CN209767512U - Micro unmanned aerial vehicle receiving and dispatching subassembly based on three-dimensional equipment and MCM technique - Google Patents
Micro unmanned aerial vehicle receiving and dispatching subassembly based on three-dimensional equipment and MCM technique Download PDFInfo
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- CN209767512U CN209767512U CN201921106830.7U CN201921106830U CN209767512U CN 209767512 U CN209767512 U CN 209767512U CN 201921106830 U CN201921106830 U CN 201921106830U CN 209767512 U CN209767512 U CN 209767512U
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- 230000005540 biological transmission Effects 0.000 claims description 8
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- 230000010363 phase shift Effects 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000676 Si alloy Inorganic materials 0.000 claims description 3
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 3
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
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- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model discloses a miniature unmanned aerial vehicle receiving and dispatching subassembly based on three-dimensional equipment and MCM technique, relate to microwave technology field, this miniature unmanned aerial vehicle receiving and dispatching subassembly uses the MCM as the basis, carry out chip integration with a large amount of discrete devices, can reduce the weight and the volume of product greatly, adopt advanced technology and manufacturing level simultaneously, adaptable multiple adverse circumstances, use under the multiple unmanned load platform, can carry out extensive marketing, this receiving and dispatching subassembly has broken through traditional equipment technology in addition, adopt three-dimensional assembly technique, under the prerequisite of guaranteeing that each item index is equivalent with conventional receiving and dispatching subassembly, the volume has been reduced greatly, 1/10 only for conventional receiving and dispatching subassembly, break through on the miniaturization, make receiving and dispatching system's miniaturization can realize.
Description
Technical Field
The utility model belongs to the technical field of the microwave technique and specifically relates to a miniature unmanned aerial vehicle receives and dispatches subassembly based on three-dimensional equipment and MCM technique.
Background
The unmanned platform is a complex system formed by fusing multiple technologies such as machinery, control, computer, communication, materials and the like, various types of unmanned platforms appear in succession, including unmanned vehicles, unmanned aerial vehicles, service robots, unmanned workshops and the like, and the unmanned platforms have obvious influence on human life and society. Among the various technologies, a transceiver system is an important component constituting an unmanned platform communication technology. The receiving and transmitting system mainly realizes the transmission and the reception of the control signal by the unmanned platform and realizes the man-machine interaction. With the current trend of increasingly miniaturization of unmanned platforms, the miniaturization of the transceiver system becomes a key part, but under the constraint of the traditional assembly process, the miniaturization of the transceiver system becomes difficult and serious.
SUMMERY OF THE UTILITY MODEL
The inventor provides a miniature unmanned aerial vehicle receiving and dispatching subassembly based on three-dimensional equipment and MCM technique to above-mentioned problem and technical demand, and this miniature unmanned aerial vehicle receiving and dispatching subassembly is under the prerequisite of guaranteeing technical index, and the volume reduces greatly for receiving and dispatching system's miniaturization can be realized.
The technical scheme of the utility model as follows:
A micro unmanned aerial vehicle transceiver module based on three-dimensional assembly and MCM technology comprises a module shell, a radio frequency control panel and a power control panel, wherein a connector is arranged on the module shell, a front cavity and a back cavity are formed in two sides of the interior of the module shell respectively, the front cavity and the back cavity are stacked and isolated from each other, the radio frequency control panel is arranged in the front cavity, the power control panel is arranged in the back cavity, a power control link of the micro unmanned aerial vehicle transceiver module is arranged on the power control panel, a radio frequency link of the micro unmanned aerial vehicle transceiver module is arranged on the radio frequency control panel, the power control link is connected with the connector, the power control link is connected with and controls the radio frequency link, and the radio frequency link comprises a receiving branch; the signal from radio frequency is input after being processed by a receiving branch circuit, and the receiving branch circuit comprises a first numerical control attenuator, a phase-shifting attenuation multifunctional chip, a first switch filter bank chip, a first bidirectional amplifier, a second switch filter bank chip, a mixer, an intermediate frequency narrow-band filter, a second numerical control attenuator, a second bidirectional amplifier and an intermediate frequency low-pass filter which are sequentially connected according to the signal transmission direction; the signal from the intermediate frequency is output after being processed by a transmitting branch circuit, and the transmitting branch circuit comprises an intermediate frequency low-pass filter, a second bidirectional amplifier, a second numerical control attenuator, an intermediate frequency broadband filter, a mixer, a second switch filter bank chip, a first bidirectional amplifier, a first switch filter bank chip and a phase-shifting attenuation multifunctional chip which are sequentially connected according to the signal transmission direction; the phase-shift attenuation multifunctional chip, the first switch filter bank chip and the second switch filter bank chip are all made by adopting MCM technology, and the phase-shift attenuation multifunctional chip is integrated with a receiving and transmitting switch, a numerical control phase shift, a numerical control attenuation, an amplifier and a serial-parallel conversion function.
The assembly shell comprises a first box body, a second box body, a first cover plate, a second cover plate, a separated partition frame and an inner cover plate, wherein a connector is arranged on the first box body, the front surface of the first box body is provided with a cavity to form a front surface cavity inside the assembly shell, a radio frequency control panel is arranged in the front surface cavity, the separated partition frame is arranged on the surface of the radio frequency control panel and is used for carrying out space isolation on devices on the radio frequency control panel, and the first cover plate is fixed at the opening of the front surface cavity; the transmission line has been laid to the back of first box body, and the back at first box body is fixed to the second box body, and the opening part at the second box body is fixed to the second apron, forms the inside reverse side chamber of subassembly shell between first box body, second box body and the second apron, and the interior apron sets up in the reverse side chamber and sets up the back at first box body, and power control panel sets up in the reverse side chamber and sets up including on the apron.
The further technical scheme is that the first cover plate and the second cover plate are made of aluminum-silicon alloy base materials, the first box body, the second box body, the separated type partition frame and the inner cover plate are made of aluminum alloy base materials, and the first box body, the second box body, the first cover plate, the second cover plate, the separated type partition frame and the inner cover plate are integrated through laser welding.
The further technical scheme is that the radio frequency control board is welded in the front cavity in a reflow welding mode, and the power supply control board is welded in the back cavity in a reflow welding mode.
The power supply control link comprises a power-on protection circuit, the power-on protection circuit comprises a diode, a voltage stabilizing diode, a triode, a first resistor, a second resistor, a third resistor and an AND gate, the anode of the diode is connected with an external positive power supply through the second resistor, the cathode of the diode is respectively connected with the cathode of the voltage stabilizing diode, the base of the triode and the third resistor, the other end of the third resistor is grounded, the anode of the voltage stabilizing diode is connected with an external negative power supply, the emitter of the triode is grounded, the collector of the triode is connected with the external positive power supply through the first resistor, the common end of the collector of the triode and the first resistor is connected with one input end of the AND gate, the other input end of the AND gate is connected with an externally input emission pulse modulation signal, and the output end of the.
The further technical scheme is that the power supply control link also comprises a temperature compensation attenuator.
The further technical scheme is that the power supply control link also comprises a temperature monitor.
the further technical scheme is that the size of the receiving and transmitting component of the micro unmanned aerial vehicle is 69mm 19mm 12 mm.
The further technical scheme is that the intermediate frequency narrow band filter adopts an FBar filter.
The further technical scheme is that the medium-frequency broadband filter and the medium-frequency low-pass filter respectively adopt MEMS filters.
The utility model has the beneficial technical effects that:
The application discloses miniature unmanned aerial vehicle receives and dispatches subassembly based on three-dimensional equipment and MCM technique, this miniature unmanned aerial vehicle receive and dispatches subassembly utilizes MCM technique and three-dimensional equipment technique to design, under the prerequisite of guaranteeing that each item index is equivalent with conventional receiving and dispatching subassembly, has reduced the volume greatly, only for 1/10 of conventional receiving and dispatching subassembly, has obtained the breakthrough on the miniaturization for the miniaturization of receiving and dispatching system can realize. This application still has carried out key design to some problems that send-receiver subassembly often, such as aspects such as heat dissipation, environmental suitability, automated inspection, carries out thermal simulation design to the system simultaneously, guarantees each components and parts normal use under tiny structure. In addition, specific materials are selected during design, and are reasonably analyzed to achieve harsh and complex environmental adaptability, so that the product can be used in various fields including aerospace, aviation, civil aviation and the like.
Drawings
fig. 1 is the assembly structure view of the unmanned aerial vehicle transceiver module of this application.
Fig. 2 is a schematic view of a connector of a drone transceiver assembly of the present application.
Fig. 3 is a circuit architecture diagram of the radio frequency link in the micro drone transceiver assembly of the present application.
Fig. 4 is an index diagram of an intermediate frequency narrowband filter in the drone transceiver assembly of the present application.
Fig. 5 is a circuit diagram of a power-up protection circuit in a power control link in a drone transceiver assembly of the present application.
Detailed Description
The following describes the embodiments of the present invention with reference to the accompanying drawings.
The application discloses a micro unmanned aerial vehicle receiving and dispatching assembly based on three-dimensional assembly and MCM technology, please refer to FIG. 1, the micro unmanned aerial vehicle receiving and dispatching assembly comprises an assembly shell 1, a radio frequency control board 2 and a power control board 3, an electronic device is arranged on the radio frequency control board 2, and the electronic device on the radio frequency control board 2 forms a radio frequency link of the micro unmanned aerial vehicle receiving and dispatching assembly through a circuit structure which is pre-arranged on the radio frequency control board 2; the power control panel 3 is also provided with an electronic device, and the electronic device on the power control panel 3 forms a power control link of the micro unmanned aerial vehicle transceiver module through a circuit structure pre-laid on the power control panel 3. The inside both sides of subassembly shell 1 are formed with positive chamber and reverse side chamber respectively, and positive chamber and the range upon range of setting in reverse side chamber and mutual isolation, and positive intracavity is arranged in to radio frequency control board 2, and power control board 3 realizes three-dimensional equipment in arranging the reverse side intracavity in, has reduced the volume of whole receiving and dispatching subassembly. In the present application, the module case 1 includes a first case 11, a second case 12, a first cover 13, a second cover 14, a separation type bulkhead 15, and an inner cover 16. The front of the first box body 11 is provided with a cavity to form a front cavity inside the component shell, the radio frequency control board 2 is arranged in the front cavity, the separated type partition frame 15 is arranged on the surface of the radio frequency control board 2 and is used for carrying out space isolation on devices on the radio frequency control board 2, and the first cover plate 13 is fixed at the opening of the first box body 11, namely at the opening of the front cavity. The transmission line, such as a microstrip line, etc., required for signal connection is disposed on the back of the first box 11. The back at first box body 11 is fixed to second box body 12, second box body 12 is both sides open-ended frame structure, an opening part of second box body 12 is fixed on first box body 11, second apron 14 is fixed at another opening part of second box body 12, first box body 11, form the inside reverse side chamber of subassembly shell 1 between second box body 12 and the second apron 14, inner cover plate 16 sets up in the reverse side chamber and sets up the back at first box body 12, power control panel 3 sets up in the reverse side chamber and sets up on inner cover plate 16, inner cover plate 16 is used for shielding the transmission line on first box body 11 and power control panel 3 and keeps apart.
In the application, the first cover plate 13 and the second cover plate 14 are made of aluminum-silicon alloy base materials, the first box body 11, the second box body 12, the separating type partition frame 15 and the inner cover plate 16 are made of aluminum alloy base materials, all structural components are made of self-matching methods, and finally are integrated through laser welding or tin welding, so that the environmental adaptability requirement of the assembly is met. The radio frequency control board 2 is welded in the front cavity in a reflow welding mode, and the power supply control board 3 is welded in the back cavity in a reflow welding mode. The module housing 1 is provided with a connector 4, as shown in fig. 1, the connector 4 is arranged on the first box 11, the power control link is connected with the connector 4, and the power control link is connected with and controls the radio frequency link. The application adopts a hybrid integrated connector to integrate radio frequency and digital interfaces into one connector, and the connector integrates 4 sets of radio frequency interfaces and a set of 19-core connectors, and is designed in an integrated manner, please refer to fig. 2.
First, the rf link includes a receiving branch and a transmitting branch, please refer to the circuit architecture diagram shown in fig. 3:
When the receiving and transmitting component receives, a signal from a radio frequency is switched to a receiving branch circuit through a receiving and transmitting switch, the receiving branch circuit comprises a first numerical control attenuator, a phase-shifting attenuation multifunctional chip, a first switch filter bank chip, a first bidirectional amplifier, a second switch filter bank chip, a mixer, an intermediate frequency narrow-band filter, a second numerical control attenuator, a second bidirectional amplifier and an intermediate frequency low-pass filter which are sequentially connected according to a signal transmission direction, and the receiving branch circuit completes receiving, down-conversion, filtering and other processing functions of the signal from the radio frequency through the components and then inputs the signal.
When the transceiving component transmits, a signal from an intermediate frequency is switched to a transmitting branch circuit through a transceiving switch, the transmitting branch circuit comprises an intermediate frequency low-pass filter, a second bidirectional amplifier, a second numerical control attenuator, an intermediate frequency broadband filter, a mixer, a second switch filter bank chip, a first bidirectional amplifier, a first switch filter bank chip and a phase-shifting attenuation multifunctional chip which are sequentially connected according to a signal transmission direction, and the transmitting branch circuit completes processing functions such as power amplification and the like on the signal from the intermediate frequency through the components and then outputs the signal. The receiving branch and the transmitting branch share the intermediate frequency low-pass filter, the second bidirectional amplifier, the second digital controlled attenuator, the mixer, the second switch filter bank chip, the first bidirectional amplifier and the first switch filter bank chip.
In order to realize product miniaturization, different from a conventional component, the radio frequency link circuit uses a large number of MCM chips, different from a common chip, the chips integrate multiple functions and integrate a complex circuit into one chip for realization, and specifically, the MCM chips comprise the following components:
(1) Phase-shift attenuation multifunctional chip: the transmit-receive switch, the 6-bit digitally controlled phase shifter, the 6-bit digitally controlled attenuator, the amplifier and the serial-to-parallel conversion function are integrated as shown in the dashed box of fig. 3, wherein the amplifier comprises a driver amplifier and a Low Noise Amplifier (LNA).
(2) The switch filter bank chip comprises a first switch filter bank chip and a second switch filter bank chip: a single chip is internally provided with a single-pole 4-throw switch and 4 groups of filters, each group of chips can cover the bandwidth of 2GHz through code combining control, the whole X wave band is covered through two groups of chips, the size of each chip is only 4mm by 0.2mm, and is less than 2% of the size of a conventional filter.
Besides, the application also has special design for the filter:
(1) The intermediate frequency narrow band filter adopts an FBar filter: the sound surface filter has the characteristics of narrower bandwidth, higher frequency and smaller size compared with the common sound surface filter, and the indexes of the sound surface filter are shown in figure 4.
(2) The intermediate frequency broadband filter and the intermediate frequency low-pass filter both adopt MEMS filters: the novel silicon cavity filter chip is manufactured by MEMS technologies such as high-precision micro-nano processing, direct bonding of silicon wafers, TSV (through silicon vias) and the like.
And secondly, compared with the conventional power control link, the power control link is added with intelligent protection and detection functions, including but not limited to power-on protection, high and low temperature compensation, temperature power protection and the like.
(1) And (4) a power-on protection function. The power control link includes a power-up protection circuit, referring to fig. 5, the power-up protection circuit includes a diode D1, a zener diode D2, a transistor D3, a first resistor R1, a second resistor R2, a third resistor R3 and an and gate D4, the anode of the diode D1 is connected to the positive external power supply +5V through the second resistor R2, the cathode of the diode D1 is connected to the cathode of the zener diode D2, the base of the transistor D3 and the third resistor R3, the other end of the third resistor R3 is grounded, the anode of the zener diode D2 is connected to the negative external power supply-4.8V, the emitter of the transistor D3 is grounded, the collector is connected to the positive external power supply +5V through the first resistor R1, the collector of the transistor D3 and the common terminal of the first resistor R1 are connected to one input terminal of the and gate D4, the other input terminal of the and gate D4 is connected to an externally input transmission pulse modulation signal PDP, and the output terminal of the and gate D4 supplies power to the transmission power source.
When an external power supply normally supplies an external positive power supply of +5V and an external negative power supply of-4.8V to the circuit, after the-4.8V passes through the voltage stabilizing diode D2, the potential of the 1 part of the triode D3 is about 0.2V, and the unidirectional conductivity of the diode D1 can ensure that no voltage leaks to the +5V end, at the moment, the triode D3 is cut off, the EN end outputs about 4.8V, a signal output after the phase of the PDP and an externally input emission pulse modulation signal PDP is used as the PDP, and the emission power supply can normally modulate and supply power.
When an external power supply normally supplies +5V but no external negative power supply of-4.8V to one end of a voltage stabilizing diode D2, the voltage from-4.8V to the end of the voltage stabilizing diode D2 is regarded as an open circuit, at the moment, the voltage of +5V is pulled down to the ground through a third resistor R3 after passing through a first resistor R1 and a diode D1, the voltage of-4.8V can be ensured to be leaked in a very small voltage value, the potential at the position 1 of a triode D3 is high, a triode D3 is conducted, the potential at the end EN is about 0.2V, and the voltage of the voltage is in phase with an externally input emission pulse modulation signal PDP and then outputs a low level, the emission power supply.
(2) High and low temperature compensation function. The power supply control link comprises a temperature compensation attenuator, so that the fluctuation under high and low temperature can be improved.
(3) And (4) temperature power protection. The power supply control link comprises a temperature monitor, temperature detection is realized in a mode of combining the temperature monitor and the operational amplifier, meanwhile, when the ambient temperature of the component is detected to be greater than 90 ℃, an alarm is given to the outside, and when the temperature of the component is greater than 100 ℃, the component is automatically powered off.
Because this application has adopted MCM chip and advanced three-dimensional packaging technology, therefore whole miniature unmanned aerial vehicle send and receive subassembly is 1/10 only than conventional subassembly, only 69mm 19mm 12mm under technical index still is unanimous with conventional subassembly or on the equivalent prerequisite. The shell of the component is made of specific materials, and the materials are reasonably analyzed, so that the harsh and complex environmental adaptability is achieved. Simultaneously this application has still carried out thermal simulation design to the system, guarantees each components and parts normal use under small structure: the high-power amplifier is arranged in the product, the high-power amplifier is subjected to good heat dissipation design, the power consumption of the product is about 2W in a saturation pulse mode, the component naturally dissipates heat in a natural environment (the temperature is 20 ℃) according to the information of the working environment of the component, simulation software is utilized for simulation, the highest temperature of the chip position is about 44.5 ℃ according to the simulation result, the temperature rise is 24.5 ℃, and the like, and the highest temperature of the chip position is 94.5 ℃ in a high-temperature environment of 70 ℃, so that the natural cooling mode meets the use requirement (the safe use temperature of the GaAs chip is 125 ℃).
what has been described above is only a preferred embodiment of the present application, and the present invention is not limited to the above embodiments. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the spirit and scope of the present invention are to be considered as included within the scope of the present invention.
Claims (10)
1. A micro unmanned aerial vehicle transceiver module based on three-dimensional assembly and MCM technique is characterized in that, the micro unmanned aerial vehicle transceiver component comprises a component shell, a radio frequency control panel and a power supply control panel, wherein the component shell is provided with a connector, a front cavity and a back cavity are respectively formed on two sides of the interior of the component shell, the front cavity and the back cavity are stacked and isolated from each other, the radio frequency control board is arranged in the front cavity, the power supply control board is arranged in the back cavity, the power control board is provided with a power control link of the micro unmanned aerial vehicle transceiver module, the radio frequency control board is provided with a radio frequency link of the micro unmanned aerial vehicle transceiver module, the power supply control link is connected with the connector, the power supply control link is connected with and controls the radio frequency link, and the radio frequency link comprises a receiving branch and a transmitting branch; the receiving branch circuit comprises a first numerical control attenuator, a phase-shifting attenuation multifunctional chip, a first switch filter bank chip, a first bidirectional amplifier, a second switch filter bank chip, a mixer, an intermediate frequency narrow-band filter, a second numerical control attenuator, a second bidirectional amplifier and an intermediate frequency low-pass filter which are sequentially connected according to a signal transmission direction; the signal from the intermediate frequency is output after being processed by the transmitting branch circuit, and the transmitting branch circuit comprises the intermediate frequency low-pass filter, the second bidirectional amplifier, the second digital controlled attenuator, the intermediate frequency broadband filter, the mixer, the second switch filter bank chip, the first bidirectional amplifier, the first switch filter bank chip and the phase-shifting attenuation multifunctional chip which are sequentially connected according to a signal transmission direction; the phase-shift attenuation multifunctional chip, the first switch filter bank chip and the second switch filter bank chip are all manufactured by adopting an MCM technology, and the phase-shift attenuation multifunctional chip is integrated with a receiving and transmitting switch, a numerical control phase shift, a numerical control attenuation, an amplifier and a serial-parallel conversion function.
2. The transceiver component of claim 1, wherein the component housing comprises a first box body, a second box body, a first cover plate, a second cover plate, a separating bulkhead and an inner cover plate, the connector is disposed on the first box body, a cavity is formed in the front surface of the first box body to form a front cavity inside the component housing, the radio frequency control board is disposed in the front cavity, the separating bulkhead is disposed on the surface of the radio frequency control board and spatially isolates devices on the radio frequency control board, and the first cover plate is fixed at an opening of the front cavity; the transmission line has been laid to the back of first box body, the second box body is fixed the back of first box body, the second apron is fixed the opening part of second box body, form between first box body, second box body and the second apron the inside reverse side chamber of subassembly shell, the inner cover board sets up in the reverse side chamber and set up the back of first box body, power control panel sets up in the reverse side chamber and set up on the inner cover board.
3. the transceiver module of claim 2, wherein the first cover plate and the second cover plate are made of aluminum-silicon alloy, the first box body, the second box body, the separating partition frame and the inner cover plate are made of aluminum alloy, and the first box body, the second box body, the first cover plate, the second cover plate, the separating partition frame and the inner cover plate are integrated by laser welding.
4. The unmanned aerial vehicle transceiver assembly of claim 2, wherein the radio frequency control board is welded in the front cavity by reflow welding and the power control board is welded in the back cavity by reflow welding.
5. The transceiver module of claim 1, wherein the power control link includes a power-up protection circuit, the power-up protection circuit includes a diode, a zener diode, a transistor, a first resistor, a second resistor, a third resistor, and an AND gate, an anode of the diode is connected to an external positive power source through the second resistor, a cathode of the diode is connected to a cathode of the zener diode, a base of the transistor, and the third resistor, respectively, another end of the third resistor is grounded, an anode of the zener diode is connected to an external negative power source, an emitter of the transistor is grounded, a collector of the transistor is connected to the external positive power source through the first resistor, a common terminal of the collector of the transistor and the first resistor is connected to one input terminal of the AND gate, and another input terminal of the AND gate is connected to an externally input transmission pulse modulation signal, and the output end of the AND gate supplies power to the transmitting power supply.
6. The drone transceiver assembly of claim 1, further comprising a temperature compensated attenuator in the power control link.
7. the drone transceiver assembly of claim 1, further comprising a temperature monitor in the power control link.
8. A transceiver module according to any one of claims 1 to 7, wherein the transceiver module has dimensions of 69mm 19mm 12 mm.
9. The unmanned aerial vehicle transceiver component of any one of claims 1-7, wherein the intermediate frequency narrowband filter is an FBar filter.
10. The transceiver module of claim 1-7, wherein the intermediate frequency broadband filter and the intermediate frequency low pass filter are MEMS filters, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921106830.7U CN209767512U (en) | 2019-07-15 | 2019-07-15 | Micro unmanned aerial vehicle receiving and dispatching subassembly based on three-dimensional equipment and MCM technique |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921106830.7U CN209767512U (en) | 2019-07-15 | 2019-07-15 | Micro unmanned aerial vehicle receiving and dispatching subassembly based on three-dimensional equipment and MCM technique |
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| Publication Number | Publication Date |
|---|---|
| CN209767512U true CN209767512U (en) | 2019-12-10 |
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| CN201921106830.7U Withdrawn - After Issue CN209767512U (en) | 2019-07-15 | 2019-07-15 | Micro unmanned aerial vehicle receiving and dispatching subassembly based on three-dimensional equipment and MCM technique |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110311698A (en) * | 2019-07-15 | 2019-10-08 | 无锡华测电子系统有限公司 | A kind of miniature drone transmitting-receiving subassembly based on three-dimensional assembling and MCM technology |
-
2019
- 2019-07-15 CN CN201921106830.7U patent/CN209767512U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110311698A (en) * | 2019-07-15 | 2019-10-08 | 无锡华测电子系统有限公司 | A kind of miniature drone transmitting-receiving subassembly based on three-dimensional assembling and MCM technology |
| CN110311698B (en) * | 2019-07-15 | 2024-06-25 | 无锡华测电子系统有限公司 | Miniature unmanned aerial vehicle receiving and transmitting assembly based on three-dimensional assembly and MCM technology |
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