CN209562897U - High-fineness thin copper foil circuit board - Google Patents
High-fineness thin copper foil circuit board Download PDFInfo
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- CN209562897U CN209562897U CN201821669748.0U CN201821669748U CN209562897U CN 209562897 U CN209562897 U CN 209562897U CN 201821669748 U CN201821669748 U CN 201821669748U CN 209562897 U CN209562897 U CN 209562897U
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- copper foil
- circuit board
- thin copper
- interface
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Abstract
The utility model discloses a kind of high-fineness thin copper foil circuit boards; it includes substrate etc.; contact pin, data-interface, reserve battery, power interface, thermal column are all fixed on substrate; data-interface is located at below contact pin; multiple reserve batteries are all located at the side of data-interface; bottom protective layer includes heat-sensitive layer, sealant, anti oxidation layer, and sealant is located at below heat-sensitive layer, and anti oxidation layer is located at below sealant.The utility model improves the hardness of high-fineness thin copper foil circuit board by a variety of levels, high-fineness thin copper foil circuit board is not allowed to be arbitrarily damaged, carrying out heat dissipation by thermal column, high-fineness thin copper foil circuit board can be worked, be stored for a long time, does not need often to replace circuit board.
Description
Technical field
The utility model relates to a kind of circuit boards, more particularly to a kind of high-fineness thin copper foil circuit board.
Background technique
High-fineness thin copper foil circuit board is a kind of circuit board for being covered with thin copper foil, and existing circuit board current is on it
Surface current is dynamic to be mostly not sufficiently stable, and electric current is easy to overflow outward, such danger close, and the flexibility of circuit board is also not good enough, gently
Micro- be bent just is easier damage circuit board, and circuit board can not also be stored for a long time, needs to be replaced frequently circuit board.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of high-fineness thin copper foil circuit boards, by a variety of
Level improves the hardness and flexibility of high-fineness thin copper foil circuit board, and high-fineness thin copper foil circuit board is not allowed arbitrarily to be damaged
It is bad, heat dissipation is carried out by thermal column, high-fineness thin copper foil circuit board can be worked, be stored for a long time, not needed often more
Change circuit board.
The utility model is to solve above-mentioned technical problem by following technical proposals: a kind of high-fineness thin copper foil electricity
Road plate, which is characterized in that it includes substrate, contact pin, data-interface, reserve battery, power interface, thermal column, and contact pin, data connect
Mouth, reserve battery, power interface, thermal column are all fixed on substrate, and data-interface is located at below contact pin, multiple reserve batteries
It is all located at the side of data-interface, multiple power interfaces are all located at the other side of multiple reserve batteries, and multiple thermal columns are all located at
The other side of multiple power interfaces, in which: substrate includes external base, middle part adhesive layer, bottom protective layer, middle part adhesive layer position
Below external base, bottom protective layer is located at below the adhesive layer of middle part；External base includes thin copper foil layer, copper-clad plate
Layer, aluminum base layer, carbon ink layer, copper-clad plate layer are located at below thin copper foil layer, and aluminum base layer is located at below copper-clad plate layer, carbon ink layer position
Below aluminum base layer；Bottom protective layer includes heat-sensitive layer, sealant, anti oxidation layer, and sealant is located at below heat-sensitive layer, is resisted
Oxide layer is located at below sealant.
Preferably, the middle part adhesive layer is equipped with adhesive glue.
Preferably, the substrate is equipped with multiple fixation holes.
Preferably, the substrate is equipped with multiple fixation holes.
Preferably, the height of the external base and the height of bottom protective layer are identical.
The positive effect of the utility model is: the utility model improves the thin copper of high-fineness by a variety of levels
The hardness of foil circuit board does not allow high-fineness thin copper foil circuit board to be arbitrarily damaged, and carries out heat dissipation by thermal column and allows fine
Degree thin copper foil circuit board can be worked for a long time, be stored, and not need often to replace circuit board, high-fineness thin copper foil circuit board
Operation can become more fine, and operation is not allowed error-prone, and flowing of the electric current on substrate becomes more stable, is safer.
Detailed description of the invention
Fig. 1 is the overall construction drawing of the utility model.
Fig. 2 is the structure chart of the substrate of the utility model.
Specific embodiment
The utility model preferred embodiment is provided, with reference to the accompanying drawing the technical solution of the utility model is described in detail.
As shown in Figure 1 to Figure 2, the utility model high-fineness thin copper foil circuit board includes substrate 1, contact pin 2, data-interface
3, reserve battery 4, power interface 5, thermal column 6, contact pin 2, data-interface 3, reserve battery 4, power interface 5, thermal column 6 are all solid
Determine on substrate 1, data-interface 3 is located at below contact pin 2, and multiple reserve batteries 4 are all located at the side of data-interface 3, multiple
Power interface 5 is all located at the other side of multiple reserve batteries 4, and multiple thermal columns 6 are all located at the other side of multiple power interfaces 5,
Wherein: substrate 1 includes external base 7, middle part adhesive layer 8, bottom protective layer 9, and middle part adhesive layer 8 is located under external base 7
Face, bottom protective layer 9 are located at below middle part adhesive layer 8；External base 7 includes thin copper foil layer 10, copper-clad plate layer 11, aluminum base layer
12, carbon ink layer 13, copper-clad plate layer 11 are located at below thin copper foil layer 10, and aluminum base layer 12 is located at below copper-clad plate layer 11, carbon ink
Layer 13 is located at below aluminum base layer 12；Thin copper foil layer 10, aluminum base layer 12, can lead between each layer of carbon ink layer 13 copper-clad plate layer 11
Glue is crossed to be bonded together.
Bottom protective layer 9 includes heat-sensitive layer 14, sealant 15, anti oxidation layer 16, and sealant 15 is located under heat-sensitive layer 14
Face, anti oxidation layer 16 are located at below sealant 15.Heat-sensitive layer 14, sealant 15 can pass through between each layer of anti oxidation layer 16
Glue is bonded together.
Middle part adhesive layer 8 is equipped with adhesive glue 17, and middle part adhesive layer bonds external base and bottom protective layer is stronger.
Substrate 1 is equipped with multiple fixation holes 18, and fixed high-fineness thin copper foil circuit board is stronger.
Substrate 1 is equipped with hex bolts 19, and installation base plate is more convenient.
The height of external base 7 and the height of bottom protective layer 9 be it is identical, substrate is less likely to be damaged.
The working principle of the utility model is as follows: contact pin, data-interface, reserve battery, power interface, thermal column are all fixed
On substrate, contact pin can further improve the operational precision of high-fineness thin copper foil circuit board and facilitate connection, fixed core
Piece etc. allows the operation of high-fineness thin copper foil circuit board to become more accurate, and data-interface is set for connecting various outsides
Standby, power interface is used for the heat dissipation of high-fineness thin copper foil circuit board, makes high-fineness thin for connecting power-supply device, thermal column
Copper foil circuit board can work for a long time.When accident power-off occurs for high-fineness thin copper foil circuit board, reserve battery can face
When solve the outage problem of high-fineness thin copper foil circuit board, provide of short duration power supply progress for high-fineness thin copper foil circuit board
Work, the work of high-fineness thin copper foil circuit board will not go wrong because of accident power-off.Substrate include external base, in
Portion's adhesive layer, bottom protective layer, middle part adhesive layer are made of vinyl, and vinyl possesses good bonding effect, bonding
External base and bottom protective layer are stronger；External base includes thin copper foil layer, copper-clad plate layer, aluminum base layer, carbon ink layer, covers copper
Plate layer is made of copper-clad plate, and copper-clad plate possesses good hardness, and substrate is allowed to be not readily susceptible to outer damage.Thin copper foil layer is by copper foil
It is made, copper foil, which is covered on copper-clad plate layer, can allow flowing of the electric current on substrate more convenient, more stable, gladly shield
Unnecessary electromagnetic induction, aluminum base layer are made of metallic aluminium, and metallic aluminium possesses good flexibility, are bonded under copper-clad plate layer
Face can allow the better flexibility of substrate head, substrate will not because it is outer be arbitrarily bent due to damage, carbon ink layer is made of bamboo charcoal ink,
Bamboo charcoal ink is applied on substrate to the stability that can further improve flowing of the electric current on substrate, allows the thin copper of high-fineness
The operation of foil circuit board becomes more fine；Bottom protective layer includes heat-sensitive layer, sealant, anti oxidation layer, and heat-sensitive layer is adopted
With silica flour, silica flour, which is applied on substrate, can allow substrate to possess good heat-resisting effect, make high-fineness thin copper foil electric
Road plate even if that good can also run at high temperature, and sealant is made of polycarbonate resin, and polycarbonate resin layer possesses well
Sealing effect, substrate is not easy by water droplet penetration to influence the work of high-fineness thin copper foil circuit board, anti oxidation layer by
Poly- methylvinyl is made, and poly- methylvinyl possesses good antioxidant effect, and being applied to substrate upper substrate can store for a long time, long
Oxidation by air is not afraid of in the storage of time, improved in this way by a variety of levels the hardness of high-fineness thin copper foil circuit board with it is soft
Toughness does not allow high-fineness thin copper foil circuit board to be arbitrarily damaged, and carries out heat dissipation by thermal column and makes high-fineness thin copper foil electric
Road plate can be worked for a long time, be stored, and not need often to replace circuit board, high-fineness thin copper foil circuit board operation can become
It is finer, operation is not allowed error-prone, and flowing of the electric current on substrate becomes more stable, is safer.
Particular embodiments described above, the technical issues of to the solution of the utility model, technical scheme and beneficial effects
It has been further described, it should be understood that the foregoing is merely specific embodiment of the utility model, not
For limiting the utility model, within the spirit and principle of the utility model, any modification for being made, changes equivalent replacement
Into etc., it should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of high-fineness thin copper foil circuit board, which is characterized in that it include substrate, contact pin, data-interface, reserve battery,
Power interface, thermal column, contact pin, data-interface, reserve battery, power interface, thermal column are all fixed on substrate, data-interface
Below contact pin, multiple reserve batteries are all located at the side of data-interface, and multiple power interfaces are all located at multiple standby electricities
The other side in pond, multiple thermal columns are all located at the other side of multiple power interfaces, in which: substrate includes that external base, middle part are viscous
Layer, bottom protective layer are closed, middle part adhesive layer is located at below external base, and bottom protective layer is located at below the adhesive layer of middle part；
External base includes thin copper foil layer, copper-clad plate layer, aluminum base layer, carbon ink layer, and copper-clad plate layer is located at below thin copper foil layer, aluminum base layer
Below copper-clad plate layer, carbon ink layer is located at below aluminum base layer；Bottom protective layer includes heat-sensitive layer, sealant, anti-oxidant
Layer, sealant are located at below heat-sensitive layer, and anti oxidation layer is located at below sealant.
2. high-fineness thin copper foil circuit board as described in claim 1, which is characterized in that the middle part adhesive layer is equipped with viscous
Close glue.
3. high-fineness thin copper foil circuit board as described in claim 1, which is characterized in that the substrate is equipped with multiple fixations
Hole.
4. high-fineness thin copper foil circuit board as described in claim 1, which is characterized in that the substrate is equipped with hexagonal spiral shell
Bolt.
5. high-fineness thin copper foil circuit board as described in claim 1, which is characterized in that the height of the external base and bottom
The height of portion's protective layer is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821669748.0U CN209562897U (en) | 2018-10-16 | 2018-10-16 | High-fineness thin copper foil circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821669748.0U CN209562897U (en) | 2018-10-16 | 2018-10-16 | High-fineness thin copper foil circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209562897U true CN209562897U (en) | 2019-10-29 |
Family
ID=68298125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821669748.0U Active CN209562897U (en) | 2018-10-16 | 2018-10-16 | High-fineness thin copper foil circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209562897U (en) |
-
2018
- 2018-10-16 CN CN201821669748.0U patent/CN209562897U/en active Active
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