CN209861462U - Air-cooled heat dissipation device for electronic element - Google Patents
Air-cooled heat dissipation device for electronic element Download PDFInfo
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- CN209861462U CN209861462U CN201920556429.7U CN201920556429U CN209861462U CN 209861462 U CN209861462 U CN 209861462U CN 201920556429 U CN201920556429 U CN 201920556429U CN 209861462 U CN209861462 U CN 209861462U
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- fins
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- fan
- cooled heat
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Abstract
The utility model discloses an air-cooled heat abstractor for electronic component, include: a substrate; two baffles symmetrically arranged on the substrate; a fan disposed between the two baffles; the distance between the two baffles is gradually reduced along the air supply direction of the fan; the two supporting plates are symmetrically arranged on the base plate and are arranged close to one end, with the smaller distance, between the two baffle plates; the distance between the two supporting plates is gradually increased along the air supply direction of the fan; the fin plate is fixedly arranged on the supporting plate; a plurality of first fins arranged in a parallel array on one side of the fin plate; and the plurality of second fins are arrayed on the other side of the fin plate in parallel, the first fins and the second fins are symmetrically arranged, and the distance between each first fin and the corresponding second fin is gradually increased along the air supply direction of the fan. The utility model provides an air-cooled heat abstractor for electronic component can guarantee to dispel the heat fast to reduce the energy consumption of fan.
Description
Technical Field
The utility model belongs to the technical field of the electronic component heat dissipation, in particular to an air-cooled heat abstractor for electronic component.
Background
The electronic components are used as the core part of various devices, the operation fluency of the electronic components has great influence on the overall working stability of the devices, and the heat dissipation condition of the electronic components is very important. The heating distribution of the electronic element is generally higher in the central part, the heat radiation pertinence of the existing heat radiation device is poorer, and the overall effect is poor; in addition, the larger fan power and the complex heat dissipation structure can cause the noise to be too large, and how to satisfy the requirements of high heat dissipation efficiency and low noise simultaneously becomes the bottleneck of the heat dissipation technology.
SUMMERY OF THE UTILITY MODEL
The utility model provides an air-cooled heat dissipation device for electronic components, which is characterized in that two baffles are arranged at two sides of a fan to form a gradually-contracted air channel, a gradually-expanded air channel is formed above the electronic components through two supporting plates, the gradually-expanded air channel is butted with the gradually-contracted air channel to form a hyperbolic air channel, and two groups of fins which form included angles with the air supply direction of the fan are symmetrically arranged at the upper side of the gradually-expanded air channel; the utility model aims at reducing the pressure sudden change of air flow simultaneously through the heat convection on hyperbolic type wind channel reinforcing electronic component surface, noise reduction to dispel the heat fast through the fin water conservancy diversion.
The utility model provides a technical scheme does:
an air-cooled heat sink for electronic components, comprising:
a substrate;
two baffles symmetrically arranged on the substrate;
the fan is fixedly arranged between the two baffles;
the distance between the two baffles is gradually reduced along the air supply direction of the fan;
the two supporting plates are symmetrically arranged on the base plate and are arranged close to one end, with the smaller distance, between the two baffle plates;
the distance between the two supporting plates is gradually increased along the air supply direction of the fan;
a fin plate fixedly disposed on the support plate;
a plurality of first fins in a parallel array on one side of the fin plate;
a plurality of second fins arrayed in parallel on the other side of the fin plate,
the first fins and the second fins are symmetrically arranged, and the distance between each first fin and the corresponding second fin is gradually increased along the air supply direction of the fan.
Preferably, the substrate is detachably attached above a circuit board on which an electronic component is mounted, so that the position of the fin plate corresponds to the position of the electronic component.
Preferably, the first fin and the second fin are symmetrical about a center line of the fin plate, and an angle between the fins and the center line of the fin plate is 10 ° to 12 °.
Preferably, the height of the fin is 8-10 mm, and the thickness of the fin is 0.6-0.7 mm.
Preferably, the distance between two adjacent fins is 1.5-1.6 mm.
Preferably, the base plate, the fin plate and the fin are all made of copper.
Preferably, the included angle between the two baffle plates is 20-30 degrees, and the included angle between the two support plates is 15-25 degrees.
The utility model has the advantages that:
the utility model provides an air-cooled heat abstractor for electronic component, two baffles are arranged on both sides of the fan to form a gradually-contracted air duct, a gradually-expanded air duct is formed above the electronic component through two supporting plates, so that the gradually-expanded air duct and the gradually-contracted air duct are butted to form a hyperbolic air duct, and two groups of fins which have included angles with the air supply direction of the fan are symmetrically arranged on the upper side of the gradually-expanded air duct; the utility model can enhance the heat convection on the surface of the electronic element through the hyperbolic air channel, simultaneously slow down the pressure jump of air flow, reduce noise, and quickly dissipate heat through the flow guide of the fins; on the premise of ensuring quick heat dissipation, the energy consumption of the fan can be effectively reduced.
Drawings
Fig. 1 is a schematic view of the general structure of an air-cooled heat dissipation device for electronic components according to the present invention.
Fig. 2 is a top view of the air-cooled heat dissipating device for electronic components according to the present invention.
Fig. 3 is a side view of the air-cooled heat dissipating device for electronic components according to the present invention.
Fig. 4 is a schematic structural diagram of the heat sink of the present invention.
Fig. 5 is a schematic view of the support plate of the present invention.
Detailed Description
The present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.
As shown in fig. 1-3, the present invention provides an air-cooled heat dissipation device for electronic components, which includes a base plate 110, two baffles 121 and 122, a fan 130 and a heat sink 140.
The substrate 110 is detachably attached above the circuit board 210 on which the electronic component 220 is mounted, and the substrate 110 has a rectangular shape. The two baffles 121 and 122 are symmetrically and fixedly disposed on both sides of the substrate 110 with a center line of the substrate 110 in the longitudinal direction as a symmetry axis. In the present embodiment, to enhance the strength of the baffle plates 121, 122, reinforcing shrouds 121a and 122a are provided on the outer sides of the baffle plate 121 and the baffle plate 122, respectively. The baffle 121 is taken as an example, and the reinforcing enclosing plate 121a and the baffle 121 are fixedly connected together to enclose a hollow right-angled triangle, so that the strength of the baffle is enhanced and the weight of the heat sink is reduced.
And a fan 130 fixedly mounted on the mounting substrate 110 and located between the two baffles 121 and 122. The distance between the two baffles 121 and 122 gradually decreases along the air blowing direction of the fan 130, that is, a tapered air duct 120 is formed between the two baffles 121 and 122.
The heat sink 140 includes: two support plates 141, 142, a fin plate 143, and two sets of fins. Wherein the position of the heat sink 140 corresponds to the position of the electronic component 220 on the circuit board 210.
As shown in fig. 4 to 5, two support plates 141 and 142 are provided near the end where the distance between the two baffle plates 121 and 122 is small. The supporting plates 141 and 142 are symmetrically arranged at the left and right sides of the substrate 110 with the central line of the substrate 110 as the symmetry axis; i.e. the symmetry axes of the two support plates 141, 142 are identical to the symmetry axes of the two baffles 121, 122. And the distance between the supporting plates 141 and 142 is gradually increased along the blowing direction of the fan 130, and a divergent air passage 140a is formed between the two supporting plates.
The fin plate 143 is fixedly disposed on the two support plates 141 and 142, and the fin plate 143 is parallel to the substrate 110. The two groups of fins are symmetrically arranged at the left side and the right side of the fin plate 143 by taking the center line of the fin plate 145 as a symmetry axis. One set of fins includes a plurality of parallel arrays of fins 144 and the other set of fins includes a plurality of parallel arrays of fins 145. Each of the fins 144 is symmetrical to its corresponding fin 145, respectively, and the distance between the fin 145 and its corresponding fin 145 gradually increases in the air blowing direction of the fan 130. A central air duct 140b is formed between the two groups of fins, part of the air flow passing through the upper part of the radiator passes through the central air duct 140b, and part of the air flow enters gaps of the fins to form multi-stage flow distribution; the airflow enters a multi-stage air duct (a central air duct and a fin gap) formed by the fins to form turbulent flow, and airflow disturbance is enhanced, so that the heat exchange of a high-temperature area of the electronic element is enhanced. Meanwhile, the fins 144 and the fins 145 play a role in guiding the air at the upper part, the two groups of fins are symmetrically arranged, and the distance between the corresponding fins is gradually increased along the air supply direction; the airflow collected above the electronic element is guided to multiple directions by the fins, so that the local overhigh temperature caused by the accumulation of high-temperature air at the rear part of the heat dissipation device is avoided, and the heat dissipation speed is accelerated.
Preferably, the height of the fins 144 and 145 is set to be 8-10 mm, and the thickness of the fins 144 and 145 is set to be 0.6-0.7 mm; the distance between two fins in the same adjacent group of fins is 1.5-1.6 mm; the angle between each fin and the centerline of the fin plate 143 is set at 10 to 12.
Preferably, the base plate 110, the support plate 141, the support plate 142, the fin plate 143, the fins 144 and the fins 145 are made of copper to increase the thermal conductivity.
Further preferably, the angle between the two baffles 121 and 122 is 20 ° to 30 °, and the angle between the two support plates 141 and 142 is 15 ° to 25 °.
The utility model discloses a set up the tapered wind channel, the fan blows out the air current and passes through tapered wind channel flow direction radiator, and the tapered wind channel improves the wind speed through reducing the air current flow area, can reduce fan power. The air flow flows into the gradually expanding air duct at the lower part of the radiator through the gradually contracting air duct, so that the whole streamline is in a hyperbolic curve shape, the pressure sudden change of the air flow can be slowed down, and the noise is reduced. The fins have a flow guiding effect on hot air flowing through the radiator, and the collected hot air is guided to multiple directions by the fins after flowing through the fins, so that the local overhigh temperature caused by the accumulation of high-temperature air at the rear part of the heat radiating device is avoided; because the fins and the airflow direction form included angles, the air duct formed by the fins close to the central part of the radiator is longer, and the heat exchange of the high-temperature area of the electronic element is enhanced.
While the embodiments of the invention have been described above, it is not intended to be limited to the details shown, or described, but rather to cover all modifications, which would come within the scope of the appended claims, and all changes which come within the meaning and range of equivalency of the art are therefore intended to be embraced therein.
Claims (7)
1. An air-cooled heat sink for electronic components, comprising:
a substrate;
two baffles symmetrically arranged on the substrate;
the fan is fixedly arranged between the two baffles;
the distance between the two baffles is gradually reduced along the air supply direction of the fan;
the two supporting plates are symmetrically arranged on the base plate and are arranged close to one end, with the smaller distance, between the two baffle plates;
the distance between the two supporting plates is gradually increased along the air supply direction of the fan;
a fin plate fixedly disposed on the support plate;
a plurality of first fins in a parallel array on one side of the fin plate;
a plurality of second fins arrayed in parallel on the other side of the fin plate,
the first fins and the second fins are symmetrically arranged, and the distance between each first fin and the corresponding second fin is gradually increased along the air supply direction of the fan.
2. The air-cooled heat dissipating device for electronic components as claimed in claim 1, wherein the substrate is detachably attached above a circuit board on which the electronic components are mounted so that the positions of the fin plates correspond to the positions of the electronic components.
3. The air-cooled heat dissipating device for electronic components as claimed in claim 2, wherein the first and second fins are symmetrical with respect to the centerline of the fin plate, and the angle between the fins and the centerline of the fin plate is 10 ° to 12 °.
4. The air-cooled heat dissipating device for electronic components as claimed in claim 3, wherein the height of the fins is 8 to 10mm and the thickness of the fins is 0.6 to 0.7 mm.
5. The air-cooled heat dissipating device for electronic components as claimed in claim 3 or 4, wherein the distance between two adjacent fins is 1.5 to 1.6 mm.
6. The air-cooled heat sink for electronic components as recited in claim 5, wherein the base plate, the fin plate and the fins are all made of copper.
7. The air-cooled heat dissipating device for electronic components as claimed in claim 6, wherein the angle between the two baffles is 20 ° to 30 ° and the angle between the two supporting plates is 15 ° to 25 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920556429.7U CN209861462U (en) | 2019-04-23 | 2019-04-23 | Air-cooled heat dissipation device for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920556429.7U CN209861462U (en) | 2019-04-23 | 2019-04-23 | Air-cooled heat dissipation device for electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209861462U true CN209861462U (en) | 2019-12-27 |
Family
ID=68938746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920556429.7U Active CN209861462U (en) | 2019-04-23 | 2019-04-23 | Air-cooled heat dissipation device for electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209861462U (en) |
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2019
- 2019-04-23 CN CN201920556429.7U patent/CN209861462U/en active Active
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