CN209690937U - Optical finger print detection components under a kind of screen - Google Patents
Optical finger print detection components under a kind of screen Download PDFInfo
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- CN209690937U CN209690937U CN201920292472.7U CN201920292472U CN209690937U CN 209690937 U CN209690937 U CN 209690937U CN 201920292472 U CN201920292472 U CN 201920292472U CN 209690937 U CN209690937 U CN 209690937U
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Abstract
The utility model discloses optical finger print detection components under a kind of screen, including CMOS sensing chip, DVP interface circuit, MCU processing chip, card i/f and substrate；The CMOS sensing chip uses unencapsulated nude film structure, and bare die is adhered on the upside of substrate with conducting resinl；The DVP interface circuit and MCU processing chip are arranged on the downside of substrate, and the CMOS sensing chip is connected to MCU by DVP interface circuit and handles chip；The card i/f setting is electrically connected in substrate side, the card i/f with MCU processing chip, and the card i/f is mutually inserted with identifying processing plate.The utility model is capable of the detection of fingerprint image quickly and efficiently, improves authentic data guarantee for subsequent fingerprint identification；Installation process is convenient and quick.
Description
Technical field
The utility model belongs to optical finger print detection components under fingerprinting detection technique field more particularly to a kind of screen.
Background technique
In recent years, fingerprint identification technology industry achieves the development advanced by leaps and bounds.Surging, the In realized with global safety
Under the background of mature cmos image acquisition technique and the market demand, promote the generation of optical finger print technology, for screen hand comprehensively
The electronic products such as machine, Fingerprint Lock develop skill support.Used fingerprint product also show it is varied, still, no matter what
Plant product, it is necessary to have the characteristics of safe, easy for installation use, strong environmental adaptability, if cost can be taken into account and used
It is convenient, then have more market prospects.
Currently used fingerprint detection component will test more and be partially encapsulated on fingerprint identification device, so that production work
Skill complicates；And the existing signal for mostly detecting fingerprint sensor is directly passed to identification chip and is sentenced by identification chip
It is disconnected, the workload of identification chip is improved, recognition speed is greatly reduced, can not fast and accurately realize fingerprint detection.
Utility model content
In order to overcome the shortcomings of art methods, the purpose of this utility model is that proposing that optical finger print is examined under a kind of screen
Component is surveyed, the detection of fingerprint image quickly and efficiently is capable of, improves authentic data guarantee for subsequent fingerprint identification；It installed
Journey is convenient and quick.
In order to achieve the above object, the utility model is using technical solution: optical finger print detection components under a kind of screen, including
CMOS sensing chip, DVP interface circuit, MCU processing chip, card i/f and substrate；The CMOS sensing chip is used and is not sealed
The nude film structure of dress, bare die are adhered on the upside of substrate with conducting resinl；The DVP interface circuit and MCU processing chip are arranged at
On the downside of substrate, the CMOS sensing chip is connected to MCU by DVP interface circuit and handles chip；The card i/f setting exists
At substrate lower edge, the card i/f is electrically connected with MCU processing chip, and the card i/f and identifying processing plate are mutual
Grafting.
Further, further including filter circuit and esd protection circuit, the filter circuit and esd protection circuit are all provided with
It sets on the downside of substrate and is connected to CMOS sensing chip；Using filter circuit and ESD protection circuit, the anti-of entire mould group is enhanced
Interference performance and antistatic effect.
Further, the card i/f is golden finger type interface, it is convenient for and identifying processing plate grafting, realization plate pair
Plate connection, is installed and used very convenient.
Further, the substrate uses FPC flexible board, realizes the stickiness of screen, prevent screen from damaging.
Using the technical program the utility model has the advantages that
CMOS sensing chip is adhered on interconnection substrates using bare die with conducting resinl in the utility model, and bare die flatness is excellent
In encapsulation chip；Other component setting is improved into the accurate of detection in substrate opposite face conducive to the image distance of control image simultaneously
Degree；
Entire mould group carries MCU and handles chip in the utility model, realizes the pretreatment of image；And MCU handles chip
The transfer for passing through DVP interface circuit with CMOS sensing chip can efficiently transmit image data, improve data transfer effect
Rate shortens the response time of entire component；
The utility model is easy to implement plate and connected to plate, installed and used very convenient by setting card i/f.
Detailed description of the invention
Fig. 1 be the utility model a kind of screen under optical finger print detection components structural schematic diagram；
Fig. 2 be the utility model a kind of screen under optical finger print detection components connection schematic diagram；
Wherein, 1 is CMOS sensing chip, and 2 be DVP interface circuit, and 3 be MCU processing chip, and 4 be card i/f, and 5 be base
Plate.
Specific embodiment
In order to keep the purposes, technical schemes and advantages of utility model clearer, with reference to the accompanying drawing to the utility model
It is further elaborated.
In the present embodiment, referring to shown in Fig. 1-Fig. 2, optical finger print detection components under a kind of screen, including CMOS sense core
Piece 1, DVP interface circuit 2, MCU processing chip 3, card i/f 4 and substrate 5；The CMOS sensing chip 1 is using unencapsulated
Nude film structure, bare die are adhered to 5 upside of substrate with conducting resinl；The DVP interface circuit 2 and MCU processing chip 3 are arranged at base
5 downside of plate, the CMOS sensing chip 1 are connected to MCU by DVP interface circuit 2 and handle chip 3；The card i/f 4 is arranged
At 5 lower edge of substrate, the card i/f 4 is electrically connected with MCU processing chip 3, the card i/f 4 and identifying processing plate
Part is mutually inserted.
Further include filter circuit and esd protection circuit as the prioritization scheme of above-described embodiment, the filter circuit and
Esd protection circuit is arranged at 5 downside of substrate and is connected to CMOS sensing chip 1；Using filter circuit and ESD protection circuit,
Enhance the anti-interference ability and antistatic effect of entire mould group.
As the prioritization scheme of above-described embodiment, the card i/f 4 is golden finger type interface, is convenient for and identifying processing plate
Part grafting is realized that plate connects plate, is installed and used very convenient.
As the prioritization scheme of above-described embodiment, the substrate 5 uses FPC flexible board, realizes the stickiness of screen, prevents
Screen damage.
In order to better understand the utility model, primary complete description is made to the working principle of the utility model below:
By other component setting in 5 opposite face of substrate, CMOS sensing chip 1 is adhered to interconnection base with conducting resinl using bare die
On plate 5, bare die flatness controls the image distance of image better than encapsulation chip；
By MCU handle chip 3 to CMOS sensing chip 1 acquire image pre-process, and MCU processing chip 3 with
CMOS sensing chip 1 passes through the transfer of DVP interface circuit 2, can efficiently transmit image data, improve data transfer effect
Rate shortens the response time of entire component；
It is mutually inserted by setting card i/f 4 with identifying processing plate, is easy to implement plate and plate is connected.
Basic principles, main features, and advantages of the present invention has been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (4)
1. optical finger print detection components under a kind of screen, which is characterized in that including CMOS sensing chip (1), DVP interface circuit (2),
MCU handles chip (3), card i/f (4) and substrate (5)；The CMOS sensing chip (1) uses unencapsulated nude film structure,
Bare die is adhered on the upside of substrate (5) with conducting resinl；The DVP interface circuit (2) and MCU processing chip (3) are arranged at substrate
(5) downside, the CMOS sensing chip (1) are connected to MCU processing chip (3) by DVP interface circuit (2)；The plug-in unit connects
Mouth (4) is arranged at substrate (5) lower edge, and the card i/f (4) is electrically connected with MCU processing chip (3), and the plug-in unit connects
Mouth (4) is mutually inserted with identifying processing plate.
2. optical finger print detection components under a kind of screen according to claim 1, which is characterized in that further include filter circuit and
Esd protection circuit, the filter circuit and esd protection circuit are arranged on the downside of substrate (5) and are connected to CMOS sensing chip
(1)。
3. optical finger print detection components under a kind of screen according to claim 1, which is characterized in that the card i/f (4)
For golden finger type interface.
4. optical finger print detection components under a kind of screen according to claim 1, which is characterized in that the substrate (5) uses
FPC flexible board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920292472.7U CN209690937U (en) | 2019-03-08 | 2019-03-08 | Optical finger print detection components under a kind of screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920292472.7U CN209690937U (en) | 2019-03-08 | 2019-03-08 | Optical finger print detection components under a kind of screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209690937U true CN209690937U (en) | 2019-11-26 |
Family
ID=68604065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920292472.7U Active CN209690937U (en) | 2019-03-08 | 2019-03-08 | Optical finger print detection components under a kind of screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209690937U (en) |
-
2019
- 2019-03-08 CN CN201920292472.7U patent/CN209690937U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201109 Address after: Room 203, 2nd floor, 497 Gauss Road, China (Shanghai) Free Trade Pilot Area, Pudong New Area, Shanghai 200000 Patentee after: SHANGHAI FEIGEEN MICROELECTRONICS TECHNOLOGY Co.,Ltd. Address before: No.22 and No.23, 3rd floor, building 1, No.1268, middle section of Tianfu Avenue, high tech Zone, Chengdu, Sichuan Province Patentee before: CHENGDU FINGER MICROELECTRONIC TECHNOLOGY Co.,Ltd. Patentee before: SHANGHAI FEIGEEN MICROELECTRONICS TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |