CN209636934U - A kind of ground sewage processing system for electroplating technology - Google Patents
A kind of ground sewage processing system for electroplating technology Download PDFInfo
- Publication number
- CN209636934U CN209636934U CN201920139305.9U CN201920139305U CN209636934U CN 209636934 U CN209636934 U CN 209636934U CN 201920139305 U CN201920139305 U CN 201920139305U CN 209636934 U CN209636934 U CN 209636934U
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- CN
- China
- Prior art keywords
- support
- processing system
- collecting tank
- sewage processing
- electroplating technology
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A10/00—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE at coastal zones; at river basins
- Y02A10/30—Flood prevention; Flood or storm water management, e.g. using flood barriers
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to the technical fields of sewage treatment, more particularly, to a kind of ground sewage processing system for electroplating technology, it includes a kind of ground sewage processing system for electroplating technology, it is characterized by comprising the bed course being layed on the ground of electroplating bath side and it is opened in mat surface collecting tank, the support plate walked about for operator is provided with above the collecting tank, deflector hole is offered in the support plate, the lower surface of the support plate is provided with the support column for being connected to the bed course.Bed course is placed on ground, is prevented the electroplating solution of drippage from directly touching with ground, is protected to ground.By the setting of support plate, operator can step on the electroplate liquid dripped on the supporting plate on the supporting plate and be flowed into collecting tank by deflector hole, to prevent the accumulation of electroplate liquid on the supporting plate.By the setting of collecting tank, convenient for being collected to the electroplate liquid of drippage on the supporting plate, in order to which the electroplate liquid to drippage focuses on.
Description
Technical field
The utility model relates to the technical fields of sewage treatment, more particularly, to a kind of ground sewage for electroplating technology
Processing system.
Background technique
Electroplating technology is to utilize the principle of electrolysis by the method for electric conductor layer overlay metal at present.Plating, which refers to, to be contained
In the saline solution of pre- plating metal, using plated parent metal as cathode, by electrolysis, make the sun of pre- plating metal in plating solution from
Son is deposited in base metal surface, forms a kind of method of surface finish of coating.Electroplating bath and electroplate liquid are then galvanizers
Indispensable equipment and raw material in skill, electroplate liquid huge number, many electroplate liquids have corrosivity.
In the prior art, it for the processing efficiency of part, needs to take out part into progress next step work after plating
Make.And the surface of part speckles with electroplate liquid, after part leaves above electroplating bath, electroplate liquid drips on the ground from piece surface.
Electroplate liquid drippage not only be easy to cause ground hydrops on the ground, causes not to the normal operation circumstances of operator
Benefit influences.
Utility model content
The purpose of the utility model is to provide a kind of sewage disposal systems, it is advantageous that, it can be to drippage on the ground
Hydrops be collected, prevent ground hydrops.
The above-mentioned purpose of utility model of the utility model has the technical scheme that
A kind of ground sewage processing system for electroplating technology, it is characterised in that: including with being layed in electroplating bath side
Bed course on face and the collecting tank for being opened in mat surface are provided with the support walked about for operator above the collecting tank
Plate offers deflector hole in the support plate, and the lower surface of the support plate is provided with the support column for being connected to the bed course.
By using above-mentioned technical proposal, bed course is placed on ground, prevent drippage electroplating solution directly with ground phase
Contact, protects ground.By the setting of support plate, operator can be stepped on the supporting plate, and drippage is on the supporting plate
Electroplate liquid by deflector hole flow into collecting tank in, to prevent the accumulation of electroplate liquid on the supporting plate.Pass through collecting tank
Setting, convenient for being collected to the electroplate liquid of drippage on the supporting plate, in order to which the electroplate liquid to drippage focuses on.
Preferably, the bed course is provided with guide face in the two sides of the collecting tank, the guide face is from far from liquid collecting
Slot tilts gradually downward to close to collecting tank.
By using above-mentioned technical proposal, by the setting of guide face, when electroplate liquid is dropped on guide face, in gravity
Under effect, electroplate liquid flows into collecting tank along guide face, prevents electroplate liquid from accumulating on guide face, improves the collection of electroplate liquid
Efficiency.
Preferably, offering several diversion trenches on the guide face.
By using above-mentioned technical proposal, by opening up for diversion trench, electroplate liquid is first flowed into diversion trench on guide face, then
It is flowed into collecting tank along diversion trench, further improves the collection efficiency of electroplate liquid.
Preferably, the surface of the bed course is provided with support rod, the bottom of the support rod offers support slot, described
Support rod is embedded in the support slot.
By using above-mentioned technical proposal, by the setting of support rod and opening up for support slot, support rod is embedded at support
In slot, the inner wall of support rod and support slot is abutted against, to limit to support rod, is improved support column and is sheathed on support rod
On stability.
Preferably, the top diameter of the support column is gradually reduced to form a guide part.
By using above-mentioned technical proposal, by the setting of guide part, so that support column when being sheathed on support rod, props up
The guide part of strut plays guiding role, even if in the case where no alignment completely, side wall the leading along support rod of support slot
It is slided to portion, so that support rod slides into support slot, facilitates the installation of support column.
Preferably, the support slot fits with the support rod.
By using above-mentioned technical proposal, by being bonded for support slot and support rod, support slot and support rod are increased
Contact area improves the reliability of support column support to improve support rod to the support effect of support slot.
Preferably, the diameter of the deflector hole is gradually increased from the bottom to top.
By using above-mentioned technical proposal, the upper diameter of deflector hole is larger, so that water conservancy diversion area increases, reduces
A possibility that electroplate liquid is dripped on the supporting plate, consequently facilitating a possibility that electroplate liquid flows directly into deflector hole, reduces plating
The splashing of liquid.
Preferably, being provided with filter cloth between the support plate and the collecting tank.
By using above-mentioned technical proposal, the surface of support plate may speckle with impurity or dust, and electroplate liquid is from support plate
When surface flows into deflector hole, the impurity for supporting plate surface or dust may be brought into collecting tank.It, can by the setting of filter cloth
To flow into deflector hole in electroplate liquid be filtered, impurity or dust are filtered, convenient for the electroplate liquid in collecting tank into
Row recycles.
Preferably, offering mounting hole on the filter cloth, the support column is arranged in the mounting hole.
By using above-mentioned technical proposal, by the setting of mounting hole, support column is arranged in mounting hole, and support column passes through
Mounting hole positions filter cloth, improves the stability of filter cloth installation.
Preferably, being provided with clamping ring on the support column, the filter cloth is pressed on the support by the clamping ring
The bottom of plate.
Filter cloth is fixed on by the setting of clamping ring by the bottom of support plate by using above-mentioned technical proposal, convenient for pair
The filtering of electroplate liquid prevents electroplate liquid from flowing out in the gap between filter cloth and support plate, improves the filter effect of filter cloth.
In conclusion the advantageous effects of the utility model are as follows:
1. bed course is placed on ground, prevents the electroplating solution of drippage from directly touching with ground, ground is protected；
2. it is logical that operator can step on the electroplate liquid dripped on the supporting plate on the supporting plate by the setting of support plate
It crosses deflector hole to flow into collecting tank, to prevent the accumulation of electroplate liquid on the supporting plate；
3. by the setting of collecting tank, convenient for being collected to the electroplate liquid of drippage on the supporting plate, in order to drippage
Electroplate liquid focus on.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of ground sewage processing system.
Fig. 2 is the structural schematic diagram of support plate and deflector hole.
Fig. 3 is the structural schematic diagram of diversion trench.
Fig. 4 is the enlarged drawing in Fig. 3 at A.
Fig. 5 is the scheme of installation of filter cloth.
In figure, 1, bed course；11, guide face；12, diversion trench；13, support rod；131, guide part；2, collecting tank；3, it supports
Plate；31, deflector hole；32, support column；321, support slot；33, clamping ring；4, electroplating bath；5, filter cloth；51, mounting hole.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
It is a kind of ground sewage processing system for electroplating technology disclosed by the utility model, packet referring to Fig.1 with Fig. 2
Include bed course 1 and collecting tank 2.Bed course 1 is layed on the ground of 4 side of electroplating bath, and collecting tank 2 is opened in the upper surface of bed course 1.
The top of collecting tank 2 is equipped with support plate 3, and several deflector holes 31 are uniformly offered in support plate 3.Plated item from
After taking out in electroplating bath 4, the electroplating solution adhered on plated item is gradually dropped in support plate 3, and is flowed into and collected along deflector hole 31
In liquid bath 2, so that electroplate liquid be prevented to accumulate in support plate 3.Operator can walk in support plate 3, to reduce
The influence that electroplate liquid works to operator.
The diameter of deflector hole 31 is gradually increased from the bottom to top, and the upper diameter of deflector hole 31 is larger, increases 3 table of support plate
The water conservancy diversion area accounting of deflector hole 31 on face, while ensure that support plate 3 has stronger support strength.With water conservancy diversion area
Increase, reduces a possibility that electroplate liquid is dropped in support plate 3, consequently facilitating electroplate liquid flows directly into the possibility of deflector hole 31
Property, reduce the splashing of electroplate liquid.
Referring to Fig. 3 and Fig. 4, the two sides of collecting tank 2 are provided with guide face 11, guide face 11 from far from collecting tank 2 to leaning on
The direction of nearly collecting tank 2 tilts gradually downward.Guide face 11 offers several diversion trenches 12 along its inclined direction at equal intervals,
Each diversion trench 12 is arranged in parallel, and the section of diversion trench 12 is arc.After electroplate liquid flows into deflector hole 31, it may be dropped in
On guide face 11.
By the inclined setting of guide face 11, facilitates electroplate liquid to flow into collecting tank 2 along guide face 11, improve electroplate liquid
Collection efficiency.By the setting of diversion trench 12, the electroplate liquid being dropped on guide face 11 can be flowed into diversion trench 12, and edge is led
Chute 12 flows downward, and is conducive to the concentration of electroplate liquid, reduces the accumulation of electroplate liquid on guide face 11.
Referring to Fig. 5, the bottom of support plate 3 is welded with cylindrical support column 32, the bottom of support column 32 along the vertical direction
It is connected on guide face 11.Support plate 3 passes through the supporting role of support column 32, is set up in the top of collecting tank 2.On guide face 11
It is welded with support rod 13 consistent with 32 quantity of support column and for cylinder along the vertical direction, the bottom of support column 32 offers confession
The support slot 321 that support rod 13 is embedded, support rod 13 are embedded in support slot 321.The side wall of support rod 13 and support slot 321
Side wall abuts against, to position to support column 32, improves the stability of the installation of support plate 3.
Diameter is gradually reduced from top to bottom at the top of support rod 13, forms a hemispheric guide part 131, support slot
321 bottom be with the hemispherical that matches at the top of support rod 13, so that support rod 13 be made to be bonded completely with support slot 321.It is logical
The setting of guide part 131 is crossed, so that support column 32, when being sheathed on support rod 13, the guide part 131 of support rod 13, which plays, leads
To effect, even if the side wall of support slot 321 is slided along the guide part 131 of support rod 13 in the case where no alignment completely, make
It obtains support rod 13 to slide into support slot 321, facilitates the installation of support column 32.
Clamping ring 33 is provided on each support column 32, clamping ring 33 is threadedly coupled with support column 32.The bottom of support plate 3
Portion is provided with filter cloth 5, and position corresponding with support column 32 offers mounting hole 51 on filter cloth 5, and filter cloth 5 is installed by mounting hole 51
In on support column 32, the diameter of mounting hole 51 is slightly larger than the diameter of support column 32.The compression of filter cloth 5 is connected to support by clamping ring 33
The bottom of plate 3 prevents electroplate liquid from flowing in the gap between filter cloth 5 and support plate 3 so that filter cloth 5 is close to support plate 3 and is arranged
Out, the filter effect of filter cloth 5 is improved.
The implementation principle of the present embodiment are as follows: bed course 1 is placed on ground, prevent drippage electroplating solution directly with ground phase
Contact, protects ground.By the setting of support plate 3, operator can be stepped down in support plate 3, be dropped in support plate 3
On electroplate liquid by deflector hole 31 flow into collecting tank 2 in, to prevent accumulation of the electroplate liquid in support plate 3.Pass through collection
The setting of liquid bath 2, convenient for being collected to the electroplate liquid being dropped in support plate 3, in order to which the electroplate liquid to drippage is concentrated
Processing.
The embodiment of present embodiment is the preferred embodiment of the utility model, and not limitation is originally practical new according to this
The protection scope of type, therefore: the equivalence changes that all structures, shape, principle according to the utility model are done should all be covered by practical
Within novel protection scope.
Claims (10)
1. a kind of ground sewage processing system for electroplating technology, it is characterised in that: including with being layed in electroplating bath (4) side
Bed course (1) on face and the collecting tank (2) for being opened in bed course (1) surface are provided with for operator above the collecting tank (2)
The support plate (3) walked about of member offers deflector hole (31) on the support plate (3), and the lower surface of the support plate (3) is provided with
It is connected to the support column (32) of the bed course (1).
2. a kind of ground sewage processing system for electroplating technology according to claim 1, it is characterised in that: the pad
The two sides of layer (1) Yu Suoshu collecting tank (2) are provided with guide face (11), the guide face (11) from far from collecting tank (2) to leaning on
Nearly collecting tank (2) tilts gradually downward.
3. a kind of ground sewage processing system for electroplating technology according to claim 2, it is characterised in that: described to lead
Several diversion trenches (12) are offered on stream interface (11).
4. a kind of ground sewage processing system for electroplating technology according to claim 1, it is characterised in that: the pad
The surface of layer (1) is provided with support rod (13), and the bottom of the support column (32) offers support slot (321), the support rod
(13) it is embedded in the support slot (321).
5. a kind of ground sewage processing system for electroplating technology according to claim 4, it is characterised in that: the branch
The top diameter of strut (13) is gradually reduced to form a guide part (131).
6. a kind of ground sewage processing system for electroplating technology according to claim 5, it is characterised in that: the branch
Support slot (321) fits with the support rod (13).
7. a kind of ground sewage processing system for electroplating technology according to claim 1, it is characterised in that: described to lead
The diameter of discharge orifice (31) is gradually increased from the bottom to top.
8. a kind of ground sewage processing system for electroplating technology according to claim 1, it is characterised in that: the branch
Filter cloth (5) are provided between fagging (3) and the collecting tank (2).
9. a kind of ground sewage processing system for electroplating technology according to claim 8, it is characterised in that: the filter
It is offered on cloth (5) mounting hole (51), the support column (32) is arranged in the mounting hole (51).
10. a kind of ground sewage processing system for electroplating technology according to claim 9, it is characterised in that: described
It is provided on support column (32) clamping ring (33), the filter cloth (5) is pressed on the support plate (3) by the clamping ring (33)
Bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920139305.9U CN209636934U (en) | 2019-01-26 | 2019-01-26 | A kind of ground sewage processing system for electroplating technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920139305.9U CN209636934U (en) | 2019-01-26 | 2019-01-26 | A kind of ground sewage processing system for electroplating technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209636934U true CN209636934U (en) | 2019-11-15 |
Family
ID=68479475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920139305.9U Expired - Fee Related CN209636934U (en) | 2019-01-26 | 2019-01-26 | A kind of ground sewage processing system for electroplating technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209636934U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111118585A (en) * | 2020-01-08 | 2020-05-08 | 广德东威科技有限公司 | Plating bath structure and electroplating device |
-
2019
- 2019-01-26 CN CN201920139305.9U patent/CN209636934U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111118585A (en) * | 2020-01-08 | 2020-05-08 | 广德东威科技有限公司 | Plating bath structure and electroplating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191115 Termination date: 20210126 |