CN209579150U - A kind of Twp-sided polishing machine - Google Patents
A kind of Twp-sided polishing machine Download PDFInfo
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- CN209579150U CN209579150U CN201822158368.7U CN201822158368U CN209579150U CN 209579150 U CN209579150 U CN 209579150U CN 201822158368 U CN201822158368 U CN 201822158368U CN 209579150 U CN209579150 U CN 209579150U
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Abstract
The utility model relates to polishing technology fields, more particularly to a kind of Twp-sided polishing machine, including polishing machine ontology and polishing liquid supplying device, polishing liquid supplying device includes control valve, polishing liquid case and polishing liquid pipeline, polishing liquid pipeline includes outlet tube road and a plurality of infusion pipeline, and infusion pipeline one end is connect with polishing liquid case, and the infusion pipeline other end is connect with control valve, outlet tube road one end is connect with control valve, and the outlet tube road other end is set on polishing machine ontology.Polishing liquid supplying device is arranged in the utility model on polishing machine ontology, control valve is installed additional on the polishing liquid pipeline of polishing liquid supplying device, polishing fluid not of the same race is packed into polishing liquid case, it is exported respectively by different infusion pipelines, the polishing fluid type that control valve control infusion pipeline is exported to outlet tube road, the polishing that surface roughness changes in various degree is carried out to adapt to polishing machine ontology to workpiece surface, dramatically saves the delivery time of equipment cost and workpiece between more polishing machines.
Description
Technical field
The utility model relates to polishing technology field more particularly to a kind of Twp-sided polishing machines.
Background technique
GaAs (GaAs) material compared with traditional silicon semiconductor material, it has, and electron mobility is high, forbidden bandwidth is big,
Power is low etc. that characteristics, electron mobility are about 5.7 times of silicon materials for direct band gap, consumption.Therefore, it is widely used in high frequency and nothing
IC device is manufactured in line communication.This high frequency produced, high speed, radiation protection high-temperature device, be usually applied to wireless communication,
The fields such as fiber optic communication, mobile communication, GPS worldwide navigation.In addition in I C products application, it can also be added in GaAs material
Its element, which changes its band structure, makes it generate photoelectric effect, and light emitting semiconductor device is made, can also make the GaAs sun
It can battery.
Box is all inevitably used out in such applications uses (epi-ready) gallium arsenide substrate, it is common
Processing method is: high purity elemental arsenic and gallium synthesis arsenide gallium monocrystal (generally circular in cross section crystal bar), successively processing, cuts by crystal bar
Piece, edging, burn into rough polishing, essence are thrown, are cleaned, clean packaging, and the gallium arsenide substrate that box is is obtained out, wherein polish in substrate
Rough polishing all can be first generally carried out in the process, removes surface damage layer caused by preceding working procedure, and make the coarse of substrate surface
Degree is reduced to 0.3nm or so, then carries out smart throwing, arrives 0.2nm or so to further decrease surface roughness, reaches extension requirement.
Currently, rough polishing and essence throwing are completed on 2 polishing machines respectively during GaAs single-sided polishing, this 2
The structure function of polishing machine is the same, difference be using polishing pad (pad) hardness and polishing fluid (slurry) in silica
The partial size of particle is different, to reach the damaging layer that can remove substrate surface quickly, and can make the roughness of substrate surface
The requirement of lower (mirror surface), but production cost is also substantially increased in this way, reduce production efficiency.
Utility model content
(1) technical problems to be solved
The technical problems to be solved in the utility model is that the polishing of the different surface roughness requirement for workpiece needs to distinguish
It is carried out in different polishing equipment, thus the problem of increasing production cost, reducing production efficiency.
(2) technical solution
In order to solve the above-mentioned technical problem, the utility model provides a kind of Twp-sided polishing machine, including polishing machine ontology and
Liquid supplying device is polished, the polishing liquid supplying device includes control valve, polishing liquid case and polishing liquid pipeline, the polishing liquid pipe
Road includes outlet tube road and a plurality of infusion pipeline, and described infusion pipeline one end is connect with the polishing liquid case, the other end with it is described
Control valve connection, outlet tube road one end are connect with the control valve, and the other end is set on the polishing machine ontology.
Wherein, the infusion pipeline includes that rough polishing polishing liquid pipe and essence polish liquid pipe.
Wherein, the control valve is three-way magnetic valve.
Wherein, the polishing machine main body includes upper polishing disk and lower polishing disk, and the upthrow optical disc surface setting essence is thrown
Rough polishing polishing pad is arranged in light pad, the lower polishing panel surface.
Wherein, the essence for selecting shore hardness to be 30-50 throws polishing pad.
Wherein, selecting shore hardness is the rough polishing polishing pad of 70-90.
Wherein, the polishing machine ontology includes carrier, and the carrier is equipped with absorption layer, is had on the absorption layer
Place the groove of workpiece.
Wherein, the depth of the groove is the 60% of the thickness of the workpiece.
Wherein, the carrier is ceramic disk.
(3) beneficial effect
The above-mentioned technical proposal of the utility model has the advantages that the utility model Twp-sided polishing machine, in polishing machine sheet
Setting polishing liquid supplying device, installs control valve additional on the polishing liquid pipeline of polishing liquid supplying device on body, polishes and fills in liquid case
Enter polishing fluid not of the same race, exported respectively by different infusion pipelines, control valve controls infusion pipeline and exports to outlet tube road
Polishing fluid type, allow the supply of polishing fluid free switching between polishing fluid not of the same race, to adapt to polishing machine ontology
The polishing that changes in various degree of surface roughness is carried out to workpiece surface, realize on same Twp-sided polishing machine to workpiece into
The effect of the different degrees of polishing of row, when dramatically saving the transmission of equipment cost and workpiece between more polishing machines
Between, there is preferable economic benefit.
In addition to the utility model described above solve the technical issues of, composition technical solution technical characteristic and
Have except advantage brought by the technical characteristic of these technical solutions, the other technical characteristics of the utility model and these technologies are special
The advantages of sign is brought, will further illustrate in conjunction with attached drawing.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model embodiment Twp-sided polishing machine；
Fig. 2 is the structural schematic diagram of the control valve of the utility model embodiment Twp-sided polishing machine；
Fig. 3 is the structural representation of the upper polishing disk, lower polishing disk and carrier of the utility model embodiment Twp-sided polishing machine
Figure.
In figure: 1: polishing machine ontology；2: polishing liquid supplying device: 11: upper polishing disk；12: lower polishing disk；21: control valve；
22: polishing liquid case；23: polishing liquid pipeline；231: infusion pipeline；232: outlet tube road；2321: rough polishing polishes liquid pipe；2322: essence
Polishing liquid pipe.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is a part of the embodiment of the utility model, instead of all the embodiments.Based on the reality in the utility model
Apply example, those of ordinary skill in the art's every other embodiment obtained without making creative work, all
Belong to the range of the utility model protection.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
In addition, in the description of the present invention, unless otherwise indicated, " multiple ", " more ", " multiple groups " are meant that two
A or more than two, " several ", " several ", " several groups " are meant that one or more.
As shown in Figure 1, Twp-sided polishing machine provided by the embodiment of the utility model, including polishing machine ontology 1 and polishing fluid supply
To device 2, polishing liquid supplying device 2 includes control valve 21, polishing liquid case 22 and polishing liquid pipeline 23, and polishing liquid pipeline 23 includes
Outlet tube road 231 and a plurality of infusion pipeline 232,232 one end of infusion pipeline are connect with polishing liquid case 22, and infusion pipeline 232 is another
End is connect with control valve 21, and 231 one end of outlet tube road is connect with control valve 21, and 231 other end of outlet tube road is set to polishing machine
On ontology 1.
The utility model Twp-sided polishing machine, setting polishing liquid supplying device, supplies in polishing fluid and fills on polishing machine ontology
It installs control valve on the polishing liquid pipeline set additional, polishes in liquid case and be packed into polishing fluid not of the same race, pass through different perfusion tubes respectively
Road output, the polishing fluid type that control valve control infusion pipeline is exported to outlet tube road, allows the supply of polishing fluid not
Free switching between polishing fluid of the same race carries out what surface roughness changed in various degree to adapt to polishing machine ontology to workpiece surface
Polishing, realizes the effect for carrying out different degrees of polishing to workpiece on same Twp-sided polishing machine, dramatically saves and set
The standby delivery time of cost and workpiece between more polishing machines, there is preferable economic benefit.
Wherein, infusion pipeline 232 includes that rough polishing polishing liquid pipe 2321 and essence throw and polish liquid pipe 2322.For the table for meeting workpiece
Surface roughness requires, and infusion pipeline is divided into rough polishing polishing liquid pipe in the application and essence polishes two kinds of liquid pipeline, polishes in liquid case
Also it is packed into rough polishing polishing fluid accordingly and essence throws polishing fluid supply rough polishing polishing liquid pipe and essence polishing liquid pipeline output, when right
When workpiece carries out rough polishing, control valve, which controls rough polishing polishing fluid and polishes liquid pipe by rough polishing and be delivered in outlet tube road, to be started to supply
It gives, starts the rough polishing program set and start rough polishing, when to carry out finishing polish to workpiece, it is logical that control valve control essence throws polishing fluid
It crosses essence polishing liquid pipe to be delivered in outlet tube road and be initially supplied, selects the essence set to throw program and start smart throwing.
Wherein, as shown in Fig. 2, control valve 21 is three-way magnetic valve.Control valve preferably uses three-way magnetic valve in the present embodiment,
Realize that rough polishing and essence throw the switching of polishing fluid by installing a three-way magnetic valve additional in polishing liquid pipeline, wherein rough polishing polishes
B mouthfuls of liquid pipeline connecting valve, essence throws A mouthfuls of polishing fluid piping connection valve, and three-way magnetic valve is worked as on connecting valve C mouthfuls of outlet tube road
Coil is powered, and sliding block F moves right, and fluid valve B mouthfuls of closing of essence polishing, rough polishing polishes fluid valve A mouthfuls of opening, rough polishing polishing fluid
Pipeline starts to supply to outlet tube road；When three-way magnetic valve coil blackout, then sliding block F is moved to the left, and rough polishing polishes fluid valve A mouthfuls
It closes, fluid valve B mouthfuls of opening of essence polishing, essence polishing liquid pipeline starts to supply to outlet tube road, to cooperate twin polishing
Machine carries out rough polishing and essence is thrown.
Wherein, as shown in figure 3, polishing machine main body 1 includes upper polishing disk 11 and lower polishing disk 12, upper 11 surface of polishing disk is set
It sets essence and throws polishing pad, rough polishing polishing pad is arranged in lower 12 surface of polishing disk.It pastes and uses in the disk of the lower polishing disk of Twp-sided polishing machine
It can be certainly in the hardness of the polishing pad that patch is thrown for essence on the polishing pad of rough polishing, the disk of upper polishing disk, upper and lower polishing disk polishing pad
It is combined by selection.The utility model Twp-sided polishing machine realizes the rough polishing for needing to be made of two single side polishing machines in the past and essence is thrown
Work significantly reduces work pieces process cost during gallium arsenide substrate carries out single-sided polishing as workpiece, has saved and has added
Between working hour, production efficiency is improved；By adjusting related polishing process parameter (such as upper and lower polishing disk rotating speed, polish pressure, in
Heart tooth revolving speed, outer gear ring revolving speed and polishing flow quantity etc.) it can be controlled separately when upper and lower polishing disk polishes and workpiece surface gone
Except amount.
Wherein, it is 30-50 that essence, which throws the shore hardness of polishing pad,.The shore hardness of rough polishing polishing pad is 70-90.This is practical new
The rough polishing polishing pad that the lower polishing disk of type Twp-sided polishing machine is pasted is the polishing pad of shore hardness 70-90, the rough polishing for workpiece；
The essence that upper polishing disk is pasted throws the polishing pad that polishing pad is shore hardness 30-50, and the essence for workpiece is thrown.
Wherein, polishing machine ontology 1 includes carrier 13, and carrier 13 is equipped with absorption layer, has on absorption layer and place work
The groove of part.The depth of groove is the 60% of the thickness of workpiece.Back of work is attached on the absorption layer of carrier, only in carrier
One side on paste absorption layer, have the groove that can be put into workpiece on absorption layer, when workpiece will polish, first spilt in groove few
The water of amount is downward put into back of work groove manually and slightly firmly compresses, and workpiece is adsorbed in recessed under the tension force effect of water
In slot, the depth of the present embodiment further groove is about the 60% of thickness of workpiece.
Wherein, carrier 13 is ceramic disk.When will to workpiece carry out rough polishing when, post workpiece ceramic disk this face
Under, three-way magnetic valve coil is powered, and rough polishing polishing fluid is initially supplied, and starts rough polishing by the rough polishing program set, rough polishing terminates
Afterwards, the polishing fluid on polishing disk, lower polishing disk and ceramic disk is rinsed in time with the hydraulic giant that polishing machine ontology carries immediately, then
Ceramic disk is overturn manually or using mechanical arm, keeps workpiece face-up and in time with hydraulic giant the polishing on workpiece and lower polishing disk
Liquid is rinsed well, three-way magnetic valve coil blackout, is switched to essence and is thrown polishing fluid supply, is selected the essence set to throw program and is started essence
It throws, essence rinses the polishing fluid on upper and lower polishing disk and workpiece well in time after throwing, arch is then removed from absorption layer simultaneously
It is put into card plug the next step to be entered, realizes the single-sided polishing of workpiece by the Twp-sided polishing machine of the utility model with this.
In conclusion the utility model Twp-sided polishing machine, setting polishing liquid supplying device, is being polished on polishing machine ontology
It installs control valve on the polishing liquid pipeline of liquid supplying device additional, polishes in liquid case and be packed into polishing fluid not of the same race, pass through difference respectively
Infusion pipeline output, the polishing fluid type that is exported to outlet tube road of control valve control infusion pipeline, so that the supply of polishing fluid
Can between polishing fluid not of the same race free switching, with adapt to polishing machine ontology to workpiece surface carry out surface roughness difference journey
The polishing changed is spent, realizes the effect for carrying out different degrees of polishing to workpiece on same Twp-sided polishing machine, greatly
The delivery time of equipment cost and workpiece between more polishing machines is saved, there is preferable economic benefit.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that:
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement；And these are modified or replaceed, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution
The spirit and scope of scheme.
Claims (9)
1. a kind of Twp-sided polishing machine, it is characterised in that: including polishing machine ontology and polishing liquid supplying device, the polishing fluid supply
Device includes control valve, polishing liquid case and polishing liquid pipeline, and the polishing liquid pipeline includes outlet tube road and a plurality of infusion pipeline,
Described infusion pipeline one end is connect with the polishing liquid case, and the other end is connect with the control valve, outlet tube road one end with
The control valve connection, the other end are set on the polishing machine ontology.
2. Twp-sided polishing machine according to claim 1, it is characterised in that: the infusion pipeline include rough polishing polishing liquid pipe with
Essence polishing liquid pipe.
3. Twp-sided polishing machine according to claim 1, it is characterised in that: the control valve is three-way magnetic valve.
4. Twp-sided polishing machine according to claim 1, it is characterised in that: the polishing machine main body includes upper polishing disk under
Polishing disk, the upthrow optical disc surface setting essence throw polishing pad, and rough polishing polishing pad is arranged in the lower polishing panel surface.
5. Twp-sided polishing machine according to claim 4, it is characterised in that: the essence for selecting shore hardness to be 30-50 throws polishing
Pad.
6. Twp-sided polishing machine according to claim 4, it is characterised in that: the rough polishing that shore hardness is 70-90 is selected to polish
Pad.
7. Twp-sided polishing machine according to claim 1, it is characterised in that: the polishing machine ontology includes carrier, described
Carrier is equipped with absorption layer, has the groove for placing workpiece on the absorption layer.
8. Twp-sided polishing machine according to claim 7, it is characterised in that: the depth of the groove is the thickness of the workpiece
60%.
9. Twp-sided polishing machine according to claim 7, it is characterised in that: the carrier is ceramic disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822158368.7U CN209579150U (en) | 2018-12-21 | 2018-12-21 | A kind of Twp-sided polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822158368.7U CN209579150U (en) | 2018-12-21 | 2018-12-21 | A kind of Twp-sided polishing machine |
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| Publication Number | Publication Date |
|---|---|
| CN209579150U true CN209579150U (en) | 2019-11-05 |
Family
ID=68378346
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822158368.7U Active CN209579150U (en) | 2018-12-21 | 2018-12-21 | A kind of Twp-sided polishing machine |
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| Country | Link |
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| CN (1) | CN209579150U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110883674A (en) * | 2019-12-06 | 2020-03-17 | 新昌县羽林街道巨晖机械厂 | Ship deck steel plate polishing machine capable of automatically turning polished surface |
| CN113001379A (en) * | 2021-03-17 | 2021-06-22 | 天津中环领先材料技术有限公司 | Large-size silicon wafer double-side polishing method |
-
2018
- 2018-12-21 CN CN201822158368.7U patent/CN209579150U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110883674A (en) * | 2019-12-06 | 2020-03-17 | 新昌县羽林街道巨晖机械厂 | Ship deck steel plate polishing machine capable of automatically turning polished surface |
| CN113001379A (en) * | 2021-03-17 | 2021-06-22 | 天津中环领先材料技术有限公司 | Large-size silicon wafer double-side polishing method |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210209 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Patentee after: Zishi Energy Co.,Ltd. Address before: Room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |