CN210245480U - Clamping and positioning device for processing semiconductor plastic parts - Google Patents
Clamping and positioning device for processing semiconductor plastic parts Download PDFInfo
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- CN210245480U CN210245480U CN201921687306.3U CN201921687306U CN210245480U CN 210245480 U CN210245480 U CN 210245480U CN 201921687306 U CN201921687306 U CN 201921687306U CN 210245480 U CN210245480 U CN 210245480U
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Abstract
The utility model discloses a centre gripping positioner is used in processing of semiconductor working of plastics relates to semiconductor processing equipment field, to the problem that current machining efficiency is low, now proposes following scheme, and it includes the mainboard, mainboard inner wall top evenly is equipped with the interface, the inside sliding plate that pegs graft of mainboard, mainboard and sliding plate top surface all are equipped with the limiting plate, the sliding plate bottom evenly is equipped with the push pedal, the fixed outer fishplate bar that is equipped with in the sliding plate outside. Through being equipped with sliding plate and interface, the semiconductor working of plastics that need process places on the sliding plate surface through the interface, and second electric putter is injectd the transverse position of sliding plate through outer fishplate bar, and first electric putter promotes the push pedal by the bottom and upwards promotes the sliding plate, injects the position of sliding plate to can injectd the semiconductor working of plastics on sliding plate surface, can carry out spacing and centre gripping to a plurality of semiconductor working of plastics simultaneously, improve machining efficiency.
Description
Technical Field
The utility model relates to a semiconductor processing equipment field especially relates to a clamping and positioning device is used in processing of semiconductor working of plastics.
Background
The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are widely used in the fields of consumer electronics, communication systems, medical instruments, etc., for example, diodes are devices made of semiconductors, and the importance of semiconductors is very great from the viewpoint of technology or economic development, and most of today's electronic products, such as computers, mobile phones or core units of digital recorders, are closely related to semiconductors.
In the existing processing and production process of semiconductor plastic parts, the semiconductor plastic parts need to be positioned and then processed by using processing equipment, but most of the existing production equipment clamps the semiconductor plastic parts one by one, so that the efficiency is low, and the semiconductor plastic parts are easy to damage.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a clamping and positioning device for processing semiconductor plastic parts.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a centre gripping positioner is used in processing of semiconductor working of plastics, includes the mainboard, mainboard inner wall top evenly is equipped with the interface, the inside sliding plate that pegs graft of mainboard has, mainboard and sliding plate top surface all are equipped with the limiting plate, the sliding plate bottom evenly is equipped with the push pedal, the fixed outer fishplate bar that is equipped with in the sliding plate outside, mainboard bottom fixed surface is equipped with the connecting seat.
Preferably, the mainboard is the cavity setting, mainboard outside surface is equipped with the jack, mainboard inner wall front side and inner wall rear side all are equipped with the spout, the spout sets up in the jack inboard.
Preferably, the number of the insertion ports is multiple, and the outer side surface of each insertion port is provided with a first insertion groove.
Preferably, the sliding plate is inserted into the jack, the top of the inner wall of the sliding plate is uniformly provided with second slots, the front side surface and the rear side surface of the sliding plate are both provided with pulleys, and the pulleys are connected with the sliding grooves in a sliding mode.
Preferably, a plug is fixedly arranged at the bottom of the limiting plate, the plug is respectively connected with the first slot and the second slot in an inserting mode, and an inclined soft pad is fixedly arranged on the inner side of the limiting plate.
Preferably, first electric push rods are uniformly arranged between the push plate and the main plate, second electric push rods are arranged between the outer connecting plate and the main plate, and the second electric push rods are arranged at the top and the bottom of the sliding plate.
The utility model has the advantages that: in the utility model, through being equipped with sliding plate and interface, the sliding plate slides in the spout, the semiconductor working of plastics that need processing is placed on the sliding plate surface through the interface, the second electric putter is passed through the outer fishplate bar and is limited the horizontal position of sliding plate, first electric putter promotes the push pedal upwards with the sliding plate by the bottom, is limited the position of sliding plate, thereby can limit the semiconductor working of plastics on sliding plate surface, can carry out spacing and centre gripping to a plurality of semiconductor working of plastics simultaneously, improve machining efficiency;
through being equipped with limiting plate and connecting seat, the plug of limiting plate bottom is divided into half and is inserted in first slot and the second slot, the semiconductor working of plastics is placed when the sliding plate surface, the limiting plate on sliding plate surface is spacing by one side carrying on of semiconductor working of plastics, the sliding plate is to the inboard gliding in-process of mainboard, the inner wall of interface and the limiting plate in the interface outside are pressed close to the semiconductor working of plastics, the semiconductor working of plastics rocks can be placed to the inboard slope cushion of limiting plate, ensure to carry out accurate processing, drive arrangement is connected in the connecting seat outside, can drive whole mainboard removal.
Drawings
FIG. 1 is a sectional view of the overall structure of the present invention;
FIG. 2 is a schematic view of the overall structure of the present invention;
fig. 3 is a side view of the main plate of the present invention;
fig. 4 is a side view of the sliding plate of the present invention;
fig. 5 is a schematic diagram of a limiting plate structure of the present invention;
reference numbers in the figures: 1 main board, 11 jacks, 12 chutes, 2 sockets, 21 first slots, 3 sliding plates, 31 second slots, 32 pulleys, 4 limiting plates, 41 plugs, 42 inclined cushions, 5 push plates, 51 first electric push rods, 6 external connecting plates, 61 second electric push rods and 7 connecting seats.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-5, the clamping and positioning device for semiconductor plastic part processing comprises a main board 1, wherein insertion ports 2 are uniformly formed in the top of the inner wall of the main board 1, a sliding plate 3 is inserted into the main board 1, limiting plates 4 are arranged on the top surfaces of the main board 1 and the sliding plate 3, a push plate 5 is uniformly arranged at the bottom of the sliding plate 3, an outer connecting plate 6 is fixedly arranged on the outer side of the sliding plate 3, a connecting seat 7 is fixedly arranged on the bottom surface of the main board 1, a driving device is connected to the outer side of the connecting seat 7, the whole main board 1 can be driven to move, and an inverted lifting mechanism.
Mainboard 1 is the cavity setting, 1 outside surface of mainboard is equipped with jack 11, 1 inner wall front side of mainboard and inner wall rear side all are equipped with spout 12, spout 12 sets up in jack 11 inboardly.
The number of the insertion ports 2 is multiple, and the outer side surface of each insertion port 2 is provided with a first insertion groove 21.
The sliding plate 3 is inserted into the insertion hole 11, the top of the inner wall of the sliding plate 3 is uniformly provided with second insertion grooves 31, the front side surface and the rear side surface of the sliding plate 3 are respectively provided with a pulley 32, the pulleys 32 are slidably connected with the sliding groove 12, the sliding plate 3 slides in the sliding groove 12, and a semiconductor plastic part to be processed is placed on the surface of the sliding plate 3 through the insertion port 2.
Fixed plug 41 that is equipped with in limiting plate 4 bottom, plug 41 pegs graft with first slot 21 and second slot 31 respectively, 4 inboard fixed slopes cushions 42 that are equipped with of limiting plate, the plug 41 of limiting plate 4 bottom insert first slot 21 and second slot 31 in half, and the semiconductor working of plastics can be placed to the inboard slope cushion of limiting plate 4 and rock, ensure to carry out accurate processing.
First electric push rods 51 are uniformly arranged between the push plate 5 and the main plate 1, second electric push rods 61 are arranged between the outer connecting plate 6 and the main plate 1, the second electric push rods 61 are arranged at the top and the bottom of the sliding plate 3, the second electric push rods 61 limit the transverse position of the sliding plate 3 through the outer connecting plate 6, the first electric push rods 51 push the push plate 5 from the bottom to push the sliding plate 3 upwards, and limit the position of the sliding plate 3, so that semiconductor plastic parts on the surface of the sliding plate 3 can be limited.
The working principle is as follows:
referring to the attached figures 1-4 of the specification: the sliding plate 3 slides in the sliding groove 12, a semiconductor plastic piece to be processed is placed on the surface of the sliding plate 3 through the inserting port 2, the second electric push rod 61 limits the transverse position of the sliding plate 3 through the outer connecting plate 6, the first electric push rod 51 pushes the sliding plate 3 upwards through the bottom push plate 5, and the position of the sliding plate 3 is limited, so that the semiconductor plastic piece on the surface of the sliding plate 3 can be limited, a plurality of semiconductor plastic pieces can be limited and clamped at the same time, and the processing efficiency is improved;
referring to the description figures 1, 2 and 5: the plug 41 of limiting plate 4 bottom is divided into half and is inserted in first slot 21 and second slot 31, the semiconductor working of plastics is placed when sliding plate 3 surface, limiting plate 4 on sliding plate 3 surface is spacing by one side to the semiconductor working of plastics, sliding plate 3 is to the inboard gliding in-process of mainboard 1, the semiconductor working of plastics is pressed close to the inner wall of interface 2 and the limiting plate 4 in the interface 2 outside, the inboard slope cushion of limiting plate 4 can be placed the semiconductor working of plastics and rock, ensure to carry out accurate processing.
Referring to the description of figure 3:
in the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a clamping and positioning device is used in processing of semiconductor working of plastics, includes mainboard (1), its characterized in that, mainboard (1) inner wall top evenly is equipped with interface (2), mainboard (1) inside grafting has sliding plate (3), mainboard (1) and sliding plate (3) top surface all are equipped with limiting plate (4), sliding plate (3) bottom evenly is equipped with push pedal (5), sliding plate (3) outside is fixed and is equipped with outer fishplate bar (6), mainboard (1) bottom fixed surface is equipped with connecting seat (7).
2. The clamping and positioning device for processing the semiconductor plastic part as claimed in claim 1, wherein the main board (1) is hollow, the outer side surface of the main board (1) is provided with a jack (11), the front side and the rear side of the inner wall of the main board (1) are provided with sliding grooves (12), and the sliding grooves (12) are arranged inside the jack (11).
3. The clamping and positioning device for processing the semiconductor plastic part as claimed in claim 2, wherein the number of the insertion ports (2) is multiple, and the outer side surface of the insertion ports (2) is provided with the first insertion groove (21).
4. The clamping and positioning device for processing the semiconductor plastic part as claimed in claim 3, wherein the sliding plate (3) is inserted into the insertion hole (11), the top of the inner wall of the sliding plate (3) is uniformly provided with a second insertion groove (31), the sliding plate (3) is provided with a pulley (32) on the front side surface and a pulley (32) on the rear side surface, and the pulleys (32) are slidably connected with the sliding grooves (12).
5. The clamping and positioning device for processing the semiconductor plastic part as claimed in claim 4, wherein a plug (41) is fixedly arranged at the bottom of the limiting plate (4), the plug (41) is respectively inserted into the first slot (21) and the second slot (31), and an inclined soft pad (42) is fixedly arranged at the inner side of the limiting plate (4).
6. The clamping and positioning device for processing the semiconductor plastic part as claimed in claim 1, wherein a first electric push rod (51) is uniformly arranged between the push plate (5) and the main plate (1), a second electric push rod (61) is arranged between the outer connecting plate (6) and the main plate (1), and the second electric push rods (61) are arranged at the top and the bottom of the sliding plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921687306.3U CN210245480U (en) | 2019-10-10 | 2019-10-10 | Clamping and positioning device for processing semiconductor plastic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921687306.3U CN210245480U (en) | 2019-10-10 | 2019-10-10 | Clamping and positioning device for processing semiconductor plastic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210245480U true CN210245480U (en) | 2020-04-03 |
Family
ID=69966314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921687306.3U Active CN210245480U (en) | 2019-10-10 | 2019-10-10 | Clamping and positioning device for processing semiconductor plastic parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210245480U (en) |
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2019
- 2019-10-10 CN CN201921687306.3U patent/CN210245480U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20201217 Address after: Room 105, building 30 (C3), Zhongguancun Software Park, Xinwu District, Wuxi City, Jiangsu Province, 214135 Patentee after: Wuxi dijiayang Technology Co.,Ltd. Address before: 214029 ground floor, building B, No. 208, Chengnan Road, New District, Wuxi City, Jiangsu Province Patentee before: Wuxi jiaheyang Precision Machinery Co.,Ltd. |