CN209710466U - Produce the rehandling facilities between microminiature multilayer circuit board technique - Google Patents
Produce the rehandling facilities between microminiature multilayer circuit board technique Download PDFInfo
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- CN209710466U CN209710466U CN201920030192.9U CN201920030192U CN209710466U CN 209710466 U CN209710466 U CN 209710466U CN 201920030192 U CN201920030192 U CN 201920030192U CN 209710466 U CN209710466 U CN 209710466U
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Abstract
The utility model discloses production microminiature multilayer circuit board technique between rehandling facilities comprising reprint plate, set on reprint plate wherein the groove of an end face central location, two be set to the first fixation hole of inside grooves, two be set to inside grooves the second fixation holes and it is several be set to reprint edges of boards edge first through hole；Two first fixations matrix part alternate with two the second fixation holes is in inside grooves, the past other end perforation for reprinting plate in an end face of each first fixation hole and the equal rotation support plate of each second fixation hole.The utility model, which has, can protect workpiece and is not readily susceptible to damage, and can be improved working efficiency, reduce cost, improve yield rate, more convenient to use, the more stable advantage of the product quality produced.
Description
Technical field
The present invention relates to the rehandling facilities between production microminiature multilayer circuit board technique.
Background technique
It is the biggish circuit board of volume ratio that general enterprises, which do large circuit board all, if the circuit board done is very small, and is compared
It is more complex, to microminiature multilayer circuit board carry out test or to microminiature multilayer circuit board carry out contact point amplification when
It waits, it is necessary to carry out plug wire and plating, whole process is all to do the process of one piece of microminiature multilayer circuit board using manually doing
It at least needs to spend one-month period, the time even more lengthened.If there is copper wire during taking plating after plug wire away
The case where disconnection, then entire product just becomes waste product, rather than substandard products, but the cost of a microminiature multilayer circuit board is very
Height is very unfavorable for enterprise.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide production microminiature multilayer circuit board
Rehandling facilities between technique is reprinted applied to the workpiece between plug wire and plating, can protect workpiece and be not readily susceptible to damage,
It can be improved working efficiency, reduce cost, improve yield rate, more convenient to use, the product quality produced is more stable
The advantages of.
The technical scheme adopted by the invention is that:
Produce the rehandling facilities between microminiature multilayer circuit board technique comprising reprint plate, be set to and reprint plate wherein one
The groove of end face central location, two be set to the first fixation hole of inside grooves, two be set to inside grooves the second fixation hole and
Several be set to reprints edges of boards edge first through hole；Two first fixations matrix part alternate with two the second fixation holes is in groove
One end face of portion, each first fixation hole and the equal rotation support plate of each second fixation hole is passed through toward the other end for reprinting plate
It is logical.
Ceramic carrier is placed on plug wire auxiliary device upper end, by very more and small copper wire on plug wire auxiliary device
Wherein one section be plugged in the hole of substrate, the other end of copper wire is connected on ceramic carrier, and ceramic carrier can be with wafer
It is contacted, electric signal is transferred on the substrate of amplification contacting volume effect by copper wire, substrate can be soft board or hard
Plate, after whole copper wire grafting finish, by the reprinting between the production microminiature multilayer circuit board technique of the utility model
Device lies in substrate upper end.Because ceramic carrier has been fixedly mounted on plug wire auxiliary device upper end during plug wire, it is
It passes through the connection that ceramic substrate carries by the first screw to agree to be fixedly connected, when by the utility model production microminiature
After rehandling facilities between multilayer circuit board technique is lain on ceramic substrate, the first fixation hole and pottery are passed through by the second screw
Porcelain support plate is fixedly connected, and two the first fixation holes are fitted with the second screw, then passes through the second fixation hole using screwdriver, because
Aperture for the first fixation hole of aperture ratio of the second fixation hole is big, because ceramic base directly will can be fixedly connected with by screwdriver
First screw of plate and plug wire auxiliary device is disassembled out, workpiece and the utility model can be produced microminiature multilayer circuit board
Rehandling facilities between technique turns together, forms the effect of support workpiece, convenient and efficient, avoids copper wire fracture of wire, reduces
Rejection rate.Whole process copper wire can be much less time the number of twisting, and copper wire will not Passive deformation, it will be able to keep longer
In the service life, because follow-up work is still likely to result in copper wire fracture of wire, preamble work has to as keep good as possible
Quality.Because the aperture of the first fixation hole of aperture ratio of the second fixation hole is big, can preferably take one's bearings.
The reprinting plate, which is that transparent reprinting plate made of plastic material is transparent, can facilitate in observation in the process tightened up a screw
Whether align, improves working efficiency.The low manufacture cost of plastics, long service life can also accomplish transparent.
The reprinting plate is in round pie, and the reprinting plate is that plate is reprinted made of acrylic material.First fixation hole
Aperture less than the second fixation hole aperture.Round pie can be avoided in loading chute, and copper wire will not be reprinted because of shaking
Edges of boards edge scratches.Further, the sidewall edge for reprinting plate is equipped with rounded corner.
The aperture of first through hole is mainly used for being more easier disconnected copper in some products less than the aperture of the first fixation hole
Line, it is therefore desirable to the soft board or hardboard of fixed workpiece.
Groove is the groove being square, and an end face of groove rotation support plate is recessed toward other end direction；The bottom surface of groove
For burnishing surface, burnishing surface is parallel to each other with the both sides of the face for reprinting plate.Rectangular groove can be with rapid identification direction.It simultaneously can
Cooperate ceramic carrier insertion, a miscellaneous function has also been made.
The left and right sides of groove is respectively equipped with two the second through-holes, and the aperture of the second through-hole is greater than the hole of first through hole
Diameter can cooperate reinforcing, or use in subsequent electroplating work procedure, be mainly used for the effect being conveniently fixed.
First annular region is formed at the reprinting plate of the radial location locating for all first through hole, it is logical to be located at all second
The second annular region is formed at the reprinting plate of radial location locating for hole, turn positioned at first annular region and the second annular region
It is formed with third annular region at support plate, the third through-hole there are four array distribution, the front side of groove are set in third annular region
End and rear side end are respectively equipped with two fourth holes.
The side wall for reprinting plate is mutually perpendicular to the both ends of the surface for reprinting plate.
The present invention, which has, can protect workpiece and is not readily susceptible to damage, and can be improved working efficiency, reduce cost, improve at
Product rate, more convenient to use, the more stable advantage of the product quality produced.
Detailed description of the invention
Fig. 1 is principle schematic diagram one of the invention；
Fig. 2 is the signal of the direction A-A section view in the schematic illustration and Fig. 1 of the section view in structural principle of the invention
Figure；
The structural schematic diagram of plug wire auxiliary device used in process before Fig. 3 is application of the invention；
Fig. 4 is the structural schematic diagram of the used plating auxiliary device of process after application of the invention.
Specific embodiment
As shown in Figures 1 to 4, the present invention produces the rehandling facilities between microminiature multilayer circuit board technique comprising turns
Support plate 1 wherein groove 2, two of an end face central location is set to 2 inside first through hole of groove 5443, two set on reprinting plate 1
First through hole 54 and several be set to inside groove 2 reprint 1 edge first through hole of plate；Two first fixations with two first
The alternate matrix part of through-hole 54 is inside groove 2, each first through hole 5443 and each equal rotation support plate 1 of first through hole 54
An end face toward reprint plate 1 other end perforation.
Ceramic carrier is placed on plug wire auxiliary device upper end, by very more and small copper wire on plug wire auxiliary device
Wherein one section be plugged in the hole of substrate, the other end of copper wire is connected on ceramic carrier, and ceramic carrier can be with wafer
It is contacted, electric signal is transferred on the substrate of amplification contacting volume effect by copper wire, substrate can be soft board or hard
Plate, after whole copper wire grafting finish, by the reprinting between the production microminiature multilayer circuit board technique of the utility model
Device lies in substrate upper end.Because ceramic carrier has been fixedly mounted on plug wire auxiliary device upper end during plug wire, it is
It passes through the connection that ceramic substrate carries by the first screw to agree to be fixedly connected, when by the utility model production microminiature
After rehandling facilities between multilayer circuit board technique is lain on ceramic substrate, by the second screw pass through first through hole 5443 with
Ceramic carrier is fixedly connected, and two first through hole 5443 are fitted with the second screw, then passes through first through hole using screwdriver
54, because the aperture of the aperture ratio first through hole 5443 of first through hole 54 is big, because can directly be connected by screwdriver by fixed
The first screw for connecing ceramic substrate and plug wire auxiliary device is disassembled out, can be more by workpiece and the utility model production microminiature
Rehandling facilities between layer circuit board technique turns together, forms the effect of support workpiece, convenient and efficient, avoids copper wire disconnected
Silk reduces rejection rate.Whole process copper wire can be much less time the number of twisting, and copper wire will not Passive deformation, it will be able to protect
The longer service life is held, because follow-up work is still likely to result in copper wire fracture of wire, preamble work has to protect as far as possible
Hold good quality.It, can the better side of discrimination because the aperture of the aperture ratio first through hole 5443 of first through hole 54 is big
To.
The reprinting plate 1, which is that transparent reprinting plate 1 made of plastic material is transparent, can facilitate in observation in the mistake tightened up a screw
Whether journey aligns, and improves working efficiency.The low manufacture cost of plastics, long service life can also accomplish transparent.
The reprinting plate 1 is in round pie, and the reprinting plate 1 is that plate 1 is reprinted made of acrylic material.The first through hole
5443 aperture is less than the aperture of first through hole 54.Round pie can be avoided in loading chute, and copper wire will not be because of shaking quilt
1 edge of plate is reprinted to scratch.Further, the sidewall edge for reprinting plate 1 is equipped with rounded corner.
The aperture of first through hole is less than the aperture of first through hole 5443, is mainly used for being more easier disconnected copper in some products
Line, it is therefore desirable to the soft board or hardboard of fixed workpiece.
Groove 2 is the groove 2 being square, and an end face of 2 rotation support plate 1 of groove is recessed toward other end direction；Groove 2
Bottom surface is burnishing surface, and burnishing surface is parallel to each other with the both sides of the face for reprinting plate 1.Rectangular groove 2 can be with rapid identification direction.Together
When ceramic carrier can be cooperated to be embedded in, a miscellaneous function has also been made.
The left and right sides of groove 2 is respectively equipped with two the second through-holes 6, and the aperture of the second through-hole 6 is greater than first through hole
Aperture can cooperate reinforcing, or use in subsequent electroplating work procedure, be mainly used for the effect being conveniently fixed.
First annular region is formed at the reprinting plate 1 of the radial location locating for all first through hole, is located at all second
The second annular region is formed at the reprinting plate 1 of radial location locating for through-hole 6, is located at first annular region and the second annular region
Reprinting plate 1 at be formed with third annular region, the third through-hole there are four array distribution, groove 2 are set in third annular region
Front side end and rear side end be respectively equipped with two fourth holes.
The side wall for reprinting plate 1 is mutually perpendicular to the both ends of the surface for reprinting plate 1.
Plug wire is carried out on plug wire auxiliary device, then product through the invention is reprinted onto plating auxiliary device.
The present invention, which has, can protect workpiece and is not readily susceptible to damage, and can be improved working efficiency, reduce cost, improve at
Product rate, more convenient to use, the more stable advantage of the product quality produced.
Claims (9)
1. producing the rehandling facilities between microminiature multilayer circuit board technique, it is characterised in that: it includes reprinting plate, being set to and reprint
Plate wherein the groove of an end face central location, two be set to the first fixation hole of inside grooves, two be set to inside grooves second
Fixation hole and several be set to reprint edges of boards edge first through hole；Two first fixations matrix part alternate with two the second fixation holes exists
The other end of one end face of inside grooves, each first fixation hole and the equal rotation support plate of each second fixation hole toward reprinting plate
Face perforation.
2. the rehandling facilities between production microminiature multilayer circuit board technique according to claim 1, it is characterised in that: institute
Stating and reprinting plate is transparent reprinting plate made of plastic material.
3. the rehandling facilities between production microminiature multilayer circuit board technique according to claim 2, it is characterised in that: institute
It states and reprints plate in round pie, the reprinting plate is to reprint plate made of acrylic material.
4. the rehandling facilities between production microminiature multilayer circuit board technique according to claim 1 or 3, feature exist
In: aperture of the aperture of first fixation hole less than the second fixation hole.
5. the rehandling facilities between production microminiature multilayer circuit board technique according to claim 1 or 3, feature exist
In: aperture of the aperture of first through hole less than the first fixation hole.
6. the rehandling facilities between production microminiature multilayer circuit board technique according to claim 1 or 3, feature exist
In: groove is the groove being square, and an end face of groove rotation support plate is recessed toward other end direction；The bottom surface of groove is smooth
Face, burnishing surface are parallel to each other with the both sides of the face for reprinting plate.
7. the rehandling facilities between production microminiature multilayer circuit board technique according to claim 3, it is characterised in that: recessed
The left and right sides of slot is respectively equipped with two the second through-holes, and the aperture of the second through-hole is greater than the aperture of first through hole.
8. the rehandling facilities between production microminiature multilayer circuit board technique according to claim 3 or 7, feature exist
In: first annular region is formed at the reprinting plate of the radial location locating for all first through hole, is located at all second through-hole institutes
The second annular region, the reprinting plate positioned at first annular region and the second annular region are formed at the reprinting plate of the radial location at place
Place is formed with third annular region, sets the third through-hole there are four array distribution in third annular region, the front side end of groove and
Rear side end is respectively equipped with two fourth holes.
9. the rehandling facilities between production microminiature multilayer circuit board technique according to claim 3 or 7, feature exist
In: the side wall for reprinting plate is mutually perpendicular to the both ends of the surface for reprinting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920030192.9U CN209710466U (en) | 2019-01-09 | 2019-01-09 | Produce the rehandling facilities between microminiature multilayer circuit board technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920030192.9U CN209710466U (en) | 2019-01-09 | 2019-01-09 | Produce the rehandling facilities between microminiature multilayer circuit board technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209710466U true CN209710466U (en) | 2019-11-29 |
Family
ID=68639278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920030192.9U Active CN209710466U (en) | 2019-01-09 | 2019-01-09 | Produce the rehandling facilities between microminiature multilayer circuit board technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209710466U (en) |
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2019
- 2019-01-09 CN CN201920030192.9U patent/CN209710466U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No.28, Xinqing 2nd Road, Jingan Town, Doumen District, Zhuhai City, Guangdong Province 519000 Patentee after: Zero one electronics (Zhuhai) Co.,Ltd. Address before: 519000 No. 28, Xinqing Second Road, Jing'an Town, Doumen District, Zhuhai City, Guangdong Province Patentee before: CORAD ELECTRONIC TECHNOLOGY (ZHUHAI) CO.,LTD. |
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| CP03 | Change of name, title or address |