CN209606540U - Electronic component temperature comprehensive testing device - Google Patents
Electronic component temperature comprehensive testing device Download PDFInfo
- Publication number
- CN209606540U CN209606540U CN201920229792.8U CN201920229792U CN209606540U CN 209606540 U CN209606540 U CN 209606540U CN 201920229792 U CN201920229792 U CN 201920229792U CN 209606540 U CN209606540 U CN 209606540U
- Authority
- CN
- China
- Prior art keywords
- electronic component
- test
- board
- main platform
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 154
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 238000009434 installation Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000013021 overheating Methods 0.000 description 14
- 238000013461 design Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to the technical field of electronic component manufacturing and discloses an electronic component temperature comprehensive testing device, which comprises a testing frame, a testing board, a heating component and a testing component, wherein the testing frame is provided with a main platform, the testing board is arranged on the main platform, and the testing board is provided with an installation area for installing electronic components; the heating assembly is fixedly arranged below the main platform, corresponds to the mounting area in position and is used for heating the electronic components in the mounting area; the test assembly is connected with the test board and used for detecting the temperature value of the electronic component on the test board in real time. The heating element who will be used for carrying out the heating to electronic components fixes the below at the main platform of test jig, can directly heat the electronic components who surveys in the inboard of survey on the main platform, and then carries out temperature rise test and overheat protection test, and whole process does not need the manual work to grip the heating element heating, has reduced the error that manual operation brought.
Description
Technical field
The utility model relates to electronic component manufacturing technology field more particularly to a kind of temperature integrated surveys of electronic component
Trial assembly is set.
Background technique
Include that temperature rise test and overheating protection are tested in the temperature integrated test of electronic component, is that electronic component must be surveyed
Project.Temperature rise test refers to the degree of heat and state that detection device works under full load condition, and logger temperature rise process is simultaneously
Matched curve, the basic reference for board temperature design.Overheating protection test is the device detected in the course of work, improves it
The defencive function that temperature and while reaching a certain value start, needs to obtain its overheating protection point and protection curve, the function be in order to
When the temperature is excessively high, output can be closed in time, and load circuit is damaged to avoid because of high temperature, is caused the accident.
Currently, existing test method is tested in temperature rise are as follows: the device of tape test is welded in homemade test board, device is made
Part is operated at full capacity, and is carried out temperature measurement using infrared radiation thermometer or thermocouple and moisture recorder over time, is passed through
The artificial current measurement temperature of continual reading, and confirm the degree of heat and state of its work, stop until temperature is relatively stable
Only measure.Overheating protection tests existing test method are as follows: under device full load situation, in the bottom of test board device under test
Manual mode Mobile hot air rifle is heated, and using infrared radiation thermometer or passes through thermocouple and moisture recorder reading device surface
Temperature read real time temperature at once when device carries out overheating protection state, that is, obtain the overheating protection temperature of device.
It requires to introduce a large amount of manual operation in both the above test item, efficiency is lower, grasps at high temperature for a long time
Make to be easy error, and the heating of manual operation heat gun is extremely inconvenient in overheating protection test, it is a large amount of artificial indefinite to introduce
Factor also needs two people to cooperate under normal circumstances, and heating is more simple and crude with thermometric mode, and there are biggish errors.
In addition, there are also a kind of testing schemes at present, using the higher high/low temperature experimental box of precision, mainly pass through whole plate
Heating obtains test temperature, and when experiment needs to consider the resistance to temperature value of other devices, there are more limitation, and thermocycling
Case is mostly desktop type, and volume is larger, and adaptation board is few, mobile inconvenient and at high cost.
Utility model content
The purpose of the utility model embodiment is: providing a kind of temperature integrated test device of electronic component, structure
Simply, testing efficiency is high, and precision is quasi-.
For this purpose, the utility model embodiment uses following technical scheme:
A kind of temperature integrated test device of electronic component is provided, comprising:
Testing jig, the testing jig are equipped with main platform；
Test board is mounted on the main platform, and the test board is equipped with the installing zone for installing electronic component；
Heating component is fixed at below the main platform, and corresponding with the installation zone position, for the peace
The electronic component in dress area is heated；
Test suite is connect with the test board, for detecting the electronics member device on the test board in real time
The temperature value of part.
As a kind of preferred embodiment of the temperature integrated test device of electronic component, it is provided on the main platform for solid
The locating part of the fixed test board.
As a kind of preferred embodiment of the temperature integrated test device of electronic component, the locating part is positive stop spring plate, institute
The one end for stating positive stop spring plate is fixed, and the test board is pushed against on the main platform by the other end.
As a kind of preferred embodiment of the temperature integrated test device of electronic component, the test suite includes temperature sensing
Device, temperature acquisition equipment and oscillograph, the temperature sensor are separately connected the test board and the temperature acquisition equipment,
The temperature acquisition equipment connects the oscillograph.
As a kind of preferred embodiment of the temperature integrated test device of electronic component, it is provided with below the main platform auxiliary
Platform is helped, the heating component is arranged on the assistance platform.
As a kind of preferred embodiment of the temperature integrated test device of electronic component, the heating component include heat gun and
Heat gun fixture, the heat gun fixture are fixed on the assistance platform, and the heat gun can by the heat gun fixture
Dismantling connection.
As a kind of preferred embodiment of the temperature integrated test device of electronic component, the main platform is far from the heating group
The side of part is provided with cover board, has the accommodating chamber for accommodating the test board between the cover board and the main platform.
As a kind of preferred embodiment of the temperature integrated test device of electronic component, the cover board is hinged on the main platform
On, the cover board can rotate around articulated position and be selectively located at closed position and open position, when the cover board is positioned at described
When closed position, the test board is enclosed in the accommodating chamber by the cover board, when the cover board is located at open position, institute
It is exposed to state test board.
As a kind of preferred embodiment of the temperature integrated test device of electronic component, the cover board is transparent cover plate.
As a kind of preferred embodiment of the temperature integrated test device of electronic component, the testing jig is equipped with easy to carry
Handle.
Having the beneficial effect that for the utility model embodiment will be used to fix the heating component that electronic component heats
In the lower section of the main platform of testing jig, directly the electronic component in the test board on main platform can be heated, in turn
Temperature rise test and overheating protection test are carried out, whole process does not need manually to hold heating component heating, significantly reduces people
Work operates bring error, and main platform can be supported test board, also not need artificial fixation, and it is difficult to reduce operation
Degree, improves detection speed and precision.
Detailed description of the invention
The utility model is described in further detail below according to drawings and examples.
Fig. 1 is the stereoscopic schematic diagram of the temperature integrated test device of electronic component of the utility model.
In figure:
1, testing jig；11, main platform；12, positive stop spring plate；13, assistance platform；14, cover board；15, handle；2, test board；
3, heating component；31, heat gun；32, heat gun fixture；4, electronic component；5, the first terminals subgroup；6, the second terminals
Subgroup；7, p-wire.
Specific embodiment
The technical issues of to solve the utility model, the technical solution of use and the technical effect that reaches are clearer,
It is described in further detail below in conjunction with technical solution of the attached drawing to the utility model embodiment, it is clear that described reality
Applying example is only the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention,
It is practical new to belong to this for those skilled in the art's every other embodiment obtained without creative efforts
The range of type protection.
In the description of the present invention, unless otherwise clearly defined and limited, term " connected ", " connection ", " Gu
It is fixed " it shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.For the ordinary skill in the art, it can be managed with concrete condition
Solve the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features directly contact, and also may include that the first and second features are not direct contacts but lead to
Cross the other characterisation contact between them.Moreover, fisrt feature includes above the second feature " above ", " above " and " above "
One feature is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.First is special
Sign is directly below and diagonally below the second feature including fisrt feature under the second feature " below ", " below " and " below ", or only
Indicate that first feature horizontal height is less than second feature.
As shown in Figure 1, the temperature integrated test device of electronic component provided by the embodiment of the utility model, is used for electricity
Sub- component 4 carries out temperature rise test and overheating protection test automatically, and the temperature integrated test device of electronic component includes testing jig
1, test board 2, heating component 3 and test suite, wherein testing jig 1 is equipped with main platform 11, and test board 2 is mounted on main platform 11
On, test board 2 is equipped with the installing zone for installing electronic component 4, and heating component 3 is fixed at main 11 lower section of platform,
And it is corresponding with installation zone position, for being heated to the electronic component 4 in installing zone；Test suite is connect with test board 2,
For detecting the temperature value of the electronic component 4 on test board 2 in real time.By be used to heat electronic component 4
Heating component 3 is fixed on the lower section of the main platform 11 of testing jig 1, can be directly to the electronics in the test board 2 on main platform 11
Component 4 is heated, and then carries out temperature rise test and overheating protection test, and whole process does not need manually to hold heating component
3 heating, significantly reduce manual operation bring error, and main platform 11 can be supported test board 2, also be not required to
It manually to fix, reduce operation difficulty, improve detection speed and precision.
In the present embodiment, test suite includes including temperature sensor, temperature acquisition equipment and oscillograph, and temperature passes
Sensor is separately connected test board 2 and temperature acquisition equipment, and temperature acquisition equipment connects oscillograph.Temperature sensor can be in real time
Detect the temperature of electronic component 4, and temperature acquisition equipment can be acquired the temperature of temperature sensor detected
And it is fitted temperature curve, oscillograph can detecte electric signal when triggering overheating protection, convenient for detecting electronics at this time
The temperature of component 4, and then realize accurate overheating protection test.Preferably, temperature sensor is high sampling rate thermocouple, this
Thermocouple measuring temperature, temperature acquisition is fast, and interval time is short, can effectively promote the accuracy of test.
Optionally, two groups of connecting terminals, respectively the first terminals subgroup 5 and the second terminals are provided on main platform 11
Subgroup 6, the first terminals subgroup 5 and the second terminals subgroup 6 are electrically connected test board 2, with the electronics member device on test board 2
Part 4 is electrically connected.First terminals subgroup 5 connects positive pole and input signal end, and the second 6 groups of terminals subgroup connection power supply is negative
Pole and output signal line, output signal line connecting test component.By the way that integrated terminals subgroup is arranged, can replace crisscross multiple
Miscellaneous line, it is only necessary to which several p-wires 7 can be realized signal transmission and conduct, and reduce by test device bring error.
In a preferred embodiment of the utility model, the limit for fixing test board 2 is provided on main platform 11
Position part.By the way that locating part is arranged, test board 2 can be fixed on to the designated position of main platform 11, prevent test board 2 from detecting
It is mobile that position occurs in journey, promotes detection accuracy.
Optionally, locating part is positive stop spring plate 12, and one end of positive stop spring plate 12 is fixed, and test board 2 is pushed against by the other end
On main platform 11.The elastic force that positive stop spring plate 12 can use itself compresses test board 2, to realize to test board 2
It is fixed.
In the present embodiment, test board 2 is square, and there are four positive stop spring plate 12, four limit bullets for setting on main platform 11
Piece 12 sets up the corner location in test board 2 separately.
Optionally, 12 one end of positive stop spring plate opens up fixation hole, and stop screw passes through fixation hole and is fixed on positive stop spring plate 12
On main platform 11, positive stop spring plate 12 can be rotated along the axis of stop screw, this design can will limit bullet when installing test board 2
The rotation of piece 12 prevents positive stop spring plate 12 from stopping to test board 2 to other positions.
In other embodiments, it can also be concavely provided with installation cavity in main platform 11, test board 2 is arranged in installation cavity.
Installation cavity be can use to 2 position restriction of test board, reduce dismounting difficulty.It is of course also possible to use positive stop spring plate 12 and installation
The structure of chamber combination promotes limit effect to the position restriction of test board 2.
In another preferred embodiment of the utility model, the installing zone that test board 2 is corresponded on main platform 11 is opened up
There are through-hole, the heating of 3 face through-hole of heating component.This design can reduce thermal loss when heating component 3 heats, and then be promoted
Heating efficiency.
Shape of through holes is unlimited, can be round, rectangular or polygon, it is only necessary to which the size of through-hole is greater than the ruler of installing zone
It is very little, it is convenient for homogeneous heating, while the size of through-hole will design the size less than test board 2, to reduce the fixed difficult of test board 2
Degree.
In another preferred embodiment of the utility model, the lower section of main platform 11 is provided with assistance platform 13, adds
Hot component 3 is arranged on assistance platform 13.
In the present embodiment, heating component 3 includes heat gun 31 and heat gun fixture 32, and heat gun fixture 32 is fixed on auxiliary
It helps on platform 13, heat gun 31 is detachably connected by heat gun fixture 32.Heat gun 31 detachably connects with heat gun fixture 32
It connects, can according to need and replace different heat guns 31, promote the temperature integrated test device of electronic component of the utility model
Versatility.
Optionally, heat gun 31 can move along the vertical direction, and selectivity is close or far from main platform 11.This design can be with
Heat gun 31 is conveniently adjusted at a distance from main platform 11, guarantees suitable heating distance, promotes the accuracy of test.
In one embodiment, main platform 11 is provided with cover board 14 far from the side of heating component 3, cover board 14 and main platform 11 it
Between have accommodate test board 2 accommodating chamber.By the way that cover board 14 is arranged, the accommodating chamber formed between cover board 14 and main platform 11 can be with
A closed test environment is provided for test board 2, makes to measure the use environment closer to electronic component 4, and then promoted
The accuracy of data.
Optionally, cover board 14 is hinged on main platform 11, and cover board 14 can rotate around articulated position and be selectively located at closure
Position and open position, when cover board 14 is located at closed position, test board 2 is enclosed in accommodating chamber by cover board 14, when cover board 14
When positioned at open position, test board 2 is exposed.The cover board 14 of radial type can reduce operation in order to the opening and closing of cover board 14
Difficulty.
For the ease of the test process inside observation, cover board 14 can be designed as transparent cover plate.
In another embodiment, testing jig 1 is equipped with handle 15 easy to carry.It can be in order to entire by setting handle 15
The movement of test device.
Optionally, wheel is arranged in the bottom of testing jig 1.By the way that wheel is arranged, test device movement can be pushed directly on, more
Add it is easy to remove, while in order to prevent test device it is mobile in place after move again, or move during the test
It is dynamic, brake is provided on wheel.
For testing current limiting switch device, overheating protection test is carried out to it, the course of work is as follows:
Step S10, current limiting switch device is welded on test board 2；
Step S20, cover board 14 is opened, is installed on the heat gun fixture 32 on heat gun 31 to assistance platform 13；
Step S30, the temperature integrated test device of entire electronic component is placed into and is easily attached power supply and test suite
Position；
Step S40, fixed using four positive stop spring plates 12 by test board 2；
Step S50, positive pole and power cathode access the terminals subgroup on main platform 11, wiring by p-wire 7
Terminal group connecting test plate 2 and test suite；
Step S60, cover board 14 is closed, heat gun 31 is opened, heat gun 31 carries out the current limiting switch device on test board 2
Heating, to carry out overheating protection test.
In the description of this article, it is to be understood that term " on ", "lower", " right side ", etc. orientation or positional relationships be based on
Orientation or positional relationship shown in the drawings is merely for convenience of description and simplification and operates, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the utility model
Limitation.In addition, term " first ", " second ", are only used to distinguish between description, have no special meaning.
In the description of this specification, the description of reference term " embodiment ", " example " etc. means to combine the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the utility model
In.In the present specification, schematic expression of the above terms may not refer to the same embodiment or example.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this narrating mode of specification be only be to understand device, those skilled in the art should
It considers the specification as a whole, the technical solutions in the embodiments can also be appropriately combined, and forming those skilled in the art can
With the other embodiments of understanding.
Technical principle of the utility model has been described above with reference to specific embodiments.These descriptions are intended merely to explain this reality
With novel principle, and it cannot be construed to the limitation to scope of protection of the utility model in any way.Based on the explanation herein,
Those skilled in the art, which does not need to pay for creative labor, can associate with other specific implementation modes of this utility model,
These modes are fallen within the protection scope of the utility model.
Claims (10)
1. a kind of temperature integrated test device of electronic component characterized by comprising
Testing jig, the testing jig are equipped with main platform；
Test board is mounted on the main platform, and the test board is equipped with the installing zone for installing electronic component；
Heating component is fixed at below the main platform, and corresponding with the installation zone position, for the installing zone
The interior electronic component is heated；
Test suite is connect with the test board, for detecting the electronic component on the test board in real time
Temperature value.
2. the temperature integrated test device of electronic component according to claim 1, which is characterized in that set on the main platform
It is equipped with the locating part for fixing the test board.
3. the temperature integrated test device of electronic component according to claim 2, which is characterized in that the locating part is limited
Position elastic slice, one end of the positive stop spring plate are fixed, and the test board is pushed against on the main platform by the other end.
4. the temperature integrated test device of electronic component according to claim 1, which is characterized in that the test suite packet
Temperature sensor, temperature acquisition equipment and oscillograph are included, the temperature sensor is separately connected the test board and the temperature
Degree acquisition equipment, the temperature acquisition equipment connect the oscillograph.
5. the temperature integrated test device of electronic component according to claim 1, which is characterized in that under the main platform
Side is provided with assistance platform, and the heating component is arranged on the assistance platform.
6. the temperature integrated test device of electronic component according to claim 5, which is characterized in that the heating component packet
Heat gun and heat gun fixture are included, the heat gun fixture is fixed on the assistance platform, and the heat gun passes through the heat
Air pressure gun fixture is detachably connected.
7. the temperature integrated test device of electronic component according to any one of claims 1 to 6, which is characterized in that described
Main platform is provided with cover board far from the side of the heating component, has between the cover board and the main platform and accommodates the survey
The accommodating chamber of test plate (panel).
8. the temperature integrated test device of electronic component according to claim 7, which is characterized in that the cover board is hinged on
On the main platform, the cover board can rotate around articulated position and be selectively located at closed position and open position, when the lid
When plate is located at the closed position, the test board is enclosed in the accommodating chamber by the cover board, is beaten when the cover board is located at
When open position, the test board is exposed.
9. the temperature integrated test device of electronic component according to claim 8, the cover board is transparent cover plate.
10. the temperature integrated test device of electronic component according to any one of claims 1 to 6, which is characterized in that described
Testing jig is equipped with handle easy to carry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920229792.8U CN209606540U (en) | 2019-02-20 | 2019-02-20 | Electronic component temperature comprehensive testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920229792.8U CN209606540U (en) | 2019-02-20 | 2019-02-20 | Electronic component temperature comprehensive testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209606540U true CN209606540U (en) | 2019-11-08 |
Family
ID=68402907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920229792.8U Active CN209606540U (en) | 2019-02-20 | 2019-02-20 | Electronic component temperature comprehensive testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209606540U (en) |
-
2019
- 2019-02-20 CN CN201920229792.8U patent/CN209606540U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206192402U (en) | Gaseous little water of SF6, density on -line monitoring system | |
| CN102494808B (en) | Microcalorimeter, power reference system utilizing microcalorimeter and measuring method | |
| CN108535664A (en) | Power emergency power source equipment movable type detection platform | |
| CN203178156U (en) | Quick water determination instrument | |
| CN209606540U (en) | Electronic component temperature comprehensive testing device | |
| CN103809196A (en) | Environmental radiation monitor and method for conducting test cycle | |
| CN105547508A (en) | Switch cabinet temperature detection device and method based on cabinet door external measurement | |
| CN108760090B (en) | Simulated environment temperature testing device | |
| CN103175783B (en) | Surface emissivity tester | |
| CN106932103A (en) | Wireless temperature surveying record device with flexible probe | |
| CN208520983U (en) | A kind of metering device on-site calibrator | |
| CN203629691U (en) | An intelligent mini-sized temperature recorder | |
| US3828251A (en) | Portable microwave radiation sensing and measuring device | |
| CN103616082B (en) | A kind of intelligent miniature temperature recorder | |
| CN206648914U (en) | A kind of Moisture Meter with multi-temperature probe | |
| CN107015556A (en) | A kind of bus solid-state power controller test device | |
| CN209387169U (en) | Pressure testing device capable of realizing real-time testing of internal pressure of lithium battery | |
| CN206002633U (en) | A kind of portable engine electrical system automatic tester | |
| CN219798573U (en) | Calibration dry type temperature calibrator standard device | |
| CN101762617B (en) | Thermal-stratification test and verification device containing insulating-layer panel body and method | |
| CN220270614U (en) | Laser energy tester | |
| CN208953658U (en) | A kind of mobile power source PCBA board test device | |
| CN220983323U (en) | Checking device for rotation speed sensor | |
| CN212721778U (en) | Sensor testing device and testing system | |
| CN221056605U (en) | Power-on/off detection induction device of sealing direct-current relay without indicator lamp for railway vehicle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |