CN209676624U - Pcb board film removing device - Google Patents
Pcb board film removing device Download PDFInfo
- Publication number
- CN209676624U CN209676624U CN201920169766.0U CN201920169766U CN209676624U CN 209676624 U CN209676624 U CN 209676624U CN 201920169766 U CN201920169766 U CN 201920169766U CN 209676624 U CN209676624 U CN 209676624U
- Authority
- CN
- China
- Prior art keywords
- pcb board
- postive stop
- removing device
- film removing
- membrane removal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
The utility model discloses a kind of pcb board film removing device, and the pcb board film removing device includes rack, and be mounted on the rack membrane removal mechanism, into trigger structure, position limiting structure.Protective film of the membrane removal mechanism to remove its two sides of pcb board.It is described into trigger structure to drive pcb board to be moved to the membrane removal mechanism.The position limiting structure is located at described between trigger structure and the membrane removal mechanism, the position limiting structure includes in two postive stop baffles being oppositely arranged, a limit channels are limited between two postive stop baffles, the limit channels are with so that pcb board passes through and shifts to the membrane removal mechanism.The pcb board film removing device of the utility model can reduce the case where pcb board is bent or deforms during membrane removal, and pcb board is avoided to damage or be broken.
Description
Technical field
The utility model relates to pcb boards to remove technical field of membrane, in particular to a kind of pcb board film removing device.
Background technique
Pcb board is when doing pattern transfer process, it will usually attach dry film in the two sides of pcb board, and paste on dry film surface
Protective film prevents dry film from scratching.The pattern on dry film is transferred on pcb board by exposure process.Before developing after exposure, need
The protective film on its two sides of pcb board is removed using pcb board film removing device, dissolves unexposed dry film to develop, it will
The pattern displaying needed comes out.
Currently, conventional pcb board film removing device is in membrane removal, the membrane removal mechanism of pcb board film removing device advances along pcb board
The forward edge in direction first separates edge of the protective film of its two sides of pcb board respectively in conjunction with dry film, then simultaneously to protection
Film is torn, and protective film is made to be detached from the dry film on its two sides of pcb board.However, since membrane removal mechanism applies its two sides of pcb board
Amount of force is different, the factors such as protective film dynamics from dry film ining conjunction with is different, transmission mechanism vibrates, be easy to cause pcb board inclined
Curving or deformation thereto cause different degrees of damage, or even fracture.
Utility model content
The main purpose of the utility model is to propose a kind of pcb board film removing device, it is intended to reduce pcb board during membrane removal
The case where being bent or deforming avoids pcb board from damaging or be broken.
To achieve the above object, the utility model proposes a kind of pcb board film removing device, the pcb board film removing device includes
Rack, and be mounted on the rack membrane removal mechanism, into trigger structure, position limiting structure.The membrane removal mechanism is to remove PCB
The protective film of its two sides of plate.It is described into trigger structure to drive pcb board to be moved to the membrane removal mechanism.The position limiting structure position
In described between trigger structure and the membrane removal mechanism, the position limiting structure includes in two postive stop baffles being oppositely arranged two
A limit channels are limited between a postive stop baffle, the limit channels are with so that pcb board passes through and shifts to the membrane removal
Mechanism.
In one embodiment, two postive stop baffles are vertically to being oppositely arranged.
In one embodiment, the spacing between two postive stop baffles is adjustable.
In one embodiment, the pcb board film removing device further includes driving device, and the driving device is at least with wherein one
A postive stop baffle connection, adjusts the spacing between two postive stop baffles to drive the postive stop baffle mobile.
In one embodiment, the driving device includes the first driving structure and the second driving structure；Wherein, described first
Driving structure is connect with postive stop baffle described in one of them；Second driving structure is connect with postive stop baffle described in another.
In one embodiment, the pcb board film removing device further includes controller and detection structure；Wherein, the detection knot
Structure is used to detect the thickness of the pcb board；The controller is all connected with the detection structure and the driving device, to root
According to the thickness for the pcb board that the detection structure detects, controls the driving device and adjust between two postive stop baffles
Spacing.
In one embodiment, the detection structure includes in two non-contact type probes being oppositely arranged, and two described non-
Contact type probe is connect with the controller.
In one embodiment, the distance of the postive stop baffle to the membrane removal mechanism is 8mm~15mm.
In one embodiment, the postive stop baffle along it is described into trigger structure into the width on plate direction be 3mm~7mm.
In one embodiment, the postive stop baffle to the spacing between the side of the pcb board be 0.3mm~0.5mm.
The technical solution of the utility model, by the way that position-limit mechanism is being arranged between trigger structure and membrane removal mechanism, the limit
Mechanism includes limiting a limit channels between two postive stop baffles, the limit is logical in two postive stop baffles being oppositely arranged
Road passes through and shifts to membrane removal mechanism with for pcb board, the trend of lateral bending occurs in the tensile force active position in pcb board
When, by above-mentioned two postive stop baffle backstop pcb board so that pcb board is difficult to happen bending deformation, thus avoid pcb board damage or
Fracture.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of the utility model pcb board film removing device；
Fig. 2 is the schematic illustration of pcb board film removing device in Fig. 1；
Fig. 3 is the schematic illustration of another embodiment of the utility model pcb board film removing device.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 10 | Rack | 29 | Third mounting rack |
| 20 | Membrane removal mechanism | 30 | Into trigger structure |
| 21 | First roller bearing | 31 | Into plate pedestal |
| 22 | Second roller bearing | 32 | First roller groups |
| 23 | First rotating shaft | 33 | Second roller groups |
| 24 | Second shaft | 40 | Postive stop baffle |
| 25 | First tensioning shaft | 50 | Pcb board |
| 26 | Second tensioning shaft | 60 | Protective film |
| 27 | First mounting rack | 70 | Controller |
| 28 | Second mounting rack | 80 | Non-contact type probe |
The utility model aim is realized, the embodiments will be further described with reference to the accompanying drawings for functional characteristics and advantage.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that if related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding,
Afterwards ...), then directionality instruction is only used for explaining opposite between each component under a certain particular pose (as shown in the picture)
Positional relationship, motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, if relating to the description of " first ", " second " etc. in the utility model embodiment, " first ", " the
Two " etc. description is used for description purposes only, and is not understood to indicate or imply its relative importance or is implicitly indicated meaning
The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one
A this feature.It in addition, the technical solution between each embodiment can be combined with each other, but must be with ordinary skill
Based on personnel can be realized, this technical side will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of case is not present, also not within the protection scope of the requires of the utility model.
The utility model discloses a kind of pcb board film removing device, and the pcb board film removing device is used to after pcb board exposure show
Before shadow, the protective film on its two sides of pcb board is removed, dissolves unexposed dry film to develop, the pattern of needs is shown
It shows and.The pcb board film removing device can reduce the case where pcb board is bent or deforms during membrane removal, avoid PCB
Dash-board injury or fracture.It should be noted that the interface that the pcb board is integrated with chip and is connected to for the chip with external circuit.
Please refer to Fig. 1 and Fig. 2, the pcb board film removing device of the utility model, including rack 10, membrane removal mechanism 20, into trigger
Structure 30 and position limiting structure.Membrane removal mechanism 20 is mounted in rack 10 into trigger structure 30 and the position limiting structure.Wherein, membrane removal machine
Protective film 60 of the structure 20 to remove 50 its two sides of pcb board.Into trigger structure 30 to drive pcb board 50 to be moved to membrane removal mechanism
20.The position limiting structure is located at between trigger structure 30 and membrane removal mechanism 20, and the position limiting structure includes in two be oppositely arranged
A postive stop baffle 40 limits a limit channels between two postive stop baffles 40, and the limit channels are passed through with for pcb board 50
And shift to membrane removal mechanism 20.
Particularly, the step of PCB film removing device progress membrane removal includes: the first step, first by driving into trigger structure 30
Pcb board 50 is passed through from the limit channels of the position limiting structure, and is moved to membrane removal mechanism 20.Second step, then by membrane removal mechanism 20
Dyestripping processing is carried out to pcb board 50.Third step drives the pcb board 50 after dyestripping to be moved to next process by ejecting plate mechanism.
In above-mentioned second step, when membrane removal mechanism 20 is to 50 dyestripping of pcb board, the two sides of protective film 60 and pcb board 50
It is gradually disengaged, the disengaged position (dyestripping position) of the two sides of protective film 60 and pcb board 50, as membrane removal mechanism 20 is to pcb board
The 50 tensile force active positions applied, pcb board 50 are easy to occur bending and deformation in the position.Here, since position-limit mechanism is located at
Into between trigger structure 30 and membrane removal mechanism 20, pcb board 50 is limited in limit channels by two postive stop baffles 40 of position-limit mechanism,
The tensile force active position that two postive stop baffles 40 are closer to.In this way, when pcb board 50 acts on position in the tensile force
When setting the trend that lateral bending occurs, two 40 backstop pcb boards 50 of postive stop baffle effectively limit the scope of activities of pcb board 50,
So that pcb board 50 is difficult to happen bending deformation, so that pcb board 50 be avoided to damage or be broken.
The technical solution of the utility model should by the way that position-limit mechanism is being arranged between trigger structure 30 and membrane removal mechanism 20
Position-limit mechanism includes limiting a limit channels, institute between two postive stop baffles 40 in two postive stop baffles 40 being oppositely arranged
Limit channels are stated with so that pcb board 50 passes through and shifts to membrane removal mechanism 20, to occur in pcb board 50 in the tensile force active position
When the trend of lateral bending, by above-mentioned two 40 backstop pcb board 50 of postive stop baffle, so that pcb board 50 is difficult to happen bending deformation,
To avoid pcb board 50 from damaging or fracture.
Fig. 1 and Fig. 2 are please referred to, for into trigger structure 30, there are many design into trigger structure 30.One is real wherein
It applies in example, includes being mounted on into plate pedestal 31 into the first roller group 32 and the second roller group on plate pedestal 31 into trigger structure 30
33, and the driver being connect with the first roller group 32 and the second roller group 33.First roller group 32 is located at the second roller group 33
Top.First roller group 32 includes multiple first idler wheels that more edges are arranged successively into plate direction.Second roller group 33 includes
Multiple second idler wheels that more edges are arranged successively into plate direction.
When delivering pcb board 50 into trigger structure 30, pcb board 50 be held in the first roller group 32 and the second roller group 33 it
Between, under the driving of the driver, the first roller group 32 and the rotation of the second roller group 33 are to carry pcb board 50 to membrane removal machine
20 direction of structure is mobile.In addition, to protect pcb board 50 not to be squeezed destruction, it can also be respectively in the first roller group 32 and second
Feed belt is arranged in roller group 33.
It in another embodiment, include and being mounted on into plate pedestal 31 into the active on plate pedestal 31 into trigger structure 30
Wheel, driven wheel, feed belt, driver.Wherein, driving wheel and the driven wheel described in feed belt ring set, the driver
It is connect with the driving wheel.When delivering pcb board 50 into trigger structure 30, pcb board 50 is placed on the feed belt, in the drive
Under the driving of dynamic device, the driving wheel and driven wheel rotation, and the feed belt is driven to rotate, so that pcb board 50 be shifted to
Membrane removal mechanism 20.
Fig. 1 and Fig. 2 are please referred to, for membrane removal mechanism 20, also there are many design for membrane removal mechanism 20.Wherein one
In embodiment, membrane removal mechanism 20 includes two film removing devices, and two film removing devices are symmetrical arranged in upward and downward.The film removing device
Including the first roller bearing 21 and the second roller bearing 22, the motor (not shown) connecting with the second roller bearing 22, and it is located at the first roller bearing 21
And the second the first mounting rack 27, the second mounting rack 28, third mounting rack 29 between roller bearing 22.Wherein, it is covered on the first roller bearing 21
Equipped with adhesive tape.Paper tube is arranged on second roller bearing 22.First rotating shaft 23 is provided on first mounting rack 27.On second mounting rack 28
It is provided with the first tensioning shaft 25 and the second tensioning shaft 26 above the first tensioning shaft 25.Is provided on third mounting rack 29
Two shafts 24.Second roller bearing of motor driven 22 rotates, and the tensioning of first rotating shaft 23, first is successively passed through in one end of the adhesive tape
Gap between axis 25 and the second tensioning shaft 26, is finally wrapped on the paper tube, the first tensioning shaft 25 and the second tensioning shaft 26
Have the function of being tensioned adhesive tape, the second roller bearing of motor driven 22 rotates, so that adhesive tape be driven to rotate.
When starting 20 dyestripping of membrane removal mechanism, pcb board 50 is moved to from the limit channels of the position limiting structure into trigger structure 30
Membrane removal mechanism 20 is wrapped in first when between two first rotating shafts 23 that one end of pcb board 50 reaches both of the aforesaid film removing device
Adhesive tape in shaft 23 pastes the protective film 60 on the two sides of pcb board 50 respectively, as motor drives the rotation of the second roller bearing 22
Turn, adhesive tape is pulled, so that protective film 60 is separated with the side of pcb board 50, the second constantly rotation of roller bearing 22 will finally glue
The waste tape for sticking protective film 60 is wrapped on paper tube.As adhesive tape pulls the effect of the power of pcb board 50, so that pcb board 50 moves
It moves to the second shaft 23, final pcb board 50 passes through the second shaft 24 and shifts to next process.
Fig. 1 and Fig. 2 are please referred to, for the position limiting structure, the structure design or mounting means of the position limiting structure
Setting tool body does not limit.If two film removing devices of membrane removal mechanism 20 are in left and right to being oppositely arranged, from left and right to pcb board 50
Protective film 60 on the side of its left and right two carries out dyestripping, that correspondingly, two postive stop baffles 40 should also be set along left and right to opposite
It sets.If two film removing devices of membrane removal mechanism 20 are oppositely arranged in upward and downward, from upward and downward its upper and lower two to pcb board 50
Protective film 60 on side carries out dyestripping, that correspondingly, two postive stop baffles 40 also should be vertically to being oppositely arranged.Specifically exist
This, is oppositely arranged in view of two film removing devices of membrane removal mechanism 20 in upward and downward, therefore by two postive stop baffles 40 vertically to phase
To setting.
It please refers to Fig.1 to Fig.3, theoretically gets on very well, the dyestripping position for the membrane removal mechanism 20 that postive stop baffle 40 is more proximate to, limit
Position baffle 40 is more obvious the backstop action effect of pcb board 50, is more beneficial to prevent 50 bending deformation of pcb board and is damaged.But
If postive stop baffle 40 too close to membrane removal mechanism 20, postive stop baffle 40 is easy to interfere with protective film 60 and 50 side of pcb board
Separation.Therefore, postive stop baffle 40 should suitably keep at a distance between the dyestripping position.Preferably, postive stop baffle 40 is to removing
Spacing (the D in such as Fig. 3 of the dyestripping position of film mechanism 201It is shown) it is 8mm~15mm.Such as 8mm, 10mm, 12mm, 14mm,
15mm etc..Within this range, postive stop baffle 40 is more apparent to the backstop action of pcb board 50, and is not easy to interfere with membrane removal mechanism 20
Dyestripping.D1
It is further, bigger in view of the internal surface area of postive stop baffle 40 please continue to refer to Fig. 1 to Fig. 3, to pcb board 50
Backstop action is more obvious, and during backstop, and the opposition applied to pcb board 50 is more dispersed, not easy damaged pcb board
50.But the internal surface area of postive stop baffle 40 also should not be too large, and otherwise will increase volume, occupy biggish volume space.Therefore, at this
In embodiment, limit postive stop baffle 40 along into trigger structure 30 into width (as l in fig. 3) on plate direction as 3mm~
7mm.Such as 3mm, 4mm, 5mm, 6mm, 7mm etc..
Also please refer to Fig.1 to Fig.3, herein it is also contemplated that after pcb board 50 enters limit channels, pcb board 50 and every
It should be formed with gap between one postive stop baffle 40, to ensure that pcb board 50 can pass through limit channels.Therefore, in this reality
It applies in example, the spacing (D in such as Fig. 3 between the side of postive stop baffle 40 to pcb board 502It is shown) it is 0.3mm~0.5mm, such as
0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm etc..
Based on above-mentioned any one embodiment, for the mounting means of postive stop baffle 40, postive stop baffle 40 can be fixed peace
In rack 10, perhaps it is removably mounted in rack 10 also or is movably mounted in rack 10.Consider
To different pcb boards 50, thickness is different, to spacing (the i.e. height of limit channels upward and downward between two postive stop baffles 40
Degree) size requirements it is also different.For example, if 50 thickness of pcb board is larger, and the spacing between two postive stop baffles 40 compared with
Small, then pcb board 50 is difficult to be likely to result in the scratch of pcb board 50 by the limit channels.On the contrary, if 50 thickness of pcb board
It is smaller, and the spacing between two postive stop baffles 40 is larger, then scope of activities restriction effect of the limit channels to pcb board 50
Smaller, backstop effect is unobvious.
It in the present embodiment, is the generation for avoiding above situation, the spacing between two postive stop baffles 40 is adjustable.
That is at least one of which postive stop baffle 40 is moved close to or far from another postive stop baffle in two postive stop baffles 40
40.When carrying out pcb board 50 except film process, producers can be according to the thickness of different pcb boards 50, can corresponding two limiting blocks
Spacing between plate 40, so that the thickness of the height of the limit channels and pcb board 50 is adapted.Based on this, the pcb board
Film removing device further includes driving device, and the driving device is at least connect with one of postive stop baffle 40, to drive the limit
Baffle 40 is mobile, and adjusts the spacing between two postive stop baffles 40.
Particularly, the driving device can only drive one of postive stop baffle 40 to move up and down, so that the limit
Position baffle 40 is relatively close or far from another postive stop baffle 40, to adjust the spacing between two postive stop baffles 40.Alternatively,
The driving device can also drive two postive stop baffles 40 to move up and down simultaneously, so that both this is relatively close or separate,
Also the spacing between adjustable two postive stop baffles 40.
Herein for convenient for the spacing between two postive stop baffles of precise controlling, it is preferable that the driving device includes first
Driving structure and the second driving structure；Wherein, first driving structure is connect with one of postive stop baffle 40；Described second
Driving structure is connect with another postive stop baffle 40.Therefore, it is driven by the first driving structure of the driving device and second
Structure can drive two postive stop baffles 40 to move up and down respectively and simultaneously, so that this two postive stop baffles are relatively close or remote
From, and then adjust the spacing between two postive stop baffles.
Based on the above embodiment, producers can voluntarily control the driving device tune according to the thickness of different pcb boards 50
Save the spacing between two postive stop baffles 40.But it may additionally increase the work of producers in this way.People is produced to reduce
The workload of member, optionally, the pcb board film removing device further includes controller 70 and detection structure；Wherein, the detection structure
For detecting the thickness of pcb board 50；Controller 70 is all connected with the detection structure and the driving device, to according to
The thickness for the pcb board 50 that detection structure detects controls the spacing between two postive stop baffles 40 of the driving device adjusting.
Particularly, when the detection structure detect pcb board 50 thickness it is smaller when, control driving device driving
Postive stop baffle 40 is mobile, reduces the spacing between two postive stop baffles 40.When the detection structure detects the thickness of pcb board 50
When larger, the driving device driving movement of postive stop baffle 40 is controlled, the spacing between two postive stop baffles 40 is increased.
As for the specific structure type of the detection structure, then there are many.In the present embodiment, the detection structure includes
In two non-contact type probes 80 being oppositely arranged, two non-contact type probes 80 are connect with controller 70.
Particularly, two non-contact type probes 80 are located at the two sides up and down of pcb board 50, two non-contact type probes
80 do not contact with pcb board 50, so can ensure that in the moving process of pcb board 50, pcb board 50 and two non-contact type probes 80
It will not interfere, improve the accuracy of detection structure.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
It is all under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of pcb board film removing device, including rack, which is characterized in that the pcb board film removing device further include be mounted on it is described
In rack:
Membrane removal mechanism, to remove the protective film of its two sides of pcb board；
Into trigger structure, to drive pcb board to be moved to the membrane removal mechanism；And
Position limiting structure, is located at described between trigger structure and the membrane removal mechanism, and the position limiting structure includes in being oppositely arranged
Two postive stop baffles limit a limit channels between two postive stop baffles, and the limit channels are passed through with for pcb board
And shift to the membrane removal mechanism.
2. pcb board film removing device as described in claim 1, which is characterized in that two postive stop baffles are vertically to opposite
Setting.
3. pcb board film removing device as described in claim 1, which is characterized in that the spacing between two postive stop baffles is big
It is small adjustable.
4. pcb board film removing device as claimed in claim 3, which is characterized in that the pcb board film removing device further includes driving dress
It sets, the driving device is at least connect with postive stop baffle described in one of them, adjusts two to drive the postive stop baffle mobile
Spacing between the postive stop baffle.
5. pcb board film removing device as claimed in claim 4, which is characterized in that the driving device includes the first driving structure
With the second driving structure；Wherein, first driving structure is connect with postive stop baffle described in one of them；The second driving knot
Structure is connect with postive stop baffle described in another.
6. pcb board film removing device as claimed in claim 4, which is characterized in that the pcb board film removing device further includes controller
And detection structure；Wherein, the detection structure is used to detect the thickness of the pcb board；The controller and the detection structure
And the driving device is all connected with, and to the thickness of the pcb board detected according to the detection structure, controls the driving device
Adjust the spacing between two postive stop baffles.
7. pcb board film removing device as claimed in claim 6, which is characterized in that the detection structure includes in being oppositely arranged
Two non-contact type probes, two non-contact type probes are connect with the controller.
8. pcb board film removing device as claimed in any one of claims 1 to 7, which is characterized in that the postive stop baffle is described in
The distance of membrane removal mechanism is 8mm~15mm.
9. pcb board film removing device as claimed in any one of claims 1 to 7, which is characterized in that the postive stop baffle is described in
Into trigger structure into width on plate direction be 3mm~7mm.
10. pcb board film removing device as claimed in any one of claims 1 to 7, which is characterized in that the postive stop baffle to institute
Stating the spacing between the side of pcb board is 0.3mm~0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920169766.0U CN209676624U (en) | 2019-01-30 | 2019-01-30 | Pcb board film removing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920169766.0U CN209676624U (en) | 2019-01-30 | 2019-01-30 | Pcb board film removing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209676624U true CN209676624U (en) | 2019-11-22 |
Family
ID=68568048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920169766.0U Active CN209676624U (en) | 2019-01-30 | 2019-01-30 | Pcb board film removing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209676624U (en) |
-
2019
- 2019-01-30 CN CN201920169766.0U patent/CN209676624U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100921716B1 (en) | A film adherence method and apparatus | |
| CN101393332B (en) | ACF paste device and flat panel display | |
| KR101340160B1 (en) | Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape | |
| US8656833B2 (en) | Leveling machine for rolled-up tablets | |
| CN204641013U (en) | Polarized light sheet pasting device | |
| CN211363844U (en) | LCD material loading and dyestripping device | |
| WO2005024932A3 (en) | Apparatus and method for removing semiconductor chip | |
| CN104898309A (en) | System for attaching film and method for attaching film | |
| JP5349779B2 (en) | Tape sticking device and manufacturing method of flat display device | |
| CN209676624U (en) | Pcb board film removing device | |
| CN210190829U (en) | Glass chip mounter and polaroid dyestripping device thereof | |
| CN209521377U (en) | A kind of coat peeling unit | |
| JP2008139523A (en) | Optical film-pasting method, optical film-pasting device, and manufacturing method of display panel | |
| CN100589015C (en) | Spacing block removing equipment and its removing method | |
| CN107481401A (en) | Medium conveying apparatus and paper processing device | |
| CN211363843U (en) | Easily tear pad dyestripping device that possesses multi freedom and pressurize function | |
| TWI386704B (en) | Apparatus for attaching polarizer to lcd panel | |
| CN207164867U (en) | Medium conveying apparatus and paper processing device | |
| CN207090414U (en) | Turning machine | |
| JP2005022676A (en) | Method and apparatus for sticking label | |
| CN210911604U (en) | Film tearing and feeding equipment on chip mounter | |
| CN208086230U (en) | Auxiliary material automatically strips and separator | |
| JP2004042270A (en) | Method and device for laminating pressure-sensitive adhesive tape to corrugated cardboard paper | |
| CN105540300A (en) | Fast and efficient RFID ticket-card transmission device | |
| CN211195266U (en) | Automatic dyestripping device of OCA |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |