CN209747483U - Novel silicon chip coating device - Google Patents

Abstract

The utility model discloses a novel source is scribbled to silicon chip device, including base, liquid reserve tank, brush liquid roller, the base is the rectangular bodily form, the upper left end welding of base has the liquid reserve tank, the brush liquid roller has been placed in the liquid reserve tank, the right side of base is equipped with the silicon chip standing groove, the silicon chip standing groove comprises circular arc groove and rectangular channel jointly, the diameter of circular arc groove equals with the diameter size of silicon chip, and the degree of depth of circular arc groove equals with the thickness size of silicon chip, the degree of depth of rectangular channel is 1 ~ 1.5cm deeper than the degree of depth of circular arc groove, the welding has the baffle on the base of first row silicon chip standing groove and second row silicon chip standing groove symmetrical line department, the brush liquid roller comprises handle, support and brush roller. The utility model discloses scribble source device simple structure, convenient operation is equipped with the brush liquid roller, once can scribble the source with the silicon chip in a plurality of silicon chip standing grooves, has not only improved and has scribbled source efficiency, can guarantee moreover to scribble the homogeneity in source, and the practicality is strong.

Description

Novel silicon chip coating device

Technical Field

The utility model belongs to the technical field of the source device technique is scribbled to the silicon chip and specifically relates to a novel source device is scribbled to silicon chip.

background

In the production process of semiconductor wafers, a blank surface coating source is needed before boron diffusion production, operations such as coating, baking, collecting and loading are needed before cleaned wafers are subjected to boron diffusion, at present, the coating source is mainly formed by that workers dip a diffusion source by using a brush pen and then fully coat the silicon wafers, the randomness of manually coating the source by using the brush pen is high, the control is not easy, the uniformity of the boron source on the surfaces of the wafers is influenced, the production efficiency is low, and the quality is uncontrollable.

SUMMERY OF THE UTILITY MODEL

in order to overcome the defects in the prior art, the utility model provides a novel silicon wafer coating source device.

The utility model provides a technical scheme that its technical problem adopted is: a novel silicon wafer source coating device comprises a base, a liquid storage tank and a liquid brushing roller, wherein the base is in a rectangular shape, anti-skidding foot pads are arranged at four corners of the lower end of the base, the liquid storage tank is welded at the upper left end of the base, a square groove is formed in the left side of the liquid storage tank, the liquid brushing roller is placed in the liquid storage tank, a silicon wafer placing groove is formed in the right side of the base and consists of two rows, namely a first row of silicon wafer placing groove and a second row of silicon wafer placing groove, the first row of silicon wafer placing groove and the second row of silicon wafer placing groove are symmetrically arranged, the silicon wafer placing groove consists of an arc-shaped groove and a rectangular groove, the diameter of the arc-shaped groove is equal to the diameter of a silicon wafer, the depth of the arc-shaped groove is equal to the thickness of the silicon wafer, the depth of the rectangular groove is 1-1.5 cm deeper than that of the arc-shaped groove, and baffles are welded on the base at symmetrical lines, the liquid brushing roller is composed of a handle, a support and a brush roller, the handle is welded in the middle of the support, the brush roller comprises a first brush roller and a second brush roller, the distance between the first brush roller and the second brush roller is slightly larger than the thickness of a baffle plate, and the first brush roller and the second brush roller are respectively fixed at two ends of the support.

The novel silicon wafer source coating device is characterized in that 5-10 silicon wafer placing grooves are arranged in each row at equal intervals.

The novel silicon wafer source coating device is characterized in that the brush roll is a brush roll.

Compared with the prior art the utility model has the advantages of it is following and outstanding effect:

The beneficial effects of the utility model are that, the utility model discloses scribble source device simple structure, convenient operation is equipped with the brush liquid roller, once can scribble the source with the silicon chip in a plurality of silicon chip standing grooves, has not only improved and has scribbled source efficiency, can guarantee moreover to scribble the homogeneity in source, and the practicality is strong.

Drawings

The present invention will be further explained with reference to the drawings and examples.

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a front view of the present invention;

Fig. 3 is a top view of the present invention.

In the figure, 1, a base, 2, an anti-skidding foot pad, 3, a liquid storage tank, 4, a handle, 5, a square groove, 6, a support, 7, a first brush roller, 8, a second brush roller, 9, a baffle, 10, a rectangular groove, 11, an arc-shaped groove, 12, a first row of silicon wafer placing grooves and 13, a second row of silicon wafer placing grooves are arranged.

Detailed Description

In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.

[ example 1 ]

A novel silicon wafer source coating device comprises a base 1, a liquid storage tank 3 and a liquid brushing roller, wherein the base 1 is rectangular, anti-skidding foot pads 2 are arranged at four corners of the lower end of the base 1, the liquid storage tank 3 is welded at the upper left end of the base 1, a square groove 5 is arranged at the left side of the liquid storage tank 3, the liquid brushing roller is placed in the liquid storage tank 3, a silicon wafer placing groove is arranged at the right side of the base 1 and consists of two rows, namely a first row of silicon wafer placing groove 12 and a second row of silicon wafer placing groove 13, the first row of silicon wafer placing groove 12 and the second row of silicon wafer placing groove 13 are symmetrically arranged, the silicon wafer placing groove consists of an arc-shaped groove 11 and a rectangular groove 10, the diameter of the arc-shaped groove 11 is equal to the diameter of a silicon wafer, the depth of the arc-shaped groove 11 is equal to the thickness of the silicon wafer, the depth of the rectangular groove 10 is 1-1.5 cm deeper than the, baffle 9 is welded on base 1 at the symmetry line of first row of silicon chip standing groove 12 and second row of silicon chip standing groove 13, the brush liquid roller comprises handle 4, support 6 and brush roll, handle 4 welds the middle part at support 6, the brush roll includes first brush roll 7 and second brush roll 8, and the distance between first brush roll 7 and the second brush roll 8 is slightly greater than the thickness of baffle 9, first brush roll 7 and second brush roll 8 are fixed respectively at the both ends of support 6.

Furthermore, 6 silicon wafer placing grooves in each row are arranged at equal intervals.

Further, the brush roller is a brush roller.

The utility model discloses the during operation, at first pour into the right amount into in the liquid reserve tank 3 and scribble source and use liquid, place the silicon chip in the circular arc groove 11 of first row silicon chip standing groove 12 and second row silicon chip standing groove 13, the brush liquid roller is held to the hand, make first brush roll 7 and second brush roll 8 be stained with and get the right amount and scribble source liquid, then with the space card in the middle of first brush roll 7 and second brush roll 8 on baffle 9, make the brush roll paste at base 1's upper surface, pulling handle 4, make the source liquid of scribbling on first brush roll 7 and the second brush roll 8 evenly scribble on the silicon chip surface, then get the silicon chip of scribbling from rectangular channel 10 department clamp with tweezers, put in suitable position, carry out operations such as drying, utilize the rag to wipe the base 1 upper surface clean at last, continue next round silicon chip and scribble the source.

The above embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and the protection scope of the present invention is defined by the claims. Various modifications and equivalents of the invention can be made by those skilled in the art within the spirit and scope of the invention, and such modifications and equivalents should also be considered as falling within the scope of the invention.

Claims (3)

1. The utility model provides a novel source is scribbled to silicon chip device, includes base (1), liquid reserve tank (3), brush liquid roller, its characterized in that: the base (1) is rectangular, anti-skidding foot pads (2) are arranged at four corners of the lower end of the base (1), a liquid storage box (3) is welded at the upper left end of the base (1), a square groove (5) is arranged at the left side of the liquid storage box (3), liquid brushing rollers are placed in the liquid storage box (3), a silicon wafer placing groove is arranged at the right side of the base (1) and consists of two rows, namely a first row of silicon wafer placing groove (12) and a second row of silicon wafer placing groove (13), the first row of silicon wafer placing groove (12) and the second row of silicon wafer placing groove (13) are symmetrically arranged, the silicon wafer placing groove consists of an arc-shaped groove (11) and a rectangular groove (10), the diameter of the arc-shaped groove (11) is equal to the diameter of a silicon wafer, the depth of the arc-shaped groove (11) is equal to the thickness of the silicon wafer, and the depth of the rectangular groove (10) is 1-1.5 cm deeper than the depth of the arc-shaped groove, the silicon wafer cleaning device is characterized in that a baffle (9) is welded on a base (1) at the symmetrical line of a first row of silicon wafer placing grooves (12) and a second row of silicon wafer placing grooves (13), a liquid brushing roller is composed of a handle (4), a support (6) and a brush roller, the handle (4) is welded in the middle of the support (6), the brush roller comprises a first brush roller (7) and a second brush roller (8), the distance between the first brush roller (7) and the second brush roller (8) is slightly larger than the thickness of the baffle (9), and the first brush roller (7) and the second brush roller (8) are respectively fixed at two ends of the support (6).

2. The novel silicon wafer coating source device according to claim 1, wherein 5-10 silicon wafer placing grooves are arranged in each row at equal intervals.

3. The novel silicon wafer coating source device of claim 1, wherein the brush roller is a brush roller.