CN209717433U - A kind of polishing disk - Google Patents

Abstract

The utility model provides a kind of polishing disk, including disk body, it further include stacking gradually the buffer layer, hard layer and polishing layer being arranged on the disk body, the hardness of the hard layer is greater than the hardness of the buffer layer and the polishing layer, to guarantee the flatness of the polishing layer.Polishing disk in the utility model, it polishes position and is stacked gradually by buffer layer, hard layer and polishing layer, since buffer layer is located at the bottom, polishing buffer function can be played, it avoids impacting excessive and damaging product, and hard layer is located at centre, and hardness is greater than the hardness of buffer layer and polishing layer, so that during clearing off, with the size variation for the sinking degree that buffer layer compression generates too big variation will not occur for the flatness of polishing layer, so that it is guaranteed that the flatness of polishing layer, makes polishing uniformly, guarantee that polishing effect and product optical flat degree are unaffected.

Description

A kind of polishing disk

Technical field

The utility model relates to glass working arts field, in particular to a kind of polishing disk.

Background technique

With the fast development of electronics and touch technology, touch screen arises.Touch screen is also known as touch-control display panel, and one As include stacking gradually cover-plate glass, touch module and the display module of connection, and cover-plate glass generally has 2D glass, 2.5D glass Glass and 3D glass.In the generating process of cover-plate glass, it usually needs carry out polishing to cover-plate glass.

The convertible machine of clearing off is that a kind of traditional board for the maturation for clearing off 2.5D or 3D glass product currently on the market is set It is standby, processing method are as follows: glass cambered surface to be processed is placed upwards and absorption is fixed on and is attached on the turnover disc on board top On vacuum adsorption jig, after absorption is fixed, the turnover disc on board top is depressed into designated position, while the polishing disk of machine bottom Accelerate positive and negative rotation, upper disk product and lower wall polishing disk under the lubrication friction effect of polishing powder solution 2.5D or 3D cambered surface by Cloudy surface originally cuts into bright face, completes to polish the cambered surface of cover-plate glass.

In the prior art, polishing disk used at present not can guarantee the flatness at itself polishing position, and polishing is uneven, Polishing effect is influenced, while having an effect on the optical flat degree of product after polishing, cover-plate glass is caused to be unable to reach the surface quality of requirement.

Utility model content

Based on this, the purpose of the utility model is to provide a kind of polishing disks, not can guarantee itself to solve existing polishing disk The technical issues of polishing the flatness at position.

One of work as polishing disk, including disk body according to the utility model embodiment, further includes stacking gradually to be arranged in institute State buffer layer, hard layer and the polishing layer on disk body, the hardness of the hard layer is greater than the buffer layer and the polishing layer Hardness, to guarantee the flatness of the polishing layer.

Above-mentioned polishing disk, polishing position is stacked gradually by buffer layer, hard layer and polishing layer, due to buffer layer position In the bottom, polishing buffer function can be played, avoids impacting excessive and damaging product, and hard layer is located at centre, and hardness Greater than the hardness of buffer layer and polishing layer, so that the flatness of polishing layer will not be pressurized with buffer layer to be generated during clearing off Sinking degree size variation and too big variation occurs, so that it is guaranteed that the flatness of polishing layer, make polishing uniformly, guarantee to throw Light effect and product optical flat degree are unaffected.

Further, the disk body, the buffer layer, the hard layer and the polishing layer tighten fixation by several bands It is integral.

Further, the band is located at the periphery position of the polishing disk, and is hidden in below the polishing layer.

Further, the buffer layer is sponge, and the hard layer is PVC board, and the polishing layer is polishing woollen blanket.

Further, the thickness ratio of the hard layer and the buffer layer is 1/5.

Further, the hard layer includes opposite first surface and second surface, and the first surface delays with described Layer bonding is rushed, the second surface is Nian Jie with the polishing layer.

Further, the adhesive strength of the first surface is greater than the adhesive strength of the second surface.

Further, the buffer layer is Nian Jie with the disk body, and adhesive strength is strong greater than the bonding of the first surface Degree.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the polishing disk in the utility model first embodiment；

Fig. 2 is the structural schematic diagram of the polishing disk in the utility model second embodiment.

Main element symbol description:

Disk body	11	Buffer layer	12
				Hard layer	13	Polishing layer	14
Band	15	First surface	131
				Second surface	132

The following detailed description will be further explained with reference to the above drawings the utility model.

Specific embodiment

The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model, It states.Several embodiments of the utility model are given in attached drawing.But the utility model can come in many different forms in fact It is existing, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes public affairs to the utility model It is more thorough and comprehensive to open content.

It should be noted that it can directly on the other element when element is referred to as " being fixedly arranged on " another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ", " right side " and similar statement are for illustrative purposes only.

Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes Any and all combinations of one or more related listed items.

Referring to Fig. 1, showing the polishing disk in the utility model first embodiment, including including disk body 11, Yi Jiyi Sublevel laying up is placed in buffer layer 12, hard layer 13 and polishing layer 14 on the disk body 11.

The disk body 11, the buffer layer 12, the hard layer 13 and the polishing layer 14 are tightened solid by several bands 15 Surely it is integral, the band 15 is located at the periphery position of the polishing disk, and is hidden in below the polishing layer 14.

Wherein, the buffer layer 12 is sponge, and the hard layer 13 is PVC board, and the polishing layer 14 is polishing woollen blanket.Institute The hardness for stating hard layer 13 is greater than the hardness of the buffer layer 12 and the polishing layer 14, to guarantee the smooth of the polishing layer 14 Degree.

When specifically tying up, the band 15 can be passed through from the bottom of polishing layer 14, band 15 is avoided to expose to polishing layer 14 Top and side wall etc. be related on the position of polishing.It, can be in buffer layer 12 meanwhile in order to guarantee that buffer layer 12 is not tearable A rubber sleeve is arranged in each hole passed through for band 15, passes through band 15 out of this rubber sleeve, is increased contact area, is avoided Buffer layer 12 is torn.

It should be understood that the excessive buffer function that will lead to polishing disk of 13 thickness of hard layer is poor, impact is big when polishing, hard 13 thickness of layer are too small, then not can guarantee the flatness of polishing layer 14.It is special under the premise of equalizing buffer effect and flatness performance 1/5 is set by the thickness ratio of the hard layer 13 and the buffer layer 12, in the present embodiment, the thickness of the hard layer 13 Degree be 5mm, the buffer layer 12 with a thickness of 40mm, the two diameter is equal, and is 1200mm.The diameter of the polishing layer 14 Equal to or more than the diameter of the hard layer 13, preferably, the edge of hard layer 13 and buffer layer 12 can be wrapped.

In the specific implementation, the assembling process of the polishing disk can be such that

Step 1: it is 1200mm, the sponge with a thickness of 40mm that one piece of diameter is padded on disk body 11；

Step 2: it is 1200mm, the PVC board with a thickness of 5mm that one piece of diameter is spread on sponge；

Step 3: one piece of carpet is spread on PVC board；

Step 4: disk body 11, sponge, PVC board and carpet are tied up together with band and are fixed together by surrounding；

Step 5: removing extra band.

It should be understood that disk body 11 is typically mounted on the chassis of polishing machine, and it connect, completes with rotary drive mechanism After above-mentioned assembling, polishing machine can be started and carry out polishing task, detailed process are as follows: board is fixed in glass absorption to be processed On the vacuum adsorption jig of the turnover disc on top, and place the cambered surface of glass to be processed upwards, after absorption is fixed, board top Turnover disc be depressed into designated position, with the polishing layer 14 of polishing disk squeeze contact, while polishing disk accelerate positive and negative rotation, on Disk product and lower wall polishing disk complete cambered surface polishing under the lubrication friction effect of polishing powder solution.

To sum up, the polishing disk in the present embodiment, polish position by buffer layer 12, hard layer 13 and polishing layer 14 successively It is laminated, since buffer layer 12 is located at the bottom, polishing buffer function can be played, avoid impacting excessive and damaging product, And hard layer 13 is located at centre, and hardness is greater than the hardness of buffer layer 12 and polishing layer 12, so that during clearing off, polishing layer With the size variation for the sinking degree that the compression of buffer layer 12 generates too big variation will not occur for 14 flatness, so that it is guaranteed that The flatness of polishing layer 14 makes polishing uniformly, guarantees that polishing effect and product optical flat degree are unaffected.

Referring to Fig. 2, show the polishing disk in the utility model second embodiment, the polishing disk in the present embodiment with Polishing disk in first embodiment the difference is that:

The hard layer 13 includes opposite first surface 131 and second surface 132, the first surface 131 with it is described Buffer layer 12 is bonded, and the second surface 132 is Nian Jie with the polishing layer 14.The adhesive strength of the first surface 131 is greater than The adhesive strength of the second surface 132.The buffer layer 12 is Nian Jie with the disk body 11, and adhesive strength is greater than described first The adhesive strength on surface 131.

In polishing, the opposite changing of the relative positions, this implementation occur for disk body 11, buffer layer 12, hard layer 13 and polishing layer 14 in order to prevent Example makes to be mutually bonded between disk body 11, buffer layer 12, hard layer 13 and polishing layer 14, to further enhance bonding strength.Meanwhile It since polishing layer 14 is easy to wear, needs to regularly replace, for the ease of replacement, by the adhesive strength between hard layer 13 and polishing layer 14 It is arranged to minimum, in this way when removing polishing layer 14, directly shuts down polishing layer 14 from hard layer 13.

It should be pointed out that device provided by the utility model second embodiment, realization principle and generation is some Technical effect is identical with first embodiment, and to briefly describe, the present embodiment does not refer to place, can refer to corresponding in first embodiment Content.

Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.

Claims (8)

1. a kind of polishing disk, including disk body, which is characterized in that further include stack gradually the buffer layer being arranged on the disk body, Hard layer and polishing layer, the hardness of the hard layer is greater than the hardness of the buffer layer and the polishing layer, to guarantee the throwing The flatness of photosphere.

2. polishing disk according to claim 1, which is characterized in that the disk body, the buffer layer, the hard layer and institute It states polishing layer and tightens fixed be integral by several bands.

3. polishing disk according to claim 2, which is characterized in that the band is located at the periphery position of the polishing disk, And it is hidden in below the polishing layer.

4. polishing disk according to claim 1, which is characterized in that the buffer layer is sponge, and the hard layer is PVC Plate, the polishing layer are polishing woollen blanket.

5. polishing disk according to claim 4, which is characterized in that the thickness ratio of the hard layer and the buffer layer is 1/ 5。

6. polishing disk according to claim 1, which is characterized in that the hard layer includes opposite first surface and second Surface, the first surface is Nian Jie with the buffer layer, and the second surface is Nian Jie with the polishing layer.

7. polishing disk according to claim 6, which is characterized in that the adhesive strength of the first surface is greater than described second The adhesive strength on surface.

8. polishing disk according to claim 7, which is characterized in that the buffer layer is Nian Jie with the disk body, and is bonded strong Degree is greater than the adhesive strength of the first surface.