CN209649208U - The bottom surface cutting equipment of silicon ingot - Google Patents
The bottom surface cutting equipment of silicon ingot Download PDFInfo
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- CN209649208U CN209649208U CN201821482499.4U CN201821482499U CN209649208U CN 209649208 U CN209649208 U CN 209649208U CN 201821482499 U CN201821482499 U CN 201821482499U CN 209649208 U CN209649208 U CN 209649208U
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Abstract
The application discloses a kind of bottom surface cutting equipment of silicon ingot, including pedestal, silicon ingot tipping gear and wire-electrode cutting device, large-sized silicon ingot can entirely be overturn by upper and lower discharge position to cutting position using silicon ingot tipping gear, using wire-electrode cutting device bottom surface cutting can be carried out to the silicon ingot for being located at location of cut, complete bottom surface flaw-piece is obtained, the recovery utilization rate of waste material is improved and the efficiency of recovery processing can be improved.
Description
Technical field
This application involves crystalline silicon processing technique fields, more particularly to a kind of bottom surface cutting equipment of silicon ingot.
Background technique
With attention and opening that society utilizes green regenerative energy sources, photovoltaic solar power field is vigorously sent out
Exhibition.In field of photovoltaic power generation, common crystal silicon solar energy battery is to need casting made of the high quality silicon on piece
Big silicon ingot carry out retrofit form.
In existing process flow, the big silicon ingot of growth can be carried out evolution using excavation machine and cut that form size lesser
Silicon cube；After evolution, intercept unit is recycled silicon cube to be truncated end to end and the flour milling of four sides and polishing
Deng.
It is well known that the crystalline silicon for being used to prepare solar battery is very expensive, moreover, crystalline silicon material itself also can be right
Environment generates pollution.Generally, silicon ingot can generate many waste materials such as rim charge, corner material, liftout and bottom material etc. after the operations such as cutting,
These waste materials are still reusable after processing.But, in previous process process, due to being first to carry out evolution to big silicon ingot to cut
It cuts to be formed after small silicon cube and MATERIAL CUTTING is carried out to silicon cube again, therefore, (mainly silicon cube is truncated the waste material of formation
Cut the liftout and bottom material etc. generated) it is large number of and be the lesser sheet of size, these waste materials are re-used and thrown
In the growth technique for entering new silicon ingot, process flow is cumbersome and treatment effeciency is low.
Utility model content
In view of the missing of the relevant technologies described above, the purpose of the application is that the bottom surface cutting for disclosing a kind of silicon ingot is set
It is standby, for solving the problems such as silicon ingot waste recovery process flow in the related technology is cumbersome and treatment effeciency is low.
To achieve the above object and other purposes, the application disclose a kind of bottom surface cutting equipment of silicon ingot, comprising: pedestal,
Equipped with mounting rack；Silicon ingot tipping gear may be reversed ground and connect with the pedestal, is used for silicon ingot in upper and lower discharge position and cleavage
It is overturn between setting；Wire-electrode cutting device, including cutting support, cutting wheel and cutting line, wherein the cutting line is around in described
Cutting wheel and form cutting line segment；The cutting line segment follow the relatively described mounting rack activity of the cutting support with to be located at cut
It cuts the silicon ingot at position and carries out bottom surface cutting.
The bottom surface cutting equipment of silicon ingot disclosed in the present application, is provided with silicon ingot tipping gear and wire-electrode cutting device, utilizes silicon
Ingot turnover device can entirely be overturn large-sized silicon ingot by upper and lower discharge position to cutting position, so that wire-electrode cutting device can align
Bottom surface cutting is carried out in the silicon ingot of location of cut, complete bottom surface flaw-piece is obtained, improves the recovery utilization rate and energy of waste material
Improve the efficiency of recovery processing.
In the certain embodiments of the application, it is equipped with silicon ingot tipping gear in the side of the mounting rack, in the line
Cutting line segment corresponding with the silicon ingot tipping gear of the mounting rack side is formed on cutter device.
In the certain embodiments of the application, it is respectively equipped with silicon ingot tipping gear in the opposite sides of the mounting rack,
Cutting line segment corresponding with the silicon ingot tipping gear of the mounting rack opposite sides is formed on the wire-electrode cutting device.
In the certain embodiments of the application, the silicon ingot tipping gear includes: turning support, by overturning transmission shaft
Axis is connected to the pedestal；Turnover driving mechanism, for driving the turning support.
In the certain embodiments of the application, the turning support includes: chassis, the bottom surface for support silicon ingot；Side
Frame is connect with the chassis, the side for support silicon ingot.
In the certain embodiments of the application, the chassis includes two supporting legs being oppositely arranged.
In the certain embodiments of the application, the chassis further includes the backer between two supporting legs.
In the certain embodiments of the application, the side frame is equipped with the wire casing that allows corresponding with the cutting line segment.
In the certain embodiments of the application, the clamping group for clamping silicon ingot side is equipped on the mounting rack
Part.
In the certain embodiments of the application, it is equipped on the mounting rack for the supporter against silicon ingot top surface.
Detailed description of the invention
Fig. 1 is shown as stereoscopic schematic diagram of the bottom surface cutting equipment of the application silicon ingot in a certain embodiment.
Fig. 2 is shown as the structural schematic diagram of silicon ingot tipping gear in Fig. 1.
Fig. 3 is shown as bottom surface cutting equipment in a certain embodiment and shows in the solid of upper and lower discharge position support silicon ingot to be cut
It is intended to.
Fig. 4 is the side view of Fig. 3.
Fig. 5 is shown as in a certain embodiment bottom surface cutting equipment in the side view of cutting position support silicon ingot to be cut.
Fig. 6 is shown as bottom surface cutting equipment in a certain embodiment and completes in cutting position to the side after the bottom surface cutting of silicon ingot
View.
Fig. 7 is shown as stereoscopic schematic diagram of the bottom surface cutting equipment of the application silicon ingot in a certain embodiment
Fig. 8 is shown as bottom surface cutting equipment in a certain embodiment and shows in the solid of upper and lower discharge position support silicon ingot to be cut
It is intended to.
Fig. 9 is the side view of Fig. 8.
Figure 10 is shown as in a certain embodiment bottom surface cutting equipment in the side view of cutting position support silicon ingot to be cut.
Figure 11 is shown as bottom surface cutting equipment in a certain embodiment after cutting position is completed to the bottom surface cutting of silicon ingot
Side view.
Specific embodiment
Presently filed embodiment is illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book understands other advantages and effect of the application easily.
In the following description, with reference to attached drawing, attached drawing describes several embodiments of the application.It should be appreciated that also can be used
Other embodiments, and can be carried out without departing substantially from spirit and scope mechanical composition, structure, electrically with
And operational change.Following detailed description should not be considered limiting, and the range of embodiments herein
Only limited by the claims for the patent announced.Term used herein is merely to describe specific embodiment, and be not
It is intended to limit the application.The term of space correlation, for example, "upper", "lower", "left", "right", " following ", " lower section ", " lower part ",
" top ", " top " etc. can be used in the text in order to an elements or features and another element or spy shown in explanatory diagram
The relationship of sign.
Although term first, second etc. are used to describe various elements herein in some instances, these elements
It should not be limited by these terms.These terms are only used to distinguish an element with another element.For example, first turn
It can be referred to as the second steering swing to swinging, and similarly, the second steering, which is swung, can be referred to as the first steering swing, and
The range of various described embodiments is not departed from.
The application discloses a kind of bottom surface cutting equipment of silicon ingot, including silicon ingot tipping gear and wire-electrode cutting device, utilizes silicon
Ingot turnover device can entirely be overturn large-sized silicon ingot by upper and lower discharge position to cutting position, so that wire-electrode cutting device can align
Bottom surface cutting is carried out in the silicon ingot of location of cut.
Referring to Fig. 1, being shown as stereoscopic schematic diagram of the bottom surface cutting equipment of the application silicon ingot in a certain embodiment.In
In the embodiment, the bottom surface cutting equipment of the silicon ingot is to obtain complete bottom surface flaw-piece for carrying out bottom surface cutting to silicon ingot.
By taking polycrystal silicon ingot as an example, polycrystal silicon ingot is the product formed by silicon material directional solidification, generally, in polycrystal silicon ingot
In growth course, being controlled by temperature, the silicon material of melting is long brilliant since the bottom, and it is gradually long brilliant upwards, and ultimately form polycrystalline
Silicon ingot.Wherein, the bottom surface portions of polycrystal silicon ingot and summit portion form poor compared to middle interruption part and there may be certain
Defect (such as: silicon material uniformity is poor, there are impurity and bubbles etc.), therefore, be typically necessary the bottom surface of polycrystal silicon ingot
Part and summit portion will be got rid of.
For polycrystal silicon ingot in the related technology, can first with silicon ingot excavation machine to polycrystal silicon ingot carry out open cutting with
Multiple silicon cubes are formed, recycling intercept unit that silicon cube to be truncated end to end, (head and tail portion in silicon cube are silicon
The summit portion and bottom surface portions of ingot), it is subsequent, it can be again sharp by the waste material being cut (head and tail portion in silicon cube)
With and put into the growth technique of new silicon ingot.Evolution is carried out to polycrystal silicon ingot using silicon ingot excavation machine and is cut to silicon cube
Specific implementation can refer to for example, the patent disclosures such as CN102172997A, CN105216128A, CN105690582A text
Offer, using the specific implementation that silicon cube is truncated in intercept unit end to end can refer to for example, CN105196434A,
The patent publication us such as CN106827268A, CN106827271A, CN106182479A.From the foregoing, it will be observed that due to being cut
Head and tail portion be the lesser sheet silicon material of size, the recycling to these sheet silicon materials, process flow it is cumbersome and locate
Manage inefficiency.
The polycrystal silicon ingot orientation impurities removal effect grown by the prior art is poor, is distributed in the summit portion of silicon ingot more
Impurity and bubble etc., compared to the summit portion of polycrystal silicon ingot, the silicon material molding in the bottom surface portions of polycrystal silicon ingot is then more preferable
A bit.The bottom surface cutting equipment of silicon ingot disclosed in the present application essentially consists in and carries out bottom surface cutting to silicon ingot, obtains complete bottom surface side
Skin, to improve the recovery utilization rate of waste material and the efficiency of recovery processing can be improved.
As shown in Figure 1, the bottom surface cutting equipment of silicon ingot disclosed in the present application includes: pedestal 1, silicon ingot tipping gear 3, and
Wire-electrode cutting device 5, wherein silicon ingot tipping gear 3 between upper and lower discharge position and cutting position for overturning silicon ingot, wire cutting
Device 5 is used to carry out bottom surface cutting to the silicon ingot for being located at location of cut.
Pedestal is the main element of the bottom surface cutting equipment of silicon ingot.Generally, the volume and weight of pedestal are larger, thus
It can provide biggish mounting surface and firm complete machine stable degree.As shown in Figure 1, in the present embodiment, a peace is equipped on pedestal 1
Shelve 11.
Ground and pedestal connection may be reversed, it can be achieved that overturning between upper and lower discharge position and cutting position in silicon ingot tipping gear.
As shown in Figure 1, in the present embodiment, the silicon ingot tipping gear 3 that connection may be reversed with pedestal 1 is equipped in the side of mounting rack 11.
Referring to Fig. 2, being shown as the structural schematic diagram of silicon ingot tipping gear in Fig. 1.In actual application, silicon ingot overturning
Device 3 further includes: turning support 31 and turnover driving mechanism 33.
Turning support 31 is connected to pedestal 1 by overturning 35 axis of transmission shaft.In the present embodiment, turning support 31 can be further
It include: chassis 311 and the side frame being connect with chassis 311 313, wherein chassis 311 is used for the bottom surface of support silicon ingot, and side frame 313 is then
Side for support silicon ingot.Generally, the silicon ingot of growth is rectangular parallelepiped structure, the length and width of the height of silicon ingot with respect to silicon ingot
Spend smaller, therefore, the planar dimension where bottom surface and top surface is larger, and the planar dimension where four sides is then smaller.
By taking G7 silicon ingot as an example, for three-dimensional dimension up to 1160 millimeters * 1160 millimeters * 360 millimeters (long * wide * high), weight has 1,200,000 enough
Gram (1.2 tons).Therefore, the turning support 31 that chassis 311 and side frame 313 form is whole to be of an L-shaped structure, wherein chassis 311 is L
The long side of type structure, side frame 313 are the short side of L-type structure.In the present embodiment, silicon ingot tipping gear 3 is at upper and lower discharge position
When, chassis 311 is in a horizontal state；Silicon ingot tipping gear 3 is in location of cut, the state in a vertical shape of chassis 311.
Chassis 311 is the bottom surface for support silicon ingot, and therefore, chassis 311 is formed by the bottom surface of support range and silicon ingot
Size is adapted.As depicted in figs. 1 and 2, chassis 311 includes two supporting legs 312 being oppositely arranged, in this way, guaranteeing support
In the case of the bottom surface of silicon ingot, it can farthest mitigate the weight of chassis 311 and turning support 31, be also beneficial to turning support
31 make rotary movement.Certainly, larger in view of the bed-plate dimension of silicon ingot, the spacing between two supporting legs 312 being oppositely arranged may
Seem bigger, and there is also the possibility of the uneven situations such as smooth for the bottom surface of silicon ingot, therefore, in some embodiments, chassis
311 may also include the backer 314 between two supporting legs 312, the quantity of backer 314 can be one or more, lean on
The structure on mountain 314 can be similar with the structure of supporting leg 312, and but, the length of backer 314 can be shorter than supporting leg 312.Utilize backer
314, the effects of auxiliary support can be played and positioned.
Side frame 313 corresponds to the side of silicon ingot with the side of the support silicon ingot in the overturning of turning support 31 to cutting position
Face.
Turnover driving mechanism 33 is for driving turning support 31 to overturn.As shown in Fig. 2, in the present embodiment, overturning is driven
Motivation structure 33 may be, for example, cylinder or oil cylinder 332 with piston rod 334, and the end of piston rod 334 passes through an overturning interlocking bar
And it is connect with overturning transmission shaft 35.In actual application, on the one hand, drive piston rod 334 to stretch out by cylinder or oil cylinder 332,
The piston rod 334 of stretching drives overturning transmission shaft 35 to rotate (such as rotating clockwise) by an overturning interlocking bar, passes in overturning
Under the rotation of moving axis 35, turning support 31 is overturn, and is overturn by upper and lower discharge position to cutting position.On the other hand, by cylinder or
Oil cylinder 332 drives piston rod 334 to shrink, and the piston rod 334 of contraction drives overturning transmission shaft 35 to rotate (example by overturning interlocking bar
Such as rotate counterclockwise), under the rotation of overturning transmission shaft 35, turning support 31 is overturn, and is overturn by cutting position to loading and unloading
Position.
It, can be by silicon ingot by the overturning of the discharge position up and down most vertical state for horizontality using silicon ingot tipping gear 3
Cutting position.To ensure silicon ingot in the stability of location of cut, in the present embodiment, as shown in Figure 1, setting on mounting rack 11
There are the clamp assemblies for clamping silicon ingot side.The clamp assemblies may include two pairs of clamping pieces setting up and down, every a pair of of folder
Two clamping pieces 71 in gripping member are relatively arranged on mounting rack 11, and, each clamping piece 71 can be moved with respect to mounting rack 11
Dynamic (in the present embodiment, the moving direction be X to), in this way, two clamping pieces 71 in a pair of of clamping piece are able to achieve phase
To movement (the clamping spacing between two clamping pieces 71 reduces) or it is moved away from (the clamping spacing increasing between two clamping pieces 71
Add), to be suitable for various sizes of silicon ingot and be held on the side of silicon ingot.It, can be by silicon ingot to be cut by clamp assemblies
Give clamping position in location of cut.
Certainly, in other embodiments, in mounting rack 11 towards can also be equipped on the mounting surface of silicon ingot tipping gear 3
For the supporter (not shown in the drawings) against silicon ingot top surface.In this way, in silicon ingot tipping gear 3 by silicon ingot by upper and lower
When discharge position is overturn to cutting position, the supporter on mounting rack 11 can be resisted against silicon ingot top surface.The supporter and silicon ingot
Chassis 311 in turnover device 3 cooperates, and plays strong fix to silicon ingot.In a particular application, the contradictory piece may be, for example, tool
Have the conflict block of certain telescopic movable or contradict mandril etc., but be not limited thereto, the contradictory piece also may be, for example, rubber pad
Block etc..
Wire-electrode cutting device is used to carry out bottom surface cutting to the silicon ingot for the silicon ingot tipping gear institute support for being located at location of cut
Operation.As shown in Figure 1, in the present embodiment, wire-electrode cutting device 5 includes cutting support 51, cutting wheel 53 and cutting line,
In, cutting line is around in cutting wheel 53 and forms cutting line segment 55.
Cutting support 51 is movably arranged on mounting rack 11.In some embodiments, cutting support 51 may include two, point
It is not configured at opposite two sides of mounting rack 11.To realize that cutting support 51 is movably arranged on mounting rack 11, support 51 is cut
Equipped with lift drive mechanism.The lift drive mechanism can further comprise: riser guide, lifting slider and lifting driving
Source, wherein the riser guide can be along lifting direction setting (in the present embodiment, the lifting direction is Z-direction), such as edge
Mounting rack 11 be arranged, the lifting slider is set on cutting support 51 and matches with the riser guide.To cut
The stability of 51 lifting and translocating of cut branch seat, can configure two riser guides, the two riser guides are located at corresponding cutting
The opposite sides of support 51.The lifting driving source then may include the ball-screw and servo motor being arranged along the vertical direction, rolling
Ballscrew has the characteristics that high-precision, invertibity and efficient, in this way, passing through the cooperation of servo motor and ball-screw, it is ensured that
Cut the precision of the lifting and translocating in the vertical direction of support 51.Certainly, the lifting driving source can also make other selections, example
Such as, in some embodiments, the lifting driving source may include lifting rack rails, driving gear and lifting driving motor, wherein
(in the present embodiment, the lifting rack rails is arranged along Z-direction), the driving gear is arranged along vertical mode in the lifting rack rails
It is engaged with the lifting rack rails, the lifting driving motor is for driving the driving gear.In this way, being driven by the lifting
Source can drive cutting support 51 to carry out lifting and translocating in the vertical direction along the riser guide.
Cutting wheel 53 is set on cutting support 51, and cutting line is sequentially around in each cutting wheel 53 on cutting support 51, from
And line secant section is formed between two cutting wheels 53 on two 51 corresponding positions of cutting support.In the present embodiment, the bottom of at
Seat 1 is equipped with a turnover silicon ingot tipping gear 3, and therefore, in cutting on line device 5, cutting line is sequentially around in cutting branch
Cutting wheel 53 and one cutting line segment 55 of formation on seat 51.
Lifting and translocating can be carried out along mounting rack 11 in the vertical direction by lift drive mechanism by cutting support 51, this
Sample, two cutting supports 51 can be controlled by corresponding lift drive mechanism to carry out lifting and translocating in wire-electrode cutting device 5.In
In certain embodiments, two cutting supports 51 being oppositely arranged can carry out same under the control of corresponding lift drive mechanism
Lifting and translocating is walked, in this way, the cutting line segment 55 between two cutting supports 51 is always horizontality and accordingly to the bottom of silicon ingot
It is cut in face.In some embodiments, two cutting supports 51 being oppositely arranged are in corresponding lift drive mechanism
Asynchronous lifting and translocating under control, one of cutting support 51 can be made to be biased to movement relative to another cutting support 51.In
In specific implementation, using lift drive mechanism, it can be achieved that be oppositely arranged two asynchronous lifting and translocatings of cutting support 51 are made
Obtaining two cutting supports 51 is setting up and down for silicon ingot (that is, the cutting line segment 55 between two cutting supports 51 is
Non-horizontal setting), to cut the part cutting line segment being located under in line segment 55 than being located at upper in cutting operation
Part cutting line segment first contacts silicon ingot, then when subsequent cutting line segment 55 is from silicon ingot outlet being located in cutting line segment 55
In upper part cutting line segment than leaving silicon ingot after the part cutting line segment that is located under and outlet, in this way, the part under
The silicon ingot surface of cutting line segment outlet can prevent, avoid at least reducing the situation for chipping occur, farthest protect
The surface of silicon ingot improves the cut quality of silicon ingot.Further more, since the cutting angle of cutting line segment 55 and silicon ingot is in on-right angle
Acute angle or obtuse angle, in cutting, cutting effective cutting line segment in line segment 55 to be smaller than aforementioned cutting line segment 55 is horizontality
Lower Effective line when being cut, and, cutting line segment 55 not will receive the frontal compression of silicon ingot, slow down cutting line segment 55
Damage extends the service life of cutting line segment 55.
It should be noted that, it is contemplated that be realize to silicon ingot to be cut it is complete cutting and for avoid cut line segment because by
The situations such as damage are generated to blocking, technical solution provided by the present application is to be cut for support when being in cutting position
The side frame 313 of silicon ingot has carried out certain structure design.In the present embodiment, adjacent to the area of turning support 31 in side frame 313
Domain, the region are the bottom surface of neighbouring silicon ingot to be cut, are provided with one corresponding with the cutting line segment 55 in wire-electrode cutting device 5
Allow wire casing 315 (as shown in Figure 1, in the present embodiment, allow wire casing 315 along X to setting).As for the size of wire casing 315 is allowed, generally
Ground allows the width of wire casing 315 and depth can be appropriate larger, to provide biggish redundancy, for example, allowing the width of wire casing can example
For example 8 millimeters to 20 millimeters.In this way, the cutting line segment 55 in wire-electrode cutting device 5 follows cutting support 51 with respect under mounting rack 11
Drop carries out bottom surface cutting by be cut silicon ingot of the cutting line segment 55 on cutting support 51 to 3 supports of silicon ingot tipping gear,
Cutting line segment 55 reaches the bottom end of silicon ingot to be cut and continues decline until through silicon ingot to be cut, from silicon ingot to be cut
The cutting line segment 55 being pierced by can submerge just to be allowed accordingly in wire casing 315, realizes the complete cutting to silicon ingot to be cut, shape
At the silicon ingot and bottom surface flaw-piece cut.In the present embodiment, the thickness of bottom surface flaw-piece is about 10 millimeters to 30 millimeters, generally
Ground may be, for example, 20 millimeters to 30 millimeters.
Certainly, for wire-electrode cutting device 5, the also settable corresponding conducting wire on two cutting supports 51 or mounting rack 11
Wheel, tension mechanism etc. are arranged, herein for realizing guiding, the tension adjustment etc. of cutting line about guide roller, tension mechanism etc.
It repeats no more.
When the bottom surface cutting equipment in application embodiment illustrated in fig. 1 implements the bottom surface cutting of silicon ingot, in the initial state,
Silicon ingot tipping gear 3 is in upper and lower discharge position (that is, the turning support 31 in silicon ingot tipping gear 3 is in horizontality or approximation
In horizontality) and wire-electrode cutting device 5 be in the top of mounting rack 11.
Firstly, silicon ingot 10 to be cut is lain against on silicon ingot tipping gear 3, held by the chassis 311 in turning support 31
The bottom surface for holding in the palm silicon ingot 10 to be cut, by the side frame 313 in turning support 31 against the side of silicon ingot 10 to be cut.Implementing should
State after step sees Fig. 3 and Fig. 4, wherein Fig. 3 is shown as the bottom surface cutting equipment in a certain embodiment in upper and lower material position
The stereoscopic schematic diagram of support silicon ingot to be cut is set, Fig. 4 is the side view of Fig. 3.In practical applications, by silicon ingot 10 to be cut
Lying against may particularly include on silicon ingot tipping gear 3: load silicon ingot 10 to be cut to overturning using silicon ingot handler
On the chassis 311 of bracket 31, ejection silicon ingot 10 is until against the side frame 313 in turning support 31.
Driving turning support 31 is overturn, and turning support 31 is overturn to cutting position by upper and lower discharge position (that is, overturning is held in the palm
Chassis 311 in frame 31 is by original horizontality or is similar to horizontality and overturns to vertical state or be similar to vertical shape
State), by the side of the silicon ingot 10 to be cut of 313 support of side frame in turning support 31, at this point, multipair on driving mounting rack 11
Each clamping piece 71 in clamping piece towards the mobile side to be held on silicon ingot 10 of silicon ingot 10, to be located at location of cut to
The silicon ingot 10 of cutting carries out clamping position.State after implementing the step sees Fig. 5, is shown as the bottom surface in a certain embodiment
Side view of the cutting equipment in cutting position support silicon ingot to be cut.
Driving cutting support 51 declines with respect to mounting rack 11, and cutting line segment 55 follows cutting support 51 to decline, by cutting line
55 pairs of section silicon ingot 10 to be cut carries out bottom surface cutting, until cutting line segment 55 is through silicon ingot 10 to be cut and submerges corresponding
It allows in wire casing 315, realizes the complete cutting to silicon ingot 10 to be cut, form the silicon ingot 12 and bottom surface flaw-piece 14 cut.It is real
State after applying the step sees Fig. 6, and the bottom surface cutting equipment being shown as in a certain embodiment is completed in cutting position to silicon
Side view after the bottom surface cutting of ingot.
It is subsequent, still using silicon ingot tipping gear, drive turning support 31 to overturn, by turning support 31 by cutting position
It overturns to loading and unloading position (that is, the chassis 311 in turning support 31 is by original vertical state or is similar to vertical state overturning
To horizontality or it is similar to horizontality), it, will by the 311 support bottom surface flaw-piece 14 of chassis and silicon ingot 12 in turning support 31
The silicon ingot 12 and bottom surface flaw-piece 14 cut is unloaded, and upper new silicon ingot to be cut of reloading.And the bottom surface unloaded
Flaw-piece 14 can then be re-used and put into the growth technique of new silicon ingot, for example, bottom surface flaw-piece 14 can be used as new silicon ingot
Growth substrate, continued growth crystal is on bottom surface flaw-piece 14 to form new silicon ingot.
It should be noted that in the present embodiment, being formed after being cut to the bottom surface of silicon ingot using bottom surface cutting equipment
Bottom surface flaw-piece, but be not limited thereto, in fact, those skilled in the art are based on similar principle, together by preceding description
Sample can obtain top surface flaw-piece after can cutting to the top surface of silicon ingot using the bottom surface cutting equipment, and details are not described herein.
Referring to Fig. 7, being shown as stereoscopic schematic diagram of the bottom surface cutting equipment of the application silicon ingot in a certain embodiment.In
In the embodiment, the bottom surface cutting equipment of the silicon ingot is to obtain complete bottom surface flaw-piece for carrying out bottom surface cutting to silicon ingot.
As shown in fig. 7, the bottom surface cutting equipment of silicon ingot disclosed in the present application includes: pedestal 1, silicon ingot tipping gear, and
Wire-electrode cutting device 5, wherein silicon ingot tipping gear between upper and lower discharge position and cutting position for overturning silicon ingot, wire cutting
Device 5 is used to carry out bottom surface cutting to the silicon ingot for being located at location of cut.
Pedestal is the main element of the bottom surface cutting equipment of silicon ingot.Generally, the volume and weight of pedestal are larger, thus
It can provide biggish mounting surface and firm complete machine stable degree.As shown in fig. 7, in the present embodiment, in the middle section of pedestal 1
Equipped with a mounting rack 11.
Ground and pedestal connection may be reversed, it can be achieved that overturning between upper and lower discharge position and cutting position in silicon ingot tipping gear.
As shown in fig. 7, in the present embodiment, being equipped with two silicon ingots that connection may be reversed with pedestal 1 in the opposite sides of mounting rack 11 and turning over
Rotary device.For ease of description, in the following description, the two silicon ingot tipping gears can be known as to 3 He of the first silicon ingot tipping gear
Second silicon ingot tipping gear 4.Using the first silicon ingot tipping gear 3 and the second silicon ingot tipping gear 4, silicon ingot can be carried respectively and is incited somebody to action
Corresponding silicon ingot is overturn between upper and lower discharge position and cutting position, that is, by silicon ingot to be cut by upper and lower discharge position overturn to
Cutting position and the silicon ingot cut is overturn by cutting position to loading and unloading position.
The structure of first silicon ingot tipping gear 3 and the second silicon ingot tipping gear 4 can be identical, therefore, can specifically join
Fig. 2 is read to illustrate the structure of the first silicon ingot tipping gear 3 in Fig. 7.As shown in Fig. 2, in actual application, the overturning of the first silicon ingot
Device 3 further includes: turning support 31 and turnover driving mechanism 33.
Turning support 31 is connected to pedestal 1 by overturning 35 axis of transmission shaft.In the present embodiment, turning support 31 can be further
It include: chassis 311 and the side frame being connect with chassis 311 313, wherein chassis 311 is used for the bottom surface of support silicon ingot, and side frame 313 is then
Side for support silicon ingot.Generally, the silicon ingot of growth is rectangular parallelepiped structure, the length and width of the height of silicon ingot with respect to silicon ingot
Spend smaller, therefore, the planar dimension where bottom surface and top surface is larger, and the planar dimension where four sides is then smaller.
By taking G7 silicon ingot as an example, for three-dimensional dimension up to 1160 millimeters * 1160 millimeters * 360 millimeters (long * wide * high), weight has 1,200,000 enough
Gram (1.2 tons).Therefore, the turning support 31 that chassis 311 and side frame 313 form is whole to be of an L-shaped structure, wherein chassis 311 is L
The long side of type structure, side frame 313 are the short side of L-type structure.In the present embodiment, the first silicon ingot tipping gear 3 is in upper and lower material position
When setting place, chassis 311 is in a horizontal state；First silicon ingot tipping gear 3 is in location of cut, the state in a vertical shape of chassis 311.
Chassis 311 is the bottom surface for support silicon ingot, and therefore, chassis 311 is formed by the bottom surface of support range and silicon ingot
Size is adapted.As shown in Fig. 7 and Fig. 2, chassis 311 includes two supporting legs 312 being oppositely arranged, in this way, guaranteeing support
In the case of the bottom surface of silicon ingot, it can farthest mitigate the weight of chassis 311 and turning support 31, be also beneficial to turning support
31 make rotary movement.Certainly, larger in view of the bed-plate dimension of silicon ingot, the spacing between two supporting legs 312 being oppositely arranged may
Seem bigger, and there is also the possibility of the uneven situations such as smooth for the bottom surface of silicon ingot, therefore, in some embodiments, chassis
311 may also include the backer 314 between two supporting legs 312, the quantity of backer 314 can be one or more, lean on
The structure on mountain 314 can be similar with the structure of supporting leg 312, and but, the length of backer 314 can be shorter than supporting leg 312.Utilize backer
314, the effects of auxiliary support can be played and positioned.
Side frame 313 corresponds to the side of silicon ingot with the side of the support silicon ingot in the overturning of turning support 31 to cutting position
Face.
Turnover driving mechanism 33 is for driving turning support 31 to overturn.As shown in Fig. 2, in the present embodiment, overturning is driven
Motivation structure 33 may be, for example, cylinder or oil cylinder 332 with piston rod 334, and the end of piston rod 334 passes through an overturning interlocking bar
And it is connect with overturning transmission shaft 35.In actual application, on the one hand, drive piston rod 334 to stretch out by cylinder or oil cylinder 332,
The piston rod 334 of stretching drives overturning transmission shaft 35 to rotate (such as rotating clockwise) by overturning interlocking bar, is driven in overturning
Under the rotation of axis 35, turning support 31 is overturn, and is overturn by upper and lower discharge position to cutting position.On the other hand, by cylinder or oil
Cylinder 332 drives piston rod 334 to shrink, the piston rod 334 of contraction by overturning interlocking bar drive the rotation of overturning transmission shaft 35 (such as
Rotate counterclockwise), under the rotation of overturning transmission shaft 35, turning support 31 is overturn, and is overturn by cutting position to loading and unloading position
It sets.
Similarly, the second silicon ingot tipping gear 4 further includes: turning support 41 and turnover driving mechanism (it does not show in the drawings,
Specific structure can refer to Fig. 2).
Turning support 41 is connected to pedestal 1 by overturning transmission shafts.In the present embodiment, turning support 41 can be wrapped further
It includes: chassis 411 and the side frame 413 being connect with chassis 411, wherein chassis 411 is used for the bottom surface of support silicon ingot, and side frame 413 is then used
In the side of support silicon ingot.Generally, the silicon ingot of growth is rectangular parallelepiped structure, the length and width of the height of silicon ingot with respect to silicon ingot
Smaller, therefore, the planar dimension where bottom surface and top surface is larger, and the planar dimension where four sides is then smaller.With
For G7 silicon ingot, for three-dimensional dimension up to 1160 millimeters * 1160 millimeters * 360 millimeters (long * wide * high), weight has 1200 kilograms enough
(1.2 tons).Therefore, the turning support 41 that chassis 411 and side frame 413 form is whole to be of an L-shaped structure, wherein chassis 411 is L-type
The long side of structure, side frame 413 are the short side of L-type structure.In the present embodiment, the first silicon ingot tipping gear 4 is in upper and lower discharge position
When place, chassis 411 is in a horizontal state；First silicon ingot tipping gear 4 is in location of cut, the state in a vertical shape of chassis 411.
Chassis 411 is the bottom surface for support silicon ingot, and therefore, chassis 411 is formed by the bottom surface of support range and silicon ingot
Size is adapted.As shown in Fig. 7 and Fig. 2, chassis 411 includes two supporting legs 412 being oppositely arranged, in this way, guaranteeing support
In the case of the bottom surface of silicon ingot, it can farthest mitigate the weight of chassis 411 and turning support 41, be also beneficial to turning support
41 make rotary movement.Certainly, larger in view of the bed-plate dimension of silicon ingot, the spacing between two supporting legs 412 being oppositely arranged may
Seem bigger, and there is also the possibility of the uneven situations such as smooth for the bottom surface of silicon ingot, therefore, in some embodiments, chassis
411 may also include the backer 414 between two supporting legs 412, the quantity of backer 414 can be one or more, lean on
The structure on mountain 414 can be similar with the structure of supporting leg 412, and but, the length of backer 414 can be shorter than supporting leg 412.Utilize backer
414, the effects of auxiliary support can be played and positioned.
Side frame 413 corresponds to the side of silicon ingot with the side of the support silicon ingot in the overturning of turning support 41 to cutting position
Face.
Turnover driving mechanism is for driving turning support 41 to overturn.In the present embodiment, turnover driving mechanism can be such as
End for cylinder or oil cylinder with piston rod, piston rod is driven axis connection with overturning by an overturning interlocking bar.In reality
In the application on border, on the one hand, stretched out by cylinder or oil cylinder driving piston rod, the piston rod of stretching is turned over by overturning interlocking bar drive
Turn transmission shaft rotation (such as rotating counterclockwise), under the rotation of overturning transmission shaft, turning support 41 is overturn, by upper and lower material position
Overturning is set to cutting position.On the other hand, it is shunk by cylinder or oil cylinder driving piston rod, the piston rod of contraction passes through overturning linkage
Bar drives overturning transmission shaft rotation (such as rotating clockwise), and under the rotation of overturning transmission shaft, turning support 41 is overturn, by
Cutting position is overturn to loading and unloading position.
It, can be by silicon ingot by the loading and unloading for horizontality using the first silicon ingot tipping gear 3 and the second silicon ingot tipping gear 4
The cutting position of position overturning most vertical state.For ensure silicon ingot in the stability of location of cut, in the present embodiment, such as
Shown in Fig. 7, the clamp assemblies for clamping silicon ingot side are equipped on mounting rack 11.For each silicon ingot tipping gear (
One silicon ingot tipping gear 3 or the second silicon ingot tipping gear 4), the clamp assemblies may include two pairs of clamping pieces setting up and down, often
Two clamping pieces 71 in a pair of of clamping piece are relatively arranged on mounting rack 11, and, each clamping piece 71 can be with respect to mounting rack
11 make mobile (in the present embodiment, the moving direction be X to), in this way, two 71 energy of clamping piece in a pair of of clamping piece
Realization moves towards (the clamping spacing between two clamping pieces 71 reduces) or is moved away from the (clamping between two clamping pieces 71
Spacing increases), to be suitable for various sizes of silicon ingot and be held on the side of silicon ingot.It, can will be to be cut by clamp assemblies
Silicon ingot give clamping position in location of cut.
Certainly, in other embodiments, may be used also on the mounting surface of the first silicon ingot tipping gear 3 of direction in mounting rack 11
Equipped with for against the supporter of silicon ingot top surface (not shown in the drawings) and in mounting rack 11 towards the second silicon ingot
It can be also equipped with for the supporter (not shown in the drawings) against silicon ingot top surface on the mounting surface of turnover device 4.In this way,
Silicon ingot is overturn to cutting position and the second silicon ingot tipping gear 4 by upper and lower discharge position by silicon in the first silicon ingot tipping gear 3
When ingot is overturn by upper and lower discharge position to cutting position, the supporter on mounting rack 11 can be resisted against silicon ingot top surface.Wherein, against
Chassis 311 in part and the first silicon ingot tipping gear 3 cooperates, and the silicon ingot carried to the first silicon ingot tipping gear 3 plays firm
It positions, the chassis 411 in supporter and the second silicon ingot tipping gear 4 cooperates, the silicon ingot carried to the second silicon ingot tipping gear 4
Play strong fix.In a particular application, the contradictory piece may be, for example, the conflict block with certain telescopic movable or conflict top
Bar etc., but be not limited thereto, the contradictory piece also may be, for example, rubber cushion blocks etc..
Wire-electrode cutting device is used to carry out bottom surface cutting to the silicon ingot for the silicon ingot tipping gear institute support for being located at location of cut
Operation.As shown in fig. 7, in the present embodiment, wire-electrode cutting device 5 includes cutting support 51, cutting wheel 53 and cutting line,
In, cutting line is around in cutting wheel 53 and forms cutting line segment.
Cutting support 51 is movably arranged on mounting rack 11.In some embodiments, cutting support 51 may include two, point
It is not configured at opposite two sides of mounting rack 11.To realize that cutting support 51 is movably arranged on mounting rack 11, support 51 is cut
Equipped with lift drive mechanism.The lift drive mechanism can further comprise: riser guide, lifting slider and lifting driving
Source, wherein the riser guide can be along lifting direction setting (in the present embodiment, the lifting direction is Z-direction), such as edge
Mounting rack 11 be arranged, the lifting slider is set on cutting support 51 and matches with the riser guide.To cut
The stability of 51 lifting and translocating of cut branch seat, can configure two riser guides, the two riser guides are located at corresponding cutting
The opposite sides of support 51.The lifting driving source then may include the ball-screw and servo motor being arranged along the vertical direction, rolling
Ballscrew has the characteristics that high-precision, invertibity and efficient, in this way, passing through the cooperation of servo motor and ball-screw, it is ensured that
Cut the precision of the lifting and translocating in the vertical direction of support 51.Certainly, the lifting driving source can also make other selections, example
Such as, in some embodiments, the lifting driving source may include lifting rack rails, driving gear and lifting driving motor, wherein
(in the present embodiment, the lifting rack rails is arranged along Z-direction), the driving gear is arranged along vertical mode in the lifting rack rails
It is engaged with the lifting rack rails, the lifting driving motor is for driving the driving gear.In this way, being driven by the lifting
Source can drive cutting support 51 to carry out lifting and translocating in the vertical direction along the riser guide.
Cutting wheel 53 is set on cutting support 51, as shown in fig. 7, in the present embodiment, being equipped with court on cutting support 51
Cutting wheel group to the first silicon ingot tipping gear 3 and the cutting wheel group towards the second silicon ingot tipping gear 4, each cutting wheel group
In include at least two cutting wheels 53.Cutting line is sequentially around in each cutting wheel 53 on cutting support 51, thus at two
It cuts and forms cutting line segment and corresponding second silicon ingot in support 51 between each cutting wheel 53 of corresponding first silicon ingot tipping gear 3
Cutting line segment is formed between each cutting wheel 53 of turnover device 4.For ease of description, in the following description, this two can be cut
Secant section is referred to as the first cutting line segment 55 and the second cutting line segment 56, wherein the first cutting line segment 55 corresponds to the first silicon
Ingot turnover device 3, the second cutting line segment 56 correspond to the second silicon ingot tipping gear 4.
Lifting and translocating can be carried out along mounting rack 11 in the vertical direction by lift drive mechanism by cutting support 51, this
Sample, two cutting supports 51 can be controlled by corresponding lift drive mechanism to carry out lifting and translocating in wire-electrode cutting device 5.In
In certain embodiments, two cutting supports 51 being oppositely arranged can carry out same under the control of corresponding lift drive mechanism
Lifting and translocating is walked, in this way, the first cutting line segment 55 and the second cutting line segment 56 between two cutting supports 51 are always horizontal
State simultaneously accordingly cuts the bottom surface of silicon ingot.In some embodiments, two cutting supports 51 being oppositely arranged are each
Asynchronous lifting and translocating under self-corresponding lift drive mechanism control, one of cutting support 51 can be with respect to another cuttings
Support 51 is made to be biased to movement.In specific implementation, using lift drive mechanism, it can be achieved that by be oppositely arranged two cutting supports
51 asynchronous lifting and translocatings, so that two cutting supports 51 are setting up and down for silicon ingot (that is, two cutting supports 51
Between the first cutting line segment 55 and the second cutting line segment 56 be non-horizontal setting), thus in cutting operation, the first cutting line
The part cutting line segment being located under in section 55 (or second cutting line segment 56) first connects than being located in upper part cutting line segment
Silicon ingot is touched, then being then the first cutting line when subsequent first cutting line segment 55 (or second cutting line segment 56) is from silicon ingot outlet
Be located in section 55 (or second cutting line segments 56) upper part cutting line segment than after the part cutting line segment that is located under from
Silicon ingot is opened and outlet, in this way, the silicon ingot surface of the part cutting line segment outlet under can prevent, avoid at least reducing out
The situation of existing chipping, farthest protects the surface of silicon ingot, improves the cut quality of silicon ingot.Further more, due to the first cutting
The cutting angle of line segment 55 (or second cutting line segment 56) and silicon ingot is in the acute angle or obtuse angle of on-right angle, and in cutting, first is cut
Effective cutting line segment in secant section 55 (or second cutting line segment 56) is smaller than (or the second cutting of aforementioned first cutting line segment 55
Line segment 56) it is Effective line under horizontality when being cut, and, the first cutting line segment 55 (or second cutting line segment 56) is no
The frontal compression that will receive silicon ingot slows down the damage of the first cutting line segment 55 (or second cutting line segment 56), extends first
Cut the service life of line segment 55 (or second cutting line segment 56).
It should be noted that, it is contemplated that be realize to silicon ingot to be cut it is complete cutting and for avoid cut line segment because by
The situations such as damage are generated to blocking, technical solution provided by the present application is to be cut for support when being in cutting position
The side frame 313,413 of silicon ingot has carried out certain structure design.In the present embodiment, by taking side frame 313 as an example, in side frame 313
The region of neighbouring turning support 31, the region are the bottom surface of neighbouring silicon ingot to be cut, are provided with and the in wire-electrode cutting device 5
One cutting line section 55 corresponding one allow wire casing 315 (as shown in fig. 7, in the present embodiment, allow wire casing 315 along X to setting).Extremely
In allowing the size of wire casing 315, generally, allow the width of wire casing 315 and depth can be appropriate larger, to provide biggish redundancy
Degree, for example, the width of wire casing is allowed to may be, for example, 8 millimeters to 20 millimeters.In this way, the first cutting line segment 55 in wire-electrode cutting device 5
It follows cutting support 51 to decline with respect to mounting rack 11, first silicon ingot is overturn by the first cutting line segment 55 on cutting support 51 and is filled
The silicon ingot to be cut for setting 3 supports carries out bottom surface cutting, the first cutting line segment 55 reach the bottom end of silicon ingot to be cut and after
Until running through silicon ingot to be cut, the first cutting line segment 55 being pierced by from silicon ingot to be cut can submerge accordingly just for continuous decline
Allow in wire casing 315, realize the complete cutting to silicon ingot to be cut, form the silicon ingot and bottom surface flaw-piece cut.With side frame
For 413, the region of neighbouring turning support 41 in side frame 413, which is the bottom surface of neighbouring silicon ingot to be cut, is provided with
Wire casing is allowed (not shown in Fig. 7, in the present embodiment with the second cutting corresponding one, line segment 56 in wire-electrode cutting device 5
In, this allow wire casing along X to setting).As for allowing the size of wire casing 415 generally to allow the width of wire casing 415 and depth can be appropriate
It is larger, to provide biggish redundancy, for example, the width of wire casing is allowed to may be, for example, 8 millimeters to 20 millimeters.In this way, wire cutting
The second cutting line segment 56 in device 5 follows cutting support 51 to decline with respect to mounting rack 11, is cut by second on cutting support 51
The silicon ingot to be cut of 56 pair second of the secant section support of silicon ingot tipping gear 4 carries out bottom surface cutting, and the second cutting line segment 56 arrives
Up to silicon ingot to be cut bottom end and continue decline until through silicon ingot to be cut, second be pierced by from silicon ingot to be cut is cut
Secant section 56 can be submerged just to be allowed accordingly in wire casing, realize the complete cutting to silicon ingot to be cut, is formed and has been cut
Silicon ingot and bottom surface flaw-piece.In the present embodiment, the thickness of bottom surface flaw-piece is about 10 millimeters to 30 millimeters, generally, can be such as
It is 20 millimeters to 30 millimeters.
Certainly, for wire-electrode cutting device 5, the also settable corresponding conducting wire on two cutting supports 51 or mounting rack 11
Wheel, tension mechanism etc. are arranged, herein for realizing guiding, the tension adjustment etc. of cutting line about guide roller, tension mechanism etc.
It repeats no more.
When the bottom surface cutting equipment in application embodiment illustrated in fig. 7 implements the bottom surface cutting of silicon ingot, in the initial state,
First silicon ingot tipping gear 3 and the second silicon ingot tipping gear 4 are in upper and lower discharge position (that is, turning in the first silicon ingot tipping gear 3
The turning support 41 to ask in frame 31 and the second silicon ingot tipping gear 4 is in horizontality or is similar to horizontality) and line cut
Cut the top that device 5 is in mounting rack 11.
Firstly, two silicon ingots 10 to be cut are lain against the first silicon ingot tipping gear 3 and the second silicon ingot overturning dress respectively
It sets on 4, wherein for the first silicon ingot tipping gear 3, by the silicon ingot 10 to be cut of 311 support of chassis in turning support 31
Bottom surface, by the side frame 313 in turning support 31 against the side of silicon ingot 10 to be cut, for the second silicon ingot tipping gear 4, by
The bottom surface of 411 support of chassis in turning support 41 silicon ingot 10 to be cut, by the side frame 413 in turning support 41 against to be cut
The side of the silicon ingot 10 cut.State after implementing the step sees Fig. 8 and Fig. 9, wherein Fig. 8 is shown as in a certain embodiment
Bottom surface cutting equipment upper and lower discharge position support silicon ingot to be cut stereoscopic schematic diagram, Fig. 9 be Fig. 8 side view.In reality
In the application of border, by taking the first silicon ingot tipping gear 3 as an example, silicon ingot 10 to be cut is lain against can on the first silicon ingot tipping gear 3
It specifically includes: silicon ingot 10 to be cut being loaded to the chassis 311 of the first turning support 31 using silicon ingot handler, is pushed away
Silicon ingot 10 is pushed up until against the side frame 313 in turning support 31.
It drives the turning support 31 in the first silicon ingot tipping gear 3 to overturn, turning support 31 is turned over by upper and lower discharge position
Cutting position is gone to (that is, chassis 311 in turning support 31 is by original horizontality or is similar to horizontality and overturns to perpendicular
Straight state is similar to vertical state), by the side of the silicon ingot 10 to be cut of 313 support of side frame in turning support 31, at this point,
Each clamping piece 71 in multipair clamping piece on driving mounting rack 11 is held on the side of silicon ingot 10 towards the movement of silicon ingot 10,
Clamping position is carried out to the silicon ingot 10 to be cut for being located at location of cut.Drive the overturning support in the second silicon ingot tipping gear 4
Frame 41 is overturn, by turning support 41 by upper and lower discharge position overturn to cutting position (that is, chassis 411 in turning support 41 by
Original horizontality is similar to horizontality and overturns to vertical state or be similar to vertical state), by turning support 41
413 support of side frame silicon ingot 10 to be cut side, at this point, each clamping in multipair clamping piece on driving mounting rack 11
Part 71 presss from both sides the silicon ingot 10 to be cut for being located at location of cut towards the mobile side to be held on silicon ingot 10 of silicon ingot 10
Hold positioning.State after implementing the step sees Figure 10, is shown as the bottom surface cutting equipment in a certain embodiment in cleavage
Set the side view of support silicon ingot to be cut.
Driving cutting support 51 declines with respect to mounting rack 11, and the first cutting line segment 55 and the second cutting line segment 56 follow cutting
Support 51 declines, wherein is carried out by the first cutting line segment 55 to the silicon ingot 10 to be cut of 3 supports of the first silicon ingot tipping gear
Bottom surface cutting, until the first cutting line segment 55 allows in wire casing 315 accordingly through silicon ingot 10 to be cut and submerging, realization is treated
The silicon ingot 12 and bottom surface flaw-piece 14 that are cut to cut completely of the silicon ingot 10 of cutting, by the second cutting line segment 56 to second
The silicon ingot 10 to be cut of 4 supports of silicon ingot tipping gear carries out bottom surface cutting, until the second cutting line segment 56 is through to be cut
Silicon ingot 10 and submerging allowed in wire casing 415 accordingly, realize and silicon ingot 10 to be cut be cut to cut completely
Silicon ingot 12 and bottom surface flaw-piece 14.State after implementing the step sees Figure 11, the bottom surface cutting being shown as in a certain embodiment
Equipment is completed in cutting position to the side view after the bottom surface cutting of silicon ingot.
It is subsequent, it is still overturn using the first silicon ingot tipping gear 3 driving turning support 31, by turning support 31 by cutting
Position is overturn to loading and unloading position (that is, the chassis 311 in turning support 31 is by original vertical state or is similar to vertical state
Overturning is to horizontality or is similar to horizontality), by the 311 support bottom surface flaw-piece 14 of chassis and silicon ingot in turning support 31
12, the silicon ingot 12 cut and bottom surface flaw-piece 14 are unloaded, and upper new silicon ingot to be cut of reloading.Utilize second
Silicon ingot tipping gear 4 drive turning support 41 overturn, by turning support 41 by cutting position overturn to loading and unloading position (that is,
Chassis 411 in turning support 41 is by original vertical state or is similar to vertical state and overturns to horizontality or be similar to water
Level state), by the 411 support bottom surface flaw-piece 14 of chassis and silicon ingot 12 in turning support 41, by the silicon ingot 12 cut and bottom surface
Flaw-piece 14 is unloaded, and upper new silicon ingot to be cut of reloading.And the bottom surface flaw-piece 14 unloaded can be then re-used
And put into the growth technique of new silicon ingot, for example, bottom surface flaw-piece 14 can be used as the growth substrate of new silicon ingot, in bottom surface flaw-piece
Continued growth crystal is on 14 to form new silicon ingot.
The bottom surface cutting equipment of silicon ingot disclosed in the present application, is provided with silicon ingot tipping gear and wire-electrode cutting device, utilizes silicon
Ingot turnover device can entirely be overturn large-sized silicon ingot by upper and lower discharge position to cutting position, so that wire-electrode cutting device can align
Bottom surface cutting is carried out in the silicon ingot of location of cut, complete bottom surface flaw-piece is obtained, improves the recovery utilization rate and energy of waste material
Improve the efficiency of recovery processing.
The principles and effects of the application are only illustrated in above-described embodiment, not for limitation the application.It is any ripe
Know the personage of this technology all can without prejudice to spirit herein and under the scope of, carry out modifications and changes to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from spirit disclosed herein and institute under technical idea such as
At all equivalent modifications or change, should be covered by claims hereof.
Claims (10)
1. a kind of bottom surface cutting equipment of silicon ingot characterized by comprising
Pedestal is equipped with mounting rack；
Silicon ingot tipping gear may be reversed ground and connect with the pedestal, be used for silicon ingot between upper and lower discharge position and cutting position
Overturning；And
Wire-electrode cutting device, including cutting support, cutting wheel and cutting line, wherein the cutting line be around in the cutting wheel and
Form cutting line segment；The cutting line segment follows the relatively described mounting rack activity of the cutting support to positioned at location of cut
Silicon ingot carry out bottom surface cutting.
2. the bottom surface cutting equipment of silicon ingot according to claim 1, which is characterized in that be equipped in the side of the mounting rack
Silicon ingot tipping gear forms cutting line corresponding with the silicon ingot tipping gear of the mounting rack side on the wire-electrode cutting device
Section.
3. the bottom surface cutting equipment of silicon ingot according to claim 1, which is characterized in that in the opposite sides of the mounting rack
It is respectively equipped with silicon ingot tipping gear, is formed on the wire-electrode cutting device and overturns dress with the silicon ingot of the mounting rack opposite sides
Set corresponding cutting line segment.
4. the bottom surface cutting equipment of silicon ingot according to claim 1, which is characterized in that the silicon ingot tipping gear includes:
Turning support is connected to the pedestal by overturning transmission shafts；And
Turnover driving mechanism, for driving the turning support.
5. the bottom surface cutting equipment of silicon ingot according to claim 4, which is characterized in that the turning support includes:
Chassis, the bottom surface for support silicon ingot；And
Side frame is connect with the chassis, the side for support silicon ingot.
6. the bottom surface cutting equipment of silicon ingot according to claim 5, which is characterized in that the chassis includes being oppositely arranged
Two supporting legs.
7. the bottom surface cutting equipment of silicon ingot according to claim 6, which is characterized in that the chassis further includes being set to two
Backer between supporting leg.
8. the bottom surface cutting equipment of silicon ingot according to claim 5, which is characterized in that the side frame is equipped with and cuts with described
The corresponding wire casing that allows of secant section.
9. the bottom surface cutting equipment of silicon ingot according to claim 1, which is characterized in that be equipped with and be used on the mounting rack
Clamp the clamp assemblies of silicon ingot side.
10. the bottom surface cutting equipment of silicon ingot according to claim 1, which is characterized in that be equipped with and use on the mounting rack
In the supporter against silicon ingot top surface.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821482499.4U CN209649208U (en) | 2018-09-11 | 2018-09-11 | The bottom surface cutting equipment of silicon ingot |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821482499.4U CN209649208U (en) | 2018-09-11 | 2018-09-11 | The bottom surface cutting equipment of silicon ingot |
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| CN209649208U true CN209649208U (en) | 2019-11-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109049375A (en) * | 2018-09-11 | 2018-12-21 | 天通日进精密技术有限公司 | The bottom surface cutting equipment of silicon ingot and the bottom surface cutting method of silicon ingot |
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2018
- 2018-09-11 CN CN201821482499.4U patent/CN209649208U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109049375A (en) * | 2018-09-11 | 2018-12-21 | 天通日进精密技术有限公司 | The bottom surface cutting equipment of silicon ingot and the bottom surface cutting method of silicon ingot |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Bottom cutting equipment of silicon ingot Effective date of registration: 20211126 Granted publication date: 20191119 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Haining sub branch Pledgor: TIANTONG RIJIN PRECISION TECHNOLOGY Co.,Ltd. Registration number: Y2021330002258 |
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