CN209748897U - Copper-clad plate - Google Patents

Abstract

The utility model discloses a copper-clad plate, which comprises a middle component, wherein the middle component comprises a second copper layer, an insulating layer and a third copper layer which are sequentially overlapped from top to bottom; the upper end of the second copper layer is connected with the first copper layer, and the lower end of the third copper layer is connected with the fourth copper layer. Pressing a copper bar on the basis of the FR4 board to obtain a high-power copper-clad plate comprising an upper copper layer, an insulating layer and a lower copper layer, wherein the thicker upper copper layer and the thicker lower copper layer are etched to become a circuit layer and the copper-clad plate to become a high-power double-layer PCB, so that the rigidity of the plate is improved, the plate is not easy to deform, the charging pile control plate is not easy to soften and break after heating, is not easy to burn and break, is not easy to have circuit breakage and residual copper and the like; the wiring density of the circuit is reduced compared with that of a single panel, thereby reducing the whole product volume and the assembly cost.

Description

Copper-clad plate

Technical Field

The utility model belongs to the technical field of the circuit board and specifically relates to a copper-clad plate is related to.

Background

The environment is deteriorated, and the haze is more, one reason is that the automobile exhaust is discharged, the traditional automobile industry uses petroleum as power, and a large amount of precious resources are consumed. The development of clean renewable energy is a sharp tool for solving the environmental problem, and the pollution can be reduced to zero by driving the automobile by using electric energy; the problems of developing new energy charging technology and popularizing new energy vehicle charging piles are more urgent and are an important way for solving energy pollution. Meanwhile, due to frequent departure of national new energy automobile field policies and coming of comprehensive intellectualization of future electric automobiles, more cities are managed by depending on infrastructure facilities of the cities, interconnection and intercommunication and real-time dynamic management are realized, so that the new energy charging pile becomes a leading role in the era of the electric automobiles, and the charging is realized when the automobiles are parked.

The future trend is high-power high-voltage rapid charging, so that the PCB for the charging pile control module has higher requirements compared with the common PCB. The charging pile plate passes large current and high voltage, and if the charging pile plate is a thin plate, the charging pile plate is easy to generate heat and burn off; there is a need for a PCB board that ensures high power carrying electrical characteristics.

SUMMERY OF THE UTILITY MODEL

For overcoming the not enough of prior art, guarantee the high-power bearing capacity of circuit board, the utility model discloses a technical scheme be:

A copper-clad plate comprises a middle component, wherein the middle component comprises a second copper layer, an insulating layer and a third copper layer which are sequentially stacked from top to bottom; the upper end of the second copper layer is connected with the first copper layer, and the lower end of the third copper layer is connected with the fourth copper layer.

According to another embodiment of the present invention, further, the sum of the thicknesses of the first copper layer and the second copper layer is 1.6-5 mm; the sum of the thicknesses of the third copper layer and the fourth copper layer is 1.6-5 mm.

According to another embodiment of the present invention, further, the thickness of the middle assembly is 1.5-5.5 mm; the thickness of the second copper layer is 0.2-0.55 mm; the thickness of the third copper layer is 0.2-0.55 mm.

according to another embodiment of the present invention, further, the sum of the thicknesses of the first copper layer and the second copper layer is 3.5-4.5 mm; the sum of the thicknesses of the third copper layer and the fourth copper layer is 3.5-4.5 mm.

According to another embodiment of the present invention, further, the sum of the thicknesses of the first copper layer and the second copper layer is 3.9-4.1 mm; the sum of the thicknesses of the third copper layer and the fourth copper layer is 3.9-4.1 mm.

According to another specific embodiment of the present invention, further, the lower end of the first copper layer and the upper end of the second copper layer are both provided with a first browning layer, and the first copper layer is connected with the second copper layer through the first browning layer; and the lower end of the third copper layer and the upper end of the fourth copper layer are both provided with second browning layers, and the third copper layer is connected with the fourth copper layer through the second browning layers.

According to another embodiment of the present invention, further, the thickness of the first browning layer and the second browning layer is 0.5-6 um.

According to the utility model discloses a further embodiment, it is further that, the copper-clad plate is provided with the locating hole.

According to another embodiment of the present invention, further, the upper end of the first copper layer and the lower end of the fourth copper layer are provided with solder resists.

The utility model discloses a copper-clad plate, following beneficial effect has: pressing a copper bar on the basis of the FR4 board to obtain a high-power copper-clad plate comprising an upper copper layer, an insulating layer and a lower copper layer, wherein the thicker upper copper layer and the thicker lower copper layer are etched to become a circuit layer and the copper-clad plate to become a high-power double-layer PCB, so that the rigidity of the plate is improved, the plate is not easy to deform, the charging pile control plate is not easy to soften and break after heating, is not easy to burn and break, is not easy to have circuit breakage and residual copper and the like; the wiring density of the circuit is reduced compared with that of a single panel, thereby reducing the whole product volume and the assembly cost.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.

As shown in fig. 1, a copper-clad plate comprises a middle component 2, wherein the middle component 2 comprises a second copper layer 21, an insulating layer 22 and a third copper layer 23 which are sequentially stacked from top to bottom; the upper end of the second copper layer 21 is connected with the first copper layer 1 in a pressing mode, and the lower end of the third copper layer 23 is connected with the fourth copper layer 4 in a pressing mode. The first copper layer 1 and the second copper layer 21 are in thermoplastic press fit connection, and the first copper layer 1 and the second copper layer 21 are in press fit connection to form an upper copper layer; the third copper layer 23 and the fourth copper layer 4 are in thermoplastic press fit connection, the third copper layer 23 and the fourth copper layer 4 are in press fit connection to form a lower copper layer, and the copper-clad plate comprises an upper copper layer, an insulating layer 22 and a lower copper layer. The double-layer circuit board is adopted, and compared with a single-panel circuit wiring density, the circuit wiring density is reduced, so that the whole product volume and the assembly cost are reduced.

The first copper layer 1 and the second copper layer 21, the third copper layer 23 and the fourth copper layer 4 may be bonded in a molten state by heating, such as spot welding. Preferably, the lower end of the first copper layer 1 and the upper end of the second copper layer 21 are both provided with a first browning layer, and the first copper layer 1 and the second copper layer 21 are connected in a combination manner through the first browning layer; the lower end of the third copper layer 23 and the upper end of the fourth copper layer 4 are both provided with a second browning layer, and the third copper layer 23 and the fourth copper layer 4 are connected in a combination mode through the second browning layer. The thickness of the first browning layer and the second browning layer is 0.5-6 um; preferably, the thickness of first brown layer and second brown layer is 1 ~ 4um, like 2 um. An oxide layer is formed on the surface of the copper layer to improve the bonding force during pressing.

The sum of the thicknesses of the first copper layer 1 and the second copper layer 21 is 1.6-5 mm; the sum of the thicknesses of the third copper layer 23 and the fourth copper layer 4 is 1.6-5 mm. Preferably, the sum of the thicknesses of the first copper layer 1 and the second copper layer 21 is 3.5-4.5 mm, such as 3.9-4.1 mm; the sum of the thicknesses of the third copper layer 23 and the fourth copper layer 4 is 3.5 to 4.5mm, such as 3.9 to 4.1 mm. The rigidity of the plate is improved, the plate is not easy to deform, the charging pile control plate is not easy to soften and break after heating, is not easy to burn out due to heating, and is not easy to generate circuit breakage and residual copper; the current that the stake board that charges passes through is great, and voltage is higher. Solder resists are provided on the upper end of the first copper layer 1 and the lower end of the fourth copper layer 4. The solder resist layer is made of polyimide.

The copper-clad laminate further comprises a blind hole, wherein the blind hole is communicated with the first copper layer 1, the second copper layer 21, the insulating layer 22, the third copper layer 23 and the fourth copper layer 4; the inner wall of the blind hole is provided with a copper plating layer, and the first copper layer 1, the second copper layer 21, the third copper layer 23 and the fourth copper layer 4 are electrically connected through the copper plating layer.

The middle component 2 is an FR4 board, and the thickness of the FR4 board is 1-5 mm; the thickness of the second copper layer 21 is 0.2-0.55 mm; the thickness of the third copper layer 23 is 0.2-0.55 mm, and the first copper layer 1 and the fourth copper layer 4 are made of copper bar materials. Preferably, the thickness of the FR4 board is 1-3.5 mm; the thickness of the second copper layer 21 is 0.2-0.4 mm; the thickness of the third copper layer 23 is 0.2-0.4 mm, such as 0.35 mm. FR4 board thickness selection wide range, the stake board that charges need be high pressure resistant, and insulating layer 22 thickness will be a little bit, and many and heavy of electronic components behind the SMT, thick plate non-deformable damage. FR4 belongs to epoxy resin glass material, has higher mechanical property and dielectric property, better heat resistance and moisture resistance, and good machinability, and the sheet material is easy to process, with low costs, the thickness selection range is wide, is convenient for laminating, and is widely applied to multilayer PCB board. FR4 board, upper and lower pressfitting copper bar are selected for use, and the copper-clad plate has great heat dispersion.

The copper-clad plate is provided with a positioning hole, and the copper-clad plate can be connected with a corresponding positioning piece by using the positioning hole in the manufacturing process or the installation of electric appliances.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

The above embodiments are only used for illustrating the technical solutions of the present invention and are not limited thereto, and any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be covered by the scope of the technical solutions of the present invention.

Claims (9)

1. A copper-clad plate is characterized in that: the copper-clad laminate comprises a middle component (2), wherein the middle component (2) comprises a second copper layer (21), an insulating layer (22) and a third copper layer (23) which are sequentially stacked from top to bottom; the upper end of the second copper layer (21) is connected with the first copper layer (1), and the lower end of the third copper layer (23) is connected with the fourth copper layer (4).

2. The copper-clad plate according to claim 1, characterized in that: the sum of the thicknesses of the first copper layer (1) and the second copper layer (21) is 1.6-5 mm; the sum of the thicknesses of the third copper layer (23) and the fourth copper layer (4) is 1.6-5 mm.

3. The copper-clad plate according to claim 2, characterized in that: the thickness of the middle component (2) is 1.5-5.5 mm; the thickness of the second copper layer (21) is 0.2-0.55 mm; the thickness of the third copper layer (23) is 0.2 to 0.55 mm.

4. The copper-clad plate according to claim 2, characterized in that: the sum of the thicknesses of the first copper layer (1) and the second copper layer (21) is 3.5-4.5 mm; the sum of the thicknesses of the third copper layer (23) and the fourth copper layer (4) is 3.5-4.5 mm.

5. The copper-clad plate according to claim 4, wherein: the sum of the thicknesses of the first copper layer (1) and the second copper layer (21) is 3.9-4.1 mm; the sum of the thicknesses of the third copper layer (23) and the fourth copper layer (4) is 3.9-4.1 mm.

6. The copper-clad plate according to any one of claims 1 to 5, characterized in that: the lower end of the first copper layer (1) and the upper end of the second copper layer (21) are both provided with a first browning layer, and the first copper layer (1) is connected with the second copper layer (21) through the first browning layer; the lower end of the third copper layer (23) and the upper end of the fourth copper layer (4) are both provided with second browning layers, and the third copper layer (23) is connected with the fourth copper layer (4) through the second browning layers.

7. The copper-clad plate according to claim 6, wherein: the thickness of the first browning layer and the second browning layer is 0.5-6 um.

8. The copper-clad plate according to any one of claims 1 to 5, characterized in that: the copper-clad plate is provided with a positioning hole.

9. The copper-clad plate according to any one of claims 1 to 5, characterized in that: and solder masks are arranged at the upper end of the first copper layer and the lower end of the fourth copper layer.