CN209817524U - Low-temperature detection room for electronic components - Google Patents

Abstract

The utility model provides a to because check-out time is less than the cool-off time far away, adopt traditional mode, detection device such as low temperature surge device, low temperature testing arrangement can not obtain the problem of effective utilization, the utility model provides a low temperature detects room for electronic components, its cooling time that can reduce electronic components in detection device by a wide margin, detection device such as low temperature surge device, low temperature testing arrangement can obtain effective utilization. It includes detection device, its characterized in that: the electronic component pre-cooling device further comprises a pre-cooling area, wherein the pre-cooling area is used for pre-cooling the electronic component to be detected; a test area, wherein the detection device is arranged in the test area; an operating zone comprising or connecting the pre-cooling zone and the testing zone.

Description

Low-temperature detection room for electronic components

Technical Field

The utility model relates to an electronic components detects technical field, specifically is a low temperature detection room for electronic components.

Background

After the electronic components such as tantalum capacitors and MLCCs are produced, high-low temperature surge tests, high-low temperature four-parameter tests and the like are required to be carried out to judge whether the electronic components are qualified, when the surge, four-parameter tests, particularly the low-temperature surge and low-temperature four-parameter tests are carried out, the electronic components are generally arranged in a clamp and are arranged in a static detection device such as a low-temperature surge box, a low-temperature test box and the like to be detected, or the electronic components are arranged in a loading box and are arranged in a dynamic detection device such as an automatic capacitance test device with the application number of CN201721084196.2 to be detected, the loading box or the clamp has heat resistance, the electronic components in the clamp need to be waited to be reduced to the detection temperature after being arranged in the detection device to be detected, for example, the detection temperature is-55 ℃, and the detection device needs to be arranged for 1-2 hours to ensure that the outer surface and the inner parts of the electronic components are both reduced to-55 ℃, the detection time is usually very short and can be completed only by a few minutes, so the detection time is far shorter than the cooling time, and detection devices such as low-temperature surge devices and low-temperature test devices cannot be effectively utilized.

SUMMERY OF THE UTILITY MODEL

The utility model provides a to because check-out time is less than the cool-off time far away, adopt traditional mode, detection device such as low temperature surge device, low temperature testing arrangement can not obtain the problem of effective utilization, the utility model provides a low temperature detects room for electronic components, its cooling time that can reduce electronic components in detection device by a wide margin, detection device such as low temperature surge device, low temperature testing arrangement can obtain effective utilization.

The technical scheme is as follows: the utility model provides a low temperature detects room for electronic components, its includes detection device, its characterized in that: the electronic component pre-cooling device further comprises a pre-cooling area, wherein the pre-cooling area is used for pre-cooling the electronic component to be detected; a test area, wherein the detection device is arranged in the test area; an operating zone comprising or connecting the pre-cooling zone and the testing zone.

It is further characterized in that:

the drying device is used for drying the electronic component to be detected, placing a loading box of the electronic component to be detected or placing a clamp of the electronic component to be detected;

the operation area also comprises a temperature return area or a connecting temperature return area, and is used for heating the detected electronic components, the loading boxes for placing the detected electronic components or the clamps for placing the detected electronic components;

the detection device comprises a detection part and a control part, wherein the detection part is positioned in the test area, and the control part is positioned in a normal-temperature normal-humidity environment.

After the detection room is adopted, the electronic components to be detected are placed into the clamp or the loading box and then are placed into the pre-cooling area for pre-cooling, so that the outer surface and the inner part of the electronic components reach the detection temperature, and then the electronic components are placed into the detection device for detection, therefore, the time for cooling the electronic components to be detected in the detection device is reduced for one batch of the electronic components to be detected, the time for one batch of the electronic components in the detection device is reduced, and the working efficiency of the expensive low-temperature testing machine is exerted to the maximum extent.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Detailed Description

As shown in fig. 1, the low-temperature detection room for electronic components comprises a detection device 1-1, and further comprises a pre-cooling area 2, wherein the pre-cooling area 2 is used for pre-cooling the electronic components to be detected, a pre-cooling box is installed in the pre-cooling area 2, and the internal temperature of the pre-cooling box is a detection temperature; the test system comprises a test area 1, wherein a detection device 1-1 is arranged in the test area 1, and a compressor is arranged in the test area 1, so that the temperature of the test area is the detection temperature; an operating zone 3, the operating zone 3 comprising or connecting the pre-cooling zone 2 and the test zone 1.

The method for using the low-temperature detection room comprises the steps of placing the electronic component to be detected into the pre-cooling area 2 for pre-cooling to enable the electronic component to be detected to reach the detection temperature, and then sequentially placing the electronic component to be detected into the detection device 1-1 of the test area 1 for detection. It is worth emphasizing that the electronic components to be detected in the pre-cooling area 2 are continuously supplemented into the detection device 1-1, and the electronic components to be detected are continuously supplemented into the pre-cooling area 2, that is, after the electronic components in the detection device 1-1 are detected and taken out, the electronic components and the transfer boxes or the clamps which are pre-cooled in the pre-cooling area 2 are immediately placed into the detection device 1-1 for detection, and the electronic components to be detected are supplemented into the pre-cooling area 2.

After being loaded into a clamp or a loading box, the electronic components to be detected are placed into the pre-cooling area 2 for pre-cooling to enable the outer surface and the inner part of the electronic components to reach the detection temperature, and then are placed into the detection device 1-1 for detection, so that the time for cooling the electronic components to be detected in the detection device 1-1 is reduced for one batch of the electronic components to be detected, the time for the batch of the electronic components in the detection device 1-1 is reduced, and the working efficiency of an expensive low-temperature testing machine is exerted to the maximum extent.

In addition, because the operation area 3 needs to have people to transfer the electronic components, the temperature of the operation area generally cannot be consistent with the detection temperature in the pre-cooling area 2 and the test area 1, the temperature of the electronic components can be increased in the transfer process, but because the transfer time is short, the internal temperature of the electronic components is basically kept at the detection temperature, after the detection device 1-1 is placed, the temperature can be restored to the detection temperature only within a very short time, such as the temperature of the pre-cooling area is minus 55 ℃, the temperature of the test area 1 (the detection part of the detection device 1-1) is minus 55 ℃, the temperature of the operation area 3 is minus 5 ℃, after the detection device 1-1 is placed, the temperature can be restored to minus 55 ℃ only within 10min to 15min, even if the time for detection is far shorter than the time for 1 h to 2 h in the traditional mode, the efficiency is higher.

In addition, the detection device 1-1 can be a conventional test box or a surge test box, electronic components are placed in a loading box and are connected with a probe board to form a clamp to be inserted into the test box for detection, and can also be an automatic test or test device, and the electronic components are placed in the loading box and are detected by pressing down the probe board of the device. The detecting device 1-1 includes a detecting part such as a connecting seat or a feeding device for mounting a jig, a blanking device, a probe card and a control part such as a test circuit board connected to the connecting seat, a controller or a test circuit board connected to the probe card, a controller, the detecting part and the control part are separated by a thermal insulation material, the detecting part is located in the test area 1, the control part is located in a normal temperature and normal humidity environment, the two parts can be connected with each other by a wire, such a structure is adopted because if the control part is also located in a low temperature and dry environment to work with electricity, a large amount of dust can be adsorbed due to static electricity, and a leakage fault is easily caused; the detection device 1-1 is embedded on the wall of the test area 1, and different tests or test equipment can be conveniently packed into the test area according to the requirements at any time so as to realize different tests and test projects, thus the utility model has certain application flexibility.

If the operation area 3 forms a low-humidity environment in a low-temperature mode, the installation mode of the plurality of precooling boxes in the precooling area 2 can adopt a mode of being embedded on the wall of the precooling area 2, so that one part of the precooling boxes are arranged in the precooling area 2 and the other part of the precooling boxes are arranged outside the precooling area 2, the external heating value of the refrigerating part of the precooling area 2 can be emitted to the external space, and the low-temperature environment in the detection room can not be influenced.

As the utility model discloses a another innovation point, if detection device or the inside humidity of anchor clamps are too big, during low temperature detection, will frost on electronic components surface, thereby improve contact resistance, the influence detects, traditional approach detects at every turn and accomplishes before needing to open at detection device, influence measuring accuracy or experimental quality for avoiding in the moisture admission apparatus and frosting in its inside, wait in the device temperature rise usually and just open for the room temperature, this is the whole low temperature test of greatly reduced or experimental efficiency, and adopt this kind of mode to increase a batch electronic components's check-out time again by a wide margin, whole detection flow can reach 3 hours-4 hours on the basis of 1 hour-2 hours of background art, in addition, even adopt this kind of mode also can not effectively get rid of the moisture in the semi-closed anchor clamps.

Therefore, the operation area 3 is provided with a dehumidifier or a refrigerator, the relative humidity of the operation area 3 is less than or equal to 10% by pumping the moisture in the operation area 3 through the dehumidifier, and preferably, the refrigerator can be adopted to keep the temperature of the operation area 3 at-10 ℃ to 0 ℃, so that the moisture can be frosted on the wall surface of the operation area 3 to reduce the humidity, and the temperature can be prevented from rising too fast when an operator transfers the electronic component to be detected from the pre-cooling area 2 to the test area 1, and meanwhile, the operator can also operate in the environment; in order to prevent moisture from entering the operation area 3 along with the operation clamp or the loading disc, a drying area 4 is arranged at the inlet of the operation area 3, a dehumidifier is arranged in the drying area 4, so that the relative humidity of the dehumidifier is less than or equal to 30%, the internal temperature of the dehumidifier can be kept at a temperature suitable for people by installing an air conditioner, a drying device 4-1 such as an oven is also arranged in the drying area 4, and the drying device 4-1 is used for drying the electronic component to be detected, placing the loading box of the electronic component to be detected or placing the clamp of the electronic component to be detected, so that the moisture in the electronic.

Therefore, before the electronic component to be detected is placed in the pre-cooling area 2, the electronic component to be detected is conveyed to the drying area 4 from the outside and then is placed in the drying device 4-1 of the drying area 4 to be dried, moisture carried by the electronic component is removed, the temperature of the electronic component is raised to prevent water vapor from being condensed on the electronic component, the electronic component can be placed in the loading box from the outside and enter the drying area 4, the electronic component can also be placed in the loading box in the drying area 4, the electronic component and the loading box are dried together during drying, and the electronic component and the probe card are assembled in the drying area 4 to form a clamp according to needs after drying is completed, so that moisture can be effectively removed to prevent the detection result caused by frosting from being inaccurate.

The operation area 3 also comprises or is connected with a temperature return area 3-1 for heating the detected electronic components, the loading boxes for placing the detected electronic components or the clamps for placing the detected electronic components to a temperature higher than 25 ℃, so that the surface of the clamps or the loading boxes does not have the condensation phenomenon when leaving the operation area 3.

After the detection is completed, the clamp can be detached in the drying area 4, the probe card is prevented from being taken out of the detection room, and the transshipment box provided with the electronic components can be circulated to the next procedure.

The above description is only for the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (4)

1. The utility model provides a low temperature detects room for electronic components, its includes detection device, its characterized in that: the electronic component pre-cooling device comprises a pre-cooling area, a pre-cooling box and a detection area, wherein the pre-cooling area is internally provided with the pre-cooling box and is used for pre-cooling an electronic component to be detected; a test area, wherein the detection device is arranged in the test area; an operating zone comprising or connecting the pre-cooling zone and the testing zone.

2. The low-temperature detection room for the electronic component as claimed in claim 1, wherein: dehumidifier or refrigerator are installed to the operation district, operation district entrance is equipped with the drying zone, be equipped with the dehumidifier in the drying zone, still be equipped with drying device in the drying zone, drying device is used for the drying to wait to detect electronic components, places the loading box that waits to detect electronic components or places the anchor clamps that wait to detect electronic components.

3. The low-temperature detection room for the electronic component as claimed in claim 1, wherein: the operation area also comprises or is connected with a temperature return area for heating the detected electronic components, the loading boxes for placing the detected electronic components or the clamps for placing the detected electronic components.

4. The low-temperature detection room for the electronic component as claimed in claim 1, wherein: the detection device comprises a detection part and a control part, wherein the detection part is positioned in the test area, and the control part is positioned in a normal-temperature normal-humidity environment.