CN209746455U - Chip for computer display screen - Google Patents
Chip for computer display screen Download PDFInfo
- Publication number
- CN209746455U CN209746455U CN201920775310.9U CN201920775310U CN209746455U CN 209746455 U CN209746455 U CN 209746455U CN 201920775310 U CN201920775310 U CN 201920775310U CN 209746455 U CN209746455 U CN 209746455U
- Authority
- CN
- China
- Prior art keywords
- chip
- irregular
- frame
- carrier
- chip frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
the utility model discloses a chip for computer display screen, including main chip, third irregular chip frame, second irregular chip frame, first irregular chip frame and chip base, main chip below is equipped with first irregular chip frame, the below of first irregular chip frame is equipped with second irregular chip frame, the lower extreme of second irregular chip frame is equipped with third irregular chip frame, the below of third irregular chip frame is equipped with the chip base, third irregular chip frame includes carrier, pin, lead wire, weld pad, sculpture circuit and thermistor, the surface covering of carrier has the sculpture circuit. This chip piles up the irregular support body that forms the middle part fretwork through the mutual overlap of irregular chip frame, can shorten the stroke between the sculpture circuit, improves signal transmission's access time, and because the crisscross clearance of having a large amount of fretworks between the chip frame that overlaps, can high efficiency dispel the heat, improves the electrical property function.
Description
Technical Field
The utility model relates to a display screen chip technical field especially relates to a chip for computer display screen.
Background
Computer displays are also commonly referred to as computer monitors or computer screens. The common multi-chip packaging structure adopts a side-by-side multi-chip packaging structure, and more than two chips are arranged side by side on a main mounting surface of a substrate. The connection between the chip and the conductive traces on the substrate is typically made by wire bonding. However, since the area of the substrate increases with the number of chips, the packaging cost of the side-by-side multi-chip package structure increases. The volume of the whole circuit is reduced, the electrical property function is improved, the heat dissipation between circuit resistors is increased, and in addition, the length of a connecting circuit of a front end and a back end welding spot of the existing planar integrated circuit is long, so that the signal delay and the access time are reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip for computer display screen possesses that the heat dissipation is fast, and the transmission is fast characteristics, has solved the problem among the prior art.
in order to achieve the above object, the utility model provides a following technical scheme: a chip for a computer display screen comprises a main chip, a third irregular chip frame, a second irregular chip frame, a first irregular chip frame and a chip base, wherein the first irregular chip frame is arranged below a flat main chip, the second irregular chip frame in an I shape is arranged below the first irregular chip frame, the third irregular chip frame is arranged at the lower end of the second irregular chip frame, the chip base is arranged below the third irregular chip frame, the third irregular chip frame comprises a carrier, pins, leads, a welding pad, an etching circuit and a thermistor, the pins are arranged on the side surface of the carrier, the leads are connected with the leads, the surface of the carrier is covered with the etching circuit, the etching circuit is connected with the thermistor, the welding pad is connected with the two ends of the etching circuit, and the second irregular chip frame is electrically connected with the third irregular chip frame through the etching circuit, the chip comprises a first irregular chip frame, a second irregular chip frame, a third irregular chip frame and a supporting foot frame, wherein the second irregular chip frame is electrically connected with the first irregular chip frame through an etching circuit, the lower end of the third irregular chip frame is connected with a chip base, the chip base comprises a connecting carrier, supporting feet and a supporting foot frame, the lower end of the third irregular chip frame is provided with two connecting carriers which are parallel to each other, the lower end of each connecting carrier is connected with the corresponding supporting foot, and the lower end of each supporting foot is fixedly.
Preferably, the carrier consists of a longitudinal carrier, a transverse carrier and a vertical carrier, the longitudinal carrier, the transverse carrier and the vertical carrier are all vertical to each other, and an arc-shaped groove is formed at the joint of the longitudinal carrier and the transverse carrier.
Preferably, the main chip is electrically connected with a display screen.
Preferably, the first irregular chip frame, the second irregular chip frame and the third irregular chip frame are of an integral structure.
Compared with the prior art, the beneficial effects of the utility model are as follows:
The utility model discloses a chip for computer display screen, pile up the irregular support body that forms the middle part fretwork through the mutual overlap of anomalous chip frame, each surface of support body all can the sculpture have integrated circuit, two chip framves that are parallel to each other can shorten the stroke between the sculpture circuit through perpendicular carrier, improve signal transmission's access time, and because the clearance of having a large amount of fretworks between the crisscross chip frame that overlaps, can place resistance element etc. that have the volume in this clearance, the volume that reduces the chip can also effectively protect the component, and clearance between the chip frame can the high efficiency heat dissipation, improve the electrical property function.
Drawings
FIG. 1 is an assembly view of the present invention;
Fig. 2 is an exploded view of the present invention;
FIG. 3 is a connection diagram of a first irregular chip frame and a second irregular chip frame according to the present invention;
FIG. 4 is a diagram of the structure of the chip base of the present invention;
Fig. 5 is a third irregular chip frame structure diagram of the present invention.
In the figure: 1. a first irregular chip holder; 2. a second irregular chip holder; 3. a third irregular chip carrier; 31. a carrier; 32. a pin; 33. a lead wire; 34. a pad; 35. etching the circuit; 36. a thermistor; 37. an arc-shaped slot; 4. a main chip; 5. a chip base; 51. connecting a carrier; 52. a support leg; 53. a foot support.
Detailed Description
the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a chip for a computer display screen comprises a main chip 4, a third irregular chip frame 3, a second irregular chip frame 2, a first irregular chip frame 1 and a chip base 5, wherein the first irregular chip frame 1 is arranged below a flat-plate-shaped main chip 4, the main chip 4 is electrically connected with a display screen, the second irregular chip frame 2 in an I shape is arranged below the first irregular chip frame 1, the third irregular chip frame 3 is arranged at the lower end of the second irregular chip frame 2, the first irregular chip frame 1, the second irregular chip frame 2 and the third irregular chip frame 3 are in an integral structure, the chip base 5 is arranged below the third irregular chip frame 3, the third irregular chip frame 3 is electrically connected with the second irregular chip frame 2 through an etching circuit 35, the second irregular chip frame 2 is electrically connected with the first irregular frame 1 through the etching circuit 35, the lower extreme of third irregular chip frame 3 is connected with chip base 5, and chip base 5 is equipped with two connection carrier 51 that are parallel to each other including connecting carrier 51, stabilizer blade 52 and foot rest 53, the lower extreme of third irregular chip, and the lower extreme of connecting carrier 51 is connected with stabilizer blade 52, and the lower extreme fixedly connected with foot rest 53 of stabilizer blade 52.
Referring to fig. 5, the third irregular chip frame 3 includes a carrier 31, pins 32, leads 33, a bonding pad 34, an etching circuit 35 and a thermistor 36, the carrier 31 is composed of a longitudinal carrier, a transverse carrier and a vertical carrier, the longitudinal carrier, the transverse carrier and the vertical carrier are all perpendicular to each other, an arc-shaped groove 37 is formed at a joint of the longitudinal carrier and the transverse carrier, the pins 32 are arranged on a side surface of the carrier 31, the leads 33 are connected at the pins 32, the surface of the carrier 31 is covered with the etching circuit 35, the etching circuit 35 is connected with the thermistor 36, and the bonding pad 34 is connected at two ends of the etching circuit 35.
In summary, the following steps: the utility model discloses a chip for computer display screen, pile up the irregular support body that forms the middle part fretwork through the mutual overlap of anomalous chip frame, each surface of support body all can the sculpture have integrated circuit, the stroke between sculpture circuit 35 can be shortened through perpendicular carrier 31 to two chip frames that are parallel to each other, improve signal transmission's access time, and because the clearance of having a large amount of fretworks between the crisscross chip frame that overlaps, can place resistance element etc. that have the volume in this clearance, the volume that reduces the chip can also effectively protect the component, and clearance between the chip frame can the high efficiency heat dissipation, improve the electrical property function.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a chip for computer display screen, includes main chip (4), third irregular chip frame (3), second irregular chip frame (2), first irregular chip frame (1) and chip base (5), its characterized in that: the chip carrier is characterized in that a first irregular chip frame (1) is arranged below the flat main chip (4), a second irregular chip frame (2) in an I shape is arranged below the first irregular chip frame (1), a third irregular chip frame (3) is arranged at the lower end of the second irregular chip frame (2), a chip base (5) is arranged below the third irregular chip frame (3), the third irregular chip frame (3) comprises a carrier (31), pins (32), a lead (33), a welding pad (34), an etching circuit (35) and a thermistor (36), the pins (32) are arranged on the side surface of the carrier (31), the lead (33) is connected to the pins (32), the etching circuit (35) covers the surface of the carrier (31), the etching circuit (35) is connected with the thermistor (36), the welding pads (34) are connected to the two ends of the etching circuit (35), third irregular chip frame (3) have second irregular chip frame (2) through etching circuit (35) electric connection, second irregular chip frame (2) have first irregular chip frame (1) through etching circuit (35) electric connection, the lower extreme of third irregular chip frame (3) is connected with chip base (5), chip base (5) are including connection carrier (51), stabilizer blade (52) and foot rest (53), the lower extreme of third irregular chip is equipped with two connection carrier (51) that are parallel to each other, the lower extreme of connection carrier (51) is connected with stabilizer blade (52), the lower extreme fixedly connected with foot rest (53) of stabilizer blade (52).
2. the chip for the computer display screen according to claim 1, wherein: the carrier (31) consists of a longitudinal carrier, a transverse carrier and a vertical carrier, the longitudinal carrier, the transverse carrier and the vertical carrier are mutually vertical, and an arc-shaped groove (37) is formed at the joint of the longitudinal carrier and the transverse carrier.
3. the chip for the computer display screen according to claim 1, wherein: the main chip (4) is electrically connected with a display screen.
4. The chip for the computer display screen according to claim 1, wherein: the chip rack is characterized in that the first irregular chip rack (1), the second irregular chip rack (2) and the third irregular chip rack (3) are of an integral structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920775310.9U CN209746455U (en) | 2019-05-25 | 2019-05-25 | Chip for computer display screen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920775310.9U CN209746455U (en) | 2019-05-25 | 2019-05-25 | Chip for computer display screen |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209746455U true CN209746455U (en) | 2019-12-06 |
Family
ID=68723099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920775310.9U Active CN209746455U (en) | 2019-05-25 | 2019-05-25 | Chip for computer display screen |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209746455U (en) |
-
2019
- 2019-05-25 CN CN201920775310.9U patent/CN209746455U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4190279B2 (en) | Carrier-based electronic module | |
EP1911092B1 (en) | Integrated circuit packaging | |
US20140238729A1 (en) | Printed circuit board structure with heat dissipation function | |
CN110337178B (en) | Circuit board assembly and electronic equipment | |
US5444294A (en) | Semiconductor device of vertical surface-mounting type | |
JP6695156B2 (en) | Resin-sealed semiconductor device | |
CN211743142U (en) | Double-chip heat-conducting patch diode | |
CN211719597U (en) | SMD diode with heat release short circuit prevention structure | |
CN209746455U (en) | Chip for computer display screen | |
CN211184421U (en) | Printed circuit board and semiconductor device | |
JP3225369U (en) | Semiconductor device package | |
CN211719589U (en) | Anti-cracking patch type diode | |
JPH0982880A (en) | Lead frame and semiconductor device | |
CN110856338B (en) | Circuit board assembly and electronic equipment | |
CN216698341U (en) | Schottky diode mounted through screw | |
CN217641307U (en) | Packaging structure of SMD SO36J semiconductor power chip | |
CN217822784U (en) | Chip packaging structure and power chip | |
CN216624253U (en) | LQFP (low-profile quad flat package) packaging chip | |
CN215266286U (en) | High-power heavy current diode encapsulation frame | |
CN210535658U (en) | Improved generation lead frame | |
CN219321343U (en) | Bonding pad structure of chip, chip and electronic equipment | |
CN217588917U (en) | Packaging structure of SMD SOT223 semiconductor chip | |
CN216928547U (en) | CMOS flat panel detector COB packaging structure based on flat substrate | |
CN210429802U (en) | SIP module and electronic equipment | |
CN218351460U (en) | Chip packaging frame and chip assembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |