CN209690937U - Optical finger print detection components under a kind of screen - Google Patents

Optical finger print detection components under a kind of screen Download PDF

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Publication number
CN209690937U
CN209690937U CN201920292472.7U CN201920292472U CN209690937U CN 209690937 U CN209690937 U CN 209690937U CN 201920292472 U CN201920292472 U CN 201920292472U CN 209690937 U CN209690937 U CN 209690937U
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China
Prior art keywords
substrate
chip
card
finger print
detection components
Prior art date
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Active
Application number
CN201920292472.7U
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Chinese (zh)
Inventor
蔡国蔚
陈真光
刘自涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI FEIGEEN MICROELECTRONICS TECHNOLOGY Co.,Ltd.
Original Assignee
Shanghai Figorn Microelectronics Technology Co Ltd
CHENGDU FEIENGEER MICROELECTRONICS TECHNOLOGY Co Ltd
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Application filed by Shanghai Figorn Microelectronics Technology Co Ltd, CHENGDU FEIENGEER MICROELECTRONICS TECHNOLOGY Co Ltd filed Critical Shanghai Figorn Microelectronics Technology Co Ltd
Priority to CN201920292472.7U priority Critical patent/CN209690937U/en
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Abstract

The utility model discloses optical finger print detection components under a kind of screen, including CMOS sensing chip, DVP interface circuit, MCU processing chip, card i/f and substrate;The CMOS sensing chip uses unencapsulated nude film structure, and bare die is adhered on the upside of substrate with conducting resinl;The DVP interface circuit and MCU processing chip are arranged on the downside of substrate, and the CMOS sensing chip is connected to MCU by DVP interface circuit and handles chip;The card i/f setting is electrically connected in substrate side, the card i/f with MCU processing chip, and the card i/f is mutually inserted with identifying processing plate.The utility model is capable of the detection of fingerprint image quickly and efficiently, improves authentic data guarantee for subsequent fingerprint identification;Installation process is convenient and quick.

Description

Optical finger print detection components under a kind of screen
Technical field
The utility model belongs to optical finger print detection components under fingerprinting detection technique field more particularly to a kind of screen.
Background technique
In recent years, fingerprint identification technology industry achieves the development advanced by leaps and bounds.Surging, the In realized with global safety Under the background of mature cmos image acquisition technique and the market demand, promote the generation of optical finger print technology, for screen hand comprehensively The electronic products such as machine, Fingerprint Lock develop skill support.Used fingerprint product also show it is varied, still, no matter what Plant product, it is necessary to have the characteristics of safe, easy for installation use, strong environmental adaptability, if cost can be taken into account and used It is convenient, then have more market prospects.
Currently used fingerprint detection component will test more and be partially encapsulated on fingerprint identification device, so that production work Skill complicates;And the existing signal for mostly detecting fingerprint sensor is directly passed to identification chip and is sentenced by identification chip It is disconnected, the workload of identification chip is improved, recognition speed is greatly reduced, can not fast and accurately realize fingerprint detection.
Utility model content
In order to overcome the shortcomings of art methods, the purpose of this utility model is that proposing that optical finger print is examined under a kind of screen Component is surveyed, the detection of fingerprint image quickly and efficiently is capable of, improves authentic data guarantee for subsequent fingerprint identification;It installed Journey is convenient and quick.
In order to achieve the above object, the utility model is using technical solution: optical finger print detection components under a kind of screen, including CMOS sensing chip, DVP interface circuit, MCU processing chip, card i/f and substrate;The CMOS sensing chip is used and is not sealed The nude film structure of dress, bare die are adhered on the upside of substrate with conducting resinl;The DVP interface circuit and MCU processing chip are arranged at On the downside of substrate, the CMOS sensing chip is connected to MCU by DVP interface circuit and handles chip;The card i/f setting exists At substrate lower edge, the card i/f is electrically connected with MCU processing chip, and the card i/f and identifying processing plate are mutual Grafting.
Further, further including filter circuit and esd protection circuit, the filter circuit and esd protection circuit are all provided with It sets on the downside of substrate and is connected to CMOS sensing chip;Using filter circuit and ESD protection circuit, the anti-of entire mould group is enhanced Interference performance and antistatic effect.
Further, the card i/f is golden finger type interface, it is convenient for and identifying processing plate grafting, realization plate pair Plate connection, is installed and used very convenient.
Further, the substrate uses FPC flexible board, realizes the stickiness of screen, prevent screen from damaging.
Using the technical program the utility model has the advantages that
CMOS sensing chip is adhered on interconnection substrates using bare die with conducting resinl in the utility model, and bare die flatness is excellent In encapsulation chip;Other component setting is improved into the accurate of detection in substrate opposite face conducive to the image distance of control image simultaneously Degree;
Entire mould group carries MCU and handles chip in the utility model, realizes the pretreatment of image;And MCU handles chip The transfer for passing through DVP interface circuit with CMOS sensing chip can efficiently transmit image data, improve data transfer effect Rate shortens the response time of entire component;
The utility model is easy to implement plate and connected to plate, installed and used very convenient by setting card i/f.
Detailed description of the invention
Fig. 1 be the utility model a kind of screen under optical finger print detection components structural schematic diagram;
Fig. 2 be the utility model a kind of screen under optical finger print detection components connection schematic diagram;
Wherein, 1 is CMOS sensing chip, and 2 be DVP interface circuit, and 3 be MCU processing chip, and 4 be card i/f, and 5 be base Plate.
Specific embodiment
In order to keep the purposes, technical schemes and advantages of utility model clearer, with reference to the accompanying drawing to the utility model It is further elaborated.
In the present embodiment, referring to shown in Fig. 1-Fig. 2, optical finger print detection components under a kind of screen, including CMOS sense core Piece 1, DVP interface circuit 2, MCU processing chip 3, card i/f 4 and substrate 5;The CMOS sensing chip 1 is using unencapsulated Nude film structure, bare die are adhered to 5 upside of substrate with conducting resinl;The DVP interface circuit 2 and MCU processing chip 3 are arranged at base 5 downside of plate, the CMOS sensing chip 1 are connected to MCU by DVP interface circuit 2 and handle chip 3;The card i/f 4 is arranged At 5 lower edge of substrate, the card i/f 4 is electrically connected with MCU processing chip 3, the card i/f 4 and identifying processing plate Part is mutually inserted.
Further include filter circuit and esd protection circuit as the prioritization scheme of above-described embodiment, the filter circuit and Esd protection circuit is arranged at 5 downside of substrate and is connected to CMOS sensing chip 1;Using filter circuit and ESD protection circuit, Enhance the anti-interference ability and antistatic effect of entire mould group.
As the prioritization scheme of above-described embodiment, the card i/f 4 is golden finger type interface, is convenient for and identifying processing plate Part grafting is realized that plate connects plate, is installed and used very convenient.
As the prioritization scheme of above-described embodiment, the substrate 5 uses FPC flexible board, realizes the stickiness of screen, prevents Screen damage.
In order to better understand the utility model, primary complete description is made to the working principle of the utility model below:
By other component setting in 5 opposite face of substrate, CMOS sensing chip 1 is adhered to interconnection base with conducting resinl using bare die On plate 5, bare die flatness controls the image distance of image better than encapsulation chip;
By MCU handle chip 3 to CMOS sensing chip 1 acquire image pre-process, and MCU processing chip 3 with CMOS sensing chip 1 passes through the transfer of DVP interface circuit 2, can efficiently transmit image data, improve data transfer effect Rate shortens the response time of entire component;
It is mutually inserted by setting card i/f 4 with identifying processing plate, is easy to implement plate and plate is connected.
Basic principles, main features, and advantages of the present invention has been shown and described above.Current row The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model Claimed range is defined by the appending claims and its equivalent thereof.

Claims (4)

1. optical finger print detection components under a kind of screen, which is characterized in that including CMOS sensing chip (1), DVP interface circuit (2), MCU handles chip (3), card i/f (4) and substrate (5);The CMOS sensing chip (1) uses unencapsulated nude film structure, Bare die is adhered on the upside of substrate (5) with conducting resinl;The DVP interface circuit (2) and MCU processing chip (3) are arranged at substrate (5) downside, the CMOS sensing chip (1) are connected to MCU processing chip (3) by DVP interface circuit (2);The plug-in unit connects Mouth (4) is arranged at substrate (5) lower edge, and the card i/f (4) is electrically connected with MCU processing chip (3), and the plug-in unit connects Mouth (4) is mutually inserted with identifying processing plate.
2. optical finger print detection components under a kind of screen according to claim 1, which is characterized in that further include filter circuit and Esd protection circuit, the filter circuit and esd protection circuit are arranged on the downside of substrate (5) and are connected to CMOS sensing chip (1)。
3. optical finger print detection components under a kind of screen according to claim 1, which is characterized in that the card i/f (4) For golden finger type interface.
4. optical finger print detection components under a kind of screen according to claim 1, which is characterized in that the substrate (5) uses FPC flexible board.
CN201920292472.7U 2019-03-08 2019-03-08 Optical finger print detection components under a kind of screen Active CN209690937U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920292472.7U CN209690937U (en) 2019-03-08 2019-03-08 Optical finger print detection components under a kind of screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920292472.7U CN209690937U (en) 2019-03-08 2019-03-08 Optical finger print detection components under a kind of screen

Publications (1)

Publication Number Publication Date
CN209690937U true CN209690937U (en) 2019-11-26

Family

ID=68604065

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920292472.7U Active CN209690937U (en) 2019-03-08 2019-03-08 Optical finger print detection components under a kind of screen

Country Status (1)

Country Link
CN (1) CN209690937U (en)

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GR01 Patent grant
GR01 Patent grant
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Effective date of registration: 20201109

Address after: Room 203, 2nd floor, 497 Gauss Road, China (Shanghai) Free Trade Pilot Area, Pudong New Area, Shanghai 200000

Patentee after: SHANGHAI FEIGEEN MICROELECTRONICS TECHNOLOGY Co.,Ltd.

Address before: No.22 and No.23, 3rd floor, building 1, No.1268, middle section of Tianfu Avenue, high tech Zone, Chengdu, Sichuan Province

Patentee before: CHENGDU FINGER MICROELECTRONIC TECHNOLOGY Co.,Ltd.

Patentee before: SHANGHAI FEIGEEN MICROELECTRONICS TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right
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Effective date of registration: 20240913

Granted publication date: 20191126