CN209693354U - A kind of mobile phone - Google Patents
A kind of mobile phone Download PDFInfo
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- CN209693354U CN209693354U CN201921770632.0U CN201921770632U CN209693354U CN 209693354 U CN209693354 U CN 209693354U CN 201921770632 U CN201921770632 U CN 201921770632U CN 209693354 U CN209693354 U CN 209693354U
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Abstract
The utility model provides a kind of mobile phone, it includes the cpu chip for stacking gradually connection, PCB circuit board, thermo-electric generation chip and rear shell, thermo-electric generation chip is equipped with insulating layer backwards to the surface of PCB circuit board, rear shell is equipped with graphite flake towards the surface of PCB circuit board, insulating layer is fitted and connected with graphite flake, thermo-electric generation chip is connect by conducting wire with battery of mobile phone or mobile phone circuit system, graphite flake is conducive to being distributed to even heat in rear shell, the temperature in this face of insulating layer is set to keep lower level, increase the temperature gradient in hot end face and cold end face, turn the characteristic of electricity according to thermo-electric generation chip heat, to increase potential difference, electric energy is stored in the battery or entered in circuit system again and is used, solve the heat dissipation problem of mobile phone；Thermo-electric generation chip is equipped with charge port, and for charge port for connecting with DC power supply, which is the power supply of thermo-electric generation chip, and thermo-electric generation chip is made to become refrigeration wafer heat dissipation when being powered.
Description
Technical field
The utility model relates to technical field of mobile phones, more particularly to a kind of mobile phone.
Background technique
As the performance of smart phone is constantly promoted, it is followed by that power consumption is also increasing.Although in now
The making technology of central processor (CPU) is increasingly advanced, and Energy Efficiency Ratio is constantly promoted, but CPU total calorific value also constantly on
It rises.
The heat that the pyrotoxins such as the cpu chip in the smart phone course of work in PCB circuit board, radio frequency PA generate at present is first
It is soaked to the center of mobile phone by way of soaking, air is then perhaps scattered to by screen or mobile phone battery cover on mobile phone battery cover
In, and then the temperature of mobile phone itself is reduced, however these heats are not used effectively, and cause energy utilization rate low.And this kind
Although design can allow most of heat to distribute, user still can be allowed to feel that the temperature at some position is very high or even boiling hot
Hand, as the power consumption of mobile phone is higher and higher, such radiating mode is no longer satisfied the demand of mobile phone heat dissipation.Therefore one kind is needed
Good heat dissipation effect and the mobile phone of environmental protection.
Utility model content
The purpose of this utility model is that proposing a kind of mobile phone, existing mobile phone heat dissipation effect difference and heat dissipation are solved not environmentally
The problem of.
A kind of mobile phone, cpu chip, PCB circuit board, thermo-electric generation chip and rear shell including stacking gradually connection are described
Thermo-electric generation chip is equipped with insulating layer backwards to the surface of the PCB circuit board, and the rear shell is towards the thermo-electric generation chip
Surface is equipped with graphite flake, and the insulating layer is fitted and connected with the graphite flake, and the thermo-electric generation chip passes through conducting wire and mobile phone
Battery or the connection of mobile phone circuit system；
The thermo-electric generation chip is equipped with charge port, and the charge port passes through the direct current for connecting with DC power supply
Power supply is thermo-electric generation chip power supply.
According to the utility model proposes mobile phone, have the advantages that the utility model be arranged thermo-electric generation chip
At the back side of PCB circuit board, thermo-electric generation chip towards cpu chip one side as hot end face, thermo-electric generation chip distance CPU
Chip pyrotoxin is close, can be to the greatest extent by the heat transfer of cpu chip to thermo-electric generation chip, the setting of thermo-electric generation chip
The one side of insulating layer is contacted as the graphite flake of cold end face and rear shell, keeps lower water conducive to the temperature in this face of insulating layer
It is flat, and then the temperature gradient in hot end face and cold end face is increased, the heat using thermo-electric generation chip turns electrical characteristics, to increase
Potential difference, then electric energy is stored in the battery or entered in circuit system and is used, solve the heat dissipation problem of mobile phone, it will not
Cause the temperature at some position on mobile phone very high, and is electric energy, the utilization rate of lifting means heat, energy-saving ring by converting heat
It protects, when the temperature difference is unstable, and thermo-electric generation chip can not carry out heat turn electricity heat dissipation, is connect at this time to the charge port of thermo-electric generation chip
Enter a DC power supply, which has reformed into a refrigeration wafer after being powered, and can drop to heat sources such as CPU
Temperature.
In addition, can also have the following additional technical features: according to mobile phone provided by the utility model
Further, the thermo-electric generation inner wafer is integrated with 65 pairs of galvanic couple arms, connects between 65 pairs of galvanic couple arms
Connection.
Further, the PCB circuit board is equipped with copper sheet layer, the galvanic couple arm attachment backwards to the surface of the cpu chip
In the copper sheet layer surface.
Further, the thermo-electric generation chip is symmetrically set with the cpu chip.
Further, the cpu chip is equipped with the metal center and screen of stacking connection backwards to the side of the PCB circuit board
Curtain, the metal center are equipped with shielding case backwards to the surface of the screen, and the shielding case is towards one end of the PCB circuit board
For open end, the cpu chip is mounted in the shielding case.
Further, the voltage of the DC power supply is 3 ~ 5V.
The additional aspect and advantage of the utility model will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model from the description of the embodiment in conjunction with the following figures will
Become obvious and be readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the mobile phone of the utility model embodiment；
Fig. 2 is the structural schematic diagram of the thermo-electric generation chip of the utility model embodiment；
10, cpu chip；20, PCB circuit board；21, copper sheet layer；30, rear shell；31, graphite flake；40, thermo-electric generation chip；
41, insulating layer；42, galvanic couple arm；43, conducting wire；50, battery of mobile phone；60, metal center；70, screen；80, shielding case.
Specific embodiment
It is practical to this with reference to the accompanying drawing to keep the purpose of this utility model, feature and advantage more obvious and easy to understand
Novel specific embodiment is described in detail.Several embodiments of the utility model are given in attached drawing.But this reality
It can be realized in many different forms with novel, however it is not limited to embodiment described herein.On the contrary, providing these realities
The purpose for applying example is to keep the disclosure to the utility model more thorough and comprehensive.
It please refers to shown in Fig. 1 and Fig. 2, the embodiments of the present invention provide a kind of mobile phone, including stacking gradually connection
Cpu chip 10, PCB circuit board 20, thermo-electric generation chip 40 and rear shell 30.
The thermo-electric generation chip 40, which is laminated, is connected to the PCB circuit board 20 backwards to the surface of the cpu chip 10, institute
It states thermo-electric generation chip 40 and is equipped with insulating layer 41 backwards to the surface of the PCB circuit board 20, the rear shell 30 is towards the temperature difference
The surface of power generation chip 40 is equipped with graphite flake 31, and the insulating layer 41 is fitted and connected with the graphite flake 31, the thermo-electric generation
Chip 40 is connect by conducting wire 43 with battery of mobile phone 50 or mobile phone circuit system；
The thermo-electric generation chip 40 is equipped with charge port, and the charge port with DC power supply for connecting, the direct current
Source is the thermo-electric generation chip 40 power supply.
It is connected in series many to galvanic couple arm 42 made of P-type material and n type material inside thermo-electric generation chip 40, these
The basic material of galvanic couple arm 42 is bismuth telluride (Bi2te3), it has very strong Seebeck effect.Seebeck effect (Seebeck
Effect it) is also referred to as the first pyroelectric effect, refers to the temperature difference due to two kinds of different electric conductors or semiconductor and causes two kinds
The pyroelectric phenomena of voltage difference between substance.
The origin cause of formation of Seebeck effect can be carrier in temperature gradient lower conductor with simplicity of explanation from hot end to cold end
Movement, and accumulated in cold end, to form potential difference in material internal, while a reversed electricity is generated under potential difference effect
Lotus stream, when the electric charge stream of warm-up movement reaches dynamic equilibrium with internal electric field, semiconductor both ends form stable thermoelectromotive force.
The working principle of the utility model are as follows: when operating handset, cpu chip 10 is used as pyrotoxin, and surface temperature is higher,
The surface that thermo-electric generation chip 40 is connect with PCB circuit board 20 is hot end face, the graphite flake of thermo-electric generation chip 40 and rear shell 30
The surface of 31 connections is cold end face, and thermo-electric generation chip 40 has very strong Seebeck effect, thus thermo-electric generation chip 40
Both ends form stable thermoelectromotive force, in the case where the temperature difference is stablized, thermo-electric generation chip 40 can be regarded as in one
Biggish voltage source is hindered, thermo-electric generation chip 40 charges to battery of mobile phone 50 by conducting wire 43 and the connection of battery of mobile phone 50, or
It is directly electrically connected with mobile phone circuit system, powers for circuit system.
When the temperature difference is unstable (depending on the usage scenario of user and thermally conductive, the hair of itself of thermo-electric generation chip 40
The heat dissipation effect of heat and huyashi-chuuka (cold chinese-style noodles)), electricity heat dissipation cannot be turned using 40 heat of thermo-electric generation chip, at this time to thermo-electric generation chip 40
Charge port accesses DC power supply, provides a DC voltage, and the thermo-electric generation chip 40 energization is allowed to drop cpu chip 10
Temperature.
As can be seen from the above description, the utility model has the beneficial effects that: thermo-electric generation chip 40 is arranged in the utility model
At the back side of PCB circuit board 20, the front installation cpu chip 10 of PCB circuit board 20, thermo-electric generation chip 40 is towards cpu chip
For 10 one side as hot end face, thermo-electric generation chip 40 is close apart from 10 pyrotoxin of cpu chip, can be to the greatest extent by CPU core
The heat transfer of piece 10 is to thermo-electric generation chip 40, and the one side of the setting insulating layer 41 of thermo-electric generation chip 40 is as cold end face with after
The graphite flake 31 of shell 30 contacts, and graphite flake 31 is conducive to the surface for being distributed to rear shell 30 of even heat making this face of insulating layer 41
Temperature keep lower level, and then increase the temperature gradient in hot end face and cold end face, utilize thermo-electric generation chip 40
Heat turns electrical characteristics, to increase potential difference, then electric energy is stored in the battery or is entered in circuit system and is used, solved
The heat dissipation problem of mobile phone, and be electric energy, the utilization rate of lifting means heat, energy conservation and environmental protection, when temperature difference shakiness by converting heat
It is fixed, when thermo-electric generation chip 40 can not carry out heat turn electricity heat dissipation, one is accessed directly to the charge port of thermo-electric generation chip 40 at this time
Galvanic electricity source, the thermo-electric generation chip 40 have reformed into a refrigeration wafer after being powered, can cool down to heat sources such as CPU.This
Utility model, which makes a thermo-electric generation chip 40 not only, realizes power generation heat dissipation, but also the reality when needing to cool down to CPU in high temperature difference
Now freeze.
By taking current mobile phone as an example, in object for appreciation " king's honor " or " stimulation battlefield ", the temperature on the surface CPU can achieve user
Nearly 70 degree being spent 60, general room temperature environment temperature is 25 degree, thinks the temperature difference for having 45 for the time being, thermo-electric generation chip under the temperature difference more
40 open-circuit voltage generally can achieve 1.4-1.5V, and internal resistance is between 3-4.5 Ω.
Specifically, the model 9502/065/018MP of the thermo-electric generation chip 40, in the thermo-electric generation chip 40
Portion is integrated between 65 pairs of galvanic couple arms, 42,65 pairs of galvanic couple arms 42 and is connected in series.
Specifically, the PCB circuit board 20 is equipped with copper sheet layer 21, the galvanic couple arm backwards to the surface of the cpu chip 10
42 are mounted on 21 surface of copper sheet layer.Directly thermo-electric generation chip 40 is placed in PCB circuit board 20, in PCB circuit board
20 surface setting copper sheet layer 21 is used as electric conductor, the direct SMT of P/N galvanic couple arm 42 is realized fixation in PCB circuit board 20, both
Heat can be more transmitted on thermo-electric generation chip 40, and can be preferably fixed by thermo-electric generation chip 40.
Specifically, the thermo-electric generation chip 40 is symmetrically set with the cpu chip 10.
Specifically, the cpu chip 10 is equipped with the metal center 60 of stacking connection backwards to the side of the PCB circuit board 20
With screen 70, the metal center 60 is equipped with shielding case 80 backwards to the surface of the screen 70, and the shielding case 80 is towards described
One end of PCB circuit board 20 is open end, and the cpu chip 10 is mounted in the shielding case 80.Cpu chip 10 is mounted on institute
It states in shielding case 80, influence of the extraneous electromagnetic wave to cpu chip 10 can be shielded, prevent electromagnetic interference.
Specifically, the voltage of the DC power supply is 3 ~ 5V.
When the temperature difference is unstable, electricity heat dissipation cannot be turned using 40 heat of thermo-electric generation chip, give thermo-electric generation chip 40 at this time
Charge port access DC power supply, a 3 ~ 5V of DC voltage is provided, allow the thermo-electric generation chip 40 be powered after to cpu chip 10
Cool down.So that a thermo-electric generation chip 40 is not only realized power generation in high temperature difference, but also realizes system when needing to cool down to CPU
It is cold.
In conclusion the utility model provides a kind of mobile phone, beneficial effect is: it is brilliant that thermo-electric generation is arranged in the utility model
Piece 40 is at the back side of PCB circuit board 20, the front installation cpu chip 10 of PCB circuit board 20, and thermo-electric generation chip 40 is towards CPU
For the one side of chip 10 as hot end face, thermo-electric generation chip 40 is close apart from 10 pyrotoxin of cpu chip, can to the greatest extent by
The heat transfer of cpu chip 10 is to thermo-electric generation chip 40, and the one side of the setting insulating layer 41 of thermo-electric generation chip 40 is as cold end
The contact of the graphite flake 31 of face and rear shell 30, graphite flake 31 are conducive to the surface for being distributed to rear shell 30 of even heat making insulating layer
The temperature in 41 this face keeps lower level, and then increases the temperature gradient in hot end face and cold end face, utilizes thermo-electric generation crystalline substance
The heat of piece 40 turns electrical characteristics, to increase potential difference, then electric energy storage in the battery or enters in circuit system and is made
With solving the heat dissipation problem of mobile phone, and be electric energy by converting heat, the utilization rate of lifting means heat, energy conservation and environmental protection works as temperature
Difference is unstable, when thermo-electric generation chip 40 can not carry out heat turn electricity heat dissipation, accesses at this time to the charge port of thermo-electric generation chip 40
One DC power supply, the thermo-electric generation chip 40 have reformed into a refrigeration wafer after being powered, can drop to heat sources such as CPU
Temperature.The utility model, which makes a thermo-electric generation chip 40 not only, realizes power generation heat dissipation in high temperature difference, but also is needing to cool down to CPU
Shi Shixian refrigeration.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (6)
1. a kind of mobile phone, which is characterized in that including stack gradually the cpu chip of connection, PCB circuit board, thermo-electric generation chip and
Rear shell, the thermo-electric generation chip are equipped with insulating layer backwards to the surface of the PCB circuit board, and the rear shell is sent out towards the temperature difference
The surface of electric chip is equipped with graphite flake, and the insulating layer is fitted and connected with the graphite flake, and the thermo-electric generation chip is by leading
Line is connect with battery of mobile phone or mobile phone circuit system；
The thermo-electric generation chip is equipped with charge port, and the charge port passes through the DC power supply for connecting with DC power supply
For thermo-electric generation chip power supply.
2. mobile phone according to claim 1, which is characterized in that the thermo-electric generation inner wafer is integrated with 65 pairs of galvanic couples
Arm is connected in series between 65 pairs of galvanic couple arms.
3. according to mobile phone as claimed in claim 2, which is characterized in that the PCB circuit board is equipped with backwards to the surface of the cpu chip
Copper sheet layer, the galvanic couple arm are mounted on the copper sheet layer surface.
4. mobile phone according to claim 1, which is characterized in that the thermo-electric generation chip and the cpu chip are mutually right
Claim setting.
5. mobile phone according to claim 1, which is characterized in that the cpu chip is set backwards to the side of the PCB circuit board
The metal center and screen for having stacking to connect, the metal center are equipped with shielding case, the shielding backwards to the surface of the screen
Cover is open end towards one end of the PCB circuit board, and the cpu chip is mounted in the shielding case.
6. mobile phone according to claim 1, which is characterized in that the voltage of the DC power supply is 3 ~ 5V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921770632.0U CN209693354U (en) | 2019-10-22 | 2019-10-22 | A kind of mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921770632.0U CN209693354U (en) | 2019-10-22 | 2019-10-22 | A kind of mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209693354U true CN209693354U (en) | 2019-11-26 |
Family
ID=68609771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921770632.0U Active CN209693354U (en) | 2019-10-22 | 2019-10-22 | A kind of mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209693354U (en) |
-
2019
- 2019-10-22 CN CN201921770632.0U patent/CN209693354U/en active Active
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