CN209544285U - A kind of absorption of wafer and it is in place detection device - Google Patents
A kind of absorption of wafer and it is in place detection device Download PDFInfo
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- CN209544285U CN209544285U CN201920089195.XU CN201920089195U CN209544285U CN 209544285 U CN209544285 U CN 209544285U CN 201920089195 U CN201920089195 U CN 201920089195U CN 209544285 U CN209544285 U CN 209544285U
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- 238000001514 detection method Methods 0.000 title claims abstract description 135
- 238000010521 absorption reaction Methods 0.000 title claims abstract description 22
- 238000007689 inspection Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 18
- 238000000034 method Methods 0.000 abstract description 6
- 238000009434 installation Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 206010021703 Indifference Diseases 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 208000012868 Overgrowth Diseases 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The utility model discloses a kind of absorption of wafer and it is in place detection device, it include: first detection unit and second detection unit, the first detection unit and second detection unit are divided into the two sides of the sucker, and, the first detection unit is set to the first height and position relative to the sucker suction face, the second detection unit is set to the second height and position relative to the sucker suction face, and second height is greater than first height；Wherein, the first detection unit for individually detect wafer whether by the sucker suction in place, the first detection unit be also used to cooperatively detect with the second detection unit wafer by when the sucker suction whether in place and inclination and wafer whether completely disengage the sucker.The utility model can precisely efficient detection adsorbed to sucker, and transport is in placement process, and whether there is or not precisely in place for wafer.
Description
Technical field
The utility model relates to wafer haulage equipment technical fields in semicon industry wafer automated process, more specifically
Ground is related to a kind of absorption of wafer and is in place detection device.
Background technique
In semicon industry automated process, loading and unloading to wafer are using by robotic manipulator
After vacuum chuck adsorbs wafer, the mode taken out from wafer cassette.
Currently, detection wafer adsorption and the mode being in place are detection vacuum pressure value.And such mode is to air pressure
More demanding, the slight fluctuations of air-flow this may result in detection mistake sometimes.
Therefore, it is necessary to design the absorption of the new wafer of one kind and be in place detection device, effectively to prevent due to air-flow
The error detection of fluctuation and generation.
Utility model content
The purpose of the utility model is to overcome drawbacks described above of the existing technology, a kind of absorption of wafer is provided and is put
Level detecting apparatus is set, whether there is or not adsorb and be in place with accurate efficient detection wafer.
To achieve the above object, the technical solution of the utility model is as follows:
A kind of absorption of wafer and it is in place detection device, comprising: first detection unit and second detection unit, it is described
First detection unit and second detection unit are divided into the two sides of the sucker, also, the first detection unit is set to relatively
The first height and position in the sucker suction face, the second detection unit are set to second relative to the sucker suction face
Height and position, second height are greater than first height；Wherein, the first detection unit is for individually detecting wafer
It is no by the sucker suction in place, the first detection unit is also used to cooperatively detect wafer with the second detection unit
By when the sucker suction whether in place and inclination and wafer whether completely disengage the sucker.
Further, the first detection unit and second detection unit are proximity sensor.
Further, the first detection unit is short distance detection proximity sensor, and the second detection unit is length
Distance detection proximity sensor.
Further, the ranging range of the long range detection proximity sensor is greater than the short distance detection close to sensing
The ranging range of device.
Further, the first detection unit and second detection unit are symmetrically positioned in the center two sides of the sucker.
Further, further includes: the judging unit for connecting the first detection unit and second detection unit, when the suction
Disk is when adsorbing wafer, the detection signal that the judging unit is issued according to the first detection unit, judge wafer whether by
The sucker suction is in place；When the sucker suction to wafer and when raising carrying, the judging unit is according to first inspection
The detection signal that survey unit and second detection unit issue jointly, judges whether wafer adsorbs in place and tilt；When the sucker
When wafer is placed in decline, the judging unit is believed according to the detection that the first detection unit and second detection unit issue jointly
Number, judge whether wafer completely disengages the sucker.
Further, the sucker connects mechanical arm.
Further, the sucker is rotatablely connected the mechanical arm by flange fixed block.
Further, the flange fixed block is rotatablely connected the mechanical arm by flange.
Further, the mechanical arm connects robot control system.
It can be seen from the above technical proposal that the proximity sensor that the utility model is different by two detecting distances of installation
Wafer is detected whether there is or not adsorbing and being in place, wherein short distance detection proximity sensor is used to detect and serve as a contrast in sucker suction wafer
Whether there is or not absorption when bottom in place；When sucker suction wafer is raised, two sensors detect wafer simultaneously, and whether there is or not adsorb in place, if has
Offset；When sucker places wafer, wafer is detected whether there is or not sucker is completely disengaged simultaneously by two sensors, has thus reached accurate
Efficient detection, entire detection device picks and places to carry to play efficiently precisely indifference in wafer and detect in semiconductor automation to be made
With.
Detailed description of the invention
Fig. 1 be a kind of absorption of wafer of one preferred embodiment of the utility model and be in place structure of the detecting device signal
Figure.
Specific embodiment
With reference to the accompanying drawing, specific embodiment of the present utility model is described in further detail.
It should be noted that in following specific embodiments, when the embodiments of the present invention is described in detail, in order to
The structure of the utility model is clearly showed that in order to illustrate, spy does not draw to the structure in attached drawing according to general proportion, goes forward side by side
Gone partial enlargement, deformation and simplify processing, therefore, should be avoided in this, as the restriction to the utility model to understand.
In following specific embodiment of the present utility model, referring to FIG. 1, Fig. 1 is that the utility model one is preferably implemented
Example a kind of wafer absorption and be in place structure of the detecting device schematic diagram.As shown in Figure 1, a kind of wafer of the utility model
Absorption and be in place detection device, comprising: the first detection unit 1 and second detection unit 2 being mounted in robot.
Please refer to Fig. 1.Mechanical arm is provided in robot；Mechanical arm passes through 6 connecting flange fixed block 5 of flange, method
The front end of blue fixed block 5 is equipped with sucker 3.To which sucker 3 can realize three-dimensional motion and suction under robot control system manipulation
Overgrowth circle 4, so that wafer 4 is carried to another station from a station.
Please refer to Fig. 1.First detection unit 1 and second detection unit 2 can be separately mounted to the left and right two of diagram sucker 3
Side；For example, first detection unit 1 and second detection unit 2 can be symmetrically positioned in the center two sides of sucker 3, it is arranged in diagonal state.
First detection unit 1 and second detection unit 2 can be vertically mounted on the front end two of flange fixed block 5 by connecting bracket respectively
Side.The detection direction of first detection unit 1 and second detection unit 2 is consistent with the absorption direction of sucker 3.
First detection unit 1 is set to the first height and position relative to 3 adsorption plane of sucker, and second detection unit 2 is set to phase
For the second height and position of 3 adsorption plane of sucker, also, the second height is greater than the first height.That is the installation of second detection unit 2
Highly (second height) mounting height (the first height) for being greater than first detection unit 1.
Wherein, first detection unit 1 is used to individually detect whether wafer 4 is adsorbed in place by sucker 3；Also, the first detection
Unit 1 be also used to cooperatively detect with second detection unit 2 wafer 4 by sucker 3 adsorb when whether in place and inclination, Yi Jijing
Whether circle 4 completely disengages sucker 3.
As a preferred embodiment, proximity sensor is can be used in first detection unit 1 and second detection unit 2.
Further, first detection unit 1 can be a short distance detection proximity sensor 1, and second detection unit 2
It can be a detection proximity sensor 2 over long distances.Wherein, the ranging range of detection proximity sensor 2 over long distances is greater than short distance
Ranging range from detection proximity sensor 1.
Please refer to Fig. 1.First detection unit 1 and second detection unit 2 are also connected with judging unit (figure omits).
When sucker 3 is when adsorbing wafer 4, wafer 4 can be detected by short distance detection proximity sensor 1, and whether there is or not be adsorbed onto
Position；The detection signal that judging unit can be issued according to short distance detection proximity sensor 1, judges whether wafer 4 is adsorbed by sucker 3
In place.
When sucker 3 is adsorbed onto wafer 4 and raises carrying, can be connect by short distance detection proximity sensor and over long distances detection
Nearly sensor 2 detects wafer 4 simultaneously, and whether there is or not adsorb in place and tilt；Judging unit is according to short distance detection proximity sensor 1
The detection signal issued jointly with long range detection proximity sensor 2, judges whether wafer 4 adsorbs in place and tilt.
When sucker 3, which declines, places wafer 4, can equally be detected by short distance detection proximity sensor 1 and over long distances close
To detect 4 wafer 4 of wafer, whether there is or not completely disengage sucker 3 simultaneously for sensor 2；Judging unit is according to short distance detection proximity sensor
The 1 detection signal issued jointly with detection proximity sensor 2 over long distances, judges whether wafer 4 completely disengages sucker 3.
By the device in the form of the dual sensor of different detecting distances and diagonal pose pattern, can precisely efficient detection to suction
Disk is adsorbing, and in transport and placement process, whether there is or not precisely in place for wafer.
In conclusion the utility model detected by the different proximity sensor of two detecting distances of installation wafer whether there is or not
It adsorbs and is in place, wherein whether there is or not be adsorbed onto for detecting in sucker suction wafer substrate for short distance detection proximity sensor
Position；When sucker suction wafer is raised, two sensors detect wafer simultaneously, and whether there is or not adsorb in place, if offsets；Sucker is placed
When wafer, wafer is detected whether there is or not sucker is completely disengaged simultaneously by two sensors, has thus reached accurate efficient detection, entirely
Detection device picks and places to carry in semiconductor automation plays the role of efficiently precisely indifference detection in wafer.
Above is only the preferred embodiment of the utility model, and embodiment is not to protect to limit the patent of the utility model
Range is protected, therefore equivalent structure made by all specifications and accompanying drawing content with the utility model changes, and should all similarly wrap
Containing within the protection scope of the present utility model.
Claims (10)
1. a kind of absorption of wafer and being in place detection device characterized by comprising first detection unit and the second detection
Unit, the first detection unit and second detection unit are divided into the two sides of sucker, also, the first detection unit is set to
Relative to first height and position in the sucker suction face, the second detection unit is set to relative to the sucker suction face
Second height and position, second height are greater than first height；Wherein, the first detection unit is brilliant for individually detecting
Circle whether by the sucker suction in place, the first detection unit is also used to cooperatively detect with the second detection unit
Wafer by when the sucker suction whether in place and inclination and wafer whether completely disengage the sucker.
2. the absorption of wafer according to claim 1 and being in place detection device, which is characterized in that first detection
Unit and second detection unit are proximity sensor.
3. the absorption of wafer according to claim 1 and being in place detection device, which is characterized in that first detection
Unit is short distance detection proximity sensor, and the second detection unit is to detect proximity sensor over long distances.
4. the absorption of wafer according to claim 3 and being in place detection device, which is characterized in that the long range inspection
The ranging range for surveying proximity sensor is greater than the ranging range of the short distance detection proximity sensor.
5. the absorption of wafer according to claim 1 and being in place detection device, which is characterized in that first detection
Unit and second detection unit are symmetrically positioned in the center two sides of the sucker.
6. the absorption of -5 any wafers and being in place detection device according to claim 1, which is characterized in that also wrap
It includes: connecting the judging unit of the first detection unit and second detection unit, it is described to sentence when the sucker is when adsorbing wafer
The detection signal that disconnected unit is issued according to the first detection unit, judge wafer whether by the sucker suction in place；Work as institute
Sucker suction is stated to wafer and when raising carrying, the judging unit is total according to the first detection unit and second detection unit
With the detection signal issued, judge whether wafer adsorbs in place and tilt；When the sucker, which declines, places wafer, the judgement
The detection signal that unit issues jointly according to the first detection unit and second detection unit, judges whether wafer completely disengages
The sucker.
7. the absorption of wafer according to claim 1 and being in place detection device, which is characterized in that the sucker connection
Mechanical arm.
8. the absorption of wafer according to claim 7 and being in place detection device, which is characterized in that the sucker passes through
Flange fixed block is rotatablely connected the mechanical arm.
9. the absorption of wafer according to claim 8 and being in place detection device, which is characterized in that the flange is fixed
Block is rotatablely connected the mechanical arm by flange.
10. the absorption of wafer according to claim 9 and being in place detection device, which is characterized in that the manipulator
Arm connects robot control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920089195.XU CN209544285U (en) | 2019-01-18 | 2019-01-18 | A kind of absorption of wafer and it is in place detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920089195.XU CN209544285U (en) | 2019-01-18 | 2019-01-18 | A kind of absorption of wafer and it is in place detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209544285U true CN209544285U (en) | 2019-10-25 |
Family
ID=68270363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920089195.XU Active CN209544285U (en) | 2019-01-18 | 2019-01-18 | A kind of absorption of wafer and it is in place detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209544285U (en) |
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2019
- 2019-01-18 CN CN201920089195.XU patent/CN209544285U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 201702 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee after: Shanghai Forsyte Robot Co.,Ltd. Address before: Room 305-308, Kaike International Building, Area A, 1801 Hongmei Road, Xuhui District, Shanghai, 2003 Patentee before: SHANGHAI FORESIGHT ROBOTICS Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 201712 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee after: Shanghai Fosaite Technology Co.,Ltd. Country or region after: China Address before: 201702 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee before: Shanghai Forsyte Robot Co.,Ltd. Country or region before: China |
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| CP03 | Change of name, title or address |