CN209548771U - A kind of defoaming device - Google Patents

A kind of defoaming device Download PDF

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Publication number
CN209548771U
CN209548771U CN201822061094.XU CN201822061094U CN209548771U CN 209548771 U CN209548771 U CN 209548771U CN 201822061094 U CN201822061094 U CN 201822061094U CN 209548771 U CN209548771 U CN 209548771U
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CN
China
Prior art keywords
defoaming device
heat
accommodating cavity
radiating component
cabinet
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Active
Application number
CN201822061094.XU
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Chinese (zh)
Inventor
丁远家
李志才
张利利
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Xinlun Optoelectronic Materials Shenzhen Co ltd
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Shenzhen Selen Science & Technology Co Ltd
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Priority to CN201822061094.XU priority Critical patent/CN209548771U/en
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Abstract

The utility model discloses a kind of defoaming device, including cabinet, defoaming device, vacuum plant, cooling circuit and radiating component;The defoaming device is set in cabinet, for removing bubble including rotating base and the first accommodating cavity being set to above pedestal;The accommodating chamber outer wall is provided with radiating component, and it can also include temperature control medium between heat-conducting layer and heat dissipating layer that the radiating component, which includes successively from inside to outside heat-conducting layer and heat dissipating layer,;The vacuum plant is for manufacturing the intracorporal vacuum of case;The cooling circuit is for defoaming device and the intracorporal heat of case to be swapped out;Radiating fin is provided on the radiating component.The equipment can control the temperature of material, and the heat generated in equipment running process is exchanged in time to outside, and use scope is wider;The equipment rotation, revolution rate can be separately adjustable, and mixing effect is more preferable.

Description

A kind of defoaming device
Technical field
The utility model relates to defoaming device technical fields, and in particular to a kind of vacuum defoamation equipment.
Background technique
Existing planetary deaeration stirring dispersion machine has vacuum pump, and when operating, vacuum state is in inside dispersion machine, Blender is in the state that runs at high speed, and can generate a large amount of heat, these heats are difficult to spread out in time, are easy to cause dispersion The temperature of machine and stirring material rises, so as to cause the damage of equipment and going bad for material.In use, in order to avoid point The heat that accumulation is excessive in machine is dissipated to need to stop, this greatly reduces working efficiency after dispersion machine operates a period of time.Separately Outside, existing deaeration mixing plant is without temperature control function, be affected by temperature biggish material be not available such equipment into Row dispersion deaeration operation.
Utility model content
In view of the problems of the existing technology, the utility model provides a kind of defoaming device, which includes cabinet, deaeration Device, vacuum plant, cooling circuit and radiating component in time can be swapped out the heat generated in equipment running process It goes, in addition, the equipment also has temperature control function, can control the temperature of material, use scope is wider;The equipment rotation, The rate that revolves can be separately adjustable, and mixing effect is more preferable.
A kind of defoaming device, including cabinet, defoaming device, vacuum plant, cooling circuit and radiating component;It is described de- Bulb apparatus is set in cabinet, for removing bubble including rotating base and the first accommodating cavity being set to above pedestal;Institute The outer wall for stating the first accommodating cavity is provided with radiating component;The vacuum plant is for manufacturing the intracorporal vacuum of case;The cooling Circulation loop is for defoaming device and the intracorporal heat of case to be swapped out;Radiating fin is provided on the radiating component.
It is preferred that outer wall of the radiating fin perpendicular to radiating component, or inclination are surrounded on the outer wall of radiating component;Into one Step ground, the radiating fin surface coat heat radiation coating.
The radiating fin has one or more;The radiating fin with a thickness of 0.1~5mm.
In the form of sheets, concrete shape is not particularly limited the radiating fin, and preferably radiating fin is rectangle, pros One of shape, trapezoidal, parallelogram;The further preferred radiating fin is rectangle.
It is preferred that the radiating component successively includes heat-conducting layer and heat dissipating layer from inside to outside;The further preferred heat-conducting layer and It include temperature control medium between heat dissipating layer, the temperature control medium controls the intracorporal temperature of the first accommodating cavity for adjusting;It is described Temperature control medium is electrically connected with temperature control system;The temperature control medium is semiconductor chilling plate.
Further, for the sake of security, the top, lower part of temperature control medium are directly contacted with thermal insulation layer.
The rotating base includes the axis of rotation and hollow shaft, and the axis of rotation and hollow shaft are concentric circular shaft, and hollow shaft is Cylindrical shape, the axis of rotation are located at revolution axis center, autorotation disk are arranged on the axis of rotation, setting the first container is protected on the autorotation disk Gripping member, the first container holder is for fixing the first accommodating cavity;Rotary table, the rotary table are set on the hollow shaft Upper setting second container holder, the second container holder are connect with the first container holder.The axis of rotation and Hollow shaft is electrically connected with driving motor respectively, and the driving motor drives hollow shaft and the axis of rotation independently to rotate, autorotation speed with The rate that revolves can be separately adjustable, is independent of each other.
The quantity of the first accommodating cavity has one or more;The first accommodating cavity is horizontally placed on the rotation On pedestal.
Optionally, the first accommodating cavity with hollow shaft is at an acute angle is obliquely installed on the rotating base.
The hollow shaft is arranged in casing, and described sleeve pipe is not directly contacted with hollow shaft, and described sleeve pipe is metal material, With good heating conduction.
The entrance of the cooling circuit is located at the lower section of wall box, and outlet is located at the top of wall box, described Cooling medium is passed through in cooling circuit, the cooling medium can be the water or oil of room temperature or low temperature;Cooling medium is by low To Gao Liudong, cooling effect is more preferable.
A part of the cooling circuit is wrapped in the outer wall of casing, and another part disk ring is set to cabinet wall, Material, the axis of rotation, the heat transfer that generates in hollow shaft rotation process to casing, then exchanged heat by cooling circuit It goes out;In addition, the heat at other positions can also be exchanged by cooling circuit to outside cabinet in cabinet, it can be to avoid cabinet Internal temperature is excessively high, to extend the service life of equipment.
In use, the second accommodating cavity is placed in the first accommodating cavity, is put in the second accommodating cavity body Glove material connects temperature sensor on the second accommodating cavity, the temperature sensor and temperature control system electrical connection, institute It states temperature control system to be also electrically connected with temperature control medium, temperature control step includes: (1) detection intracorporal temperature of the second accommodating cavity, is obtained To the first temperature signal;(2) temperature control system receives first temperature signal, it is compared with preset temperature;(3) warm Spend control system driving semiconductor refrigeration chip heating or refrigeration.
In addition, universal wheel and heelpiece can be set in the bottom of cabinet in the utility model, the universal wheel is convenient for cabinet Mobile, the heelpiece makes cabinet be easy to level and reduce equipment vibration
The utility model has the advantages that
The utility model includes cabinet, defoaming device, vacuum plant, cooling circuit and radiating component, can be by object The heat that material dispersion deaeration and equipment operation process generate is exchanged to cabinet in time, avoids that temperature is excessively high to cause material Rotten and equipment damage, guarantee continuously runs equipment for a long time, extends service life of equipment.In addition, the utility model Temperature of charge can be accurately controlled, both dispersion effect can be improved with heating melting solid material, material can also be cooled down, avoided Material volatilization is rotten, and therefore, the utility model can carry out dispersion to various materials and deaeration, use scope are wider.In addition, The utility model autorotation speed, revolution rate can be separately adjustable, do not interfere with each other, dispersion deaeration effect is more preferable;The utility model can To level by heelpiece, requirement of the equipment for ground level degree is reduced.
Detailed description of the invention
Fig. 1 equipment appearance figure
Fig. 2 equipment front view
Fig. 3 A, 3B radiating component sectional view
Fig. 4 A, 4B, 4C radiating fin main view
Fig. 5 second accommodates cavity cross-section figure
Specific embodiment
Below in conjunction with the attached drawing of the utility model, the technical solution of the utility model is clearly and completely described.
For solve existing vacuum defoaming device temperature of charge is uncontrollable, heat can not pass in time, equipment can not It continuously running and revolves for a long time, the problem that autorotation speed can not be separately adjustable, the utility model provides a kind of defoaming device, Including cabinet, defoaming device, vacuum plant, cooling circuit and radiating component, the defoaming device is used to remove bubble, if It is placed in cabinet, including rotating base and the first accommodating cavity being set to above pedestal;The first accommodating chamber outer wall is set It is equipped with radiating component;The vacuum plant is for manufacturing the intracorporal vacuum of case;The cooling circuit is used for defoaming device It is swapped out with the intracorporal heat of case;Radiating fin is provided on the radiating component.
As shown in Figure 1, cabinet is equipped with cover board 1, defoaming device 2, cross spirit bubble 3, operation panel 4, the side of cabinet Power switch 5 and scram button 6 are set;The bottom of cabinet is equipped with universal wheel, keeps cabinet easy to remove, the universal wheel is removable It unloads, the quantity of the universal wheel is not particularly limited, preferably 1~5, further preferably 4;The bottom of the cabinet 11 Portion is additionally provided with heelpiece, and heelpiece and cross spirit bubble 4 cooperate, and cabinet is made to be easy to level and reduce equipment vibration, the number of the heelpiece Amount is not particularly limited, and the quantity of the preferably described heelpiece is even number, and the further preferred heelpiece is 4, is located at cabinet bottom On 4 angles in face, the heelpiece can be rubber material.
The vacuum plant includes vacuum pump and pipeline, and vacuum pump is placed in outside cabinet, and pipeline connects vacuum pump and cabinet, When work, vacuum pump vacuumizes cabinet, and entire cabinet is made to be in vacuum state.
As shown in Fig. 2, the defoaming device, cooling circuit and radiating component are respectively positioned in cabinet 11, the deaeration Device includes rotating base and the first accommodating cavity 12 being set on rotating base, and the quantity of the first accommodating cavity 12 has 1 Or it is multiple, the rotating base includes the axis of rotation 14 and hollow shaft 15, and the axis of rotation 14 and hollow shaft 15 are concentric circular shaft, public Shaft 15 is cylindrical shape, and the axis of rotation 14 is located at the center of hollow shaft 15, autorotation disk 13, the rotation is arranged on the axis of rotation 14 The first container holder 17 is set on disk 13, and the first container holder 17 is for fixing the first accommodating cavity 12;The public affairs Rotary table 16 is set in shaft 15, second container holder 18, the second container holder 18 are set on the rotary table 16 It is connect with the first container holder 17.The axis of rotation 14 and hollow shaft 15 are electrically connected with driving motor respectively, the drive Dynamic motor drives the axis of rotation 14 and the independent rotation of hollow shaft 15, and the axis of rotation 14 drives the driving of autorotation disk 13 first accommodating cavity 12 rotations;The hollow shaft 15 drives the driving of rotary table 16 first accommodating cavity 12 to revolve, and autorotation speed and revolution rate can be with It is separately adjustable, it is independent of each other.
The first accommodating cavity 12 is horizontally placed on the rotating base;In addition, the first accommodating cavity 12 Can with hollow shaft is at an acute angle is obliquely installed on the rotating base.
The hollow shaft 15 is arranged in casing 19, and described sleeve pipe 19 is not directly contacted with hollow shaft 15, described sleeve pipe 19 It is metal material, there is good heating conduction.The outer wall of described sleeve pipe 19 winds cooling circuit 20, cooling circuit Cooling medium is passed through in 20.The cooling medium can be the water or oil of room temperature or low temperature, and the cooling circuit 20 enters Mouth 21 is located at the lower section of wall box, and the outlet 22 of the cooling circuit 20 is located at the top of wall box, cooling medium It flows from low to high, cooling effect is more preferable.Particularly, the utility model cooling circuit 20 is set in 11 inside disk ring of cabinet It sets, the heat at each position of box house can be taken away.
In use, the axis of rotation 14, the heat transfer that generates in 15 rotation process of hollow shaft to casing 18, then pass through Heat is swapped out by cooling circuit 20, avoids the temperature of box house excessively high, to extend the service life of equipment.
As shown in Figure 3A, the first accommodating 12 outer wall of cavity is provided with radiating component, and the radiating component is from inside to outside It is followed successively by heat-conducting layer 121 and heat dissipating layer 123, includes temperature control medium 122, institute between the preferably described heat-conducting layer 121 and heat dissipating layer 123 It is semiconductor system that temperature control medium 122, which is stated, for adjusting the temperature controlled in the first accommodating cavity 12, the temperature control medium 122 Cold, the temperature control medium 122 is electrically connected with temperature control system.The heat-conducting layer 121 is made of the higher material of thermal conductivity, It can be the materials such as copper, aluminium, iron, the preferably described heat-conducting layer 121 is made of copper;The semiconductor chilling plate is partly led by p-type, N-shaped Body is constituted;The temperature control medium 122 is electrically connected with temperature control system;The heat dissipating layer 123 by good heat dispersion performance material Composition, can be the materials such as copper, aluminium, iron, the preferably described heat dissipating layer 123 is made of aluminium layer.
In another embodiment, as shown in Figure 3B, the first accommodating 12 outer wall of cavity is provided with radiating component, described to dissipate Hot component from inside to outside be respectively heat-conducting layer 121, temperature control medium 122, heat dissipating layer 123, the top of the temperature control medium 122, under Portion is directly contacted with thermal insulation layer 124, and safety can be improved;In addition, during temperature control medium refrigeration, the thermal insulation layer 124 can accommodate inside cavity 12 to avoid the heat transfer in cabinet to first, influence refrigeration effect.
Radiating fin 23 is provided on the radiating component, the radiating fin 23 there are one or more, the radiating fin 23 in the form of sheets, with a thickness of 0.1~5mm.
Bottom surface perpendicular arrangement of the radiating fin 23 relative to the first accommodating cavity 12, is deposited between the radiating fin In gap, structure is as shown in Figure 4 A.
The radiating fin 23 relative to the first accommodating cavity 12 bottom surface in horizontally arranged, deposited between the radiating fin In gap, structure is as shown in Figure 4 B.
The angle of the radiating fin 23 and the first accommodating 12 side wall of cavity is acute angle, is surrounded on radiating component, structure As shown in Figure 4 C.
23 surface of radiating fin coats heat radiation coating.
As shown in figure 5, placing the second accommodating cavity 24 in the first accommodating cavity 12, the second accommodating cavity 24 is used In placing material, it is covered with cup lid 241 at the top of the second accommodating cavity 24, through-hole is set on the cup lid 241, the through-hole Quantity is one or more, and the preferably described through-hole has 2, respectively through-hole 242 and through-hole 243, and the through-hole 242 is for placing Temperature-sensing probe 244, the temperature-sensing probe 244 be used for perceive second accommodate cavity 24 in temperature, the one of the temperature-sensing probe 244 In end insertion the second accommodating cavity 24, the other end connects temperature control system, and the temperature-sensing probe 244 can be thermometer or heat Galvanic couple.When equipment operates, a temperature is first preset, after temperature-sensing probe 244 senses the temperature in the second accommodating cavity 24, feedback To temperature control system, temperature control system controls semiconductor chilling plate refrigeration or heating again, makes in the second accommodating cavity 24 Temperature reaches set temperature.Through-hole 243 is venthole, and when vacuumizing, the air in the second accommodating cavity 24 is from 243 row of through-hole Out.The second accommodating cavity 24 is made of the good material of heating conduction, such as the metal materials such as copper, aluminium, iron.
Material is placed in the second accommodating cavity, and the second accommodating cavity is placed in the first accommodating cavity, in revolution, rotation In the process, material can generate relative motion, achieve the effect that evenly dispersed;In addition, rubbing action and material between material And second accommodating cavity between rubbing action can generate a large amount of heat, these heats can be transferred to the first accommodating chamber outer wall Radiating component on, by heat-conducting layer, transfer heat to heat dissipating layer, on radiating fin, radiating fin is again by heat heat radiation To other intracorporal spaces of case, final heat is exchanged by cooling circuit to outside cabinet.In addition, in the course of rotation, Rubbing action occurs for the axis of rotation and hollow shaft and other component, can also generate heat, these heats can be returned by cooling cycle Road is transferred to outside cabinet.
In addition, radiating component can also include temperature control medium, the temperature of material can be accurately controlled, can both freeze, and make The temperature of material lowers, and some solid material heating and meltings can also be become liquid, is conveniently dispersed with stirring, this will widen this The use scope of equipment.
Although specifically showing and describing the utility model in conjunction with preferred embodiment, it is understood, however, that this is practical new Type is not intended to be limited thereto.For those skilled in the art, the present invention may have various modifications and changes.It is all this Within the spirit and principle of utility model, any modification, equivalent substitution and improvement done should be included in the utility model Within scope of the claims.

Claims (10)

1. a kind of defoaming device, which is characterized in that including cabinet, defoaming device, vacuum plant, cooling circuit and heat dissipation structure Part;
The defoaming device is set in cabinet for removing bubble, including rotating base and be set to above pedestal first Accommodate cavity;
The first accommodating chamber outer wall is provided with radiating component;
The vacuum plant is for manufacturing the intracorporal vacuum of case;
The cooling circuit is for defoaming device and the intracorporal heat of case to be swapped out;
Radiating fin is provided on the radiating component.
2. defoaming device according to claim 1, which is characterized in that the radiating component is from inside to outside successively comprising thermally conductive Layer and heat dissipating layer.
3. defoaming device according to claim 2, which is characterized in that be situated between the heat-conducting layer and heat dissipating layer comprising temperature control Matter controls the intracorporal temperature of the first accommodating cavity for adjusting.
4. defoaming device according to claim 1-3, which is characterized in that the radiating fin is perpendicular to heat dissipation structure The outer wall of part, or inclination are surrounded on the outer wall of radiating component.
5. defoaming device according to claim 1-3, which is characterized in that the radiating fin surface coats hot spoke Penetrate coating.
6. defoaming device according to claim 3, which is characterized in that the temperature control medium is semiconductor chilling plate.
7. defoaming device according to claim 1, which is characterized in that the rotating base includes the axis of rotation and hollow shaft.
8. defoaming device according to claim 7, which is characterized in that the first accommodating cavity is horizontally placed on the rotation Turn on pedestal.
9. defoaming device according to claim 7, which is characterized in that the first accommodating cavity with hollow shaft is at an acute angle inclines It is tiltedly set on the rotating base.
10. according to claim 1~3,6~9 described in any item defoaming devices, which is characterized in that the cooling circuit It arises from below case-side, by hollow shaft, goes out above case-side.
CN201822061094.XU 2018-12-10 2018-12-10 A kind of defoaming device Active CN209548771U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822061094.XU CN209548771U (en) 2018-12-10 2018-12-10 A kind of defoaming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822061094.XU CN209548771U (en) 2018-12-10 2018-12-10 A kind of defoaming device

Publications (1)

Publication Number Publication Date
CN209548771U true CN209548771U (en) 2019-10-29

Family

ID=68301621

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822061094.XU Active CN209548771U (en) 2018-12-10 2018-12-10 A kind of defoaming device

Country Status (1)

Country Link
CN (1) CN209548771U (en)

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GR01 Patent grant
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CP03 Change of name, title or address

Address after: 518052 32 / F, Haibin Huanqing building, 24 Futian Road, Weizhen community, Futian street, Shenzhen, Guangdong

Patentee after: Xinlun New Material Co.,Ltd.

Address before: 13-14 / F, creative building, 3025 Nanhai Avenue, Nantou street, Nanshan District, Shenzhen, Guangdong 518052

Patentee before: SHENZHEN SELEN SCIENCE & TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20221111

Address after: 518000 workshop 2, Xinlun science and Technology Industrial Park, south of TANGMING Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen, Guangdong

Patentee after: Xinlun optoelectronic materials (Shenzhen) Co.,Ltd.

Address before: 518052 32 / F, Haibin Huanqing building, 24 Futian Road, Weizhen community, Futian street, Shenzhen, Guangdong

Patentee before: Xinlun New Material Co.,Ltd.