CN209561409U - Integrated electronic circuit - Google Patents
Integrated electronic circuit Download PDFInfo
- Publication number
- CN209561409U CN209561409U CN201790001054.7U CN201790001054U CN209561409U CN 209561409 U CN209561409 U CN 209561409U CN 201790001054 U CN201790001054 U CN 201790001054U CN 209561409 U CN209561409 U CN 209561409U
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- module
- cube shaped
- electronic circuit
- integrated electronic
- cube
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0618—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/06181—On opposite sides of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16265—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being a discrete passive component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
- H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
Abstract
The utility model relates to a kind of integrated electronic circuits, it includes at least one passive electronic, especially inductance or capacitor, wherein the electronic circuit has at least two cube shaped modules, wherein the first cube shaped module has the first connecting terminal on its bottom side, the second connecting terminal on its top side, wherein the second cube shaped module has at least third connecting terminal on its bottom side, and wherein the second cube shaped module is installed in the first cube shaped module, and the third connecting terminal is at least partly connect with second connecting terminal.
Description
Technical field
The present invention relates to a kind of integrated electronic circuits, in particular for portable electronic system, the integrated electronic circuit
With at least one passive electrical device (especially inductance or capacitor).
Background technique
For a large amount of electronic equipments, especially portable electronic device, integrated electronic circuit is needed, such as height
The integrated electric pressure converter of degree.When constructing this integrated electronic circuit, usually using with the specific electronic circuit of application
Module (Baustein) and passive electronic are disposed on printed circuit board identical with integrated electronic circuit.According to cloth
Be placed in the passive device on printed circuit board how it is a large amount of and how it is complicated depending on, for this integrated electronic circuit
Manufacture consuming can be high.So-called integrated passive devices (Integrated Passive Device(integrated passive devices),
It IPD is) known.In the case, one or more passive electronics are assembled on substrate and then described will be integrated
Passive device is installed on printed circuit board.Due to merely having to an integrated passive devices rather than multiple passive devices are installed
Onto printed circuit board, the manufacture consuming for being consequently for integrated electronic circuit can be reduced.Increasingly with portable electronic device
Miniaturization, it is available for arranging that the space of integrated circuit and passive device is fewer and fewer on identical printed circuit board.
Highly integrated electric pressure converter is also referred to as DC/DC converter, and when need to have with provided by accumulator
When the electric flux of different voltage levels, then always needing the highly integrated electric pressure converter.For example, can be portable
The application for this is found in field of electronic device.The voltage of battery or battery may differ from the institute for running electronic equipment
Need voltage.In order to plan alap space requirement for electric pressure converter, highly integrated voltage is needed to convert
Device.
Summary of the invention
It should be provided using the present invention in view of its flexibility and the improved integrated electronic circuit of its manufacture view.
For this purpose, integrated electronic circuit arranged according to the present invention.Advantageous extension scheme of the invention is described below.
In the integrated electronic according to the present invention electricity at least one passive electronic, especially inductance or capacitor
Provide in the case where road: electronic circuit has at least two cube shaped modules, wherein the first cube shaped module has
The first connecting terminal on its bottom side and the second connecting terminal on its top side, wherein the second cube shaped module has at it
At least third connecting terminal on bottom side, and wherein the second cube shaped module is mounted in the first cube shaped module, and
The third connecting terminal is at least partly connect with second connecting terminal.
Modular construction is realized in integrated electronic circuit according to the present invention.For example, passive electronic, such as inductance
Integrated circuit can be arranged as in different cube shaped modules.Nevertheless, passive device and integrated circuit can be with little spaces
Demand combinations are at electric pressure converter according to the present invention.This is it is achieved thereby that described on the bottom side of the second cube shaped module
Second connecting terminal on the top side of third connecting terminal and the first cube shaped module carrys out structure in a manner of matching each other
It makes.Therefore, it is in electrical contact the connecting terminal of two sides thus and being simply installed to cube shaped module each other above.It is described
Then connecting terminal can be connected to each other by welding in a known way, for example.However, in two cube shaped modules or two
Between the above cube shaped module, then respectively there is only the spacing of very little and integrated electronic circuit according to the present invention can be with pole
Compact way constructs.
Due to modular construction, depending on the application of defined, for example, different passive devices can connect with integrated circuit
It connects.Therefore, it can produce modular construction external member (Baukasten), thus for example can be assembled with characteristic needed for specific application
Highly integrated electric pressure converter.Can by so-called flip process by two cube shaped module aggregates to together.In this mistake
Cheng Zhong, one of cube rotate 180 ° and are installed on another cube.Due to according to the present invention, on the bottom side of the first cube
First connecting terminal and the second cube top side on second connecting terminal be configured to match each other, therefore
This method can be executed in an automated manner.
Since two or more cube shaped modules are by the connection on the bottom side of cube shaped module or on top side
Contact and be connected to each other, therefore the supply line between each device is very short and hardly causes ghost effect.Therefore, root
Great advantages according to circuit of the invention also relative to custom circuit offer about its electrical characteristics.
In expansion scheme of the invention, being arranged, there is the first connecting terminal on bottom side and second on top side to connect
At least two first cube shaped modules of contact point, wherein at least two first cube shaped module be installed to each other it
On, and wherein the second cube shaped module is mounted to the described first cube shaped module first cube in top therein
On the top side of bodily form module.
By this method, so-called stacking, plurality of cube shaped module therefore stacked on top can be constructed and be electrically connected to each other.
By this method, the cube shaped module with different functionalities can be combined with each other, and thus integrated electronic circuit can be with high flexible
Mode constructs.For example, one or more cube shaped modules include electronic circuit and other cubes with active electronic device
Bodily form module only includes passive electronic.By this method, the functionality of circuit can pass through cube with passive electronic
The modification of bodily form module and for example adapt to various boundary.
In expansion scheme of the invention, at least one cube shaped module includes the integrated electronic with passive device
Circuit, so-called integrated passive devices (IPD).
It, can be on very small space in fact using the functionality of passive device, the realization such as filter by this IPD
It is existing.The IPD is preferably constructed with thin film technique or thin-bed technique.
In expansion scheme of the invention, one of cube shaped module be configured to can conduct magnetism or magnetism
Layer and/or can conduct electricity layer shroud module, wherein described magnetic, the magnetic layer of conduction and/or can conduct electric
Layer substantially extends on the entire cross section of shroud module.
Electromagnetic effect can be reduced by this method.On the one hand, this is suitable for the electromagnetic effect between each device.Example
Such as, it can be realized by shroud module, when shroud module is arranged between described two modules, the first cube shaped module
Electronic circuit is not by the electromagnetic radiation of another cube shaped module.It on the other hand, can be to avoid the electromagnetism being input from the outside
Radiation effect integrated electronic circuit.Finally, it goes without saying that the electromagnetism spoke of integrated electronic circuit according to the present invention can also be reduced
It penetrates.
In expansion scheme of the invention, shroud module is mounted to the first cube shaped mould at least one inductance
On the top side of block.
By this method, the usual strong electromagnetic radiation for carrying out self-inductance can be reduced.
In development plan of the invention, at least one described cube shaped module of the first or second is configured to cooling mould
Block, wherein the refrigerating module has at least one first metal plate, at least one described first gold medal at least one exterior face
Category plate can conduct on the bottom side or top side of refrigerating module at least one second metal plate by metal connecting elements thermally to be connected
It connects.
By this refrigerating module, the heat that can reliably generate in the cube shaped module of dissipation.Therefore, according to the present invention
Integrated electronic circuit can also be used for high electrical power and high switching frequency.This by integrated electronic circuit according to the present invention come
It is especially advantageous when realizing highly integrated electric pressure converter.In the case, refrigerating module according to the present invention is similarly
With cube shaped shape.First metal plate is arranged at least one exterior face of refrigerating module, wherein first gold medal
Belong to plate and is arranged for transmitting or transferring heat energy.Second metal plate is set on the bottom side or top side of refrigerating module, described second
Metal plate should absorb thermal energy from another cube shaped module and be transmitted on the first metal plate by metal connecting elements.Cause
This, refrigerating module according to the present invention can be not only used as the top mould for the stacking being made of multiple cube shaped modules
Block, for example, the refrigerating module can also be cube shaped at two if the first metal plate is arranged on the side of refrigerating module
It is used between module.
In expansion scheme of the invention, the first metal plate is arranged on the bottom side of refrigerating module, and is thermally connected element structure
Make the metal throuth hole for the first metal plate and the second metal plate are connected to each other.
By this method, it can be realized using low thermal resistance between two metal plates reliable thermally conductive.For example, will a large amount of gold
Belong to through-hole (such as 30 to 50) to be set between two metal plates.
In expansion scheme of the invention, highly integrated electronic voltage converter is realized.
The invention allows to realize that the very compact highly integrated voltage in particular for portable electronic system turns
Parallel operation.In expansion scheme of the invention, device is embedded into plastics in cube shaped module, wherein cube shaped module
Exterior face in addition to first, second and/or third connecting terminal is formed by plastics.
In expansion scheme of the invention, the top side of the first cube shaped module is the bottom side with the second cube shaped module
Same size.
In this way, so that the first cube shaped module is connected with the automation of the second cube shaped module becomes to hold
Easily, because if the side of the cube shaped module is aligned with each other, then reach following exact position, in the exact position,
Wherein the connecting terminal on the bottom side or top side of cube shaped module by matching each other orients.
In expansion scheme of the invention, the height of cube shaped module be in about 0.2 mm and about 0.8 mm it
Between.
In expansion scheme of the invention, at least one described passive device or the integrated electronic circuit with passive device
It (IPD) is constructed with thin-bed technique.
Such as coil and capacitor may be implemented by thin-bed technique or thin film technique, wherein only needing very small structure
Space, for realizing this passive device.
In expansion scheme of the invention, passive device is configured to coil.
In expansion scheme of the invention, by multiple layers of construction passive device.
When using so-called multilayer technique, the structure space requirement for passive device, such as coil can be further
It reduces.
In expansion scheme of the invention, the total height for the cube being connected to each other is less than or equal to 1 mm.
Especially, for very-close-coupled integrated electronic circuit used in portable electronic device, for example highly integrated
Electric pressure converter is created by this method.
Detailed description of the invention
Other features and advantages of the present invention are from the following of claim and the preferred embodiment of the present invention combination attached drawing
It is obtained in description.Without departing from the scope of the invention, different embodiments be shown in the accompanying drawings and description
Single feature can be combined with each other in any way herein.Particularly, without departing from the scope of the invention, attached drawing is come from
Or carry out the single feature of the paragraph of self-described also can be other features that it shows or describe within a context the case where
Down in conjunction with other single features.In the attached drawing:
Fig. 1 shows the view of highly integrated electric pressure converter according to the present invention from oblique upper,
Fig. 2 shows the view of the electric pressure converter of Fig. 1 from obliquely downward,
Fig. 3 shows the view of the first cube of the integrated circuit of the electric pressure converter with Fig. 1 from oblique upper,
Fig. 4 shows the view of the first cube of at least one passive device of the electric pressure converter with Fig. 1 from below,
Fig. 5 shows the another of the first cube of the electric pressure converter according to the present invention with the coil as passive device
One embodiment, wherein the plastics of package are had been omitted from,
Fig. 6 shows the device of Fig. 5 from obliquely downward,
Fig. 7 shows another embodiment of the first cube of the electric pressure converter of Fig. 1, wherein having been omitted from the modeling of package
Material,
Fig. 8 shows the device of Fig. 7 from obliquely downward,
Fig. 9 shows the first cube of another embodiment according to the present invention from obliquely downward,
Figure 10 shows two cube shaped modules of another embodiment of the present invention,
Figure 11 shows the stacking of three cube shaped modules,
Figure 12 shows another stacking according to the present invention being made of three cube shaped modules, wherein cube of top
Bodily form module is refrigerating module,
Figure 13 shows the refrigerating module of Figure 12 with different view,
Figure 14 shows the refrigerating module of Figure 12 with view from below,
Figure 15 shows the view of the refrigerating module of Figure 12 from top,
Figure 16 shows the side view of the refrigerating module of Figure 15,
Figure 17 shows another side view of the refrigerating module of Figure 15,
Figure 18 shows the side view of shroud module according to the present invention, and
Figure 19 shows the side view of stacking according to the present invention.
Specific embodiment
Fig. 1 first embodiment according to the present invention shows highly integrated electric pressure converter 10 according to the present invention.Electricity
Pressure converter 10 is by the first cube or the first cube shaped module 12 and the second cube or the second 14 groups of cube shaped module
At.Described two cube shaped modules 12,14 bottom surfaces having the same, to keep the side of the cube aligned with each other.In
It should find out connecting terminal 16 on the bottom side of second cube 14, the connecting terminal is for converting the voltage into device 10 and printed circuit
The matched connecting terminal of plate connects.
First cube 12 includes at least one passive device that do not find out in the diagram of Fig. 1.Cube 12 pass through by
At least one passive electronic is embedded into plastics and is formed.For example, being formed using by epoxy resin and glass fabric
Composite material, wherein the composite material is known with title FR-4.
Integrated electronic circuit is arranged in the second cube 14, and the integrated electronic circuit is not by finding out in Fig. 1
On the bottom side of the first cube 12 or on the top side of the second cube 14 connecting terminal come in cube 12 extremely
A few passive device is in electrical connection.The integrated circuit is also in connecting terminal 16 and is electrically connected.Integrated circuit is embedded in
In plastics, such as FR-4, to obtain the shape of the second cube 14.
Fig. 2 shows the electric pressure converter 10 of Fig. 1 in view from below.It should find out and be arranged in the second cube 14
Connecting terminal 16 on bottom side.Six connecting terminals 16 are set in total, and wherein the number is merely exemplary.
On the bottom side of the second cube 14, another metal covering 18 is arranged in centre.This metal covering 18 is relative to connection
Contact 16 is significantly larger and for exporting heat from integrated circuit in the second cube 14.Metal covering 18 therefore also referred to as heat pad
(Thermal-Pad).The appropriate metal covering that metal covering 18 can be connected on printed circuit board goes out to improve thermal conductivity.
The number of connecting terminal 16 and the size of metal covering 18 depend on the application of defined.For example, in thermally non-pass
In the application of key, metal covering 18 can be exempted.Integrated circuit is embedded into the second cube 14 therein and is also referred to as IC shell.
The diagram of Fig. 3 shows the second cube 14 in the view from oblique upper.Should find out: two connecting terminals 20 are by cloth
It is placed on the top side of the second cube 14.Connecting terminal 20 be used for the first cube 12 and be arranged in the first cube
At least one passive electronic mechanical connection and electrical connection in 12.The number and size of connecting terminal 20 depend on being advised again
Fixed application.For example, it is also possible to other connecting terminal is arranged relative to two connecting terminals drawn 20, so as to improve with
The mechanical connection of first cube 12.This connecting terminal is not needed centainly to be in integrated circuit or passive device and is electrically connected.
The diagram of Fig. 4 shows the first cube 12 in the view from obliquely downward.In the view of figure 4, the first cube
12 are positioned to upward with its bottom side.It should find out, there are two connecting terminal 22, described two companies for the bottom side tool of the first cube 12
Connecting terminal 20 of the contact point 22 on the top side in terms of size and the arrangement corresponding to the second cube 14, referring to Fig. 3.If existing
It overturns during making the first cube 12 in so-called flip and is placed on the top side of the second cube 14 with its bottom side, then the
The first connecting terminal 22 on the bottom side of one cube 12 then matches on the top side for accurately lying against the second cube 14
On second connecting terminal 20.After the so-called flip process that can be executed in an automated manner, connecting terminal 20,22 connects each other
It connects, for example, being welded to one another.This linker can also carry out in an automated manner.Due to the first cube 12 and second cube
The bottom surface having the same of body 14, thus the first cube 12 when being mounted on the second cube 14 in a very simplified manner
Thus it orients, arranges aligned with each otherly so that the side of two cubes 12,14 is distinguished.If this is implemented, first connects
Contact point 22 is also accurately lain against on the second connecting terminal 20.
After the first connecting terminal 22 is connect with the second connecting terminal 20, two cubes 12,14 are connected to each other, and therefore
Form the electric pressure converter 10 of Fig. 1 and Fig. 2.If desired, can be viscous between cube 12,14 by being at least arranged in paragraph by paragraph
Layer is connect to support the mechanical connection of the first cube 12 and the second cube 14.
The diagram of Fig. 5 shows the electric pressure converter 10 of Fig. 1 in following diagram, has been omitted from two cubes in the diagram
Whole plastic materials of body 12,14.Therefore, should find out in Fig. 5: the integrated circuit 24 schematically shown, the integrated electricity
Road is connect by that can conduct the intermediary element 26 of electricity with connecting terminal 16.For example, intermediary element 26 can be configured to so-called mistake
Hole or through-hole.
It should find out that joint face 28, the joint face pass through the intermediary element 30 that can conduct electricity on the top side of integrated circuit 24
It is connect with the second connecting terminal 20.In the diagram of Fig. 5, the second connecting terminal 20 is connect with the first connecting terminal 22, and
Connecting terminal 20,22 is not separately depicted in Fig. 5.
Wire winding 32 is connect with connecting terminal 22, wherein the wire winding forms coil and therefore forms passive electric appliance
Part.
The diagram of Fig. 6 shows the electric pressure converter 10 in the following state from obliquely downward, wherein the electric pressure converter
It is shown in Fig. 5 in the state.Here, should find out integrated circuit 24, coil 32 and in integrated circuit 24 again
Bottom side on should also find out and be arranged in intermediate metal covering 18, so-called heat pad.Metal covering 18 also by can conduct electricity and because
This intermediary element 26 that can conduct heat is connect with integrated circuit 24.Also should further it find out in the view of Fig. 6, third connection touching
Point 16 and by third connecting terminal 16 it is therein each connect with integrated circuit 24 can conduct electric intermediary element 26.
The diagram of Fig. 7 shows the integrated circuit being embedded into plastic tube 44 in the view from top.In its top side
On, cube 44 has the second connecting terminal of a total of six 20, wherein the cube has integrated circuit.The connecting terminal
Integrated circuit in intermediary element and cube 44 as having referred to described in Fig. 5 and Fig. 6 by the way that electricity can be conducted again
Connection.The bottom side of the first cube at least one passive electrical device has the top side with cube 44 shown in fig. 7
Identical configuration.Accordingly the first cube of configuration is then passed through flip process and rotates 180 ° again and be installed to its bottom side
On the top side of second cube 44 shown in fig. 7.The first contact of a total of six on the bottom side of first cube is then with
The contact of two connecting terminals 20.Thus highly integrated electric pressure converter according to the present invention is generated again, it cannot be with from outside
Integrated voltage converter 10 as illustrated in fig. 1 and 2 is distinguished.
This electric pressure converter is shown from oblique upper in Fig. 8, again in a manner of the plastics of no package.As illustrated,
Integrated circuit 24 is connect with a total of six connecting terminal 16 again, and only four are wherein shown in Fig. 8.In addition, such as having been explained according to Fig. 7
It states, integrated circuit 24 is connect by that can conduct the intermediary element of electricity with the second connecting terminal of a total of six 20.
A total of three passive electrical device 46,48 and 50 is connect with the second connecting terminal 20, wherein the three passive electric appliance
Part is only shown as block in a schematic way in the diagram of Fig. 8.For example, the passive electrical device 46,48,50 can be line
Circle, capacitor, resistance etc..
The diagram of Fig. 9 shows the electric pressure converter 40 of Fig. 8 in the view from obliquely downward.It should find out again in being arranged in
Between metal covering 18, be used to export heat from integrated circuit 24.In addition, should find out passive electrical device 46,48,50, it is described passive
Electrical part is in integrated circuit 24 and is electrically connected.
Integrated electronic circuit is provided through the invention, and the electric pressure converter being especially a highly integrated can pass through itself
Modular construction different application is adapted to very plain mode.The circuit can have low-down structure height, and example
As the height of electric pressure converter 10,40 according to the present invention is still located at lower than 1 mm.Electric pressure converter 10,40 can be with automation
Mode manufacture and assemble and be specifically adapted for using in portable due to its low spatial demand.
The diagram of Figure 10 shows two according to the present invention cube shaped modules 60 and 62, presents in the view of Figure 10
It is identical.However, the first cube shaped module 60 has the first connecting terminal on the bottom side hidden in Figure 10 of itself
64, wherein should find out only three paragraph by paragraph.First cube shaped module has on its top side there are two the second connecting terminal 66.
Second cube shaped module 62, which has to connect there are two third on the bottom side being located above in Figure 10 of itself, to be touched
Point 68.Figure 10 is easily shown: when the second cube shaped module 62 rotates 180 ° and is installed in the first cube shaped module 60
When, then third connecting terminal 68 is located on the second connecting terminal 66.Second connecting terminal 66 and third connecting terminal 68
Then it can be electrically connected to each other and be mechanically connected, for example, welding.
By this method, be arranged in electronic device in the first cube shaped module 60 then with the second cube shaped module 62
In electronic device connection.Two cube shaped modules 60,62 then form following integrated electronic circuit, the integrated electronic electricity
It road again can be again by the first connecting terminal 64 and unshowned printed circuit on the bottom side of the first cube shaped module 60
The conductor line of plate connects.
First cube shaped module 60 and the second cube shaped module 62 further respectively have thermo-contact device 70 or heat
Via hole.Thermo-contact device 70 is used to export heat from the first cube shaped module 62 of cube shaped module 60 or the second.When second vertical
When cube shape module 62 is mounted in the first cube shaped module 60 and when connecting terminal 66,68 is then connected to each other, heat is connect
Touching device 70 can also be connected to each other simultaneously, such as similarly by welding.
The diagram of Figure 11 shows the integrated electronic circuit according to the present invention 72 of another embodiment according to the present invention.Electricity
Road 72 has the so-called stacking being made of the cube shaped module 60,62 and 74 of a total of three.Cube of bottommost in Figure 11
The first connecting terminal 64 should be found out in bodily form module 60 on the bottom side of itself.Described second and third are hidden in the diagram of Figure 11
Connecting terminal.The cube shaped module 74 of third has the connecting terminal do not found out on its bottom side, then with the second cube
Connecting terminal connection on the top side of shape module 62.
The modular construction of integrated circuit 72 according to the present invention should be found out in Figure 11.When the first cube shaped module 60
When such as including integrated circuit, therefore cube shaped module 62 and 74 may include such as passive electronic, such as capacitor, resistance
And coil, wherein the integrated circuit has active device.Due to the difference of the integrated circuit in the first cube shaped module 60
Circuit can then provide the integrated electronic circuit 72 for being matched with respective application situation.For example, integrated electronic circuit 72 is embodied as
Electric pressure converter.
The diagram of Figure 12 shows another integrated electronic circuit 82 of another embodiment according to the present invention.First cube
Shape module 60 and the second cube shaped module 62 and the cube shaped module 84 of third are formed together stacking (Stapel oder
Stek).The cube shaped module 84 of third is designed to refrigerating module and for only that heat is cube shaped from second in the case
The top side dissipation of module 62.
For this purpose, refrigerating module 84 has the first metal plate 86 on its top side.It furthermore should be in the bottom side of refrigerating module 84
On find out the second metal plate 88.Second metal plate 88 is lain on the top side of the second cube shaped module 62.Two metal plates 86,
88 are connected to each other by element 90 is thermally connected.It is thermally connected the through-hole that element 90 is embodied as metal, is divided in the illustrated embodiment
It Wei not be cylindrical.Two metal plates 86,88 are connected by 45 thermal connection elements 90.
Figure 13 shows the view of refrigerating module 84 from another visual angle.First metal plate 86 implement on surface area ratio second
Metal plate 88 is bigger.First metal plate 86 extends between two opposite side edges of refrigerating module 84, but in Figure 13
In vertical direction respectively in the side edge end immediately front of refrigerating module 84.For example, the first metal plate 86 is embodied as copper sheet.It should
The surface area of first metal plate selects as big as possible so as to by heat dissipation as much as possible to surrounding.
The diagram of Figure 14 shows the bottom side for the refrigerating module 84 hidden in Figure 12.It should find out, as the first metal plate 86,
Second metal plate 88 is configured to copper sheet, and should find out 45 thermal connection elements 90 in total.Second metal plate 88 extends to cold
But the opposite side edge of module 84.This is the same side edge that the first metal plate 86 extends to.However, in vertical direction
On, i.e. bottom right to upper left in Figure 14, the second metal plate 88 is configured to more shorter than the first metal plate 86.Therefore in the second metal plate
88 in Figure 14 be located at bottom right feather edge and refrigerating module 84 in Figure 14 be located at bottom right side edge between there are still
Sufficient space, to arrange two connecting terminals 92.In the same manner, it is located at upper left in Figure 14 in the second metal plate 88
Top edge and refrigerating module 84 between the side edge for being located at upper left in Figure 14, similarly arrange two connecting terminals 92.Even
Contact point 92 is respectively embedded in plastic material, and two metal plates 86,88 and heat through-hole 90 are also embedded into the plastic material.Even
Contact point 92 is for mechanically connected by refrigerating module 84 and the second cube shaped module 62, referring to Figure 12.However, in shown reality
It applies in mode, does not arrange passive or active electronic device in refrigerating module 84, so that the connection in illustrated embodiment be made to touch
Point 92 only undertakes mechanical holding function rather than Electricity Functional.
The diagram of Figure 15 shows refrigerating module 84 in the view from top.In this view, it should only find out the first metal
Plate 86 and thermal connection element 90.The second metal plate 88 and connecting terminal 92 itself on the bottom side of refrigerating module 84 it is invisible and
Therefore it is marked using only dotted line.
Figure 16 shows the side view of refrigerating module 84.In this view, it should find out the first metal plate 86 and the second metal plate
88.Element 90 is thermally connected to mark using dotted line.Also it should find out connecting terminal 92.
The diagram of Figure 17 shows another side view of refrigerating module 84 from relatively narrow side now.Just as being thermally connected element 90
Equally small mode should find out two metal plates 86,88 in this view, be shown so that dotted line be used only.However, connection
Contact 92 is visible on the bottom side of refrigerating module 84.
Figure 18 is shown ... in a side view the cube shaped module 94 of another embodiment according to the present invention.Cube shaped module
94 are configured to shroud module.Shroud module is made of two plastic layers 96, and arrangement is by that can pass between described two plastic layers 96
The pantostrat that magnetic conductivity and the material 89 that can conduct electricity when necessary form.For example, layer 98 can be made of ferrite.For example, plastics
Layer can be made of FR4 plastics, and composite material is made of glass fabric and resin, is usually made of fibre reinforced plastics.
Connecting terminal 100 or 102 is respectively arranged on the top side and bottom side of shroud module 94.Connecting terminal 100,102 is first
First for shroud module 94 and other cube shaped modules is mechanically connected.When necessary, when needing the electricity of shroud module 94 logical
Kong Shi, one of connecting terminal 100 on the bottom side of shroud module 94 respectively can be also corresponding on the top side of shroud module 94
Connecting terminal 102 is electrically connected.
Shroud module 94 can be used for shielding electromagnetic radiation and can for example be installed in the cube shaped module with coil.
Figure 19 shows integrated electronic circuit 112 according to the present invention, is configured to by three cube shaped modules 60,62 and
The stacking that shroud module 94 forms.In the illustrated embodiment, the first cube shaped module 60 can be for example comprising with active electricity
The integrated circuit of sub- device.Second cube shaped module 62 may include inductance.Then, on the one hand it is next to be responsible for shielding for shroud module 94
The electromagnetic radiation of inductance in comfortable module 62 and on the other hand also it is responsible for reducing electromagnetic radiation into the inductance in module 62
And to the injection in the circuit in module 60.
Replace only one inductance, the second cube shaped module 62 and/or the first cube shaped module 60 also may include having
The integrated electronic circuit of passive device, and then it is configured to integrated passive devices (IPD).This IPD may include coil, capacitor
It device and/or resistance and is usually configured on substrate in a manner of very compact with thin-bed technique or thin film technique.This IPD allows shape
At very-close-coupled integrated electronic circuit 112.
Claims (17)
1. a kind of integrated electronic circuit, the integrated electronic circuit has at least one passive electronic, which is characterized in that institute
Electronic circuit is stated at least two cube shaped modules, wherein the first cube shaped module has first on its bottom side to connect
Contact point and the second connecting terminal on its top side, wherein the second cube shaped module has on its bottom side at least
Third connecting terminal, and wherein the described second cube shaped module is installed in the described first cube shaped module, and described
Third connecting terminal is at least partly connect with second connecting terminal.
2. integrated electronic circuit as described in claim 1, which is characterized in that the first connection having on the bottom side is arranged
At least two first cube shaped modules of contact and the second connecting terminal on the top side, wherein described at least two
One cube shaped module is installed to over each other, and the second cube shaped module be mounted to the described first cube shaped module its
In on the top side of the first cube shaped module of top.
3. the integrated electronic circuit as described at least one preceding claims, which is characterized in that the cube shaped module is extremely
It is one of few to include integrated electronic circuit, so-called integrated passive devices (IPD) with passive device.
4. integrated electronic circuit as described in claim 1, which is characterized in that one of described cube shaped module is configured with
Can magnetic, the magnetic layer of conduction and/or can conduct electricity layer shroud module, wherein it is described can conduct magnetism, it is magnetic
Layer and/or the layer that can conduct electricity extend on the entire cross section of the shroud module.
5. integrated electronic circuit as claimed in claim 4, which is characterized in that the shroud module, which is mounted to, has at least one
On the top side of the cube shaped module of the first of a inductance.
6. integrated electronic circuit as described in claim 1, which is characterized in that the cube shaped module of the first or second is at least
One of be configured to refrigerating module, wherein the refrigerating module at least one exterior face have at least one first metal plate,
At least one described first metal plate by metal connecting elements on the bottom side or top side of the refrigerating module at least one
Second metal plate, which can conduct, thermally to be connected.
7. integrated electronic circuit as claimed in claim 6, which is characterized in that first metal plate is disposed in the cooling
On the bottom side of module, and second metal plate is disposed on the top side of the refrigerating module, and the thermal connection
Element is configured to the metal throuth hole that first metal plate and second metal plate are connected to each other.
8. integrated electronic circuit as described in claim 1, which is characterized in that realize highly integrated electronic voltage converter.
9. integrated electronic circuit as described in claim 1, which is characterized in that by the device in the cube shaped module
It is embedded into plastics, wherein the cube shaped module is in addition to described first, described second and/or the third connecting terminal
Exterior face is formed by the plastics.
10. integrated electronic circuit as described in claim 1, which is characterized in that the top of the first cube shaped module
Side is the bottom side same size with the described second cube shaped module.
11. integrated electronic circuit as described in claim 1, which is characterized in that the height of the cube shaped module is in 0.2
Between mm and 0.8 mm.
12. integrated electronic circuit as described in claim 1, which is characterized in that at least one described passive electronic be with
Thin-bed technique construction.
13. integrated electronic circuit as described in claim 1, which is characterized in that the passive electronic is configured to coil.
14. integrated electronic circuit as described in claim 1, which is characterized in that the passive electronic is come by multiple layers
Construction.
15. integrated electronic circuit as described in claim 1, which is characterized in that the cube shaped module being connected to each other
Total height is less than or equal to 1 mm.
16. integrated electronic circuit as described in claim 1, which is characterized in that the passive electronic is inductance or capacitor
Device.
17. integrated electronic circuit as claimed in claim 3, which is characterized in that the integrated electronic electricity with passive device
(IPD) is constructed with thin-bed technique on road.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE202016004404.5U DE202016004404U1 (en) | 2016-07-12 | 2016-07-12 | Highly integrated voltage converter |
| DE202016004404.5 | 2016-07-12 | ||
| PCT/EP2017/067245 WO2018011133A1 (en) | 2016-07-12 | 2017-07-10 | Integrated electronic circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209561409U true CN209561409U (en) | 2019-10-29 |
Family
ID=56738717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201790001054.7U Active CN209561409U (en) | 2016-07-12 | 2017-07-10 | Integrated electronic circuit |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN209561409U (en) |
| DE (1) | DE202016004404U1 (en) |
| TW (2) | TW201817296A (en) |
| WO (1) | WO2018011133A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10971434B2 (en) | 2019-05-02 | 2021-04-06 | Silanna Asia Pte Ltd | Lead frame package having conductive surface with integral lead finger |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9601412B2 (en) * | 2007-06-08 | 2017-03-21 | Cyntec Co., Ltd. | Three-dimensional package structure |
| US8743553B2 (en) * | 2011-10-18 | 2014-06-03 | Arctic Sand Technologies, Inc. | Power converters with integrated capacitors |
| JP5975180B2 (en) * | 2013-10-03 | 2016-08-23 | 富士電機株式会社 | Semiconductor module |
| DE102014010373A1 (en) * | 2014-07-12 | 2015-01-15 | Daimler Ag | Electronic module for a motor vehicle |
-
2016
- 2016-07-12 DE DE202016004404.5U patent/DE202016004404U1/en active Active
-
2017
- 2017-07-10 CN CN201790001054.7U patent/CN209561409U/en active Active
- 2017-07-10 WO PCT/EP2017/067245 patent/WO2018011133A1/en active Application Filing
- 2017-07-11 TW TW106123174A patent/TW201817296A/en unknown
- 2017-07-11 TW TW108203014U patent/TWM585466U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018011133A1 (en) | 2018-01-18 |
| DE202016004404U1 (en) | 2016-08-03 |
| TW201817296A (en) | 2018-05-01 |
| TWM585466U (en) | 2019-10-21 |
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