7. The elastic ejector pins 26 can be caused to eject the lower substrate 38 by the ejector pin lift cylinder 29, as shown in fig. 8. After the upper substrate 38 is gripped, the centering pin 26 is driven to descend by the pin elevating mechanism 29, and preparation is made for the next debonding.
Claims (8)
1. An automatic bonding machine of separating, includes the casing, characterized by: a substrate adsorption fixing top piece device (16) capable of adsorbing the bonded substrate group and a substrate adsorption heating device (19) capable of heating the bonded substrate group are arranged in the machine shell, the substrate adsorption heating device (19) is positioned at the upper part in the machine shell, the substrate adsorption fixing top piece device (16) is arranged at the lower part in the machine shell through a manipulator (15), and the substrate adsorption fixing top piece device (16) can move to the position right below the substrate adsorption heating device (19) in the machine shell through the manipulator (15);
the substrate adsorption heating device comprises an upper connecting plate (34), an upper vacuum sucker (21) arranged on the lower side surface of the upper connecting plate (34) and a welding corrugated pipe (23) arranged on the upper side surface of the upper connecting plate (34), after the welding corrugated pipe (23) is inflated, the upper vacuum sucker (21) can be driven to move towards the substrate adsorption and fixation top piece device (16) which is close to the right lower part by the extension of the welding corrugated pipe (23), after the upper vacuum sucker (21) is connected with the bonding substrate on the substrate adsorption and fixation top piece device (16), the bonded substrate group can be heated by the upper vacuum chuck (21) until the bonded substrate group is debonded, the lower substrate (38) obtained after debonding can be adsorbed on the substrate adsorption and fixation top piece device (16), and the upper substrate (39) obtained after debonding can be adsorbed on the upper vacuum chuck (21).
2. The automatic de-bonder of claim 1, wherein: still including bellows guide post (22) that can lead to welding bellows (23) motion, the one end and the top in the casing of bellows guide post (22) are connected, and upper junction plate (34) are passed to the other end of bellows guide post (22), and the tip that bellows guide post (22) are located upper junction plate (34) below sets up spacing end plate of guide post (35), and the cover is equipped with guide post spring (20) on bellows guide post (22), guide post spring (20) are located between spacing end plate of guide post (35) and upper junction plate (34).
3. The automatic de-bonder of claim 2, wherein: the upper connecting plate (34) is provided with a plurality of push-pull air cylinders (25), piston rods of the push-pull air cylinders (25) are provided with locking blocks (24), and the corresponding corrugated pipe guide columns (22) can be locked through the push-pull air cylinders (25) and the locking blocks (24).
4. The automatic de-bonder of claim 1, wherein: the substrate adsorption and fixation top piece device (16) comprises a support flange (31) connected with a manipulator (15), a lower connecting plate (27) positioned right above the support flange (31) and a substrate jacking mechanism capable of jacking a lower substrate (38), wherein the lower connecting plate (27) is supported on the support flange (31) through a plurality of connecting plate support columns (28); a lower vacuum sucker (17) is arranged on the lower connecting plate (27), and a plurality of lower vacuum adsorption holes (37) which penetrate through the lower vacuum sucker (17) are arranged on the lower vacuum sucker (17).
5. The automatic de-bonder of claim 4, wherein: the substrate jacking mechanism comprises a thimble lifting cylinder (29) arranged on a supporting flange (31) and a plurality of elastic thimbles (26) capable of penetrating out of a lower vacuum sucker (17), and the elastic thimbles (26) are in adaptive connection with a piston rod of the thimble lifting cylinder (29) through thimble fixing blocks (30); the lower substrate (38) can be lifted from the lower vacuum chuck (17) by the elastic ejector pins (26).
6. The automatic de-bonder of claim 1, wherein: the machine shell comprises two symmetrically distributed vertical plates (2) and a top plate (1) fixedly connected with the vertical plates (2), a substrate adsorption heating device (19) is installed on the inner side surface of the top plate (1), and a corrugated pipe inflation and deflation interface (32) capable of inflating a welding corrugated pipe (23) is arranged on the top plate (1).
7. The automatic de-bonder of claim 1, wherein: the casing supports on support body (4), sets up embedded handle (5) on side board (6) of support body (4), sets up a plurality of evenly distributed's support foot seat (7) in the bottom of support body (4).
8. The automatic de-bonder of claim 7, wherein: the front surface of the frame body (4) is provided with a display screen (11), and a display screen shell (12) of the display screen (11) is connected with the frame body (4) through a hinge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920687681.1U CN209872344U (en) | 2019-05-14 | 2019-05-14 | Automatic bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920687681.1U CN209872344U (en) | 2019-05-14 | 2019-05-14 | Automatic bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209872344U true CN209872344U (en) | 2019-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920687681.1U Active CN209872344U (en) | 2019-05-14 | 2019-05-14 | Automatic bonding machine |
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| CN (1) | CN209872344U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110040684A (en) * | 2019-05-14 | 2019-07-23 | 苏州美图半导体技术有限公司 | Automatic solution bonder |
| CN115323497A (en) * | 2022-07-18 | 2022-11-11 | 苏州芯睿科技有限公司 | Novel high-efficient bonding of separating device |
-
2019
- 2019-05-14 CN CN201920687681.1U patent/CN209872344U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110040684A (en) * | 2019-05-14 | 2019-07-23 | 苏州美图半导体技术有限公司 | Automatic solution bonder |
| CN110040684B (en) * | 2019-05-14 | 2024-04-09 | 苏州美图半导体技术有限公司 | Automatic bond-releasing machine |
| CN115323497A (en) * | 2022-07-18 | 2022-11-11 | 苏州芯睿科技有限公司 | Novel high-efficient bonding of separating device |
| CN115323497B (en) * | 2022-07-18 | 2024-02-02 | 苏州芯睿科技有限公司 | Efficient de-bonding device |
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