CN209641688U - A kind of adopting surface mounted LED lamp bead - Google Patents

A kind of adopting surface mounted LED lamp bead Download PDF

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Publication number
CN209641688U
CN209641688U CN201920728204.5U CN201920728204U CN209641688U CN 209641688 U CN209641688 U CN 209641688U CN 201920728204 U CN201920728204 U CN 201920728204U CN 209641688 U CN209641688 U CN 209641688U
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CN
China
Prior art keywords
substrate
connecting column
lamp bead
led lamp
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920728204.5U
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Chinese (zh)
Inventor
陈都
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan City Beyond Photoelectric Technology Co Ltd
Original Assignee
Dongguan City Beyond Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan City Beyond Photoelectric Technology Co Ltd filed Critical Dongguan City Beyond Photoelectric Technology Co Ltd
Priority to CN201920728204.5U priority Critical patent/CN209641688U/en
Application granted granted Critical
Publication of CN209641688U publication Critical patent/CN209641688U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The utility model discloses a kind of adopting surface mounted LED lamp bead, including LED chip, metal substrate, metal substrate includes a first substrate and the second substrate;First substrate and the second substrate are connected to each other;The centre of first substrate and the second substrate interface is formed with a chip placing groove, and LED chip is placed in chip placing groove;The slot bottom of chip placing groove offers multiple connecting holes, and a heat dissipation connector is equipped in the connecting hole of part;The connector that radiates includes a connecting column, and a limit plate is fixed in the upper end of connecting column, and connecting column is protruded in the side of limit plate;The lower end of connecting column is fixed with an elastomer block, and elastomer block protrudes from connecting column.The good heat dissipation effect of the utility model is hardly damaged after LED lamp bead long-time use, and the service life is longer;LED chip installation rear stability is strong, and replacement easy to disassemble, easy to repair.

Description

A kind of adopting surface mounted LED lamp bead
Technical field
The utility model relates to LED lamp bead fields, and in particular to adopting surface mounted LED lamp bead.
Background technique
Adopting surface mounted LED lamp bead principle of luminosity is exactly by electric current by compound semiconductor, by the combination of electronics and hole, Superfluous energy will release in the form of light, achieve the effect that luminous.
Compared to traditional incandescent lamp, the loss late of energy consumption and light greatly reduces current adopting surface mounted LED lamp bead, but The maintenance of adopting surface mounted LED lamp bead is more troublesome.Secondly, present adopting surface mounted LED lamp bead heat dissipation on there is also certain problem, can The shortening in LED lamp bead service life can be will cause.
Utility model content
The purpose of this utility model is to provide a kind of adopting surface mounted LED lamp beads, are conveniently replaceable LED lamp bead, and mounting structure is steady Fixed, thermal diffusivity is strong.
For this purpose, the utility model uses following technical scheme:
There is provided a kind of adopting surface mounted LED lamp bead, including LED chip, metal substrate, metal substrate includes a first substrate and the Two substrates;First substrate and the second substrate are connected to each other;The centre of first substrate and the second substrate interface is formed with a chip and puts Slot is set, LED chip is placed in chip placing groove;The slot bottom of chip placing groove offers multiple connecting holes, in the connecting hole of part Equipped with a heat dissipation connector;The connector that radiates includes a connecting column, and a limit plate, the side of limit plate are fixed in the upper end of connecting column Protrude connecting column in face;The lower end of connecting column is fixed with an elastomer block, and elastomer block protrudes from connecting column.
The bottom of LED chip passes through a piece of cooling fin to match of thermally conductive gluing knot as a preferred technical solution,.
Chip placing groove is in rectangle or circular configuration as a preferred technical solution, and the half of chip placing groove is arranged On the first substrate, the other half is arranged in the second substrate.
Connecting column is made of heat-conducting metal as a preferred technical solution, and the surface of connecting column is equipped with external screw thread, connection The inner wall in hole is equipped with the internal screw thread to match with external screw thread, and connecting column is inserted into connecting hole by being threadedly engaged.
Limit plate includes that one piece of light-transmitting plate and one layer of translucent silica gel layer, translucent silica gel layer are set as a preferred technical solution, It sets in the lower section of light-transmitting plate, translucent silica gel layer is in contact with LED chip.
A heat dissipation channel is vertically equipped in connecting column as a preferred technical solution,;Elastomer block structure in the form of annular discs, elasticity Fix a heat conductive filament for the upper end of block, and heat conductive filament and the top of interface channel are mutually fixed.
The utility model has the beneficial effects that the good heat dissipation effect of the utility model, not rapid wear after LED lamp bead long-time use Bad, the service life is longer;LED chip installation rear stability is strong, and replacement easy to disassemble, easy to repair.
Detailed description of the invention
It, below will be in the utility model embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment Required attached drawing is briefly described.It should be evident that drawings described below is only the one of the utility model A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these Attached drawing obtains other attached drawings.
Fig. 1 is the top view of the utility model.
Fig. 2 is the structure chart of the heat dissipation connector of the utility model.
Fig. 3 is the structure chart of the limit plate of the utility model.
In figure:
1, LED chip;3, first substrate;4, the second substrate: 5, chip mounting groove;6, connecting hole;7, radiate connector; 7a, connecting column;7b, limit plate;7c, elastomer block;7d, light-transmitting plate;7e, translucent silica gel layer;7f, heat dissipation channel;7g, heat conductive filament; 8, channel.
Specific embodiment
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
Wherein, the drawings are for illustrative purposes only and are merely schematic diagrams, rather than pictorial diagram, should not be understood as to this The limitation of patent;In order to better illustrate the utility model embodiment, the certain components of attached drawing have omission, zoom in or out, The size of actual product is not represented;It will be understood by those skilled in the art that certain known features and its explanation may save in attached drawing Slightly it will be understood by.
The same or similar label correspond to the same or similar components in the attached drawing of the utility model embodiment;It is practical at this In novel description, it is to be understood that if there is the orientation of the instructions such as term " on ", "lower", "left", "right", "inner", "outside" Or positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model and simplification is retouched It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, Therefore the terms describing the positional relationship in the drawings are only for illustration, should not be understood as the limitation to this patent, for this For the those of ordinary skill in field, the concrete meaning of above-mentioned term can be understood as the case may be.
In the description of the present invention, unless otherwise clearly defined and limited, if there is the instruction such as term " connection " Connection relationship between component, which shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, Or it is integral;It can be mechanical connection, be also possible to be electrically connected;It can be directly connected, it can also be indirect by intermediary It is connected, can be the connection of two components interiors or the interaction relationship of two components.For the ordinary skill people of this field For member, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
As shown in Figure 1, a kind of adopting surface mounted LED lamp bead, including LED chip 1, metal substrate, metal substrate include one first Substrate 3 and the second substrate 4;First substrate 3 and the second substrate 4 are connected to each other, and two pieces of substrates are easy to disassemble more preferable;3 He of first substrate The centre of 4 interface of the second substrate is formed with a chip placing groove 5, moves the position of first substrate 3 and the second substrate 4, makes The size for obtaining chip placing groove 5 can change, and conducive to different LED chips 1 is placed, LED chip 1 is placed on chip placing groove 5 It is interior;The slot bottom of chip placing groove 5 offers multiple connecting holes 6, and a heat dissipation connector 7 is equipped in part connecting hole 6.
In the present embodiment, as shown in Fig. 2, heat dissipation connector 7 includes a connecting column 7a, the upper end of connecting column 7a fixes one Protrude connecting column 7a in the side of limit plate 7b, limit plate 7b;The lower end of connecting column 7a is fixed with an elastomer block 7c, and elastomer block 7c is convex For connecting column 7a.
Wherein, the bottom of LED chip 1 is by a piece of cooling fin (not shown) to match of thermally conductive gluing knot, cooling fin Metal fin.
Wherein, chip placing groove 5 is in rectangle or circular configuration, and the half of chip placing groove 5 is arranged in first substrate 3 On, the other half is arranged in the second substrate 4.
Wherein, connecting column 7a is made of heat-conducting metal, and the surface of connecting column 7a is equipped with external screw thread, the inner wall of connecting hole 6 Equipped with the internal screw thread to match with external screw thread, connecting column 7a is inserted by being threadedly engaged in connecting hole 6, and connecting column 7a is convenient for tearing open It unloads, and is conveniently adjusted its position.
Wherein, as shown in figure 3, limit plate 7b includes one piece of light-transmitting plate 7d and one layer of translucent silica gel layer 7e, translucent silica gel layer The lower section of light-transmitting plate 7d is arranged in 7e, and translucent silica gel layer 7e is in contact with LED chip 1, light-transmitting plate 7d and translucent silica gel layer 7e it Between be adhesively fixed.Light-transmitting plate 7d increases hardness, and translucent silica gel layer 7e is contacted with LED chip 1 and increased shock resistance.
Wherein, a heat dissipation channel 7f is vertically equipped in connecting column 7a;Elastomer block 7c structure in the form of annular discs, elastomer block 7c's is upper A heat conductive filament 7g is fixed at end, and the top of heat conductive filament 7g and heat dissipation channel 7f is mutually fixed.
Working principle: in use, first substrate 3 and the second substrate 4 can be adjusted according to the shape and size of LED chip 1, make The size for obtaining chip placing groove 5 is conveniently adjusted, and there is a channel 8 in the lower section of chip placing groove 5, conducive to the heat dissipation of LED chip 1.
When LED chip 1 is placed in chip placing groove 5, edge department wants close part connecting hole 6, in these connecting holes Insertion heat dissipation connector 7 is limited by the way that the limit plate 7b on heat dissipation connector 7 is fixed to LED chip 1, so that it is not easy to loosen, When replacement, the position of adjustment heat dissipation connector 7 can be taken off LED chip and replace into 1 row.
The connector 7 that radiates all is made of heat-conducting metal, for example uses aluminium alloy, is conducive to promote the heat dissipation of LED chip 1 significantly Property.The heat of heat dissipation connector 7 is exported downwards by heat conductive filament 7g, bullet made of the rubber or silica gel below the connector that radiates Property block 7f increase the stability after substrate installation.
The utility model has the beneficial effects that the good heat dissipation effect of the utility model, not rapid wear after LED lamp bead long-time use Bad, the service life is longer;LED chip installation rear stability is strong, and replacement easy to disassemble, easy to repair.
It is to be understood that above-mentioned specific embodiment is only the preferred embodiment and institute's application technology of the utility model Principle.It will be understood by those skilled in the art that various modifications, equivalent replacement, variation etc. can also be done to the utility model.But It is that these transformation should be all within the protection scope of the utility model without departing from the spirit of the utility model.In addition, this Some terms used in application specification and claims are not limitation, it is only for convenient for description.

Claims (6)

1. a kind of adopting surface mounted LED lamp bead, including LED chip (1), metal substrate, which is characterized in that metal substrate includes one first Substrate (3) and the second substrate (4);First substrate (3) and the second substrate (4) are connected to each other;First substrate (3) and the second substrate (4) The centre of interface is formed with a chip placing groove (5), and LED chip (1) is placed in chip placing groove (5);Chip placing groove (5) slot bottom offers multiple connecting holes (6), and heat dissipation connector (7) is equipped in part connecting hole (6);It radiates connector (7) Including a connecting column (7a), the upper end of connecting column (7a) is fixed a limit plate (7b), and connection is protruded in the side of limit plate (7b) Column (7a);The lower end of connecting column (7a) is fixed with an elastomer block (7c), and elastomer block (7c) protrudes from connecting column (7a).
2. adopting surface mounted LED lamp bead according to claim 1, which is characterized in that the bottom of LED chip (1) passes through heat-conducting glue Bond a piece of cooling fin to match.
3. adopting surface mounted LED lamp bead according to claim 1, which is characterized in that chip placing groove (5) is in rectangle or circle The half of structure, chip placing groove (5) is arranged on first substrate (3), the other half is arranged on the second substrate (4).
4. adopting surface mounted LED lamp bead according to claim 1, which is characterized in that connecting column (7a) is made of heat-conducting metal, The surface of connecting column (7a) is equipped with external screw thread, and the inner wall of connecting hole (6) is equipped with the internal screw thread to match with external screw thread, connecting column (7a) is inserted into connecting hole (6) by being threadedly engaged.
5. adopting surface mounted LED lamp bead according to claim 1, which is characterized in that limit plate (7b) includes one piece of light-transmitting plate (7d) and one layer of translucent silica gel layer (7e), translucent silica gel layer are arranged in the lower section of light-transmitting plate, translucent silica gel layer and LED chip (1) It is in contact.
6. adopting surface mounted LED lamp bead according to claim 1, which is characterized in that be vertically equipped with a heat dissipation in connecting column (7a) Channel (7f);Elastomer block (7c) structure in the form of annular discs, the upper end of elastomer block (7c) are fixed a heat conductive filament (7g), heat conductive filament (7g) with The top of heat dissipation channel (7f) is mutually fixed.
CN201920728204.5U 2019-05-20 2019-05-20 A kind of adopting surface mounted LED lamp bead Expired - Fee Related CN209641688U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920728204.5U CN209641688U (en) 2019-05-20 2019-05-20 A kind of adopting surface mounted LED lamp bead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920728204.5U CN209641688U (en) 2019-05-20 2019-05-20 A kind of adopting surface mounted LED lamp bead

Publications (1)

Publication Number Publication Date
CN209641688U true CN209641688U (en) 2019-11-15

Family

ID=68498614

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920728204.5U Expired - Fee Related CN209641688U (en) 2019-05-20 2019-05-20 A kind of adopting surface mounted LED lamp bead

Country Status (1)

Country Link
CN (1) CN209641688U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191115

Termination date: 20210520