CN209786830U

CN209786830U - Circuit assembly and wireless charger

Info

Publication number: CN209786830U
Application number: CN201920631437.3U
Authority: CN
Inventors: 李贡献
Original assignee: Shenzhen Ranvoo Technology Co Ltd
Current assignee: Shenzhen Ranvoo Technology Co Ltd
Priority date: 2019-04-30
Filing date: 2019-04-30
Publication date: 2019-12-13
Anticipated expiration: 2029-04-30

Abstract

The utility model relates to a circuit assembly is applied to in the wireless charger, circuit assembly includes base plate, first chip and second chip set up in on the base plate, integrated micro-program controller, full-bridge gate driver, field effect transistor and DC-DC power module on the first chip, the second chip is the digital circuit chip, electronic components's that sets up on the first chip calorific capacity is greater than the calorific capacity of second chip. The utility model discloses still relate to a wireless charger including this circuit assembly.

Description

Circuit assembly and wireless charger

Technical Field

The utility model relates to a circuit assembly and wireless charger with separation sets up.

Background

Existing circuit boards include a variety of different modules or chips that exhibit different heat generation conditions due to different nature of operation. However, the modules or chips are all arranged on a circuit substrate, which is inconvenient for centralized and targeted heat dissipation management, so that a distributed heat dissipation design of individual elements is easily caused, which consumes higher cost and is not favorable for miniaturization design.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, it is desirable to provide a circuit assembly and a wireless charger having a separate configuration.

The utility model provides a circuit assembly, is applied to in the wireless charger, circuit assembly includes base plate, first chip and second chip set up in on the base plate, integrated micro-program controller, full-bridge gate driver, field effect transistor and DC-DC power module on the first chip, the second chip is the digital circuit chip, the calorific capacity of the electronic components who sets up on the first chip is greater than the calorific capacity of second chip.

Preferably, the substrate is a printed circuit board.

Preferably, a heat dissipation assembly is disposed on the first chip to dissipate heat of the first chip.

Preferably, the heat dissipation assembly includes a heat dissipation adhesive layer and a heat dissipation sheet layer, the heat dissipation adhesive layer is coated on the first chip, the heat dissipation sheet layer is arranged on the heat dissipation adhesive layer, and the heat dissipation adhesive layer and the heat dissipation sheet layer are right for heat dissipation of the electronic component arranged on the first chip.

Preferably, the heat dissipation glue layer is silicone grease.

Preferably, the first chip is further integrated with an OP demodulation signal controller and a low dropout regulator.

Preferably, the micro-program controller, the OP demodulation signal controller, the full-bridge gate driver, the field effect transistor, the DC-DC power supply module, and the low dropout regulator are flip-chip integrated on the first chip.

Preferably, the field effect transistor is a four-way field effect transistor.

Preferably, the second chip is provided with electronic components such as a software program module and a corresponding circuit function module.

A wireless charger comprises a coil and a circuit assembly, wherein the circuit assembly is electrically connected with the coil so as to wirelessly charge an electronic device.

Compared with the prior art, the hardware electronic components are arranged on the first chip in a centralized manner, and the hardware electronic components generate larger heat when in work; software electronic components are arranged on the second chip in a centralized mode, and the heating value of the software electronic components is small when the software electronic components work. Therefore, the electronic components with larger heat productivity can be conveniently and intensively cooled through the soft and hard separation framework mode, and the circuit board layout is more convenient, so that the area of the circuit board can be effectively reduced, and the production cost is reduced.

Drawings

Fig. 1 is a schematic diagram of a preferred embodiment of the wireless charger of the present invention.

Fig. 2 is a schematic diagram of a circuit assembly in the wireless charger of the present invention.

Fig. 3 is a schematic diagram of a first chip in the circuit assembly according to the present invention.

Description of the main elements

Wireless charger 1

Circuit assembly 100

Substrate 10

First chip 30

Microprogram controller 31

OP demodulation signal controller 32

Full bridge door driver 33

4-way field effect transistor 34

DC-DC power module 35

Low dropout linear regulator 36

Heat dissipation glue layer 37

Radiator layer 38

Second chip 50

Coil 200

Detailed Description

Referring to fig. 1, a wireless charger 1 according to a preferred embodiment of the present invention includes a circuit assembly 100 and a coil 200. The circuit assembly 100 is connected with the coil 200 to realize a wireless charging function, and is used for wirelessly charging an electronic device.

Referring to fig. 2, the circuit assembly 100 includes a substrate 10, a first chip 30 and a second chip 50. The first chip 30 and the second chip 50 are disposed on the substrate 10. The substrate 10 may be, but is not limited to, a Printed Circuit Board (PCB).

The first chip 30 is provided with a micro programmed Control Unit (MCU) 31, an OP (Operational Amplifier) demodulation signal controller 32, a full-bridge gate driver (gate drive)33, a 4-way field effect transistor (MOSFET)34, a DC-DC power supply module 35, and a low dropout regulator (LDO) 36. In this embodiment, the MCU 31, the OP demodulation signal controller 32, the full-bridge gate driver 33, the 4-way fet 34, the DC-DC power module 35, and the LDO36 disposed on the first chip 30 are electronic components that generate a large amount of heat during the operation of the circuit assembly 100. In this embodiment, the MCU 31, the OP demodulation signal controller 32, the full-bridge gate driver 33, the 4-way fet 34, the DC-DC power module 35, and the LDO36 are integrated on the first chip 30 by a flip chip (flip chip) technology. The substrate of the first chip 30 may be deposited with tin-lead balls, and the electronic components are arranged on the substrate to be turned over and away from the substrate 10, and are combined with the substrate by heating and using the melted tin-lead balls to form an electrical joint, so as to form a package. Preferably, the plurality of electronic components are integrated into the first chip 30 by a flip chip technology, so that the integrated flip chip has smaller internal resistance, reduced heat generation, and better overvoltage protection.

Referring to fig. 3, the first chip 30 is coated with a heat dissipation adhesive layer 37, and a heat dissipation sheet layer 38 is disposed on the heat dissipation adhesive layer. In this embodiment, the heat dissipation adhesive layer 37 may be, but not limited to, silicone grease. Accordingly, the MCU 31, the OP demodulation signal controller 32, the full-bridge gate driver 33, the 4-way fet 34, the DC-DC power module 35, and the LDO36 on the first chip 30 are collectively dissipated heat through the heat dissipation adhesive layer 37 and the heat dissipation sheet layer 38.

The second chips 50 are disposed at intervals on the first chip 30. The second chip 50 is provided with electronic components such as a software program module and a corresponding circuit function module. In this embodiment, the electronic component disposed on the second chip 50 is an electronic component that generates less heat during the operation of the circuit assembly 100.

In this embodiment, hardware electronic components are centrally disposed on the first chip 30, and the hardware electronic components generate a large amount of heat during operation; software electronic components are centrally arranged on the second chip 50, and the electronic components generate less heat when in work. Therefore, the electronic components with larger heat productivity can be conveniently and intensively cooled through the soft and hard separation framework mode, and the circuit board layout is more convenient, so that the area of the circuit board can be effectively reduced, and the production cost is reduced.

In addition, various modifications, additions and substitutions in form and detail may occur to those skilled in the art within the scope and spirit of the disclosure as claimed. It is understood that various modifications, additions, substitutions and the like are intended to be included within the scope of the invention as claimed.

Claims

1. A circuit assembly is applied to a wireless charger and is characterized in that: the circuit assembly comprises a substrate, a first chip and a second chip, wherein the first chip and the second chip are arranged on the substrate, a micro-program controller, a full-bridge gate driver, a field effect transistor and a DC-DC power module are integrated on the first chip, the second chip is a digital circuit chip, and the heat productivity of an electronic component arranged on the first chip is larger than that of the second chip.

2. The circuit assembly of claim 1, wherein: the substrate is a printed circuit board.

3. The circuit assembly of claim 1, wherein: and the first chip is provided with a heat dissipation assembly for dissipating heat of the first chip.

4. The circuit assembly of claim 3, wherein: the heat dissipation assembly comprises a heat dissipation adhesive layer and a heat dissipation sheet layer, wherein the heat dissipation adhesive layer is coated on the first chip, the heat dissipation sheet layer is arranged on the heat dissipation adhesive layer, and the heat dissipation adhesive layer and the heat dissipation sheet layer are used for dissipating heat of the electronic component arranged on the first chip.

5. The circuit assembly of claim 4, wherein: the heat dissipation glue layer is silicone grease.

6. The circuit assembly of any one of claims 1-5, wherein: the first chip is further integrated with an OP demodulation signal controller and a low dropout linear regulator.

7. The circuit assembly of claim 6, wherein: the micro-program controller, the OP demodulation signal controller, the full-bridge gate driver, the field effect transistor, the DC-DC power supply module and the low dropout linear regulator are all integrated on the first chip in an inverted mode.

8. The circuit assembly of claim 1, wherein: the field effect transistor is a four-way field effect transistor.

9. The circuit assembly of claim 1, wherein: the second chip is provided with electronic components such as a software program module and a corresponding circuit function module.

10. A wireless charger, characterized by: the wireless charger comprises a coil and the circuit assembly of any one of claims 1-9, the circuit assembly being electrically connected to the coil for wirelessly charging an electronic device.