CN209718275U - A kind of carrier meeting the cutting of polygon silicon wafer - Google Patents
A kind of carrier meeting the cutting of polygon silicon wafer Download PDFInfo
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- CN209718275U CN209718275U CN201821721482.XU CN201821721482U CN209718275U CN 209718275 U CN209718275 U CN 209718275U CN 201821721482 U CN201821721482 U CN 201821721482U CN 209718275 U CN209718275 U CN 209718275U
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- loading plate
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Abstract
The utility model provides a kind of carrier for meeting the cutting of polygon silicon wafer, including adhering device, fixed device and binding platform, adhering device, fixed device and binding platform are sequentially connected, and adhering device is equipped with groove far from one end of fixed device, and groove shapes and polygon silicon wafer shape are adapted.The utility model has the beneficial effects that structure is simple, own wt is light, and using the fixation device of clamping, it is easily installed disassembly, convenient for safeguarding, adhering device has groove, it can satisfy the demand of different polygon silicon wafer cuttings, it is easy to use, low manufacture cost, and can be improved the bonding efficiency of polygon silicon rod.
Description
Technical field
The utility model belongs to silicon wafer production equipment technology, meets what polygon silicon wafer was cut more particularly, to a kind of
Carrier.
Background technique
With the promotion of technical requirements and market progress, there is higher requirement to silicon wafer unit area generated energy, at present
The square rod of main monocrystalline silicon piece is to cut four corners by pole to be formed, must not to further increase individual monocrystalline silicon piece area
Just also needing further to take measures to further increase the effective use of material and the energy there are four circular arc chamfering；Using
Polygon monocrystalline silicon piece makes cell piece, and monocrystal silicon-rod butting is changed to polygon square rod from quadrangle square rod, and monocrystalline silicon piece is from four
Side shape is changed to polygon；Component forms cell piece typesetting by cell piece, interconnecting strip, busbar and insulating film, is handed over using battery strings
Wrong typesetting pattern.Using the technology, the monocrystalline finished product stick utilization rate after truncation compares traditional four side evolutions and increases 19%, list
10% or more the non-silicon cost decline of crystal silicon chip, but at present in sticky stick link not for the load of polygon silicon rod bonding
Tool, existing carrier is unable to satisfy the slice processing of polygon silicon rod, and existing carrier weight is big, operator's large labor intensity.
Summary of the invention
In view of the above problems, problem to be solved in the utility model is to provide a kind of load for meeting the cutting of polygon silicon wafer
Tool is especially suitable for using when polygon silicon rod bonding, and having reeded adhering device can satisfy the cutting need of polygon silicon wafer
It asks, and the binding platform with hollow cavity, mitigates the labor intensity of operator.
In order to solve the above technical problems, the technical solution adopted in the utility model is: a kind of to meet the cutting of polygon silicon wafer
Carrier, including adhering device, fixed device and binding platform, adhering device, fixed device and binding platform be sequentially connected, and bonding fills
It sets one end far from fixed device and is equipped with groove, groove shapes and polygon silicon wafer shape are adapted.
Specifically, fixed device includes the first connector, the second connector and locking bar, and the first connector one side is equipped with
Groove, the second connector one side be equipped with protrusion, locking bar and protrusion be set to groove in, and locking bar two sides respectively with groove
It is matched with protrusion, protrusion is matched with groove, and locking bar is detachably connected with the first connector.
Further, locking bar includes latch and multiple connecting columns, is equipped with multiple through-holes in the groove of the first connector,
Connecting column is matched with through-hole, and connecting column is connect by locking member with the first connector.
Further, the first connector recess sidewall is equipped with lateral through aperture, is equipped with fastener in lateral through aperture, fastener with
Latch connection.
Specifically, binding platform includes the first loading plate, the second loading plate, third loading plate, the 4th loading plate and guide rail, the
One loading plate is arranged in parallel with the second loading plate, and third loading plate is arranged in parallel with the 4th loading plate, and the two of third loading plate
End is connect with the first loading plate and the second loading plate respectively, and the 4th loading plate connects with the first loading plate and the second loading plate respectively
It connects, guide rail is symmetrically set in the two sides of the second loading plate.
Further, third loading plate is vertically arranged with the first loading plate and the second loading plate respectively, the 4th loading plate point
It is not vertically arranged with the first loading plate and the second loading plate.
Further, the first loading plate is equipped with multiple thermally conductive items.
Further, third loading plate is equipped with lightening hole.
Further, the 4th loading plate is equipped with the first lightening hole.
Further, the second loading plate is equipped with the second lightening hole.
The utility model has the advantages and positive effects of:
1. due to the adoption of the above technical scheme, so that the carrier structure for meeting the cutting of polygon silicon wafer is simple, own wt
Gently, and using the fixation device of clamping, it is easily installed disassembly, convenient for safeguarding, adhering device has groove, and it is more to can satisfy difference
The demand of side shape silicon wafer cutting, easy to use, low manufacture cost, and can be improved the bonding efficiency of polygon silicon rod；
2. fixed device is matched and is connected using raised second connector and reeded first connector of tool
It connects, and the second connector and locking bar cooperate, the groove of locking bar and the first connector cooperates, and realizes the first connector, second
Connector and locking bar are detachably connected, and convenient for the connection and disassembly of adhering device and binding platform, assembly is simple, connection jail
Gu reducing with glue cost；
3. binding platform uses hollow structure, the weight of binding platform is reduced, reduces the labor intensity of operator, and install
There is thermally conductive item, the heat transfer that can cut silicon wafer gives binding platform entirety, accelerates the transmitting of heat.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of an embodiment of the utility model；
Fig. 2 is the structural schematic diagram of the fixation device of an embodiment of the utility model；
Fig. 3 is the structural schematic diagram of the binding platform of an embodiment of the utility model；
Fig. 4 is the side view of Fig. 3；
Fig. 5 is the bottom view of Fig. 3.
In figure:
1, adhering device 2, fixed device 3, binding platform
100, groove 200, the second connector 201, the first connector
202, locking member 203, gasket 204, lateral through aperture
205, locking bar 300, the first loading plate 301, the 4th loading plate
302, guide rail 303, the second loading plate 304, third loading plate
305, thermally conductive item 306, lightening hole
Specific embodiment
The utility model is described further in the following with reference to the drawings and specific embodiments.
Fig. 1 shows the structural schematic diagram of an embodiment of the utility model, and the structure of the present embodiment has been shown in particular, this
Embodiment is related to a kind of carrier for meeting the cutting of polygon silicon wafer, for using when the cutting of polygon silicon wafer, can satisfy difference
Polygon silicon wafer cut demand, and the carrier structure is simple, is easily installed disassembly, and carrier is light-weight, reduces operator's
Labor intensity, the installation of adhering device and binding platform is carried out using fixed device, and fixed device uses snap-in structure, disassembly installation
It is convenient, reduce with glue cost.
Specifically, as shown in Figure 1, the above-mentioned carrier for meeting the cutting of polygon silicon wafer, including adhering device 1, fixation fill
2 and binding platform 3 are set, adhering device 1, fixed device 2 are sequentially connected with binding platform 3, and adhering device 1 is for Nian Jie with silicon rod, just
It is cut in silicon rod, fixed device 2 is used to for adhering device 1 being mounted on binding platform 3, and fixed device 2 uses mechanical structure
It is attached, reduces glue consumption；Binding platform 3 is used to connect by fixed device 2 with adhering device 1, and binding platform 3 is used for and cuts
Cutting mill is cut into connection convenient for the silicon rod after bonding to be mounted on cutting machine；Adhering device 1 is far from fixed device 2
One end is equipped with groove 100, and 100 shape of groove and polygon silicon wafer shape are adapted, the setting of groove 100, so that the bonding fills
Setting 1 can satisfy the bonding of different polygon silicon rods, meet the cutting of different polygon silicon wafers.Fixed device 2 is mounted on viscous
On consecutive 3, adhering device 1 is mounted on fixed device 2, silicon rod is bonded on adhering device 1, will be bonded with the carrier of silicon rod
It is mounted on the cutting that silicon rod is carried out on cutting machine.
Above-mentioned adhering device 1 is adhesive sheet, which is that the side far from fixed device has groove 100, this is recessed
The shape of slot 100 and the shape of polygon silicon wafer are adapted, and can are V-type, are also possible to W type or other shapes, according to
Actual demand is selected, it is preferred that the groove is V type, meets the needs of different polygon silicon wafers cutting.
As shown in Fig. 2, above-mentioned fixation device 2 is used to for adhering device 1 and binding platform 3 being attached, the fixation device 2
Including the first connector 201, the second connector 200 and locking bar 205, the first connector 201 is connect with binding platform 3, and second connects
Fitting 200 is connect with adhering device 1, and the one side of the first connector 201 is equipped with groove, and the second connector 200 is connect with first
The opposite side of part 201 is equipped with protrusion, so that the first connector 201 and the second connector 200 pass through groove and protrusion, locking bar
205 are detachably connected.Here, the groove of the first connector 201 can be dovetail groove trough with straight angle or its
His shape, is selected according to actual needs, it is preferred that and herein, the groove one side wall of the first connector 201 is dovetail wall,
Another side wall is right angle walls, convenient for being coupled with the protrusion and locking bar 205 of the second connector；Second connector 200 it is convex
The protrusion risen is dovetail, and the maximum width of the protrusion of the second connector 200 is less than the maximum of the groove of the first connector 201
Width, the second connector 200 during installation, the side of the protrusion of the second connector 200 and the groove of first connector 201
Dovetail wall is clamped to contact, the two clamping, the other side of the protrusion of the second connector 200 and locking bar 205, locking bar 205
The other side is contacted with the vertical wall of the groove of the first connector 201, realizes the first connector 201,200 and of the second connector with this
The installation of locking bar 205.
Above-mentioned locking bar 205 includes latch and multiple connecting columns, and latch is plate structure, the side of the latch
For straight wall, the other side is dovetail wall, and connecting column is connect with latch, the quantity of connecting column be it is multiple, be equidistantly mounted on locking
On plate lower surface, the connection type of connecting column and latch can be welding, can also be connected by connectors such as bolts, can also
It to be integrated molding or other connection types, is selected according to actual needs, it is preferred that latch and multiple connections
Column is integrally formed, and threaded hole is equipped with far from one end of latch in connecting column, convenient for locking bar 205 and the first connector 201
Connection.It is equipped with through-hole in the bottom portion of groove of the first connector 201, which is located at the side of the right angle walls of groove, and connecting column is inserted
Enter in the through-hole, by locking member 202, locking bar 205 is connect with the first connector 201, here, locking member 202 is preferably
Dormant bolt, convenient for the connection of locking member 202 and locking bar 205.The through-hole is counter sink, and dormant bolt is inserted into connecting column
In threaded hole, locking bar 205 is fastened in the groove of the first connector 201, passes through the dovetail of the latch of locking bar 205
Dovetail of the dovetail wall of wall and the first connector 201 respectively with the protrusion of the second connector 200 is clamped, and is realized to the second connector
200 fixation, adopts the structure, so that gravity of second connector 200 when silicon rod is cut by silicon rod, is connected firmly,
First connector 201 will not be separated with the second connector 200, and locking member 202 applies coupling mechanism force to the second connector 200, so that
Second connector 200 connect fastening with the first connector 201, and the contact position of locking member 202 and the first connector 201 is equipped with pad
Piece 203 reduces the damage to the first connector 201.To lock locking bar 205 more to the second connector 200,
On the side wall of the right angle walls of a connection piece 201, it is equipped with lateral through aperture 204, the center line of the lateral through aperture 204 and the center of through-hole
Line is mutually perpendicular to, and fastener is equipped in the lateral through aperture 204, which is used to apply fastening to the side wall of locking bar 205
Power, so that locking bar 205 more fastens the second connector 200, fastener is fastening bolt here, and lateral through aperture is equipped with spiral shell
Line, fastening bolt are extended lateral through aperture and are contacted with locking bar 205, squeeze locking bar 205, provide transverse direction to locking bar 205
Thrust, and then lateral thrust is applied to the second connector 200, so that the second connector 200 and the first connector 201, lock
Closely connection, the second connector 200 when subjected to tension, will not separate tight item 205 with the first connector 201.Fastening bolt
It can screw in the side wall of locking bar 205, so that fastening bolt is connect with locking bar, lateral thrust be applied to locking bar 205, is made
Locking bar 205 connect stronger with the first connector 201, will not be separated with the first connector 201.
Second connector 200 is connect with adhering device 1, and the first connector 201 is connect with binding platform 3, the first connector 201
It is attached with the second connector 200 by groove, protrusion and locking bar 205, realizes the connection of adhering device 1 and binding platform 3,
Using mechanical connection, adhesive glue amount is reduced.
As shown in figure 3, above-mentioned binding platform 3 include the first loading plate 300, the second loading plate 303, third loading plate 304,
4th loading plate 301 and guide rail 302, the first loading plate 300, the second loading plate 303, third loading plate 304 and the 4th loading plate
301 be plate structure, and the first loading plate 300 is arranged in parallel with the second loading plate 303, third loading plate 304 and the 4th carrying
Plate 301 is arranged in parallel, and the both ends of third loading plate 304 are connect with the first loading plate 300 and the second loading plate 303 respectively, the
Four loading plates 301 are connect with the first loading plate 300 and the second loading plate 303 respectively, and third loading plate 304 is respectively with first
Loading plate 300 and the second loading plate 303 are vertically arranged, the 4th loading plate 301 respectively with the first loading plate 300 and the second loading plate
303 are vertically arranged, so that the first loading plate 300, the second loading plate 303, third loading plate 304 and the 4th 301 plates of carrying are constituted
One cavity, the second loading plate 303, third loading plate 304 and the 4th loading plate 301 play the role of support, carry to first
Plate 300 is supported, and fixed device 2 and adhering device 1 is mounted on the first loading plate 300, guide rail 302 is symmetrical
The two sides of second loading plate 303, the setting of guide rail 302, convenient for the installation of binding platform 3 and cutting machine are installed.
Scheme is advanced optimized, as shown in Figure 4 and Figure 5, multiple thermally conductive items are installed in the upper surface of the first loading plate 300
305, multiple thermally conductive items 305 are equidistantly mounted on the first loading plate 300, and the heat convenient for generating to silicon wafer cutting passes
It passs.The shape of the cross section of the thermally conductive item 305 can be convex, be also possible to trapezoidal, can also be other shapes, according to reality
Demand is selected, and thermally conductive item 305 is embedded on the first loading plate 300, and the height of thermally conductive item 305 is less than the first loading plate
The inside of thermally conductive 305 mounting groove of item, difference in height 1-2mm, convenient for the transmitting of heat on 300.
Multiple lightening holes 306 are equipped on the second loading plate 303, alternatively, being equipped with multiple lightening holes in third loading plate 304
306 perhaps the 4th loading plate 301 be equipped with two perhaps in three of multiple lightening holes 306 and be equipped with lightening hole or three
It is designed with lightening hole, is selected according to actual needs.The setting of lightening hole alleviates the weight of binding platform, so that binding platform
Overall weight mitigate.
Fixed device 2 with the connection type of binding platform 3 be it is Nian Jie, be bonded by bonded adhesives, be also possible to other companies
Mode is connect, is selected according to actual needs；Adhering device 1 with the connection type of fixed device 2 be it is Nian Jie, by bonded adhesives into
Row bonding.
The course of work of the present embodiment: by the protrusion of the second connector 200 of fixed device 2 and the first connector 201
Groove is attached by clamping, locking bar 205 is mounted on the first connector 201, so that locking bar 205 is connect with second
Part 200 is clamped, and is fixedly connected with locking bar 205 with the first connector 201 by locking member 205 and fastener, locking bar 205
To the second connector 200 apply pressure so that the second connector 200 connect with the first connector 201 it is firm；By adhering device 1
It is carried out with the second connector 200 of fixed device 2 be bonded, binding platform 3 is carried out with fixation device 2 be bonded, that is, complete the carrier
Installation, polygon silicon rod to be cut is bonded on adhering device 1, so will be bonded with polygon silicon rod carrier installation
On cutting machine, the cutting of silicon rod can be carried out.
The utility model has the advantages and positive effects of: due to the adoption of the above technical scheme, so that meeting polygon
The carrier structure of silicon wafer cutting is simple, and own wt is light, and using the fixation device of clamping, is easily installed disassembly, convenient for safeguarding,
Adhering device has groove, can satisfy the demand of different polygon silicon wafers cutting, easy to use, low manufacture cost, and can
Improve the bonding efficiency of polygon silicon rod；Fixed device is using raised second connector and has reeded first connection
Part, which matches, to be attached, and the second connector and locking bar cooperate, and the groove of locking bar and the first connector cooperates, and realizes the
A connection piece, the second connector and locking bar are detachably connected, convenient for the connection and disassembly of adhering device and binding platform, assembly
Simply, connection securely, is reduced with glue cost；Binding platform uses hollow structure, reduces the weight of binding platform, reduces operation
The labor intensity of person, and thermally conductive item is installed, the heat transfer that can cut silicon wafer gives binding platform entirety, accelerates the biography of heat
It passs.
One embodiment of the utility model is described in detail above, but the content is only the utility model
Preferred embodiment should not be considered as limiting the scope of the present invention.It is all to be made according to application scope of the utility model
All the changes and improvements etc., should still belong within the patent covering scope of the utility model.
Claims (10)
1. a kind of carrier for meeting the cutting of polygon silicon wafer, it is characterised in that: including adhering device, device and binding platform are fixed,
The adhering device, the fixed device are sequentially connected with the binding platform, and the adhering device is far from the fixed device
One end is equipped with groove, and the groove shapes and polygon silicon wafer shape are adapted.
2. the carrier according to claim 1 for meeting the cutting of polygon silicon wafer, it is characterised in that: the fixed device includes
First connector, the second connector and locking bar, the first connector one side are equipped with groove, second connector side
Face be equipped with protrusion, the locking bar and it is described protrusion be set to the groove in, and the locking bar two sides respectively with it is described recessed
Slot and the protrusion match, and the protrusion is matched with the groove, and the locking bar and first connector are detachable
Connection.
3. the carrier according to claim 2 for meeting the cutting of polygon silicon wafer, it is characterised in that: the locking bar includes lock
Tight plate and multiple connecting columns, the groove of first connector is interior to be equipped with multiple through-holes, and the connecting column and the through-hole match
It closes, the connecting column is connect by locking member with first connector.
4. the carrier according to claim 3 for meeting the cutting of polygon silicon wafer, it is characterised in that: first connector is recessed
Groove sidewall is equipped with lateral through aperture, is equipped with fastener in the lateral through aperture, the fastener is connect with the latch.
5. the carrier according to claim 1-4 for meeting the cutting of polygon silicon wafer, it is characterised in that: the bonding
Platform include the first loading plate, the second loading plate, third loading plate, the 4th loading plate and guide rail, first loading plate with it is described
Second loading plate is arranged in parallel, and the third loading plate is arranged in parallel with the 4th loading plate, and the third loading plate
Both ends are connect with first loading plate and second loading plate respectively, and the 4th loading plate is carried with described first respectively
Plate is connected with second loading plate, and the guide rail is symmetrically set in the two sides of second loading plate.
6. the carrier according to claim 5 for meeting the cutting of polygon silicon wafer, it is characterised in that: the third loading plate point
Be not vertically arranged with first loading plate and second loading plate, the 4th loading plate respectively with first loading plate
It is vertically arranged with second loading plate.
7. the carrier according to claim 6 for meeting the cutting of polygon silicon wafer, it is characterised in that: on first loading plate
Equipped with multiple thermally conductive items.
8. the carrier according to claim 6 or 7 for meeting the cutting of polygon silicon wafer, it is characterised in that: the third carrying
Plate is equipped with lightening hole.
9. the carrier according to claim 8 for meeting the cutting of polygon silicon wafer, it is characterised in that: the 4th loading plate is set
There is the first lightening hole.
10. the carrier according to claim 9 for meeting the cutting of polygon silicon wafer, it is characterised in that: second loading plate
Equipped with the second lightening hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821721482.XU CN209718275U (en) | 2018-10-23 | 2018-10-23 | A kind of carrier meeting the cutting of polygon silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821721482.XU CN209718275U (en) | 2018-10-23 | 2018-10-23 | A kind of carrier meeting the cutting of polygon silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209718275U true CN209718275U (en) | 2019-12-03 |
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ID=68658152
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821721482.XU Active CN209718275U (en) | 2018-10-23 | 2018-10-23 | A kind of carrier meeting the cutting of polygon silicon wafer |
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| Country | Link |
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| CN (1) | CN209718275U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116945010A (en) * | 2023-09-21 | 2023-10-27 | 长治高测新材料科技有限公司 | Clamping assembly, feeding mechanism and wire cutting device |
-
2018
- 2018-10-23 CN CN201821721482.XU patent/CN209718275U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116945010A (en) * | 2023-09-21 | 2023-10-27 | 长治高测新材料科技有限公司 | Clamping assembly, feeding mechanism and wire cutting device |
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