CN209733701U - Food processor - Google Patents

Abstract

The application provides a cooking machine. This cooking machine includes: a cup assembly including a food material receiving cavity; and the cooling mechanism comprises a heat exchange shell and a semiconductor refrigeration sheet packaged in the heat exchange shell, and the heat exchange shell can be selectively inserted into the food material accommodating cavity. After the semiconductor refrigeration piece is electrified, the heat transmitted to the heat exchange shell by the food material can be absorbed, so that the food material in the food material accommodating cavity can be cooled, and the time for cooling the food material is shortened.

Description

Food processor

Technical Field

the application relates to the technical field of household appliances, in particular to a food processor.

Background

most of existing food processors have a heating function, such as a soybean milk machine, a wall breaking machine and the like, and the cooked food materials are too high in temperature to be eaten immediately and need to be cooled for a long time.

SUMMERY OF THE UTILITY MODEL

in view of this, the present application provides a food processor, which can cool food materials quickly.

Specifically, the method is realized through the following technical scheme:

A food processor, comprising:

A cup assembly including a food material receiving cavity; and

and the cooling mechanism comprises a heat exchange shell and a semiconductor refrigeration sheet packaged in the heat exchange shell, and the heat exchange shell is inserted in the food material accommodating cavity.

Optionally, the semiconductor refrigeration piece includes a heat absorption surface, and the heat absorption surface is attached to the inner wall of the heat exchange shell.

Optionally, the cooling mechanism further comprises a heat dissipation member, the semiconductor refrigeration sheet comprises a heat dissipation surface, and the heat dissipation surface is in contact with the heat dissipation member.

Optionally, the cooling mechanism includes a fan and an air duct, and the heat sink and the fan are disposed in the air duct.

optionally, the air duct includes an air inlet channel and an air exhaust channel that are communicated with each other, the air duct is bent at a position where the air inlet channel is communicated with the air exhaust channel, and the heat dissipation member is disposed at a position where the air inlet channel is communicated with the air exhaust channel.

Optionally, the heat exchange shell is of an integral structure, or the heat exchange shell comprises a first shell and a second shell of a split structure, and the first shell is connected with the second shell in a sealing manner.

Optionally, the cooling mechanism further comprises a housing and an electrically conductive contact, the housing being connected to the heat exchange housing, the cup assembly comprising an electrically conductive terminal,

The conductive contact is movably arranged relative to the shell and is arranged to be in contact with the conductive terminal in a movable stroke so as to supply power to the semiconductor refrigeration piece.

Optionally, the cooling mechanism further includes a limiting member, and the limiting member is configured to limit the conductive contact from deviating in other directions than the moving stroke direction of the conductive contact.

Optionally, the housing is provided with a limiting hole, the limiting member is movably disposed on the housing and connected with the conductive contact,

The limiting piece has a movable stroke extending into and out of the limiting hole under the action of external force, and in the movable stroke, the limiting piece drives the conductive contact to be contacted with the conductive terminal,

The annular inner wall of the limiting hole is in limiting fit with the limiting piece so as to limit the deviation of the conductive contact in other directions except the moving stroke direction of the conductive contact.

Optionally, the cooling mechanism further comprises a contact holder for holding a contact force between the conductive contact and the conductive terminal.

Optionally, the contact holder includes a tapered compression spring, and the conductive contact is held in contact with the conductive terminal by an elastic force of the tapered compression spring.

The technical scheme provided by the application can achieve the following beneficial effects:

The application provides a food processer, including cooling body, wherein, the heat exchange shell sets up in eating material holding intracavity, can with eat material direct contact, semiconductor refrigeration piece attached in the inner wall of heat exchange shell, semiconductor refrigeration piece circular telegram back, the heat absorption surface can absorb the heat of transferring to the heat exchange shell by eating the material to can cool off eating the material of eating material holding intracavity, shortened and eat the required time of material cooling. And, cooling body independent setting does not occupy the space of cooking machine itself, makes the cooking machine both increased the refrigeration function and satisfies organism still small and exquisite focus itself, has improved user experience.

Drawings

Fig. 1 is a schematic view of a food processor according to an exemplary embodiment of the present application;

FIG. 2 is an exploded view of the lid and cooling mechanism of the food processor shown in an exemplary embodiment of the present application;

FIG. 3 is an exploded view of a cooling mechanism shown in an exemplary embodiment of the present application;

FIG. 4 is a cross-sectional view of the heat exchange shell, the thermally conductive coating, the semiconductor chilling plate and its heat sink attachment shown in an exemplary embodiment of the present application;

FIG. 5 is a schematic view of an exemplary embodiment of the present application showing a lid and a portion of a cooling mechanism removed;

FIG. 6 is a schematic view of a cooling mechanism with portions broken away shown in an exemplary embodiment of the present application;

FIG. 7 is a schematic view of a conductive contact shown in an exemplary embodiment of the present application in electrical contact with a conductive terminal;

FIG. 8 is a schematic view of a conductive contact shown in another exemplary embodiment of the present application in electrical contact with a conductive terminal;

fig. 9 is an exploded view of a cup cover of the food processor according to an exemplary embodiment of the present application.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the description and claims of this application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "a number" means two or more. Unless otherwise specified, "front", "back", "lower" and/or "upper", "top", "bottom", and the like are for ease of description only and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

Referring to fig. 1, fig. 1 shows a schematic diagram of a food processor according to an exemplary embodiment of the present application. The food processor 10 of the embodiment of the present application includes a main body 11 and a cup assembly 12, wherein the cup assembly 12 is detachably assembled to the main body 11, and the two can be separated from each other if necessary, but is not limited thereto, and the cup assembly 12 and the main body 11 can also be fixedly disposed.

The cup assembly 12 comprises a cup body 120 and a cup cover 122, the cup cover 122 covers the opening of the cup body 120, and a sealing ring can be arranged between the cup body 120 and the cup cover 122 to prevent food materials from overflowing. Cup 120 is including being used for holding the edible material holding chamber of eating the material, and the bottom of cup 120 can be provided with the heating plate, and the heating plate can heat the edible material of eating the material holding intracavity after the circular telegram.

Referring to fig. 2, the food processor 10 further includes a cooling mechanism 14, and the cooling mechanism 14 can rapidly cool the cooked food material to shorten the time required for cooling the food material. In one embodiment, the cooling mechanism 14 may be disposed on the cup body 120 and extend into the food receiving cavity through a hole in the cup body 120. In this embodiment, the cooling mechanism 14 is disposed on the cup lid 122, the cup lid 122 is provided with a through hole 1220, and the cooling mechanism 14 is inserted into the through hole 1220 and contacts with the food material in the food material accommodating cavity.

The cooling mechanism 14 is removably connected to the cap 122 in a manner including, but not limited to, snap-fit. In addition, for the cylindrical matching structure, a limiting structure can be arranged between the cooling mechanism 14 and the cup cover 122 for limiting the rotational displacement between the two. For example, a protrusion may be provided on one of the cooling mechanism 14 and the lid 122, and a groove may be provided on the other, the protrusion and the groove cooperating to limit the relative rotational displacement therebetween.

Referring to fig. 3, fig. 3 illustrates an exploded view of a cooling mechanism according to an exemplary embodiment of the present application.

The cooling mechanism 14 comprises a housing 140 and a heat exchange shell 142, wherein the housing 140 comprises an upper body 1400 and an upper cover 1402, the upper cover 1402 covers the mouth of the upper end of the upper body 1400, and a containing cavity is formed inside. A buffer gasket 1401 is arranged between the big body 1400 and the upper cover 1402, and the buffer gasket 1401 can isolate the big body 1400 from the upper cover 1402 to buffer the vibration generated when the big body 1400 and the upper cover 1402 are in direct contact with each other and reduce the noise.

The heat exchange case 142 is coupled to the lower end of the large body 1400. In one embodiment, the heat exchange shell 142 may be a one-piece structure, i.e., the heat exchange shell 142 is integrally formed. In another embodiment, the heat exchange shell 142 includes a first shell 1420 and a second shell 1422 which are separate bodies, and the first shell 1420 and the second shell 1422 may be welded, bolted, or clamped. To increase the sealing performance, a sealing ring 1421 may be provided at a portion where the first housing 1420 is joined to the second housing 1422. In addition, the heat exchange case 142 of an integrated structure is more convenient to clean.

A sealing ring 1403 is sleeved at the lower end of the large body 1400, and the sealing ring 1403 can seal a gap between the cooling mechanism 14 and the cup cover 122 to prevent impurities from entering the cup body 120.

The heat exchange shell 142 can be selectively inserted into the food material accommodating cavity and directly contact with the food material in the food material accommodating cavity, where the term "selectively" refers to that the heat exchange shell 142 is inserted into the food material accommodating cavity when the food material needs to be cooled, and the heat exchange shell 142 is not inserted into the food material accommodating cavity when the food material does not need to be cooled.

be provided with semiconductor refrigeration piece 144 in the heat exchange shell 142, semiconductor refrigeration piece 144 includes heat-absorbing surface 144a and radiating surface 144b, and after semiconductor refrigeration piece 144 circular telegram, heat that edible material transmitted to heat exchange shell 142 can be absorbed to heat-absorbing surface 144a to lose heat through radiating surface 144b, thereby can cool off edible material, shorten the required time of edible material cooling. Moreover, the cooling mechanism 14 is independently arranged without occupying the space of the food processor 10, so that the food processor 10 not only has an additional cooling function, but also satisfies the hot spot of the small body, and the user experience is improved.

Further, in order to improve heat transfer efficiency, the heat absorbing surface 144a of the semiconductor chilling plate 144 may be attached to the inner wall of the heat exchange case 142, thereby allowing the semiconductor chilling plate 144 and the heat exchange case 142 to be in direct contact.

Referring to fig. 4, the inner wall of the heat exchange shell 142 may be provided with a heat conductive coating 142a, for example, a heat conductive silicone layer, and the heat conductive coating 142a may fill a gap between the heat absorbing surface 144a of the semiconductor cooling plate 144 and the heat exchange shell 142, so as to ensure effective heat transfer between the heat absorbing surface and the heat exchange shell, and improve the heat absorbing efficiency of the heat absorbing surface.

the heat dissipation surface 144b of the semiconductor cooling plate 144 is used for releasing heat, and in the present embodiment, in order to achieve rapid heat dissipation, the cooling mechanism 14 further includes a heat dissipation member 146, and the heat dissipation surface 144b is in contact with the heat dissipation member 146, so that the energy absorbed by the heat absorption surface 144a can be dissipated through the heat dissipation surface 144b and the heat dissipation member 146.

The number of the semiconductor refrigeration pieces 144 can be selected according to actual requirements, in this embodiment, two semiconductor refrigeration pieces 144 are provided and are both attached to the inner wall of the heat exchange shell 142.

With continued reference to fig. 3, the heat dissipating member 146 includes a base 1460 and a plurality of heat dissipating ribs 1462 disposed on the base 1460. The base 1460 is provided with a connecting hole, and a bolt is screwed in the connecting hole to fix the heat sink 146 to the heat exchange shell 142. The semiconductor cooling plate 144 is press-fixed between the heat radiating member 146 and the heat exchange case 142 by a fastening force of a bolt, and a heat radiating surface of the semiconductor cooling plate 144 is in contact with the base 1460.

in some embodiments, a portion of the heat dissipating ribs 1462 of the heat dissipating member 146 may be exposed outside the cooling mechanism 14, so as to dissipate heat through air circulation from the outside. In this embodiment, the cooling mechanism 14 includes an air duct, and the heat sink 146 is disposed in the air duct to dissipate heat through air circulation in the air duct.

specifically, the cooling mechanism 14 further includes an air duct partition 143, a fan 145, a ventilation pipe 147, and an elongated ventilation pipe 149, which are disposed in a cavity defined by the main body 1400 and the upper cover 1402. The air duct partition 143, the ventilation pipe 147 and the lengthened ventilation pipe 149 divide the interior space of the cooling mechanism 14 into an air intake channel S1 and an air exhaust channel S2 (see fig. 5), and the air intake channel S1 and the air exhaust channel S2 are communicated to form an air duct together. The fan 145 is disposed in the air duct, for example, in the air exhaust channel S2, and the fan 145 can accelerate the circulation of air in the air duct, so that the external cold air enters from the air intake channel S1 and carries heat out from the air exhaust channel S2, so as to accelerate the heat dissipation of the heat dissipation member 146, and finally realize the heat dissipation of the semiconductor cooling fins 144.

The heat dissipation member 146 is disposed in the air duct and disposed at a position where the air inlet channel S1 and the air outlet channel S2 are communicated, where the air duct is bent, the wind direction in the air duct is changed, and the air flow has a multi-directional characteristic, so that the heat dissipation member 146 can be sufficiently contacted with the cold air, and more heat on the heat dissipation member 146 can be taken away.

This application is not limited to the quantity that sets up of heat sink 146, can select the setting according to the size in wind channel, and in this embodiment, heat sink 146 sets up to two sets of. The position of the heat sink 146 is not limited to the above, and may be provided in the discharge duct S2, for example.

In the embodiment shown in fig. 3, the air duct partition 143 may be fastened to the rib 1400e by a screw, the upper end of the ventilation pipe 147 is hung to the lower end of the large body 1400, the lower end of the ventilation pipe 147 is clamped to the elongated ventilation pipe 149, and the fan 145 is pressed between the air duct partition 143 and the ventilation pipe 147. Wherein, the fan 145 and the ventilation pipe 147 are respectively in limited fit with the big body 1400 in the circumferential direction. Of course, the connection structure between the above components is not limited thereto.

The air duct partition 143 is connected to a rib 1400e in the main body 1400, the air duct partition 143 includes a plurality of partition ribs 1430, and the partition ribs 1430 and the rib 1400e partition the space in the main body 1400 into a plurality of subspaces. The gaps between both the ventilation pipe 147 and the elongated ventilation pipe 149 and the heat exchange shell 142 form a part of the air supply passage S1, and the inner chambers of the ventilation pipe 147 and the elongated ventilation pipe 149 form a part of the air discharge passage S2.

Referring to fig. 5 and 6, the side of the main body 1400 is provided with a first air inlet hole 1400a, the bottom is provided with a second air inlet hole 1400b, a channel between the first air inlet hole 1400a and the second air inlet hole 1400b and a gap between the ventilation pipe 147 and the elongated ventilation pipe 149 and the heat exchange shell 142 form an air inlet channel S1, and external cold air can enter the air inlet channel S1 through the first air inlet hole 1400a and flow into the position of the heat dissipation member 146. The channel between the first air inlet hole 1400a and the second air inlet hole 1400b is formed by isolating the convex rib 1400e by the isolating rib 1430.

The upper cover 1402 is provided with a first air outlet hole 1402a, the air duct partition 143 is provided with a second air outlet hole 1432, and the channel between the first air outlet hole 1402a and the second air outlet hole 1432, the inner cavity of the ventilation pipe 147 and the inner cavity of the lengthened ventilation pipe 149 form an exhaust channel S2 together. Therefore, after the cold air enters the air inlet channel S1, the cold air can be discharged through the air outlet channel S2 with the heat carried by the fan 145. The channel between the first air outlet 1402a and the second air outlet 1432 can be isolated from the rib 1400e by the isolating rib 1430.

further, the cooling mechanism 14 includes a natural exhaust passage S3, that is, when the air pressure in the cup 120 is increased, the hot air can be naturally exhausted without being forcibly exhausted by the fan. Referring to fig. 6, the upper cover 1402 further has a third air outlet 1402b, the main body 1400 further has a fourth air outlet 1400c, and hot air in the food material accommodating chamber can be exhausted through the fourth air outlet 1400c and the third air outlet 1402 b. It is easy to understand that the channel between the third air outlet 1402b and the fourth air outlet 1400c can also be isolated from the rib 1400e by the isolating rib 1430. It should be noted that when the air pressure in the cup 120 is lower than the external air pressure, the external air may enter the cup 120 through the air inlet/outlet passage S3.

Referring to fig. 3 and 7, the cooling mechanism 14 further includes a conductive contact 148, and the conductive contact 148 is used for electrically connecting with an external conductive terminal to supply power to the semiconductor chilling plate 144.

In one embodiment, the cap 122 includes conductive terminals 1222, and the conductive terminals 1222 are in electrical contact with the conductive contacts 148. The conductive terminal 1222 may be fixed to serve as a stationary contact, and the conductive contact 148 may be movable to serve as a moving contact, or vice versa.

in the embodiment shown in fig. 3, the conductive contacts 148 are movably disposed relative to the body 1400, and the conductive contacts 148 are movable contacts and have a contact stroke in electrical contact with the conductive terminals 1222 and a disengagement stroke in the opposite direction. In fig. 3, the large body 1400 is configured as a cylindrical structure, and the conductive contacts 148 are movable in a radial direction of the large body 1400. During the moving stroke of the conductive contacts 148, the conductive contacts 148 can be electrically contacted with the conductive terminals 1222 to supply power to the semiconductor cooling fins 144. In this arrangement, the movable arrangement of the conductive contacts 148 may increase the flexibility of their own position and may avoid interference with other components during installation.

Further, the cooling mechanism 14 may further include a limiting member 150, and the limiting member 150 may limit the displacement of the conductive contact 148 in other directions than the moving stroke, so as to ensure reliable electrical contact between the conductive contact 148 and the conductive terminal 1222.

In one embodiment, the position-limiting member 150 is movably disposed on the body 1400 and connected to the conductive contact 148. The main body 1400 is provided with a limiting hole 1400d, and the limiting member 150 can extend into and withdraw from the limiting hole 1400d under the action of external force. During the extension stroke, the position-limiting element 150 drives the conductive contact 148 to generate a contact stroke contacting with the conductive terminal 1222, and during the withdrawal stroke, the position-limiting element 150 drives the conductive contact 148 to generate a reverse disengagement stroke.

The stopper 150 is restricted by the annular inner wall of the stopper hole 1400d, so that the stopper 150 has only a movable stroke extending into and out of the stopper hole 1400d, and displacement in other directions deviating from the movable stroke direction is restricted.

When the cooling mechanism 14 is mounted in the through hole 1220, the limiting member 150 can be in a retracted state by an external force, and at this time, the cooling mechanism 14 can be prevented from interfering with the cap 122. The cap 122 has a fitting hole corresponding to the conductive contact 148, and after the cooling mechanism 14 reaches the installation position, the external force is released to make the limiting member 150 extend into the limiting hole 1400d, so that the conductive contact 148 can electrically contact with the conductive terminal 1222.

In other embodiments, the position limiter 150 may be fixed relative to the housing 140, and the conductive contact 148 cooperates with the position limiter 150 during the moving stroke to reduce the offset of the conductive contact 148.

Referring to fig. 3 again, the outer surface of the limiting member 150 is provided with a protrusion 1500, and the protrusion 1500 can increase the friction force during manual operation to prevent slipping. In addition, the surface of the limiting member 150 contacting the annular inner wall of the limiting hole 1400d is provided with a contact protrusion 1502, and the contact protrusion 1502 can reduce the area when contacting the limiting hole 1400d, thereby reducing the friction force.

Further, in order to ensure the reliability of the connection between the conductive contacts 148 and the conductive terminals 1222, the cooling mechanism 14 further includes a contact holder 152, and the contact holder 152 can apply a force to the stopper 150 to maintain the contact force between the conductive contacts 148 and the conductive terminals 1222, so as to ensure the reliability of the electrical connection.

The contact holder 152 may be any component capable of applying a force to the retaining member 150. in this embodiment, the contact holder 152 includes an elastic member. In a specific embodiment, the elastic member includes a conical pressure spring, a small end of the conical pressure spring abuts against the limiting member 150, and a large end of the conical pressure spring abuts against the outer wall of the air duct partition 143. Alternatively, the compression force of the conical compression spring can be selected within the range of 0.5 kg-2.5 kg.

On the other hand, the conical pressure spring can also reduce the occupation of the internal space, because when the conical pressure spring is subjected to pressure, the conical pressure spring can approximately form a plane structure in a limit state, and the occupied space in the axial direction is smaller compared with a cylindrical pressure spring.

In order to further increase the stability of the tapered pressure spring, the limiting member 150 further includes a positioning portion 1504, and the small end of the tapered pressure spring is sleeved outside the positioning portion 1504 to limit the contact position of the tapered pressure spring and the limiting member 150, so as to avoid slipping.

The conductive terminals 1222 may be provided as a spring structure to maintain a reliable contact force with the conductive contacts 148. In the embodiment shown in fig. 7, the conductive terminals 1222 are in electrical contact with the conductive contacts 148 at only one location. Referring to fig. 8, the conductive terminal 1222 may also be provided in a plug-in configuration including a first contact portion 1222a and a second contact portion 1222b, with the conductive contact 148 being plugged between the first contact portion 1222a and the second contact portion 1222b and in electrical contact with the first contact portion 1222a and the second contact portion 1222b, respectively.

Referring to fig. 9, fig. 9 shows an exploded view of a lid of the present application in an exemplary embodiment. In the embodiment shown in fig. 9, the cap 122 includes an upper cap 122a and a lower cap 122b, and the upper cap 122a and the lower cap 122b are detachably connected by, but not limited to, snapping or bolting. The through holes 1220 are respectively opened on the upper cup cover 122a and the lower cup cover 122b, and are concentrically arranged.

The upper cup cover 122a and the lower cup cover 122b are connected to form a cavity, the conductive terminal 1222 is disposed in the cavity, and the conductive terminal 1222 is electrically connected to the conductive contact 148. The lower cap 122b includes a connection post 122ba protruding toward the upper cap 122a, the connection post 122ba is provided with a central hole, and the conductive terminal 1222 is connected to the central hole of the connection post 122ba by a screw, but not limited thereto.

Cup 120 includes a handle, lid 122 includes an extension 1224 opposite the handle, the extension 1224 has a cavity in which pin coupler 1226 is disposed, and correspondingly, a receptacle coupler (not shown) is disposed in the handle and electrically connected to pin coupler 1226, and when lid 122 is closed on cup 120, pin coupler 1226 is plugged into the receptacle coupler to supply power to cooling mechanism 14.

In one embodiment, the lid 122 may be screwed onto the cup 120, and the pin coupler 1226 is inserted into the socket coupler to electrically connect with the socket coupler during rotation of the lid 122 relative to the cup 120.

The cap 122 further includes a sealing ring 1228, the sealing ring 1228 is used to seal a gap between the handle and the cap 122, so as to prevent foreign matter or moisture from invading into a portion where the pin coupler 1226 is electrically contacted with the socket coupler, and ensure reliability of electrical connection between the pin coupler 1226 and the pin coupler.

the cap 122 also includes a cover 1223, the cover 1223 being configured to enclose the cavity of the extension 1224 to enhance appearance.

The semiconductor chilling plate 144 includes a positive terminal and a negative terminal, the positive terminal and the negative terminal are respectively electrically connected to the two conductive contacts 148 and are electrically connected to the conductive terminal 1222 through the conductive contact 148, the conductive terminal 1222 is connected to the pin coupler 1226, and finally the whole circuit is conducted.

The conductive contacts 148 and the conductive terminals 1222 are made of metal conductive materials, which are fatigue-resistant, have small deformation, can be used repeatedly, and have good stability.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims (11)

1. A food processor, comprising:

A cup assembly (12) comprising a food material receiving cavity; and

the cooling mechanism (14) comprises a heat exchange shell (142) and a semiconductor refrigeration piece (144) packaged in the heat exchange shell (142), and the heat exchange shell (142) can be selectively inserted into the food material accommodating cavity.

2. the food processor of claim 1, wherein the semiconductor refrigeration sheet (144) comprises a heat absorbing surface (144a), the heat absorbing surface (144a) affixed to an inner wall of the heat exchange shell (142).

3. The food processor of claim 1, wherein the cooling mechanism (14) further comprises a heat sink (146), the semiconductor chilling plate (144) comprising a heat dissipating surface (144b) in contact with the heat sink (146).

4. The food processor of claim 3, wherein the cooling mechanism (14) comprises a fan (145) and an air duct, the heat sink (146) and the fan (145) being disposed within the air duct.

5. the food processor of claim 4, wherein the air duct comprises an air inlet channel (S1) and an air outlet channel (S2) which are communicated with each other, the air duct is bent at a position where the air inlet channel (S1) is communicated with the air outlet channel (S2), and the heat dissipating member (146) is disposed at a position where the air inlet channel (S1) is communicated with the air outlet channel (S2).

6. The food processor of claim 1, wherein the heat exchange shell (142) is provided as a single structure, or wherein the heat exchange shell (142) comprises a first shell (1420) and a second shell (1422) which are of a split structure, and the first shell (1420) is hermetically connected with the second shell (1422).

7. The food processor of claim 1, wherein the cooling mechanism (14) further comprises a housing (140) and electrically conductive contacts (148), the housing (140) being connected to the heat exchange housing (142), the cup assembly (12) comprising electrically conductive terminals (1222),

The conductive contact (148) is movably arranged relative to the shell (140), and the conductive contact (148) is arranged to be contacted with the conductive terminal (1222) in an active stroke to supply power to the semiconductor chilling plate (144).

8. the food processor of claim 7, wherein the cooling mechanism (14) further comprises a stop (150), the stop (150) being configured to limit the displacement of the conductive contact (148) in a direction other than the direction of its movable travel.

9. The food processor of claim 8, wherein the housing (140) defines a limiting hole (1400d), the limiting member (150) is movably disposed on the housing (140) and connected to the conductive contact (148),

the limiting piece (150) has a movable stroke extending into and out of the limiting hole (1400d) under the action of external force, in the movable stroke, the limiting piece (150) drives the conductive contact (148) to be in contact with the conductive terminal (1222),

the annular inner wall of the limiting hole (1400d) is in limiting fit with the limiting piece (150) so as to limit the deviation of the conductive contact (148) in other directions except the moving stroke direction of the conductive contact.

10. The food processor of claim 7, wherein the cooling mechanism (14) further comprises a contact holder (152), the contact holder (152) for holding a contact force between the conductive contact (148) and the conductive terminal (1222).

11. The food processor of claim 10, wherein the contact holder (152) comprises a conical compression spring, and the conductive contact (148) is held in contact with the conductive terminal (1222) by the elastic force of the conical compression spring.