CN209783132U - Vacuum oven with uniform heat transfer - Google Patents
Vacuum oven with uniform heat transfer Download PDFInfo
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- CN209783132U CN209783132U CN201920488881.4U CN201920488881U CN209783132U CN 209783132 U CN209783132 U CN 209783132U CN 201920488881 U CN201920488881 U CN 201920488881U CN 209783132 U CN209783132 U CN 209783132U
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Abstract
The utility model relates to a vacuum oven with uniform heat transfer, which comprises an opening heating cavity matched with a vacuum unit and an airtight door arranged at the opening of the opening heating cavity for sealing the opening heating cavity, wherein a plurality of heat-conducting clapboards are arranged in the opening heating cavity, a heating source is arranged at the joint of the heat-conducting clapboards and the opening heating cavity and/or the bottom surface of the heat-conducting clapboards, and a control cabinet connected with the heating source is arranged at the bottom of the opening heating cavity; compared with the prior art, the utility model has the advantages that: the problem of poor temperature uniformity of the vacuum oven is effectively solved, the heating uniformity of a heated device in the vacuum oven is improved, and the device can be effectively baked within a required temperature range, so that the degassing effect of the infrared thermal imaging device is improved, and the service life of the infrared detector is prolonged.
Description
Technical Field
The utility model relates to a vacuum oven field, concretely relates to heat transfer even vacuum oven.
Background
An infrared image sensor needs to have better sensitivity under high vacuum, wherein the most important influence on the vacuum degree is the gas released by the metal tube shell, the ceramic tube shell and the adhesive for fixing a chip, so that the vacuum degree cannot be maintained after vacuum sealing and welding.
The insufficient vacuum degree is caused to influence the thermal imaging quality, in order to remove the gas of the materials, the materials need to be baked at high temperature for a long time in a vacuum oven, but the materials are heated by heat radiation by adopting a cavity wall heating mode in the conventional vacuum oven, air is not used as a heat transfer medium in the vacuum state, the heat is difficult to be uniformly transferred to the middle of the cavity from the cavity wall, the temperature of the material close to the cavity wall is far higher than that of the material placed at the center of the cavity, the temperature difference of different parts of the material can reach +/-10 percent through measurement, the temperature difference is overlarge, the degassing effect is not good, and the quality of the infrared sensor is directly influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the purpose is: a vacuum oven with uniform heat transfer is provided.
The technical scheme of the utility model is that: the utility model provides a heat transfer even vacuum oven, includes and heats the chamber with vacuum unit matched with opening heating chamber and installs the opening in opening heating chamber is in order to carry out confined airtight door to it, install a plurality of heat conduction baffle in the opening heating chamber, heat conduction baffle with the junction in opening heating chamber and/or the heating source is installed to the heat conduction baffle bottom surface, opening heating chamber bottom install with the switch board that the heating source links to each other.
Further: the heating source is a heating electrode and/or a heating wire and/or a heating pipe.
Further: when the heating source is installed on the bottom surface of the heat conduction partition plate, the heating source is uniformly distributed on the surface of the heat conduction partition plate.
Further: the heat-conducting partition plate is a graphite plate and/or a metal plate with uniform thickness.
Further: and a temperature sensor connected with the control cabinet is further installed in the opening heating cavity.
Further: the edge of the airtight door is wrapped with a sealing strip.
Compared with the prior art, the utility model has the advantages that: the problem of poor temperature uniformity of the vacuum oven is effectively solved, the heating uniformity of a heated device in the vacuum oven is improved, and the device can be effectively baked within a required temperature range, so that the degassing effect of the infrared thermal imaging device is improved, and the service life of the infrared detector is prolonged.
Drawings
The invention will be further described with reference to the following drawings and examples:
fig. 1 is a front view of embodiment 1 and embodiment 2;
FIG. 2 is a bottom view of each of the thermally conductive spacers in example 2;
FIG. 3 is a structural view of embodiment 3;
FIG. 4 is a bottom view of each of the thermally conductive spacers of FIG. 3;
Wherein: 1. an opening heating cavity; 2. an airtight door; 3. a thermally conductive spacer; 4. heating the electrode; 5. a control cabinet 6 and a heating wire; 7. heating the tube.
Detailed Description
Example 1: as shown in fig. 1, the vacuum oven with uniform heat transfer comprises an opening heating cavity 1 matched with a vacuum unit and an airtight door 2 installed at the opening of the opening heating cavity 1 to seal the opening, wherein three heat-conducting partition plates 3 horizontally arranged are installed in the opening heating cavity 1, the heat-conducting partition plates 3 are connected with the opening heating cavity 1 to form a heating source, and the heating source is a heating electrode 4.
And the bottom of the opening heating cavity 1 is provided with a control cabinet connected with a heating electrode 4. The control cabinet is internally provided with a PID microcomputer automatic temperature control system which is the same as the PID microcomputer automatic temperature control system used by the existing vacuum oven in the market and is not described herein again.
The heat-conducting partition plate 3 is a graphite plate with uniform thickness, and the uniform heat transfer performance of each part is ensured. And a temperature sensor connected with the control cabinet 5 is further installed in the opening heating cavity 1. The edge cladding of airtight door 2 has the sealing strip, and this sealing strip is the silica gel sealing strip, and high temperature resistant and leakproofness are good.
example 2: combine the even vacuum oven of heat transfer that fig. 1 and fig. 2 show, include with vacuum unit matched with opening heating chamber 1 and install opening heating chamber 1's opening is in order to carry out confined airtight door 2 to it, install the heat conduction baffle 3 that three levels set up in the opening heating chamber 1, heat conduction baffle 3 with opening heating chamber 1's junction with the heating source is all installed to heat conduction baffle 3 bottom surface, heat conduction baffle 3 with heating electrode 4 is installed to opening heating chamber 1's junction, and heater strip 6 is installed to heat conduction baffle 3's bottom surface, and heater strip 6 evenly arranges 3 surfaces of heat conduction baffle.
And a control cabinet connected with the heating electrode 4 and the heating wire 6 is arranged at the bottom of the opening heating cavity 1. The control cabinet is internally provided with a PID microcomputer automatic temperature control system which is the same as the PID microcomputer automatic temperature control system used by the existing vacuum oven in the market and is not described herein again. The heat-conducting partition plate 3 is a graphite plate with uniform thickness.
And a temperature sensor (not shown in the figure) connected with the control cabinet is further arranged in the opening heating cavity 1, so that the temperature in the opening heating cavity 1 can be conveniently controlled.
The edge cladding of airtight door 2 has the sealing strip, and this sealing strip is the silica gel sealing strip, and high temperature resistant and leakproofness are good.
Example 3: combine the even vacuum oven of heat transfer that fig. 3 and fig. 4 show, include with vacuum unit matched with opening heating chamber 1 and install opening heating chamber 1's opening is in order to carry out confined airtight door 2 to it, install the heat conduction baffle 3 of three horizontal settings in the opening heating chamber 1, heat conduction baffle 3 is the even metal sheet of thickness, guarantees that each position heat transfer performance of metal sheet is the same. The heating source is installed to 2 bottom surfaces of heat conduction baffle, the heating source is heating pipe 7. The heating pipes 7 are uniformly distributed on the surface of the heat-conducting partition plate 3.
And a control cabinet connected with the heating pipe 7 is arranged at the bottom of the opening heating cavity 1. The control cabinet is internally provided with a PID microcomputer automatic temperature control system which is the same as the PID microcomputer automatic temperature control system used by the existing vacuum oven in the market and is not described herein again.
Still install in the opening heating chamber 1 with the temperature sensor that the switch board links to each other, the temperature in the opening heating chamber 1 is in time adjusted to the switch board 5 of being convenient for. The edge cladding of airtight door 2 has the sealing strip, and this sealing strip is the silica gel sealing strip, and high temperature resistant and leakproofness are good.
the above-mentioned embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, which should not be construed as limiting the scope of the present invention. All modifications made according to the spirit of the main technical scheme of the present invention shall be covered within the protection scope of the present invention.
Claims (6)
1. A vacuum oven with uniform heat transfer is characterized in that: include with vacuum unit matched with opening heating chamber and install the opening in opening heating chamber is in order to carry out confined airtight door to it, install a plurality of heat conduction baffle in the opening heating chamber, heat conduction baffle with the junction in opening heating chamber and/or the heating source is installed to the heat conduction baffle bottom surface, opening heating chamber bottom install with the switch board that the heating source links to each other.
2. a uniform heat transfer vacuum oven as defined in claim 1 wherein: the heating source is a heating electrode and/or a heating wire and/or a heating pipe.
3. A uniform heat transfer vacuum oven as defined in claim 1 wherein: when the heating source is installed on the bottom surface of the heat conduction partition plate, the heating source is uniformly distributed on the surface of the heat conduction partition plate.
4. A uniform heat transfer vacuum oven as claimed in claim 1 or 3 wherein: the heat-conducting partition plate is a graphite plate and/or a metal plate with uniform thickness.
5. A uniform heat transfer vacuum oven as defined in claim 1 wherein: and a temperature sensor connected with the control cabinet is further installed in the opening heating cavity.
6. A uniform heat transfer vacuum oven as defined in claim 1 wherein: the edge of the airtight door is wrapped with a sealing strip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920488881.4U CN209783132U (en) | 2019-04-11 | 2019-04-11 | Vacuum oven with uniform heat transfer |
Applications Claiming Priority (1)
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CN201920488881.4U CN209783132U (en) | 2019-04-11 | 2019-04-11 | Vacuum oven with uniform heat transfer |
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CN209783132U true CN209783132U (en) | 2019-12-13 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109974400A (en) * | 2019-04-11 | 2019-07-05 | 江苏鼎茂半导体有限公司 | A kind of uniform vacuum oven of heat transfer |
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2019
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109974400A (en) * | 2019-04-11 | 2019-07-05 | 江苏鼎茂半导体有限公司 | A kind of uniform vacuum oven of heat transfer |
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