CN209691684U - Circuit protecting element - Google Patents
Circuit protecting element Download PDFInfo
- Publication number
- CN209691684U CN209691684U CN201920910708.9U CN201920910708U CN209691684U CN 209691684 U CN209691684 U CN 209691684U CN 201920910708 U CN201920910708 U CN 201920910708U CN 209691684 U CN209691684 U CN 209691684U
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- China
- Prior art keywords
- layer
- insulating substrate
- components department
- circuit protecting
- protecting element
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Abstract
The purpose of this utility model is to provide a kind of circuit protecting elements that can be improved resistance to vulcanization characteristics.The circuit protecting element of the utility model has: insulating substrate (11)；A pair of of upper surface electrode (12) is arranged at the both ends of the upper surface of the insulating substrate (11)；Components department (13) is electrically connected with the pair of upper surface electrode (12)；And insulating layer (17), resin by covering the components department (13) is constituted, the components department (13) is constituted and pressing the sequence of resistivity from small to large from the upper surface side of the insulating substrate (11) and multiple metal layer (13d) are laminated, and the whole face of the metal layer (13d) by the metal layer (13d) on its upper layer covering lower layer.
Description
Technical field
The utility model relates to fuse to protect the circuit protecting element of various electronic equipments when overcurrent flows through.
Background technique
As shown in figure 3, previous this circuit protecting element has: insulating substrate 1；A pair of of upper surface electrode 2, setting exist
The both ends of the upper surface of the insulating substrate 1；Components department 3 bridges a pair of upper surface electrode 2；Basal layer 4, is formed in this yuan
Between part portion 3 and the insulating substrate 1；End electrode 5 is formed in both ends of insulating substrate 1 and upper with the components department 3
Surface connection；And insulating layer 6, protect the components department 3.
In addition, as citation associated with the utility model of present application, such as it has been known that there is patent documents 1.
Citation
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2001-273847 bulletin
Utility model content
The utility model project to be solved
In above-mentioned previous structure, it is easy using in the case where components department 3 generates the metals such as the silver of sulfide, if
Circuit protecting element is used in vulcanized gas, then silver occurs chemical reaction with sulfatin factor and forms sulfide, therefore resistance
Value can change, and there is resistance to vulcanization characteristics can deteriorate such project.
Utility model aims to solve the above subject, provide a kind of circuit protection that can be improved resistance to vulcanization characteristics
Element.
Means for solving the problems
Circuit protecting element involved in 1st mode has: insulating substrate；A pair of of upper surface electrode, setting is described exhausted
The both ends of the upper surface of edge substrate；Components department is electrically connected with the pair of upper surface electrode；And insulating layer, described in covering
Components department, the components department are multiple by being laminated from the upper surface side of the insulating substrate by the sequence of resistivity from small to large
Metal layer and constitute, and by the upside of it the metal layer covering downside the metal layer whole face.
In the circuit protecting element involved in the 2nd mode, in the 1st mode, the metal layer is from the insulating substrate
Upper surface side constituted by the sequence of silver layer, layers of copper, nickel layer.
In the circuit protecting element involved in the 3rd mode, in the 2nd mode, covering is formed in the surface of the nickel layer
Oxide skin(coating) configure the insulating layer.
Utility model effect
As described above, in the circuit protecting element of the utility model, due to the top layer in components department in components department
It is formed with the resistivity for being difficult to vulcanize big metal or nickel layer, therefore can play and can be improved the such effect of resistance to vulcanization characteristics
Fruit.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the circuit protecting element in an embodiment of the utility model.
Fig. 2 is partly cut-away's top view of the circuit protecting element.
Fig. 3 is the cross-sectional view of previous circuit protecting element.
Specific embodiment
Fig. 1 is the cross-sectional view of the circuit protecting element in an embodiment of the utility model, and Fig. 2 is the circuit protection
Partly cut-away's top view of the main portions of element, the electricity as shown in Fig. 1, the Fig. 2, in an embodiment of the utility model
Road protection element has: insulating substrate 11；A pair of of upper surface electrode 12, is arranged in the both ends of the upper surface of the insulating substrate 11
Portion；Components department 13 is formed as bridging a pair of upper surface electrode 12, and is electrically connected with the pair of upper surface electrode 12；
Basal layer 14 is arranged between the components department 13 and the insulating substrate 11；And fuse part 15, it is formed at the substrate
The components department 13 of the upper surface of layer 14.
In addition, being overlappingly formed with a part of components department 13 by the material of silver system at the both ends of insulating substrate 11
The end electrode layer 16 of composition, and plated film (not shown) is formed on the surface of the end electrode layer 16.In turn, electric from end face
Insulating layer 17 made of silicone is provided in the components department 13 that pole layer 16 exposes.In addition, in Fig. 2, to simplify the explanation,
End electrode layer 16, insulating layer 17 is omitted.
In said structure, the shape of the insulating substrate 11 is rectangular, and by the Al containing 55%~96%2O3's
Aluminium oxide is constituted.
In addition, the both ends of the upper surface of insulating substrate 11 are arranged in the pair of upper surface electrode 12, and pass through print
It brushes Ag etc. and is formed.
Moreover, the components department 13 be formed as cover insulating substrate 11 at least part, and be located at basal layer 14 and
The upper surface of a pair of of upper surface electrode 12 and be arranged.The components department 13 uses sputtering, vapor deposition etc. by the sequence according to Cr, Cu, Ni
The lower layer (hereinafter, not shown) and be sequentially formed with silver layer 13a, layers of copper in the upper surface of lower layer that physical vapor flop-in method is formed
The metal layer 13d composition of 13b, nickel layer 13c.
Silver layer 13a is using lower layer as core is electroplated and is formed.In addition, silver layer 13a covers a pair of of upper surface electrode 12
Whole face.Layers of copper 13b by covering silver layer 13a by entire surface be electroplated to be formed, nickel layer 13c by covering layers of copper 13b it is whole
It is electroplated and is formed to face.Since nickel layer 13c covers the silver layer 13a of resistance to vulcanization characteristics difference, the whole face of layers of copper 13b, make
It is improved for the resistance to vulcanization characteristics of circuit protecting element.In turn, the whole face of nickel layer 13c is covered by insulating layer 17.
In addition, the components department 13 central part by laser from the side of mutually opposed components department 13 towards element
The center position in portion 13 forms trim slots 18 at two, moreover, the region impaled by the two trim slots 18, which becomes, was applying electricity
The fuse part 15 for melting and breaking when stream.
In addition, trim slots 18 may not be as shown in Figure 2 linear, but the other shapes such as L-shaped.In turn,
The trim slots of resistance value adjustment can also be additionally formed.
Moreover, the central portion of the upper surface of insulating substrate 11 is arranged in the basal layer 14, and the basal layer 14 is arranged
In the components department 13 between the pair of upper surface electrode 12 and between insulating substrate 11.In addition, the basal layer 14 with by
SiO2Etc. compositions glass be principal component.
In addition, being formed on its surface the oxidation film of nickel if placing certain time after forming nickel layer 13c.Moreover, if covering
Form insulating layer 17 with covering the oxidation film, then with 13 surface of components department be metal (nickel layer 13c) the case where compared with, components department 13 with
The cementability of insulating layer 17 is improved.
In an embodiment of above-mentioned the utility model, sulphur is difficult to due to being formed in components department 13 in top layer
Change, i.e. resistivity big metal, particularly nickel, therefore can obtain can be improved effect as resistance to vulcanization characteristics.
At this point, using the worst silver layer 13a of resistance to vulcanization characteristics as the lowest level of components department 13.Moreover, as components department 13,
With resistance to vulcanization characteristics from difference to good sequence (that is, the sequence of resistivity from low to high), according to silver layer 13a, layers of copper 13b, nickel layer
The sequence of 13c is laminated, therefore can reliably improve resistance to vulcanization characteristics.
In addition, when forming trim slots 18 by laser, due to using the big nickel layer 13c of laser absorption rate as components department 13
Top layer, therefore the power setting of laser can be obtained small, thereby, it is possible to inhibit the components department 13 when the formation of trim slots 18
Temperature rises, therefore resistance value is stablized, and operating chacteristics is improved.
In turn, although since silver layer 13a connects with layers of copper 13b, will form the silver melted when flowing through overcurrent and
The eutectic alloy of copper, still, since the fusing point of the alloy is down to 788 DEG C, the copper melted by the alloying is in nickel layer
It is spread among 13c, so that the fusing point of 13 entirety of components department can reduce, thus, it is possible to so that fuse part 15 is fused in the short time.
Industrial availability
Circuit protecting element involved in the utility model, which has, can be improved effect as resistance to vulcanization characteristics, especially
It is useful in circuit protecting element for fusing to protect various electronic equipments when overcurrent flows through etc..
Description of symbols
11: insulating substrate
12: upper surface electrode
13: components department
13a: silver layer
13b: layers of copper
13c: nickel layer
13d: metal layer
17: insulating layer
Claims (3)
1. a kind of circuit protecting element, which is characterized in that have:
Insulating substrate；
The both ends of the upper surface of the insulating substrate are arranged in a pair of of upper surface electrode；
Components department is electrically connected with the pair of upper surface electrode；And
Insulating layer covers the components department,
The components department is by being laminated multiple gold by the sequence of resistivity from small to large from the upper surface side of the insulating substrate
Belong to layer and constitute, and the whole face of the metal layer by the metal layer covering downside on the upside of it.
2. circuit protecting element according to claim 1, which is characterized in that
The metal layer is constituted from the upper surface side of the insulating substrate by the sequence of silver layer, layers of copper, nickel layer.
3. circuit protecting element according to claim 2, which is characterized in that
Covering configures the insulating layer with being formed in the oxide skin(coating) on the surface of the nickel layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018126475A JP7220344B2 (en) | 2018-07-03 | 2018-07-03 | circuit protection element |
| JP2018-126475 | 2018-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209691684U true CN209691684U (en) | 2019-11-26 |
Family
ID=68609562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920910708.9U Active CN209691684U (en) | 2018-07-03 | 2019-06-17 | Circuit protecting element |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7220344B2 (en) |
| CN (1) | CN209691684U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113937606A (en) * | 2021-10-14 | 2022-01-14 | 浙江水晶光电科技股份有限公司 | Circuit protection element and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5627291B2 (en) * | 2010-05-21 | 2014-11-19 | 京セラ株式会社 | Current fuse device and circuit board |
| JP2014096272A (en) * | 2012-11-09 | 2014-05-22 | Panasonic Corp | Circuit protection element |
-
2018
- 2018-07-03 JP JP2018126475A patent/JP7220344B2/en active Active
-
2019
- 2019-06-17 CN CN201920910708.9U patent/CN209691684U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113937606A (en) * | 2021-10-14 | 2022-01-14 | 浙江水晶光电科技股份有限公司 | Circuit protection element and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020009531A (en) | 2020-01-16 |
| JP7220344B2 (en) | 2023-02-10 |
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| GR01 | Patent grant |