CN209728113U - A kind of apparatus for testing chip - Google Patents

A kind of apparatus for testing chip Download PDF

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Publication number
CN209728113U
CN209728113U CN201920092197.4U CN201920092197U CN209728113U CN 209728113 U CN209728113 U CN 209728113U CN 201920092197 U CN201920092197 U CN 201920092197U CN 209728113 U CN209728113 U CN 209728113U
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China
Prior art keywords
installation part
chip
adjustable plate
measured
force
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CN201920092197.4U
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Chinese (zh)
Inventor
姜磊
刘敬伟
仝飞
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Guoke Optical Core (haining) Technology Co Ltd
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Guoke Optical Core (haining) Technology Co Ltd
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Priority to CN201920092197.4U priority Critical patent/CN209728113U/en
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Abstract

The utility model relates to chip testing technology fields, more particularly to a kind of apparatus for testing chip, it include: force application structure, it is equipped with a pair of electrodes plate towards the acting surface of chip to be measured, the force application structure includes the installation part for fixed a pair of electrode plate and is connected to the upper surface of the installation part, applies the force-applying piece of pressing force to it.The utility model provides a kind of test repeatability and the preferable apparatus for testing chip of accuracy.

Description

A kind of apparatus for testing chip
Technical field
The utility model relates to chip testing technology fields, and in particular to a kind of apparatus for testing chip.
Background technique
Semiconductor laser is due to having many advantages, such as that small in size, light-weight, electro-optical efficiency is high, in industry, doctor It learns and high-power semiconductor laser is widely used as work light in scientific research field.Semiconductor laser chip is as laser The core component of light source will carry out photoelectric parameter testing in production links, by test it will be seen that semiconductor laser The working performance and reliability of device chip provide foundation to improve the production testing of semiconductor laser, this just needs a kind of fixed Position apparatus for testing chip with high accuracy.
Traditional apparatus for testing chip is to be crimped on semiconductor laser chip on plate by two spring probes, is led to The spring pressure for crossing spring probe compresses chip, and two spring probe energization noise spectra of semiconductor lasers chip positive and negative anodes are added Electricity tests the photoelectric characteristic of semiconductor laser chip.Spring probe is to be contacted in a manner of point with semiconductor laser chip, Therefore the contact position of two spring probes needs symmetrically, to be crimped on the center of chip, just can guarantee to be tested and partly lead Body laser chip uniform force, difficulty when putting and crimp which adds chip.In addition, partly due to The frequent use of spring probe causes two-side elastic variable different, causes probe virtual connection, need to be replaced frequently;And spring is visited The power that the spring of needle pushes every time is inconsistent, causes the thermal resistance between semiconductor laser chip and cooling fin different, test dress That sets is less reproducible, influences the accuracy of semiconductor laser chip test.
Utility model content
Therefore, the technical problem to be solved by the present invention is to overcome the repeatability and standard of test device in the prior art The true poor defect of property, to provide a kind of test repeatability and the preferable apparatus for testing chip of accuracy.
In order to solve the above-mentioned technical problem, the utility model provides a kind of apparatus for testing chip, comprising:
Force application structure is equipped with a pair of electrodes plate towards the acting surface of chip to be measured, and the force application structure includes for solid Determine the installation part of a pair of electrode plate and is connected to the upper surface of the installation part, applies the force-applying piece of pressing force to it.
Further, the installation part has one towards the inclined-plane of the chip to be measured, and the inclined-plane is equipped with and is adapted to therewith Connector, a pair of electrode plate is set to the connector towards on the horizontal end face of the chip to be measured.
Further, the installation part is slidably connected with the connector, and the effect of the connector and the installation part The limited block for preventing it to be detached from the installation part is formed on face.
Further, the opposite both ends of the installation part have been separately formed a guide rod, and the force-applying piece is by being set to a pair The supporting element on the guide rod top is abutted with the installation part, and the installation part is pushed to move back and forth along the guide rod.
Further, the through-hole for allowing the force-applying piece to pass through is formed on the supporting element, the force-applying piece can be described It is rotated in through-hole and pressing force is applied to the installation part.
Further, further include test platform for placing the chip to be measured, formed on the test platform described The accommodation groove of chip to be measured.
It further, further include being arranged in the test platform bottom, the tune of the degree of balance for adjusting the test platform Regulating device.
Further, the regulating device includes the first adjustable plate and the second adjustable plate being oppositely arranged, and is arranged in institute The balance weight between the first adjustable plate and second adjustable plate is stated, second adjustable plate can be relatively described around the balance weight The rotation of first adjustable plate.
Further, several limitations balance weight displacement is equipped between first adjustable plate and second adjustable plate The bias piece of amount.
Further, appearance is respectively provided on the end face that first adjustable plate and second adjustable plate are oppositely arranged Receive the first groove body and the second groove body of the balance weight, the extending direction of first groove body and the second groove body is mutually perpendicular to or puts down Row.
Technical solutions of the utility model have the advantages that
1. apparatus for testing chip provided by the utility model is provided with a pair of electrodes plate, force-applying piece in the bottom of installation part By pressure, all effect on mountings, acts on chip to be measured, so that acting on simultaneously to pass through a pair of electrodes plate Pressure on chip to be measured is constant, and the pressure of every electrode plate can be consistent, while increasing and connecing with chip to be measured Contacting surface product.Compared with the prior art, the difficulty of chip to be measured in crimping in effective solution conventional solution, while The number for reducing replacement electrode, ensure that each pressing force is not influenced by operator's human factor, guarantee measurement essence While spending, also enhance the consistency of test, improves the repeatability and accuracy of test.
2. apparatus for testing chip provided by the utility model, the installation part has one towards the oblique of the chip to be measured Face, the inclined-plane are equipped with the connector being adapted to therewith, and a pair of electrode plate is set to the connector towards the core to be measured On the horizontal end face of piece.The interaction face of installation part and connector is arranged to inclined-plane, in order to installation part into When row force, the power being applied on chip to be measured can be made to be decomposed, power vertically and horizontally is decomposed into, acts on simultaneously On chip to be measured, compressed respectively from both direction by chip to be measured.
3. apparatus for testing chip provided by the utility model, the installation part is slidably connected with the connector, and described The limited block for preventing it to be detached from the installation part is formed on the acting surface of connector and the installation part.By installation part and company It is arranged to be slidably connected between fitting, convenient for the installation and removal of connector, the purpose that limited block is arranged is to prevent connector from existing It is under pressure and is detached from installation part when acting on.
4. apparatus for testing chip provided by the utility model further includes the test platform for placing the chip to be measured, The accommodation groove of the chip to be measured is formed on the test platform.Accommodation groove is arranged on test platform, pacifies in chip to be measured Play the role of limitation and guiding during dress.
5. apparatus for testing chip provided by the utility model further includes being arranged in the test platform bottom, for adjusting The regulating device of the degree of balance of the test platform.Regulating device can be parallel between electrode plate with adjust automatically chip to be measured, In the case where guaranteeing that electrode plate and chip to be measured completely attach to, chip bottom to be measured is in close contact with test platform simultaneously, is possessed Good radiating condition.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art Under the premise of labour, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of apparatus for testing chip provided by the utility model;
Fig. 2 is the cross-sectional view of Fig. 1;
Fig. 3 is structural schematic diagram when connector is not contacted with chip to be measured in Fig. 1;
Fig. 4 is structural schematic diagram when connector and chip to be measured contact in Fig. 1;
Fig. 5 is the structural schematic diagram of regulating device in Fig. 1.
Description of symbols:
The first adjustable plate of 1-;2- balance weight;3- bias piece;The second adjustable plate of 4-;5- calorific potential electricity refrigerator;
6- test platform;7- chip to be measured;8- first electrode plate;9- second electrode plate;10- guide rod;
11- connector;12- limited block;13- installation part;14- supporting element;15- force-applying piece.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally Field those of ordinary skill every other embodiment obtained without making creative work belongs to practical Novel protected range.
In addition, as long as technical characteristic involved in the utility model different embodiments disclosed below is each other Not constituting conflict can be combined with each other.
A kind of specific embodiment of apparatus for testing chip as shown in Figs. 1-5, comprising:
Force application structure is equipped with a pair of electrodes plate towards the acting surface of chip 7 to be measured, and the force application structure includes for solid Determine the installation part 13 of a pair of electrode plate and is connected to the upper surface of the installation part 13, applies the force-applying piece of pressing force to it 15。
The lower surface of installation part 13 is provided with a pair of electrodes plate, respectively first electrode plate 8 and second electrode plate 9, it is right Answer the positive electrode and negative electrode of chip 7 to be measured, mutually insulated between first electrode plate 8 and second electrode plate 9, first electrode plate 8 and Two electrode plates 9 are connected by connecting line with external control circuit respectively, have certain distance between electrode plate and chip to be measured 7, It exerts a force to force-applying piece 15, to push installation part 13 and the first electrode plate 8 and second electrode plate affixed with installation part 13 9, on the positive and negative anodes of chip 7 to be measured, such first electrode plate 8 and second electrode plate 9 press on chip 7 to be measured collective effect Pressure be just able to maintain unanimously, i.e., the upper surface of chip 7 to be measured and first electrode plate 8 and second electrode plate 9 completely attach to, and Uniform force starts to measure after reaching optimum controlling condition;After the completion of pressing, force-applying piece 15 is promoted, installation part 13 drives First electrode plate 8 and second electrode plate 9 move up, and replace chip 7 to be measured, carry out next group of measurement.
In the present embodiment, force-applying piece 15 is ratchet mechanism, naturally it is also possible to be lead screw, or can exert a force to installation part 13 Object.Force-applying piece 15 and installation part 13 can be integrally machined molding, or dismantling connection.
As in Figure 2-4, the installation part 13 has one towards the inclined-plane of the chip 7 to be measured, and the inclined-plane is equipped with The connector 11 being adapted to therewith, a pair of electrode plate are set to the connector 11 towards the horizontal end face of the chip 7 to be measured On.The installation part 13 is slidably connected with the connector 11, and on the acting surface of the connector 11 and the installation part 13 Form the limited block 12 for preventing it to be detached from the installation part 13.
The interaction face of installation part 13 and connector 11 is arranged to inclined-plane, in order to carry out to installation part 13 When force, the power being applied on chip 7 to be measured can be made to be decomposed, power vertically and horizontally is decomposed into, acts on simultaneously On chip 7 to be measured, compressed respectively from both direction by chip 7 to be measured.Installation part 13 is including a level board and is set to level board First skewback of lower surface, connector 11 are the second skewback compatible with the first skewback, are arranged on the inclined-plane of the first skewback It is fluted, protrusion compatible with groove is equipped on the inclined-plane of the second skewback, by the cooperation of groove and protrusion by connector 11 are fixedly mounted on the bottom of installation part 13, convenient for the installation and removal of connector 11.In the work of connector 11 and installation part 13 Limited block 12 is formed with face upper end, in order to connector 11 and installation part 13 be prevented to be detached from.
In the present embodiment, groove is dovetail groove, and dovetail groove is acute angle, as long as being avoided that due to setting the side of dovetail groove It is set to vertically, connector 11 is caused to fall off.Limited block 12 is the protrusion for being fastened on the level board side of installation part 13.
As shown in Figure 1, the opposite both ends of the installation part 13 have been separately formed a guide rod 10, the force-applying piece 15 passes through Supporting element 14 set on a pair of 10 top of guide rod is abutted with the installation part 13, and the promotion installation part 13 is along described Guide rod 10 moves back and forth.The through-hole for allowing the force-applying piece 15 to pass through, the force-applying piece 15 are formed on the supporting element 14 It can rotate in the through hole and pressing force is applied to the installation part 13.
It is respectively provided with a guide rod 10 at the opposite both ends of installation part 13, guide rod 10 runs through installation part 13,13 edge of installation part The axial direction of guide rod 10 moves reciprocatingly, and is equipped with supporting element 14 on the top of guide rod 10, is equipped at the middle part of supporting element 14 logical Hole, force-applying piece 15 are plugged in the through-hole of supporting element 14, are exerted a force to press force-applying piece 15 to installation part 13, and then are acted on On chip 7 to be measured.
Further include the test platform 6 for placing the chip to be measured 7, is formed on the test platform 6 described to be measured The accommodation groove of chip 7.Accommodation groove is arranged on test platform 6, plays limitation and guiding during chip 7 to be measured installation Effect.
After pressure of the installation part 13 by force-applying piece 15, installation part 13 is with 11 vertical drop of follower link, first electrode Plate 8 and second electrode plate 9 apply pressing force to chip 7 to be measured, and chip 7 to be measured is not fully pressed at this time, persistently to peace Piece installing 13 applies pressure, and pressure is decomposed into the power of horizontal and vertical directions by inclined-plane, further by chip to be measured 7 in water Gentle vertical direction is pressed in the accommodation groove of test platform 6, until compressing completely.
In the present embodiment, first electrode plate 8 and second electrode plate 9 are that arbitrary metal material or surface are coated with conductive layer Nonmetallic materials.
As shown in figure 5, further including being arranged in 6 bottom of test platform, for adjusting the degree of balance of the test platform 6 Regulating device.The regulating device includes the first adjustable plate 1 and the second adjustable plate 4 being oppositely arranged, and is arranged described Balance weight 2 between first adjustable plate 1 and second adjustable plate 4, second adjustable plate 4 can be opposite around the balance weight 2 First adjustable plate 1 rotates.It is described flat that several limitations are equipped between first adjustable plate 1 and second adjustable plate 4 The bias piece 3 of weighing apparatus 2 displacement of block.It is set respectively on the end face that first adjustable plate 1 and second adjustable plate 4 are oppositely arranged There are the first groove body and the second groove body for accommodating the balance weight 2, the extending direction phase of first groove body and the second groove body It is mutually perpendicular or parallel.
The bottom end of two guide rods 10 is fixedly mounted on the both ends of the first adjustable plate 1, plays the work of fixed guide pole 10 With shaking when preventing installation part 13 from moving reciprocatingly along the axial direction of guide rod 10, to influence the accuracy pushed.
It is equipped with temperature sensor in the inside of test platform 6, the lower section of test platform 6 is provided with calorific potential electricity refrigerator 5, It is fixed by screw, calorific potential electricity refrigerator 5 is fed back by temperature sensor, is adjusted the operating temperature of chip 7 to be measured in real time, is passed through Electric current loading method can be such that temperature changes between 5 °~55 °;Calorific potential electricity refrigerator 5 is mounted on the second adjustable plate 4, In It is respectively equipped with groove body on first adjustable plate 1 and the second adjustable plate 4, for accommodating balance weight 2, the second adjustable plate 4 is with balance weight 2 Axis rotates by a certain angle with respect to the first adjustable plate 1, so that the position that the chip to be measured 7 of 4 top of the second adjustable plate is set is adjusted, Second adjustable plate 4, come limiting balance block 2, prevents from occurring again after the position for regulating the second adjustable plate 4 by several bias pieces 3 Displacement, i.e. the second adjustable plate 4 is by first adjustable plate of spring straining 1 at four angles, in the first adjustable plate 1 and the second adjustable plate 4 Between accompany balance weight 2, and the moving direction of balance weight 2 is limited by the V-groove on the first adjustable plate 1 and the second adjustable plate 4, can only It is rotated with the center of balance weight 2, when on the second adjustable plate 4 by a non-uniform force, stress is biggish on the second adjustable plate 4 It can be depressed at one, the second adjustable plate 4 can be rotated with the center of balance weight 2, will be pushed up at stress smaller one on the second adjustable plate 4 Rise, stress is larger and stress lesser two at 2 central symmetry of relative equilibrium block, guarantee 4 uniform force of the second adjustable plate, when power takes When disappearing, the second adjustable plate 4 is restored to initial position by spring.
In the present embodiment, it is equipped with the first groove body in the lower surface of the first adjustable plate 1, in the upper surface of the second adjustable plate 4 Equipped with the second groove body, the first groove body and the second groove body are V-groove, and the angle of the extending direction of the first groove body and the second groove body is 90 ° or 180 °.
In the present embodiment, bias piece 3 is spring, and number is four, is separately positioned on the lower surface of the second adjustable plate 4 Edge, it is of course also possible to be multiple.
In the present embodiment, the material of balance weight 2 is metal material or nonmetallic materials, and balance weight 2 is sphere, can also be with For hemisphere, cylindrical body, semicylinder etc., (when balance weight 2 is semicylinder, the cambered surface of semicylinder is towards the second adjustable plate 4 Lower surface).
The concrete operation method of apparatus for testing chip: chip 7 to be measured is placed on test platform 6, promotes installation part 13, It is moved up simultaneously with follower link 11 and first electrode plate 8 and second electrode plate 9, connector 11 is in the oblique of chip 7 to be measured at this time Rear after measurement starts, applies a downward pressure to force-applying piece 15, installation part 13 is pushed to move down, installation part 13 drives connection Part 11 is pressed respectively against first electrode plate 8 and second electrode plate 9 on connector 11 on the positive and negative anodes of chip 7 to be measured, persistently gives Installation part 13 applies pressure, and pressure is decomposed into the power of horizontal and vertical directions, and then chip 7 to be measured is pressed on test and is put down In the holding tank of platform 6, until compressing completely, force-applying piece 15 starts to dally at this time, no longer applies downward pressure to installation part 13, During compression, chip 7 to be measured can be adjusted by the second adjustable plate 4 and be tilted, and guarantee chip 7 and test platform 6 to be measured It completely attaches to, and uniform force, reaches optimum controlling condition, start to measure.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or It changes among the protection scope created still in the utility model.

Claims (10)

1. a kind of apparatus for testing chip characterized by comprising
Force application structure is equipped with a pair of electrodes plate towards the acting surface of chip to be measured (7), and the force application structure includes for fixing It the installation part (13) of a pair of electrode plate and is connected to the upper surface of the installation part (13), applies the force of pressing force to it Part (15).
2. apparatus for testing chip according to claim 1, which is characterized in that the installation part (13) has described in a direction The inclined-plane of chip (7) to be measured, the inclined-plane are equipped with the connector (11) being adapted to therewith, and a pair of electrode plate is set to the company Fitting (11) is towards on the horizontal end face of the chip (7) to be measured.
3. apparatus for testing chip according to claim 2, which is characterized in that the installation part (13) and the connector (11) it is slidably connected, and is formed on the acting surface of the connector (11) and the installation part (13) and prevent itself and the installation The limited block (12) that part (13) is detached from.
4. apparatus for testing chip according to claim 1, which is characterized in that the opposite both ends difference of the installation part (13) Form a guide rod (10), the force-applying piece (15) by be set to the supporting element (14) on a pair of guide rod (10) top with The installation part (13) abuts, and the installation part (13) is pushed to move back and forth along the guide rod (10).
5. apparatus for testing chip according to claim 4, which is characterized in that forming on the supporting element (14) allows institute The through-hole that force-applying piece (15) passes through is stated, the force-applying piece (15) can rotate in the through hole and apply to the installation part (13) Pressing force.
6. apparatus for testing chip according to claim 1, which is characterized in that further include for placing the chip to be measured (7) test platform (6) forms the accommodation groove of the chip to be measured (7) on the test platform (6).
7. apparatus for testing chip according to claim 6, which is characterized in that further include being arranged in the test platform (6) Bottom, the regulating device of the degree of balance for adjusting the test platform (6).
8. apparatus for testing chip according to claim 7, which is characterized in that the regulating device includes be oppositely arranged One adjustable plate (1) and the second adjustable plate (4), and be arranged between first adjustable plate (1) and second adjustable plate (4) Balance weight (2), second adjustable plate (4) can rotate around the balance weight (2) relative to first adjustable plate (1).
9. apparatus for testing chip according to claim 8, which is characterized in that in first adjustable plate (1) and described The bias piece (3) of several limitation balance weight (2) displacements is equipped between two adjustable plates (4).
10. apparatus for testing chip according to claim 8, which is characterized in that in first adjustable plate (1) and described The first groove body and the second groove body for accommodating the balance weight (2) are respectively provided on the end face that two adjustable plates (4) are oppositely arranged, The extending direction of first groove body and the second groove body is mutually perpendicular to or in parallel.
CN201920092197.4U 2019-01-18 2019-01-18 A kind of apparatus for testing chip Active CN209728113U (en)

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CN201920092197.4U CN209728113U (en) 2019-01-18 2019-01-18 A kind of apparatus for testing chip

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CN201920092197.4U CN209728113U (en) 2019-01-18 2019-01-18 A kind of apparatus for testing chip

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111366806A (en) * 2020-04-01 2020-07-03 成都为辰信息科技有限公司 Adjustable constant temperature low temperature test equipment of components and parts
CN111458623A (en) * 2020-04-17 2020-07-28 全球能源互联网研究院有限公司 Semiconductor chip's testing arrangement
CN112872536A (en) * 2021-01-19 2021-06-01 苏州长光华芯光电技术股份有限公司 Auxiliary welding device for laser chip
CN112958480A (en) * 2021-02-20 2021-06-15 广州智能装备研究院有限公司 Chip pressing device for chip testing and sorting machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111366806A (en) * 2020-04-01 2020-07-03 成都为辰信息科技有限公司 Adjustable constant temperature low temperature test equipment of components and parts
CN111458623A (en) * 2020-04-17 2020-07-28 全球能源互联网研究院有限公司 Semiconductor chip's testing arrangement
CN111458623B (en) * 2020-04-17 2022-03-11 全球能源互联网研究院有限公司 Semiconductor chip's testing arrangement
CN112872536A (en) * 2021-01-19 2021-06-01 苏州长光华芯光电技术股份有限公司 Auxiliary welding device for laser chip
CN112958480A (en) * 2021-02-20 2021-06-15 广州智能装备研究院有限公司 Chip pressing device for chip testing and sorting machine

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