CN209675329U - A kind of LED light source mould group - Google Patents
A kind of LED light source mould group Download PDFInfo
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- CN209675329U CN209675329U CN201920450744.1U CN201920450744U CN209675329U CN 209675329 U CN209675329 U CN 209675329U CN 201920450744 U CN201920450744 U CN 201920450744U CN 209675329 U CN209675329 U CN 209675329U
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- lantern ring
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Abstract
The utility model discloses a kind of LED light source mould group, it includes LED support, and the cylinder for loading LED substrate component is formed on the LED support, is provided with multiple planes on the outside of the cylinder, the LED substrate component placement is in the plane on the outside of the cylinder, to form multifaceted light-emitting;The LED support is made of metal;LED substrate component front at least has a positive electrode, which has a negative electrode, which connects with LED support;The cylinder is equipped with insulation lantern ring, on the inside of the insulation lantern ring there is several groups anode to connect a group, it includes that at least one anode connects a little that each group of anode, which connects a group, which covers in LED substrate component lower end periphery, and anode is connected a little to contact and formed with positive electrode and be electrically conducted;The insulation lantern ring lower part, which is additionally provided with, connects the bonding wire a being electrically connected anode with anode, which, which is welded and fixed and is formed with positive electrical wire, electrically conducts, and connects the positive electrode of the LED substrate component with positive electrical wire.
Description
Technical field:
The utility model relates to light emitting device technical fields, refer in particular to a kind of LED light source mould group.
Background technique:
It is well known that lamps and lanterns are one of household necessity articles, traditional incandescent lamp energy consumption is higher, and energy utilization rate is very
Low, the energy probably only less than 1/10th becomes luminous energy, and energy waste is serious.Therefore, energy-saving lamp just comes into being,
For energy-saving lamp is with respect to incandescent lamp, energy-saving lamp cheaply good production again so a large amount of application can have been obtained, and has and gradually takes
For the trend of incandescent lamp.Energy-saving lamp is shone using electron excitation principle, and relative to incandescent lamp, energy-saving lamp has the excellent of power saving
Point.But a disadvantage existing for energy-saving lamp is exactly: containing mercury in energy-saving lamp, mercury has been intermediation in the fluorescent tube of energy-saving lamp
, if mercury, energy-saving lamp would not shine, and will cause in energy-saving lamp production process in this way and have mercury dirty using after discarded
Dye, in addition, energy-saving lamp is still glassware, easily broken, bad transport, bad installation, and energy-saving lamp is easily damaged, the service life is short.
Relative to above-mentioned illuminator, LED light is had the advantages that
1, energy saving.The energy consumption of white LED lamp is only the 1/10 of incandescent lamp, and the 1/4 of energy-saving lamp.
2, long service life.The service life of LED light up to 100,000 hours or more, significantly larger than incandescent lamp and energy-saving lamp.
It 3, can be with frequent starting.If traditional energy-saving lamp, incandescent lamp are frequently started or shut down, filament will black,
It is cracking to break down, and LED light will not.
4, environmentally friendly, the not no harmful substance of mercury.The assembling parts easy disassembling of LED light, recycling are convenient.
Based on These characteristics, LED light will gradually replace other illuminators.
LED light source on the market includes bracket and the LED module that is installed on bracket at present, in order to realize that multi-panel is sent out
Multiple LED modules must be then respectively arranged on multiple faces of the bracket by light, and pass through multiple conducting wires for multiple LED
Mould group links together in parallel or in series, so as to later period welding wire, forms all LED modules with the electric wire and electrically connects
It connects.But manually multiple LED modules are linked together in parallel or in series using multiple conducting wires, assembling process complicates, and
And multiple conducting wires and multiple scolding tin have been highlighted in bracket periphery, lead to monnolithic case extremely unsightly, also will affect other zero
The assembly of part, and since the scolding tin is exposed outside, there is the risk for short circuit occur.
In view of this, the present inventor proposes following technical scheme.
Utility model content:
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of LED light source mould group.
In order to solve the above-mentioned technical problem, the utility model is using following technical proposals: the LED light source mould group includes
LED support forms the cylinder for loading LED substrate component on the LED support, is provided with multiple planes on the outside of the cylinder,
The LED substrate component placement is in the plane on the outside of the cylinder, to form multifaceted light-emitting;The LED support is made of metal;Institute
Stating LED substrate component front at least has a positive electrode, which has a negative electrode, the negative electrode
It is connected with LED support;The cylinder is equipped with insulation lantern ring, on the inside of the insulation lantern ring there is several groups anode to connect a group, often
It includes that at least one anode connects a little that one group of anode, which connects a group, which covers outside the LED substrate component lower end
It encloses, and the anode is connected a little to contact and formed with positive electrode and be electrically conducted;The insulation lantern ring lower part is additionally provided with to be connected with anode
The bonding wire anode that point is electrically connected, which, which is welded and fixed and is formed with positive electrical wire, electrically conducts, and makes the LED substrate group
The positive electrode of part is connected with positive electrical wire.
Furthermore, in above-mentioned technical proposal, to offer an accommodating described just upwardly along its lower end for the LED support
The cabling channel of pole electric wire, the cabling groove bottom extend to a plane on the outside of cylinder, and with the planes align.
Furthermore, in above-mentioned technical proposal, the insulation lantern ring is positioned at the cylinder lower end, and covers the cabling
Slot.
Furthermore, in above-mentioned technical proposal, the LED substrate component includes that a substrate and one group are set to this
LED chip group on substrate, the LED chip group include an at least LED chip, the substrate front side be provided with one it is described just
Electrode and a cathode connect plate, which is provided with the negative electrode, which connects plate and negative electrode electricity
Property connection, anode and the positive electrode welding of the LED chip be connected, and the cathode of the LED chip and the cathode, which connect plate and weld, leads
It is logical.
Furthermore, in above-mentioned technical proposal, the LED substrate component include a substrate and two groups or two groups with
On be set to LED chip group on the substrate, each group of LED chip group includes an at least LED chip, the substrate front side
Setting connects plate there are two one cathode of the positive electrode, which is provided with the negative electrode, which connects
Plate and the negative electrode are electrically connected, and the anode of the LED chip in first group of LED chip group is connected with first positive electrode welding,
The anode of LED chip in second group of LED chip group is connected with second positive electrode welding, in first, second group of LED chip group
LED chip cathode and the cathode connect plate welding be connected, to cause first group of LED chip group and second group of LED chip
Group can independent control conducting.
Furthermore, in above-mentioned technical proposal, the cross section of the cylinder is in polygon.
Furthermore, in above-mentioned technical proposal, the substrate uses aluminum oxide substrate or aluminium nitride substrate, superconduction aluminium base
Any one in plate.
Furthermore, in above-mentioned technical proposal, the LED support upper end is also coated integrally formed with the crown top of burner, the crown top of burner
In the LED substrate component periphery.
Furthermore, in above-mentioned technical proposal, it is described insulation lantern ring include can mutually open or close left lantern ring
With right lantern ring, the left lantern ring and right lantern ring one end are hinged, and the other end is fixed by snap;Either, the left lantern ring and right lantern ring
Both ends are fixed by snap.
Furthermore, in above-mentioned technical proposal, the insulation lantern ring periphery is additionally provided with a body, the body periphery in
The smooth linking in LED support lower end periphery.
After adopting the above technical scheme, the utility model have the following beneficial effects: compared with prior art it is practical
The novel insulation lantern ring added can assist fitting in LED substrate component fixation on the cylinder, guarantee the steady of assembling structure
It is qualitative, and the insulation lantern ring connects all LED substrate components, makes to weld between LED substrate component without conducting wire, be made with this
The positive electrode of all LED substrate components is connected with positive electrical wire, and structure is simple, and easy to assembly;Also due to the insulation lantern ring
All LED substrate components and positive electrical wire welding structure are covered, not only can guarantee monnolithic case aesthetics, and can avoid due to this
Scolding tin is exposed outside and there is the risk for short circuit occur, and the utility model is enabled to have the extremely strong market competitiveness.
Detailed description of the invention:
Fig. 1 is the structural schematic diagram (without the crown top of burner) of the utility model;
Fig. 2 is the perspective view of LED support in the utility model;
Fig. 3 is the structure chart after Fig. 1 disassembly insulation lantern ring;
Fig. 4 is the perspective view of insulation lantern ring in the utility model;
Fig. 5 is the rearview of LED substrate component in the utility model;
Fig. 6 is the top view of insulation lantern ring in the utility model;
Fig. 7 is the internal wiring figure of insulation lantern ring in the utility model;
Fig. 8 is insulation lantern ring another kind internal wiring figure in the utility model;
Fig. 9 is the main view of the utility model;
Figure 10 is the structural schematic diagram of the utility model another kind structure (without the crown top of burner);
Figure 11 is the main view of LED substrate component another kind structure in the utility model;
Figure 12 is the rearview of LED substrate component another kind structure in the utility model.
Specific embodiment:
The present invention will be further described with attached drawing combined with specific embodiments below.
It is a kind of LED light source mould group as shown in Fig. 1-12 comprising LED support 1 is formed on the LED support 1 and is used for
The cylinder 11 of LED substrate component 2 is loaded, is provided with multiple planes on the outside of the cylinder 11, which is mounted on the column
In the plane in 11 outside of body, to form multifaceted light-emitting;The LED support 1 is made of metal;2 front of LED substrate component is extremely
There is a positive electrode 201 less, which has a negative electrode 202, the negative electrode 202 and LED support 1
It connects;The cylinder 11 is equipped with insulation lantern ring 3, on the inside of the insulation lantern ring 3 there is several groups anode to connect a group, each group just
It includes that at least one anode connects a little 31 that pole, which connects a group, 3 upper shield of insulation lantern ring in 2 lower end of LED substrate component periphery,
And the anode connects and a little 31 contacts and formed with positive electrode 201 and electrically conduct;3 lower part of insulation lantern ring is additionally provided with leads with anode
The bonding wire anode 33 that contact 31 is electrically connected, bonding wire anode 33, which is welded and fixed and is formed with positive electrical wire 5, to electrically conduct, and makes this
The positive electrode 201 of LED substrate component 2 is connected with positive electrical wire 5.The insulation lantern ring 3 that the utility model is added can assist should
The fixation of LED substrate component 2 fits on the cylinder 11, guarantees the stability of assembling structure, and the insulation lantern ring 3 will be all
LED substrate component 2 connects, and makes to weld between LED substrate component 2 without conducting wire, the positive electricity of all LED substrate components 2 is made with this
Pole 201 is connected with positive electrical wire 5, and structure is simple, and easy to assembly;Since the insulation lantern ring 3 also covers all LED substrate groups
Part 2 and 5 welding structure of positive electrical wire not only can guarantee monnolithic case aesthetics, and can avoid since the scolding tin is exposed outside and
In the presence of the risk for short circuit occur, enable the utility model that there is the extremely strong market competitiveness.
In conjunction with shown in Fig. 4,6,7, each group of anode, which connects, a little 31 to interconnect, can be by insulation lantern ring
Portion's installation wire connects;The anode, which connects, a little 31 can be used SMT patch weldering mode with the positive electrode 201 in LED substrate component 2
Welding.
In conjunction with shown in Fig. 1-10, the LED support 1 offers upwardly walking for the accommodating positive electrical wire along its lower end
Wire casing 12,12 bottom surface of cabling channel extend to a plane in the outside of cylinder 11, and with the planes align.Due to the positive electrical wire
It is accommodated in cabling channel 12, can avoid the in disorder phenomenon of positive electrical wire occur, while avoiding positive electrical wire from being exposed outside and influencing
Component assembly influences the utility model use.The insulation lantern ring 3 is positioned at 11 lower end of cylinder, and covers the cabling channel
12, effectively positive electrical wire can be defined in the cabling channel 12 with this, can prevent the positive electrical wire from undesirably falling off cabling channel 12.
The LED support 1 connects cathode electrical property as cathode, which exceptionally coats in addition to junction
There is insulating layer.
The plane in 11 outside of cylinder is additionally provided with a mounting groove, and the LED substrate component 2 is installed on the mounting groove
In, the stability of assembling structure can be further ensured that with this.It is of course also possible to not design mounting groove.
In conjunction with shown in 1-9, the LED substrate component 2 includes that a substrate 21 and one group are set on the substrate 21
LED chip group, the LED chip group include an at least LED chip 22, which is provided with the positive electrode
201 and a cathode connect plate 203, which is provided with the negative electrode 202, the negative electrode 202 and this is negative
Pole connects 203 electrical communication of plate, and anode and the positive electrode 201 welding of the LED chip 22 are connected, the cathode of the LED chip 22
The welding of plate 203 is connected with the cathode to be connected, when work, after which is powered, the LED chip in the LED chip group
22 shine simultaneously.
In conjunction with shown in Figure 10-12, the LED substrate component 2 can also be a flowering structure: the LED substrate component 2 includes
Have a substrate 21 and two groups or more be set to the LED chip group on the substrate 21, each group of LED chip group includes
There is an at least LED chip 22, there are two the positive electrodes 201 and a cathode to connect plate 203 for the 21 front setting of substrate, should
21 back side of substrate is provided with the negative electrode 202, and the negative electrode 202 and the cathode connect 203 electrical communication of plate, and first group
The anode of LED chip 22 in LED chip group is connected with first welding of positive electrode 201, the LED in second group of LED chip group
The anode of chip 22 is connected with second welding of positive electrode 201, the cathode of the LED chip 22 in first, second group of LED chip group
It connects the welding of plate 203 with the cathode to be connected, to cause first group of LED chip group and second group of LED chip group can independent control
Conducting.When work, after which is powered, it can control the LED chip 22 in first group of LED chip group while sending out
Light, the LED chip 22 in second group of LED chip group do not shine;Also it can control the LED in second group of LED chip group
Chip 22 shines simultaneously, and the LED chip 22 in first group of LED chip group does not shine;It can will be in first group of LED chip group
High beam of the LED chip 22 as auto lamp, the entering light by the LED chip 22 in first group of LED chip group as auto lamp
Lamp, can be provided simultaneously with high beam and entering light lamp function, and can independent control shine.It is of course also possible to control first, second group
LED chip 22 in LED chip group shines simultaneously.
As shown in connection with fig. 2, the cross section of the cylinder 11 is in polygon, and the present embodiment is in four sides with the cross section of cylinder 11
For shape.
The substrate 21 is using any one in aluminum oxide substrate or aluminium nitride substrate, superconduction aluminum substrate, with pole
Good heat dissipation effect.
As shown in connection with fig. 9,1 upper end of LED support is also coated on the LED substrate integrally formed with the crown top of burner 4, the crown top of burner 4
2 periphery of component, to form a complete LED light source, can be applied to LED automobile lamp.
As shown in connection with fig. 6, it is described insulation lantern ring 3 include can mutually open or close left lantern ring 301 and right lantern ring
302, the left lantern ring 301 and 302 one end of right lantern ring are hinged, and the other end is fixed by snap;Either, the left lantern ring 301 and the right side
302 both ends of lantern ring are fixed by snap, and the insulation lantern ring 3 of two kinds of structures is relatively simple in structure, and assembly operation is equal
It is more convenient.
As shown in connection with fig. 9,3 periphery of insulation lantern ring is additionally provided with a body 6, and 6 periphery of body is in the LED support 1
The smooth linking in lower end periphery, so as to improve the aesthetics of entire shape.
In conclusion the insulation lantern ring 3 that the utility model is added can assist fitting in the LED substrate component 2 fixation
On the cylinder 11, guarantee the stability of assembling structure, and the insulation lantern ring 3 connects all LED substrate components 2, makes LED base
It is welded between board group part 2 without conducting wire, connects the positive electrode 201 of all LED substrate components 2 with positive electrical wire 5 with this, tied
Structure is simple, and easy to assembly;Since the insulation lantern ring 3 also covers all LED substrate components 2 and 5 welding structure of positive electrical wire, no
It only can guarantee monnolithic case aesthetics, and can avoid there is the risk for short circuit occur since the scolding tin is exposed outside, enable this reality
There is the extremely strong market competitiveness with novel.
As shown in connection with fig. 8, the insulation lantern ring 3 is it may also is that a kind of structure: positive solder joint 31 is elastic piece structure, should
Positive solder joint 31 is contacted with positive electrode 201 by compressing, and is electrically connected with realizing, without welding, makes more convenient, knot
Assembling structure of the structure similar to terminal and plastic cement seat in USB connector;Insulation lantern ring 3 is internally provided with the first metal frame 303, should
There are four the first elastic slices 304 for setting on first metal frame 303, and first elastic slice 304 is as the positive solder joint 31;First bullet
Piece 303 stretches out in 3 inner wall of insulation lantern ring, in order to be contacted with positive electrode 201 by compressing, is electrically connected with realizing;It is described
First metal frame, 301 lower end forms the first sheet metal 305, which is used as the bonding wire anode 33.
It certainly, is not to limit the utility model and implement the foregoing is merely specific embodiment of the utility model
Range, all equivalent change or modifications done according to structure, feature and principle described in present utility model application the scope of the patents, should all wrap
It includes in present utility model application the scope of the patents.
Claims (10)
1. a kind of LED light source mould group comprising LED support (1) is formed for loading LED substrate group on the LED support (1)
The cylinder (11) of part (2), the cylinder (11) outside are provided with multiple planes, which is mounted on the cylinder (11)
In the plane in outside, to form multifaceted light-emitting;It is characterized by:
The LED support (1) is made of metal;LED substrate component (2) front at least has a positive electrode (201), should
LED substrate component (2) back side has a negative electrode (202), which connects with LED support (1);The cylinder
(11) it is equipped with insulation lantern ring (3), on the inside of the insulation lantern ring (3) there is several groups anode to connect a group, each group of anode connects
Point group includes that at least one anode connects point (31), and insulation lantern ring (3) upper shield is peripheral in LED substrate component (2) lower end,
And the anode connects point (31) and contacts and formed with positive electrode (201) and electrically conducts;Insulation lantern ring (3) lower part be additionally provided with
The bonding wire that anode connects point (31) electric connection is positive (33), and bonding wire anode (33) and positive electrical wire (5) is welded and fixed and shape
At electrically conducting, connect the positive electrode (201) of the LED substrate component (2) with positive electrical wire (5).
2. a kind of LED light source mould group according to claim 1, it is characterised in that: the LED support (1) is along its lower end surface
The cabling channel (12) of the accommodating positive electrical wire is offered upwards, which extends on the outside of cylinder (11)
One plane, and with the planes align.
3. a kind of LED light source mould group according to claim 2, it is characterised in that: the insulation lantern ring (3) is positioned at the column
Body (11) lower end, and cover the cabling channel (12).
4. a kind of LED light source mould group according to claim 1, it is characterised in that: the LED substrate component (2) includes
One substrate (21) and one group of LED chip group being set on the substrate (21), the LED chip group include an at least LED
Chip (22), which is provided with a positive electrode (201) and a cathode connects plate (203), the substrate
(21) back side is provided with the negative electrode (202), which connects plate (203) and electrically conduct with negative electrode (202), should
The anode of LED chip (22) is connected with the positive electrode (201) welding, and the cathode and the cathode of the LED chip (22) connect plate
(203) welding conducting.
5. a kind of LED light source mould group according to claim 1, it is characterised in that: the LED substrate component (2) includes
One substrate (21) and two groups or more be set to the LED chip group on the substrate (21), each group of LED chip group packet
An at least LED chip (22) is included, there are two the positive electrode (201) and a cathode to connect for the setting of the substrate (21) front
Plate (203), substrate (21) back side are provided with the negative electrode (202), which connects plate (203) and negative electrode
(202) it electrically conducts, the anode of the LED chip (22) in first group of LED chip group is led with first positive electrode (201) welding
Logical, the anode of the LED chip (22) in second group of LED chip group is connected with second positive electrode (201) welding, and first, second
The cathode and the cathode of LED chip (22) in group LED chip group connect plate (203) welding and are connected, to cause first group of LED
Chipset and second group of LED chip group can independent control conductings.
6. a kind of LED light source mould group described in -5 any one according to claim 1, it is characterised in that: the cylinder (11)
Cross section is in polygon.
7. a kind of LED light source mould group according to claim 4 or 5, it is characterised in that: the substrate (21) uses aluminium oxide
Any one in substrate or aluminium nitride substrate, superconduction aluminum substrate.
8. a kind of LED light source mould group described in -5 any one according to claim 1, it is characterised in that: the LED support (1)
Integrally formed with the crown top of burner (4), which is also coated on the LED substrate component (2) periphery for upper end.
9. a kind of LED light source mould group described in -5 any one according to claim 1, it is characterised in that: the insulation lantern ring (3)
Include can mutual open or close left lantern ring (301) and right lantern ring (302), the left lantern ring (301) and right lantern ring (302) one
End is hinged, and the other end is fixed by snap;Either, it is solid to pass through buckle for the left lantern ring (301) and right lantern ring (302) both ends
It is fixed.
10. a kind of LED light source mould group described in -5 any one according to claim 1, it is characterised in that: the insulation lantern ring
(3) periphery is additionally provided with a body (6), and the body (6) periphery is in the smooth linking in LED support (1) lower end periphery.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920450744.1U CN209675329U (en) | 2019-04-02 | 2019-04-02 | A kind of LED light source mould group |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920450744.1U CN209675329U (en) | 2019-04-02 | 2019-04-02 | A kind of LED light source mould group |
Publications (1)
Publication Number | Publication Date |
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CN209675329U true CN209675329U (en) | 2019-11-22 |
Family
ID=68573574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201920450744.1U Active CN209675329U (en) | 2019-04-02 | 2019-04-02 | A kind of LED light source mould group |
Country Status (1)
Country | Link |
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CN (1) | CN209675329U (en) |
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2019
- 2019-04-02 CN CN201920450744.1U patent/CN209675329U/en active Active
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