CN109974400A - A kind of uniform vacuum oven of heat transfer - Google Patents

A kind of uniform vacuum oven of heat transfer Download PDF

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Publication number
CN109974400A
CN109974400A CN201910288328.0A CN201910288328A CN109974400A CN 109974400 A CN109974400 A CN 109974400A CN 201910288328 A CN201910288328 A CN 201910288328A CN 109974400 A CN109974400 A CN 109974400A
Authority
CN
China
Prior art keywords
heating chamber
opening
heat conduction
vacuum oven
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910288328.0A
Other languages
Chinese (zh)
Inventor
林明芳
陈俊宇
郭信良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Dingmao Semiconductor Co Ltd
Original Assignee
Jiangsu Dingmao Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Dingmao Semiconductor Co Ltd filed Critical Jiangsu Dingmao Semiconductor Co Ltd
Priority to CN201910288328.0A priority Critical patent/CN109974400A/en
Publication of CN109974400A publication Critical patent/CN109974400A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B23/00Heating arrangements
    • F26B23/04Heating arrangements using electric heating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/008Seals, locks, e.g. gas barriers or air curtains, for drying enclosures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06Chambers, containers, or receptacles
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06Chambers, containers, or receptacles
    • F26B25/08Parts thereof
    • F26B25/12Walls or sides; Doors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06Chambers, containers, or receptacles
    • F26B25/14Chambers, containers, receptacles of simple construction
    • F26B25/18Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
    • F26B25/185Spacers; Elements for supporting the goods to be dried, i.e. positioned in-between the goods to build a ventilated stack
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B9/00Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
    • F26B9/06Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Electric Stoves And Ranges (AREA)

Abstract

The present invention relates to a kind of uniform vacuum ovens of heat transfer, including the opening heating chamber matched with vacuum pump set and the opening for being mounted on the opening heating chamber to carry out closed gas-tight door to it, several heat conduction baffles are installed in the opening heating chamber, the junction and/or the heat conduction baffle bottom surface of the heat conduction baffle and the opening heating chamber are equipped with heating source, and the opening heating chamber bottom is equipped with the control cabinet being connected with the heating source;Compared with prior art, the invention has the advantages that the problem of being effectively improved vacuum oven poor temperature uniformity, improve the degree of being heated evenly for the device that is heated in vacuum oven, allow device that can do effective baking within the temperature range of requiring, to improve infrared thermal imaging device degassing effect, extend infrared detector service life.

Description

A kind of uniform vacuum oven of heat transfer
Technical field
The present invention relates to vacuum oven fields, and in particular to a kind of uniform vacuum oven of heat transfer.
Background technique
A kind of infrared image sensor needs can just have preferable sensitivity under a high vacuum, wherein main influence vacuum What is spent is exactly the solid of Can & ceramic cartridge & fixed chip, and the gas released causes after vacuum seal, Vacuum degree is unable to maintain that
Causing vacuum degree deficiency to influence thermal imaging quality need to bake material in vacuum to remove the gas of these materials High temperature is done in case to toast for a long time, but is added since the heating method of current vacuum oven all uses cavity wall to heat by heat radiation These hot materials, under vacuum state as a heat transfer medium without air, heat is difficult uniformly to reach among cavity from cavity wall, causes Material temperature close to cavity wall can be much higher than the material for being placed on chamber central, and the temperature difference of material different parts is through measuring meeting Reach +/- 10%, excessive temperature differentials, degassing effect is bad, directly affects the quality of infrared sensor.
Summary of the invention
Object of the present invention is to: a kind of uniform vacuum oven of heat transfer is provided.
The technical scheme is that a kind of uniform vacuum oven of heat transfer, including the opening matched with vacuum pump set Heating chamber carries out closed gas-tight door, peace in the opening heating chamber with the opening for being mounted on the opening heating chamber to it Equipped with several heat conduction baffles, the junction and/or the heat conduction baffle bottom surface of the heat conduction baffle and the opening heating chamber are pacified Equipped with heating source, the opening heating chamber bottom is equipped with the control cabinet being connected with the heating source.
Further: the heating source is heating electrode and/or heater strip and/or heating tube.
Further: when the heating source is mounted on the heat conduction baffle bottom surface, the heating source is evenly spaced in described Heat conduction baffle surface.
Further: the heat conduction baffle is graphite plate in homogeneous thickness and/or metal plate.
It is further: to be also equipped with the temperature sensor being connected with the control cabinet in the opening heating chamber.
Further: the edge of the gas-tight door is coated with sealing strip.
Compared with prior art, the invention has the advantages that the problem of being effectively improved vacuum oven poor temperature uniformity, improves Be heated the degree of being heated evenly of device in vacuum oven, allows the device to do effective baking within the temperature range of requiring, thus Infrared thermal imaging device degassing effect is improved, infrared detector service life is extended.
Detailed description of the invention
The invention will be further described with reference to the accompanying drawings and embodiments:
Fig. 1 is the front view of embodiment 1 and embodiment 2;
Fig. 2 is the bottom view of each heat conduction baffle in embodiment 2;
Fig. 3 is the structure chart of embodiment 3;
Fig. 4 is the bottom view of each heat conduction baffle in Fig. 3;
Wherein: 1, be open heating chamber;2, gas-tight door;3, heat conduction baffle;4, electrode is heated;5, control cabinet, 6, heater strip;7, Heating tube.
Specific embodiment
Embodiment 1: the uniform vacuum oven of a kind of heat transfer as shown in Figure 1, including the opening matched with vacuum pump set Heating chamber 1 and be mounted on it is described opening heating chamber 1 opening to carry out closed gas-tight door 2, the opening heating chamber 1 to it Three pieces of horizontally disposed heat conduction baffles 3 are inside installed, the heat conduction baffle 3 and the junction of the opening heating chamber 1 are respectively mounted There is heating source, the heating source is heating electrode 4.
Opening 1 bottom of heating chamber is equipped with the control cabinet being connected with heating electrode 4.PID is installed micro- in control cabinet PID micro computer used in computer automatic temperature control system, the PID micro computer automatic temperature control system and the existing vacuum oven in market Automatic temperature control system is identical, and this will not be repeated here.
The heat conduction baffle 3 is graphite plate in homogeneous thickness, guarantees that each position heat transfer property is uniform.The opening heating chamber The temperature sensor being connected with the control cabinet 5 is also equipped in 1.The edge of the gas-tight door 2 is coated with sealing strip, the sealing Item is silicone sealing strip, high temperature resistant and good airproof performance.
Embodiment 2: it is matched in conjunction with Fig. 1 and a kind of uniform vacuum oven of heat transfer shown in Fig. 2, including with vacuum pump set Opening heating chamber 1 and be mounted on it is described opening heating chamber 1 opening to carry out closed gas-tight door 2, the opening to it Three pieces of horizontally disposed heat conduction baffles 3, the junction of the heat conduction baffle 3 and the opening heating chamber 1 are installed in heating chamber 1 It is mounted on heating source with 3 bottom surface of heat conduction baffle, heat conduction baffle 3 and the junction for being open heating chamber 1 are equipped with and add Thermode 4, the bottom surface of heat conduction baffle 3 are equipped with heater strip 6, and heater strip 6 is evenly spaced in 3 surface of heat conduction baffle.
Opening 1 bottom of heating chamber is equipped with the control cabinet being connected with heating electrode 4 and heater strip 6.Peace in control cabinet Equipped with PID micro computer automatic temperature control system, used in the PID micro computer automatic temperature control system and the existing vacuum oven in market PID micro computer automatic temperature control system is identical, and this will not be repeated here.The heat conduction baffle 3 is graphite plate in homogeneous thickness.
It is also equipped with the temperature sensor (being not drawn into figure) being connected with the control cabinet in the opening heating chamber 1, just Temperature in control opening heating chamber 1.
The edge of the gas-tight door 2 is coated with sealing strip, which is silicone sealing strip, high temperature resistant and good airproof performance.
Embodiment 3: it is matched in conjunction with Fig. 3 and a kind of uniform vacuum oven of heat transfer shown in Fig. 4, including with vacuum pump set Opening heating chamber 1 and be mounted on it is described opening heating chamber 1 opening to carry out closed gas-tight door 2, the opening to it Three pieces of horizontally disposed heat conduction baffles 3 are installed, the heat conduction baffle 3 is metal plate in homogeneous thickness, guarantee fund in heating chamber 1 Each position heat transfer property for belonging to plate is identical.2 bottom surface of heat conduction baffle is equipped with heating source, and the heating source is heating tube 7.The heating tube 7 is evenly spaced in the 3 surface of heat conduction baffle
Opening 1 bottom of heating chamber is equipped with the control cabinet being connected with heating tube 7.PID micro- electricity is installed in control cabinet PID micro computer used in brain automatic temperature control system, the PID micro computer automatic temperature control system and the existing vacuum oven in market is certainly Dynamic temperature-controlling system is identical, and this will not be repeated here.
It is also equipped with the temperature sensor being connected with the control cabinet in the opening heating chamber 1, it is timely convenient for control cabinet 5 Temperature in adjustment opening heating chamber 1.The edge of the gas-tight door 2 is coated with sealing strip, which is silicone sealing strip, resistance to High temperature and good airproof performance.
Certainly the above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow be familiar with technique People can understand the content of the present invention and implement it accordingly, it is not intended to limit the scope of the present invention.It is all according to this hair The modification that the Spirit Essence of bright main technical schemes is done, should be covered by the protection scope of the present invention.

Claims (6)

1. a kind of uniform vacuum oven of heat transfer, it is characterised in that: including the opening heating chamber matched with vacuum pump set and peace Opening mounted in the opening heating chamber is equipped with several lead in opening heating chamber to carry out closed gas-tight door to it Hot partition, the junction and/or the heat conduction baffle bottom surface of the heat conduction baffle and the opening heating chamber are equipped with heating source, The opening heating chamber bottom is equipped with the control cabinet being connected with the heating source.
2. a kind of uniform vacuum oven of heat transfer according to claim 1, it is characterised in that: the heating source is to add Thermode and/or heater strip and/or heating tube.
3. a kind of uniform vacuum oven of heat transfer according to claim 1, it is characterised in that: the heating source is mounted on institute When stating heat conduction baffle bottom surface, the heating source is evenly spaced in the heat conduction baffle surface.
4. a kind of uniform vacuum oven of heat transfer according to claim 1 or 3, it is characterised in that: the heat conduction baffle is Graphite plate and/or metal plate in homogeneous thickness.
5. a kind of uniform vacuum oven of heat transfer according to claim 1, it is characterised in that: in the opening heating chamber also The temperature sensor being connected with the control cabinet is installed.
6. a kind of uniform vacuum oven of heat transfer according to claim 1, it is characterised in that: the edge packet of the gas-tight door It is covered with sealing strip.
CN201910288328.0A 2019-04-11 2019-04-11 A kind of uniform vacuum oven of heat transfer Pending CN109974400A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910288328.0A CN109974400A (en) 2019-04-11 2019-04-11 A kind of uniform vacuum oven of heat transfer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910288328.0A CN109974400A (en) 2019-04-11 2019-04-11 A kind of uniform vacuum oven of heat transfer

Publications (1)

Publication Number Publication Date
CN109974400A true CN109974400A (en) 2019-07-05

Family

ID=67084016

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910288328.0A Pending CN109974400A (en) 2019-04-11 2019-04-11 A kind of uniform vacuum oven of heat transfer

Country Status (1)

Country Link
CN (1) CN109974400A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110530543A (en) * 2019-07-23 2019-12-03 上海卫星装备研究所 Closure assembly is heated in vacuum degassing suitable for aerospace product
CN111578625A (en) * 2020-05-22 2020-08-25 华北电力大学(保定) Vacuum oven with uniform heat transfer
CN114279174A (en) * 2021-12-24 2022-04-05 房县众创赢新能源科技有限公司 Uniform constant-temperature full-intelligent hot air circulation type high-vacuum oven

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5259124A (en) * 1988-06-15 1993-11-09 Poterala Robert J Open top compact dryer oven for a web
CH690857A5 (en) * 1995-07-04 2001-02-15 Erich Bergmann System for plasma-enhanced physical Hochvakuumbedampfung workpieces with wear-resistant coatings and methods for performing in this complex
CN206905410U (en) * 2017-04-25 2018-01-19 深圳力士智造科技有限公司 A kind of universal vacuum drying oven
CN207600069U (en) * 2017-11-29 2018-07-10 东莞市泽润机械有限公司 A kind of novel evacuated oven
CN207779021U (en) * 2017-12-08 2018-08-28 成都市生华生物制品制造有限公司 A kind of vacuum drying chamber being heated evenly
CN209783132U (en) * 2019-04-11 2019-12-13 江苏鼎茂半导体有限公司 Vacuum oven with uniform heat transfer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5259124A (en) * 1988-06-15 1993-11-09 Poterala Robert J Open top compact dryer oven for a web
CH690857A5 (en) * 1995-07-04 2001-02-15 Erich Bergmann System for plasma-enhanced physical Hochvakuumbedampfung workpieces with wear-resistant coatings and methods for performing in this complex
CN206905410U (en) * 2017-04-25 2018-01-19 深圳力士智造科技有限公司 A kind of universal vacuum drying oven
CN207600069U (en) * 2017-11-29 2018-07-10 东莞市泽润机械有限公司 A kind of novel evacuated oven
CN207779021U (en) * 2017-12-08 2018-08-28 成都市生华生物制品制造有限公司 A kind of vacuum drying chamber being heated evenly
CN209783132U (en) * 2019-04-11 2019-12-13 江苏鼎茂半导体有限公司 Vacuum oven with uniform heat transfer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110530543A (en) * 2019-07-23 2019-12-03 上海卫星装备研究所 Closure assembly is heated in vacuum degassing suitable for aerospace product
CN111578625A (en) * 2020-05-22 2020-08-25 华北电力大学(保定) Vacuum oven with uniform heat transfer
CN111578625B (en) * 2020-05-22 2021-10-12 华北电力大学(保定) Vacuum oven with uniform heat transfer
CN114279174A (en) * 2021-12-24 2022-04-05 房县众创赢新能源科技有限公司 Uniform constant-temperature full-intelligent hot air circulation type high-vacuum oven

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