CN209810109U - Fluid mixing device and etching equipment - Google Patents

Fluid mixing device and etching equipment Download PDF

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Publication number
CN209810109U
CN209810109U CN201920365410.4U CN201920365410U CN209810109U CN 209810109 U CN209810109 U CN 209810109U CN 201920365410 U CN201920365410 U CN 201920365410U CN 209810109 U CN209810109 U CN 209810109U
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fluid
valve
control valve
mixing
pipeline
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Chinese (zh)
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马鹏伟
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Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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Abstract

The utility model relates to the field of semiconductor technology, a fluid mixing device and etching equipment is proposed. The fluid mixing device comprises a mixing valve, a mixer and a pre-discharger; the mixing valve is connected with a first fluid supply device and a second fluid supply device, the first fluid supply device and the second fluid supply device respectively supply a first fluid and a second fluid to the mixing valve, and the mixing valve outputs a mixture of the first fluid and the second fluid; the mixer is connected to a liquid outlet of the mixing valve through a first pipeline, and a first control valve is arranged on the first pipeline; the pre-discharger is connected to the liquid outlet of the mixing valve through a second pipeline, and a second control valve is arranged on the second pipeline. Use the utility model discloses a fluid mixing arrangement makes etching liquid concentration stable, can not influence the sculpture volume of wafer, can not influence the yield of product.

Description

Fluid mixing device and etching equipment
Technical Field
The utility model relates to the field of semiconductor technology, especially, relate to a fluid mixing device and install this fluid mixing device's etching equipment.
Background
In the manufacturing process of semiconductor devices, an etching apparatus is used to etch a wafer. At present, the concentration fluctuation of etching liquid in etching equipment is large, the concentration fluctuation of the etching liquid can seriously influence the etching amount of a wafer, and the yield of products is finally and directly influenced.
Therefore, it is necessary to develop a fluid mixing device and an etching apparatus having the fluid mixing device mounted thereon.
The above information disclosed in the background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not constitute prior art known to a person of ordinary skill in the art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome the great not enough of concentration fluctuation of above-mentioned prior art's sculpture liquid, provide the undulant less fluid mixing device of concentration of sculpture liquid and install this fluid mixing device's etching equipment.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
According to an aspect of the present disclosure, there is provided a fluid mixing device comprising:
a mixing valve to which a first fluid supply and a second fluid supply are connected, the first and second fluid supplies supplying a first fluid and a second fluid, respectively, to the mixing valve, the mixing valve outputting a mixture of the first fluid and the second fluid;
the mixer is connected to the liquid outlet of the mixing valve through a first pipeline, and a first control valve is arranged on the first pipeline;
the pre-discharger is connected to the liquid outlet of the mixing valve through a second pipeline, and a second control valve is arranged on the second pipeline.
In an exemplary embodiment of the disclosure, the liquid outlet of the mixer is connected to the liquid inlet of the pre-discharger via a pipe.
In an exemplary embodiment of the present disclosure, the fluid mixing device further includes:
and the premixer is connected to the liquid outlet of the mixing valve through a third pipeline, and a third control valve is arranged on the third pipeline.
In an exemplary embodiment of the disclosure, the liquid outlet of the premixer is connected to the liquid inlet of the mixer.
In an exemplary embodiment of the present disclosure, the first control valve, the second control valve, and the third control valve are all pneumatic valves.
In an exemplary embodiment of the present disclosure, the first fluid supply device is connected to the liquid inlet of the mixing valve through a fourth pipeline, and a first main valve, a needle valve, a first flow meter, and a fourth control valve are sequentially disposed on the fourth pipeline from one end close to the first fluid supply device to one end close to the mixing valve.
In an exemplary embodiment of the present disclosure, the fluid mixing device further includes:
the chemical supply box is connected to the chemical supply box through a fifth pipeline, a second main valve is arranged on the fifth pipeline, the chemical supply box is connected to a liquid inlet of the mixing valve through a sixth pipeline and a seventh pipeline which are arranged in parallel, a second flow meter and a fifth control valve are sequentially arranged on the sixth pipeline from one end close to the chemical supply box to one end close to the mixing valve, and a third flow meter and a sixth control valve are sequentially arranged on the seventh pipeline from one end close to the chemical supply box to one end close to the mixing valve.
According to an aspect of the present disclosure, there is provided an etching apparatus including:
the fluid mixing device of any one of the preceding claims.
In an exemplary embodiment of the present disclosure, the etching apparatus further includes:
and the spray head is connected to the liquid outlet of the mixer.
In an exemplary embodiment of the present disclosure, the etching apparatus further includes:
and the etching cavity is internally provided with the spray head.
According to the above technical scheme, the utility model discloses possess at least one in following advantage and the positive effect:
the fluid mixing device of the utility model is characterized in that the liquid outlet of the mixing valve is connected with a mixer through a first pipeline, and a first control valve is arranged on the first pipeline; the liquid outlet of the mixing valve is connected with a pre-discharger through a second pipeline, and a second control valve is arranged on the second pipeline. The second control valve can be opened and the first control valve can be closed under the condition that the concentration of the etching liquid is unstable, so that the etching liquid flows into the pre-discharger instead of the mixer, and the use of the etching liquid with unstable concentration is avoided; the first control valve can be opened and the second control valve can be closed under the condition that the concentration of the etching liquid is stable, so that the etching liquid flows into the mixer instead of the pre-discharger to start etching the wafer.
Drawings
The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
FIG. 1 is a schematic view showing a structure of a fluid mixing apparatus according to the related art;
FIG. 2 is a schematic representation of the flow rates of the first and second fluids and the first and third control valve on-off times in the fluid mixing apparatus shown in FIG. 1;
FIG. 3 is a schematic view of an embodiment of a fluid mixing apparatus according to the present invention;
FIG. 4 is a schematic representation of the flow rates of the first and second fluids of the fluid mixing apparatus shown in FIG. 3 corresponding to the first, second, and third control valve on-off times;
FIG. 5 is a schematic representation of the change in concentration value of the mixing fluid in the pre-modification mixer compared to the change in concentration value of the mixing fluid in the post-modification mixer;
FIG. 6 is a block diagram illustrating a flow of an embodiment of a method for controlling a fluid mixing apparatus according to the present invention;
fig. 7 is a schematic structural diagram of an embodiment of the etching apparatus of the present invention.
The reference numerals of the main elements in the figures are explained as follows:
1. a mixing valve; 2. a mixer; 3. a pre-discharger; 4. a premixer;
51. a first conduit; 52. a second conduit; 53. a third pipeline; 54. a fourth conduit; 55. a fifth pipeline; 56. a sixth pipeline; 57. a seventh pipe;
61. a first control valve; 62. a second control valve; 63. a third control valve; 64. a fourth control valve; 65. a fifth control valve; 66. a sixth control valve; 67. a seventh control valve; 68. an eighth control valve; 69. a ninth control valve;
71. a first main valve; 72. a second main valve;
81. a first flow meter; 82. a second flow meter; 83. a third flow meter;
9. a needle valve; 10. a chemical supply tank; 11. a liquid level meter; 12. an exhaust pipe; 13. a nitrogen inlet pipe; 14. etching the cavity; 15. a spray head; 16. and a liquid discharge pipe.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Referring to fig. 1, a schematic structural view of an embodiment of a fluid mixing apparatus in the related art is shown; a first fluid supply device and a second fluid supply device are connected to the liquid inlet of the mixing valve 1, the first fluid supply device supplies a first fluid to the mixing valve 1, the second fluid supply device supplies a second fluid to the mixing valve 1, and the mixing valve 1 outputs the first fluid or the second fluid or a mixture of the first fluid and the second fluid.
A first pipeline 51 and a third pipeline 53 are connected to a liquid outlet of the mixing valve 1, the mixer 2 is connected to the liquid outlet of the mixing valve 1 through the first pipeline 51, and a first control valve 61 is arranged on the first pipeline 51; the premixer 4 is connected to the outlet of the mixing valve 1 through a third pipe 53, and a third control valve 63 is provided on the third pipe 53.
The first fluid and the second fluid are mixed by the mixing valve 1 and then directly supplied to the mixer 2 and the premixer 4. Referring to fig. 2, the flow rates of the first fluid and the second fluid in the fluid mixing device are shown corresponding to the on-off time of the first control valve and the on-off time of the third control valve, in which the first control valve is simply referred to as the first valve and the third control valve is simply referred to as the third valve. In the case of opening the first and second fluid supply means, that is, in the case of the first and second fluids having flow rates, the first and third control valves 61 and 63 are opened. However, the flow rates of the first fluid and the second fluid are unstable in the initial state, and the concentration of the mixture formed in the mixing valve 1 also fluctuates. The concentration fluctuation of the mixture can seriously affect the etching amount of the wafer, and finally, the yield of the product is directly affected.
The utility model firstly provides a fluid mixing device, which is shown in figure 3 and is a structural schematic diagram of an embodiment of the fluid mixing device; the fluid mixing device may include a mixing valve 1, a mixer 2, and a pre-discharger 3. A first fluid supply device and a second fluid supply device are connected to the mixing valve 1, the first fluid supply device and the second fluid supply device respectively supply a first fluid and a second fluid to the mixing valve 1, and the mixing valve 1 outputs the first fluid or the second fluid or a mixture of the first fluid and the second fluid; the mixer 2 is connected to the liquid outlet of the mixing valve 1 through a first pipeline 51, and a first control valve 61 is arranged on the first pipeline 51; the pre-discharger 3 is connected to the liquid outlet of the mixing valve 1 through a second pipeline 52, and a second control valve 62 is arranged on the second pipeline 52. The mixed liquid in the mixer 2 is used for etching liquid of a subsequent etching procedure, and the mixed liquid in the pre-discharger 3 is waste liquid and is not used for the subsequent etching procedure.
In the present exemplary embodiment, the first fluid may be water, and the second fluid may be a hydrofluoric acid solution having a concentration of approximately 49%. Of course, the first fluid and the second fluid are not limited to the above description, and may be any fluids that are suitable for the mixing method of the fluid mixing device.
In the present exemplary embodiment, the first fluid supply means is connected to the inlet port of the mixing valve 1 through a fourth pipe 54, and a first main valve 71, a needle valve 9, a first flow meter 81, and a fourth control valve 64 are provided on the fourth pipe 54 in this order from an end near the first fluid supply means to an end near the mixing valve 1.
In the present exemplary embodiment, the second fluid supply device is connected to the chemical supply tank 10 via a fifth pipe 55, and a second main valve 72 is provided on the fifth pipe 55. The chemical supply tank 10 is connected to the liquid inlet of the mixing valve 1 through a sixth pipe 56 and a seventh pipe 57 which are arranged in parallel, a second flow meter 82 and a fifth control valve 65 are arranged on the sixth pipe 56 in sequence from one end close to the chemical supply tank 10 to one end close to the mixing valve 1, and a third flow meter 83 and a sixth control valve 66 are arranged on the seventh pipe 57 in sequence from one end close to the chemical supply tank 10 to one end close to the mixing valve 1.
Three level meters 11 are sequentially arranged in the chemical supply tank 10 from bottom to top, and in the case where the level of the second fluid in the chemical supply tank 10 is lower than the bottommost level meter 11, the second master valve 72 is controlled to be opened so that the second fluid supply device inputs the second fluid into the chemical supply tank 10 up to the level meter 11 in the intermediate position. In the case that the level of the second fluid in the chemical supply tank 10 is higher than the topmost level gauge 11, the second main valve 72 is controlled to be closed so that the second fluid supply device stops inputting the second fluid into the chemical supply tank 10, and an alarm is given through an alarm. The chemical supply tank 10 is also provided with an exhaust pipe 12, a nitrogen gas inlet pipe 13, and a drain pipe 16.
In the present exemplary embodiment, a connecting line is connected between the fourth line 54 and the fifth line 55, and a seventh control valve 67 is provided in the connecting line. The seventh control valve 67 is opened and the first fluid may flow to the chemical supply tank 10 through the connection pipe to flush the chemical supply tank 10.
In the present exemplary embodiment, the liquid outlet of the mixing valve 1 may be connected to one nozzle of a four-way pipe, and the other three nozzles of the four-way pipe are connected to the first pipe 51, the second pipe 52, and the third pipe 53 in a one-to-one correspondence. Of course, the connection of the first, second and third pipes 51, 52 and 53 to the mixing valve 1 is not limited to the above description, for example, in other exemplary embodiments of the present invention, one pipe orifice of the first tee may be connected to the liquid outlet of the mixing valve 1, and the other two pipe orifices of the first tee are connected to one pipe orifice of the second pipe 52 and one pipe orifice of the second tee in a one-to-one correspondence; the other two orifices of the second tee are connected with the first pipeline 51 and the third pipeline 53 in a one-to-one correspondence manner.
The first pipe 51 is provided with a first control valve 61, and the mixer 2 is connected to the outlet of the mixing valve 1 through the first pipe 51 and a four-way pipe. The second pipe 52 is provided with a second control valve 62, and the pre-discharger 3 is connected to the liquid outlet of the mixing valve 1 through the second pipe 52 and a four-way pipe. The third pipe 53 is provided with a third control valve 63, and the premixer 4 is connected to the outlet of the mixing valve 1 through the third pipe 53 and a four-way pipe.
In the present exemplary embodiment, the liquid discharge port of the mixer 2 is connected to the liquid inlet port of the pre-discharger 3 via a pipe, on which a ninth control valve 69 is provided. In case of acid change, the ninth control valve 69 can be controlled to open to directly discharge the mixed liquid in the mixer 2 to the pre-discharger 3.
In the present example embodiment, the first control valve 61, the second control valve 62, and the third control valve 63 are all pneumatic valves.
Referring to fig. 4, the flow rates of the first fluid and the second fluid in the fluid mixing device correspond to the on-off time of the first control valve, the on-off time of the second control valve, and the on-off time of the third control valve, in the figure, the first control valve is simply referred to as the first valve, the second control valve is simply referred to as the second valve, and the third control valve is simply referred to as the third valve; the utility model discloses a fluid mixing arrangement's use does: during a preset time period A after the fluid mixing device is started, the first fluid is supplemented, the second fluid is supplemented, the first fluid is replaced or the second fluid is replaced, the concentration of the mixture is unstable due to unstable flow rates of the first fluid and the second fluid; at this time, the second control valve 62 is opened, and the first control valve 61 and the third control valve 63 are closed at the same time, so that the mixed liquid flows into the pre-discharger 3, but does not flow into the mixer 2 and the pre-mixer 4, and the use of etching liquid with unstable concentration is avoided; after the preset time period a, the first control valve 61 and the third control valve 63 can be opened and the second control valve 62 can be closed under the condition that the concentration of the etching solution is stable, so that the etching solution flows into the mixer 2 and the premixer 4 instead of the pre-discharger 3, and the wafer is etched.
Referring to fig. 5, a schematic diagram of the change of the concentration value of the mixture in the pre-modified mixer 2 compared with the change of the concentration value of the mixture in the post-modified mixer 2 is shown; from the figure, it can be derived: the change N of the concentration of the mixed liquid in the GQ mixer 2 before modification is about 2.94-3.28, and the change N of the concentration of the mixed liquid is about 3.28-2.94-0.34; the change M of the concentration value of the mixed liquid in the GH mixer 2 after the modification is about 3.07-3.17, and the change M of the concentration of the mixed liquid is about 3.17-3.07-0.1.
In the present exemplary embodiment, the liquid outlet of the premixer 4 may be connected to the liquid inlet of the mixer 2 through a pipe, on which an eighth control valve 68 may be provided. When the liquid level of the mixed liquid in the mixer 2 is lower than the first preset value, that is, the liquid level of the mixed liquid in the mixer 2 is lower than the low liquid level, (since the mixed liquid in the mixer 2 and the mixed liquid in the premixer 4 are both provided by the mixing valve 1 with stabilized concentration, the concentration of the mixed liquid in the mixer 2 is the same as that of the mixed liquid in the premixer 4.) the eighth control valve 68 may be controlled to open, so that the mixed liquid in the premixer 4 flows into the mixer 2 to continue etching the wafer. When the liquid level of the mixed liquid in the mixer 2 is higher than the second preset value, that is, when the liquid level of the mixed liquid in the mixer 2 is higher than the high liquid level, the eighth control valve 68 may be controlled to be closed, so as to prevent the mixed liquid in the premixer 4 from flowing into the mixer 2. The first preset value is a low liquid level, the second preset value is a high liquid level, and the first preset value is smaller than the second preset value.
It should be noted that, in other exemplary embodiments of the present invention, the third pipe 53, the third control valve 63, and the premixer 4 may not be provided. The wafer is etched only by the mixed liquid in the mixer 2.
The control method of the fluid mixing apparatus of the present invention, referring to the flow schematic block diagram of an embodiment of the control method of the fluid mixing apparatus shown in fig. 6, may include the following steps:
step S10, opening the second control valve 62 and closing the first control valve 61 within a preset time period after the fluid mixing device is started, the first fluid is supplemented, the second fluid is supplemented, the first fluid is replaced, or the second fluid is replaced.
In step S20, after a preset time period, the second control valve 62 is closed, and the first control valve 61 is opened.
The respective steps of the control method of the fluid mixing apparatus will be described in detail below.
In step S10, the second control valve 62 is opened and the first control valve 61 is closed within a preset time period after the fluid mixing device is started, the first fluid is supplemented, the second fluid is supplemented, the first fluid is replaced, or the second fluid is replaced.
In the present exemplary embodiment, when the first fluid or the second fluid is replaced, the mixer 2 needs to be emptied, and the mixing valve 1 supplies the mixed acid into the empty mixer 2 again in proportion, so that the flow rates of the first fluid and the second fluid are unstable in a preset time period after the first fluid or the second fluid is replaced, resulting in unstable concentration of the formed mixed solution. In a preset time period after the fluid mixing device is started, the first fluid is supplemented, the second fluid is supplemented, the first fluid is replaced or the second fluid is replaced, the flow rates of the first fluid and the second fluid are unstable, and the concentration of the formed mixed liquid is unstable. At this time, the second control valve 62 is opened, and the first control valve 61 is closed. The mixed liquid flows into the pre-discharger 3 but not into the mixer 2, thereby avoiding using the etching liquid with unstable concentration.
In step S20, after a preset time period, the second control valve 62 is closed, and the first control valve 61 is opened.
In the present exemplary embodiment, the preset time period may be approximately 7 seconds or more and 8 seconds or less. In addition, in other example embodiments of the present invention, the preset time period is greater than or equal to 6 seconds and less than or equal to 10 seconds, so as to achieve the purpose of stabilizing the concentration of the mixed liquid. After a preset time period, the flow rates of the first fluid and the second fluid are both stable, so that the concentration of the formed mixed liquid is stable. At this time, the second control valve 62 is closed, and the first control valve 61 is opened. The etching liquid flows into the mixer 2 instead of the pre-discharger 3, and the wafer is etched, so that the concentration of the etching liquid is stable, the etching amount of the wafer is not influenced, and the yield of the product is not influenced.
In this exemplary embodiment, the fluid mixing device may further include a third pipe 53, a third control valve 63, and a premixer 4, where the premixer 4 is connected to the outlet of the mixing valve 1 through the third pipe 53, and the third pipe 53 is provided with the third control valve 63; the control method may further include: in a preset time period after the fluid mixing device is started, the third control valve 63 is closed, and mixed liquid with unstable concentration is prevented from entering the premixer 4; after a preset period of time, the third control valve 63 is opened to allow a stable concentration of mixed liquor to enter the premixer 4.
In the present exemplary embodiment, the liquid outlet of the premixer 4 may be connected to the liquid inlet of the mixer 2 through a pipe, on which an eighth control valve 68 may be provided. When the liquid level of the mixed liquid in the mixer 2 is lower than the first preset value, that is, the liquid level of the mixed liquid in the mixer 2 is lower than the low liquid level, (since the mixed liquid in the mixer 2 and the mixed liquid in the premixer 4 are both provided by the mixing valve 1 with stabilized concentration, the concentration of the mixed liquid in the mixer 2 is the same as that of the mixed liquid in the premixer 4.) the eighth control valve 68 may be controlled to open, so that the mixed liquid in the premixer 4 flows into the mixer 2 to continue etching the wafer. When the liquid level of the mixed liquid in the mixer 2 is higher than the second preset value, that is, when the liquid level of the mixed liquid in the mixer 2 is higher than the high liquid level, the eighth control valve 68 may be controlled to be closed, so as to prevent the mixed liquid in the premixer 4 from flowing into the mixer 2. The first preset value is a low liquid level, the second preset value is a high liquid level, and the first preset value is smaller than the second preset value.
Further, the utility model also provides an etching equipment, it is shown with reference to figure 7 the utility model discloses an etching equipment embodiment's schematic structure diagram. The etching apparatus may include the fluid mixing device, and the specific structure of the fluid mixing device has been described in detail above, and therefore, the detailed description thereof is omitted here.
In the present exemplary embodiment, the etching apparatus may further include a spray head 15, the spray head 15 is connected to the liquid outlet of the mixer 2, the spray head 15 is disposed in the etching chamber 14, and etching of the semiconductor device is completed in the etching chamber 14.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments, and the features discussed in connection with the embodiments are interchangeable, if possible. In the description above, numerous specific details are provided to give a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.
The terms "about" and "approximately" as used herein generally mean within 20%, preferably within 10%, and more preferably within 5% of a given value or range. The amounts given herein are approximate, meaning that the meaning of "about", "approximately" or "approximately" may still be implied without specific recitation.
Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". Other relative terms, such as "high", "low", "top", "bottom", and the like, are also intended to have similar meanings. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.
In this specification, the terms "a", "an", "the" and "the" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.
It is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the description. The present invention is capable of other embodiments and of being practiced and carried out in a variety of ways. The foregoing variations and modifications fall within the scope of the present invention. It will be understood that the invention disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute various alternative aspects of the present invention. The embodiments set forth herein explain the best modes known for practicing the invention and will enable others skilled in the art to utilize the invention.

Claims (10)

1. A fluid mixing device, comprising:
a mixing valve to which a first fluid supply and a second fluid supply are connected, the first and second fluid supplies supplying a first fluid and a second fluid, respectively, to the mixing valve, the mixing valve outputting a mixture of the first fluid and the second fluid;
the mixer is connected to the liquid outlet of the mixing valve through a first pipeline, and a first control valve is arranged on the first pipeline;
the pre-discharger is connected to the liquid outlet of the mixing valve through a second pipeline, and a second control valve is arranged on the second pipeline.
2. The fluid mixing device defined in claim 1, wherein the drain port of the mixer is connected to the inlet port of the pre-discharger by a conduit.
3. The fluid mixing device defined in claim 1, further comprising:
and the premixer is connected to the liquid outlet of the mixing valve through a third pipeline, and a third control valve is arranged on the third pipeline.
4. The fluid mixing device defined in claim 3, wherein the outlet of the premixer is connected to the inlet of the mixer.
5. The fluid mixing device defined in claim 3, wherein the first control valve, the second control valve, and the third control valve are pneumatic valves.
6. The fluid mixing device according to claim 1, wherein the first fluid supply device is connected to the liquid inlet of the mixing valve through a fourth pipe, and a first main valve, a needle valve, a first flow meter and a fourth control valve are sequentially arranged on the fourth pipe from one end close to the first fluid supply device to one end close to the mixing valve.
7. The fluid mixing device defined in claim 1, further comprising:
the chemical supply box is connected to the chemical supply box through a fifth pipeline, a second main valve is arranged on the fifth pipeline, the chemical supply box is connected to a liquid inlet of the mixing valve through a sixth pipeline and a seventh pipeline which are arranged in parallel, a second flow meter and a fifth control valve are sequentially arranged on the sixth pipeline from one end close to the chemical supply box to one end close to the mixing valve, and a third flow meter and a sixth control valve are sequentially arranged on the seventh pipeline from one end close to the chemical supply box to one end close to the mixing valve.
8. An etching apparatus, comprising:
a fluid mixing device according to any one of claims 1 to 7.
9. The etching apparatus according to claim 8, further comprising:
and the spray head is connected to the liquid outlet of the mixer.
10. The etching apparatus according to claim 9, further comprising:
and the etching cavity is internally provided with the spray head.
CN201920365410.4U 2019-03-21 2019-03-21 Fluid mixing device and etching equipment Active CN209810109U (en)

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Application Number Priority Date Filing Date Title
CN201920365410.4U CN209810109U (en) 2019-03-21 2019-03-21 Fluid mixing device and etching equipment

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Application Number Priority Date Filing Date Title
CN201920365410.4U CN209810109U (en) 2019-03-21 2019-03-21 Fluid mixing device and etching equipment

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Publication Number Publication Date
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114177824A (en) * 2020-09-14 2022-03-15 长鑫存储技术有限公司 Monitoring feedback system and monitoring feedback method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114177824A (en) * 2020-09-14 2022-03-15 长鑫存储技术有限公司 Monitoring feedback system and monitoring feedback method

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