CN209693074U - A kind of PTC heat radiating structure - Google Patents
A kind of PTC heat radiating structure Download PDFInfo
- Publication number
- CN209693074U CN209693074U CN201822216271.7U CN201822216271U CN209693074U CN 209693074 U CN209693074 U CN 209693074U CN 201822216271 U CN201822216271 U CN 201822216271U CN 209693074 U CN209693074 U CN 209693074U
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- CN
- China
- Prior art keywords
- ptc
- euthermic chip
- silica gel
- heat
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of PTC heat radiating structures, and including the silica gel frame for installing PTC euthermic chip, the multiple and matched through-hole of PTC euthermic chip is provided on the silica gel frame；Pass through conducting resinl outside the PTC euthermic chip and is coated with aluminium film；Silica gel outer frame side is provided with the electrode slice connecting with PTC euthermic chip, and ceramic insulation piece is provided on the outside of the electrode slice, is provided with heat-radiation belt outside the ceramic insulation piece, the section of the heat-radiation belt be in U-shape shape and its be internally provided with multiple radiating fins.The utility model structure designs advantages of simple, can effectively improve heat transfer efficiency, and anti-aging property improves；And there is preferable impact resistance, improve its safety.
Description
Technical field
The present invention relates to a kind of heater technical field, specifically a kind of PTC heat radiating structure.
Background technique
PTC heater in the prior art generallys use PTC ceramics as heater element, and its structure is complicated, flat by more
Row conductor synthesizes one as conductive core line, but such structure heat transfer efficiency is not high, and impact resistance is weaker, makes it using model
It encloses and the pot life is restricted.
Summary of the invention
Technical problem to be solved by the present invention lies in: existing PTC structure conduction inequality is even, and heat transfer efficiency is not high.
In order to solve the above technical problems, the invention provides the following technical scheme:
A kind of PTC heat radiating structure is provided with more including the silica gel frame for installing PTC euthermic chip on the silica gel frame
A and matched through-hole of PTC euthermic chip；Pass through conducting resinl outside the PTC euthermic chip and is coated with aluminium film；The silica gel outer frame
Side is provided with the electrode slice connecting with PTC euthermic chip, is provided with ceramic insulation piece, the ceramic insulation on the outside of the electrode slice
Be provided with heat-radiation belt outside piece, the section of the heat-radiation belt be in U-shape shape and its be internally provided with multiple radiating fins.
As a further solution of the present invention: the PTC euthermic chip is Nian Jie by silica gel with electrode slice.
As further scheme of the invention: the PTC euthermic chip is in long strip, is evenly distributed in silica gel frame
Portion.
As further scheme of the invention: headed by the radiating fin is between interlaced arrangement and adjacent heat radiation fin
Tail connects.
Compared with prior art, it the beneficial effects of the present invention are: the utility model structure designs advantages of simple, can effectively improve
Heat transfer efficiency, anti-aging property improve；And there is preferable impact resistance, improve its safety.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of embodiment.
In figure: 1- silica gel frame, 2-PTC euthermic chip, 3- aluminium film, 4- electrode slice, 5- ceramic insulation piece, 6- heat-radiation belt, 7-
Radiating fin.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, a kind of PTC heat radiating structure, including the silica gel frame 1 for installing PTC euthermic chip 2, the silica gel
The multiple and matched through-hole of PTC euthermic chip 2 is provided on frame 1；Aluminium is coated with by conducting resinl outside the PTC euthermic chip 2
Film 3；It is provided with the electrode slice 4 connecting with PTC euthermic chip 2 on the outside of the silica gel frame 1, is provided with pottery on the outside of the electrode slice 4
Porcelain insulating piece 5, is provided with heat-radiation belt 6 outside the ceramic insulation piece 5, and the section of the heat-radiation belt 6 is in U-shape shape and its internal setting
There are multiple radiating fins 7.
Alternatively, the PTC euthermic chip 2 is Nian Jie by silica gel with electrode slice 4.
Alternatively, the PTC euthermic chip 2 is in long strip, is evenly distributed in inside silica gel frame 1.
Alternatively, it is end to end that the radiating fin 7, which is between interlaced arrangement and adjacent heat radiation fin 7,.
The working principle of the invention is: by the setting of silica gel frame 1, can effectively improve the shock resistance of PTC euthermic chip 2
Ability, therefore its safety is improved, facilitate popularization；Aluminium film 3 is set, as conductive, heat-conducting medium, is optimized outside PTC euthermic chip 2
Performance, energy-saving effect is obviously improved；Ceramic insulation piece 5 is set, and good insulation preformance, thermal coefficient is high, can reduce PTC fever
The temperature of chip 2 improves its thermal-shock resistance and anti-aging property；Heat-radiation belt 6 and radiating fin 7 are set, it can be further
Its heat dissipation performance is improved, the temperature of PTC euthermic chip 2 is then reduced.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (4)
1. a kind of PTC heat radiating structure, which is characterized in that including the silica gel frame for installing PTC euthermic chip, on the silica gel frame
It is provided with the multiple and matched through-hole of PTC euthermic chip；Pass through conducting resinl outside the PTC euthermic chip and is coated with aluminium film；It is described
Silica gel outer frame side is provided with the electrode slice connecting with PTC euthermic chip, is provided with ceramic insulation piece on the outside of the electrode slice, described
Be provided with heat-radiation belt outside ceramic insulation piece, the section of the heat-radiation belt be in U-shape shape and its be internally provided with multiple radiating fins.
2. PTC heat radiating structure according to claim 1, which is characterized in that the PTC euthermic chip and electrode slice pass through silicon
Glue sticking.
3. PTC heat radiating structure according to claim 1, which is characterized in that the PTC euthermic chip is in long strip, uniformly
Be distributed in inside silica gel frame.
4. PTC heat radiating structure according to claim 1, which is characterized in that the radiating fin is interlaced arrangement and adjacent
It is end to end between radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822216271.7U CN209693074U (en) | 2018-12-27 | 2018-12-27 | A kind of PTC heat radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822216271.7U CN209693074U (en) | 2018-12-27 | 2018-12-27 | A kind of PTC heat radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209693074U true CN209693074U (en) | 2019-11-26 |
Family
ID=68597215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822216271.7U Expired - Fee Related CN209693074U (en) | 2018-12-27 | 2018-12-27 | A kind of PTC heat radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209693074U (en) |
-
2018
- 2018-12-27 CN CN201822216271.7U patent/CN209693074U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191126 Termination date: 20211227 |