CN209526111U - Semiconductor temperature-lowering device - Google Patents
Semiconductor temperature-lowering device Download PDFInfo
- Publication number
- CN209526111U CN209526111U CN201920324721.6U CN201920324721U CN209526111U CN 209526111 U CN209526111 U CN 209526111U CN 201920324721 U CN201920324721 U CN 201920324721U CN 209526111 U CN209526111 U CN 209526111U
- Authority
- CN
- China
- Prior art keywords
- shell
- semiconductor chip
- semiconductor
- lowering device
- water tubes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 238000007789 sealing Methods 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 abstract description 9
- 238000007664 blowing Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000013475 authorization Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of semiconductor temperature-lowering devices, including shell, the bottom of the shell inner cavity is fixedly installed with semiconductor chip carrier, the surface of the semiconductor chip carrier is equipped with semiconductor chip, the side of the shell is communicated with water inlet pipe, the outer sheath of the semiconductor chip is equipped with rectangular water tubes, one end of the water inlet pipe extends into the inside of shell and is connected to the side of rectangular water tubes, the other side of the rectangular water tubes is communicated with outlet pipe, the outlet pipe runs through far from one end of rectangular water tubes and extends to the outside of shell, the two sides of the shell are respectively equipped with opposite air inlet and exhaust outlet.The utility model carries out convection current by the way that the wind that exhaust fan is fanned out to by multiple baffles is arranged, wind is extended in the residence time of semiconductor chip surface, improve radiating efficiency, by the way that filter screen is arranged, impurity is foreclosed the outside of shell, impurity is avoided and enters the case where interior of shell causes semiconductor chip working efficiency to reduce.
Description
Technical field
The utility model relates to semiconductor cooling equipment technical field more particularly to a kind of semiconductor temperature-lowering devices.
Background technique
Semiconductor refers to that a kind of electric conductivity can be controlled, and range can be from insulator to the material between conductor.No matter from section
From the perspective of skill or economic development, the importance of semiconductor be all it is very huge, during semiconductor refrigerating hot end dissipate
The quality of hot mode will directly affect the refrigeration performance of semiconductor cooler.The temperature difference of hot and cold side has very big shadow to the transmitting of heat
It rings, if both ends heat dissipation effect is bad, will lead to temperature difference increase, to reduce the refrigerating capacity of semiconductor refrigeration system, semiconductor
When refrigeration system works, heat constantly passes to hot end from cold end, and the heat in hot end is only drained in time, and hot and cold side is just able to maintain
The lesser temperature difference, cold end could continue to freeze, therefore it is critically important for semiconductor working efficiency to cool down.
Chinese utility model patent, Authorization Notice No. CN206992098U disclose a kind of semiconductor-type cooling device, lead to
Interior of shell can be injected into for cooling water by crossing setting water inlet pipe, make semiconductor chip outer surface by setting rectangular duct
Surrounding can carry out water cooling, reduce the temperature of semiconductor chip outer surface, thus extend semiconductor chip use the longevity
Life, it is air-cooled by setting radiator fan progress, distribute the temperature of interior of shell from heat release hole, but the device exists
Wind direction is straight-through in ventilation process, and the residence time of wind is short, and radiating efficiency is poor, and impurity is easy to enter from heat release hole when ventilation,
Cause interior of shell dirty, influence semiconductor working efficiency, the installation process of cover board is complicated, and work effect is reduced in certain situation
Rate.
Utility model content
The utility model is intended to solve at least some of the technical problems in related technologies.For this purpose, this reality
It is to propose a kind of semiconductor temperature-lowering device with a novel purpose, good heat dissipation effect, work efficiency is high.
According to a kind of semiconductor temperature-lowering device of the utility model embodiment, including shell, the bottom of the shell inner cavity
It is fixedly installed with semiconductor chip carrier, the surface of the semiconductor chip carrier is equipped with semiconductor chip, and the side of the shell connects
It is connected with water inlet pipe, the outer sheath of the semiconductor chip is equipped with rectangular water tubes, and one end of the water inlet pipe extends into the interior of shell
Portion is simultaneously connected to the side of rectangular water tubes, and the other side of the rectangular water tubes is communicated with outlet pipe, and the outlet pipe is far from rectangle
The outside of shell is run through and extended in one end of water pipe, and the two sides of the shell are respectively equipped with opposite air inlet and exhaust outlet,
Several baffles are removably connected on the inner sidewall of the shell, and air inlet is interspersed up and down in parallel, wind outlet is in loudspeaker
Shape, the baffle above semiconductor chip are tilted to direction of air outlet, and the top of the shell is equipped with sealing cover, described outer
Shell top open part is equipped with groove compatible with sealing cover.
Preferably, the housing interior side-wall is equipped with exhaust fan close to the side of air inlet, and the outside of the exhaust fan is equipped with
Protective cover.
Preferably, the outer side of shell is equipped with filter screen close to the side of air inlet, and the filter screen is bolted
On the lateral wall of shell.
Preferably, it is connected by quick coupling between the water inlet pipe and outlet pipe and rectangular water tubes.
Preferably, the top surface of the semiconductor chip is equipped with radiating fin, and is located at the baffle above semiconductor chip
Inclination angle be 45 ° -75 ° between.
Preferably, the top of the sealing cover is equipped with handle, and the sealing cover and shell contact position are equipped with sealing ring.
Preferably, the filter screen is activated charcoal strainer.
Beneficial effect in the utility model is: carrying out convection current by the way that the wind that exhaust fan is fanned out to by multiple baffles is arranged, prolongs
Wind has been grown in the residence time of semiconductor chip surface, has improved radiating efficiency, and by the way that filter screen is arranged, impurity has been foreclosed
The outside of shell avoids impurity and enters the case where interior of shell causes semiconductor chip working efficiency to reduce, sealed by setting
Lid directly covers shell, at work, by forming positive and negative pressure inside and outside exhaust fan blowing shell, sealing cover is compressed, is avoided
Complicated operation sequence, improves installation effectiveness.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 be the utility model proposes a kind of semiconductor temperature-lowering device structural schematic diagram；
Fig. 2 be the utility model proposes the rectangular water tubes of semiconductor temperature-lowering device a kind of, water inlet pipe, outlet pipe connection show
It is intended to.
In figure: 1 shell, 2 semiconductor chip carriers, 3 semiconductor chips, 4 water inlet pipes, 5 rectangular water tubes, 6 outlet pipes, 7 air inlets
It is mouth, 8 baffles, 9 sealing covers, 10 air outlets, 11 exhaust fans, 12 filter screens, 13 quick couplings, 14 radiating fins, 15 handles, 16 close
Seal.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
Examples of the embodiments are shown in the accompanying drawings, and in which the same or similar labels are throughly indicated identical or classes
As element or element with the same or similar functions.The embodiments described below with reference to the accompanying drawings are exemplary, purport
It is being used to explain the utility model, and should not be understood as limiting the present invention.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " suitable
The orientation or positional relationship of the instructions such as hour hands ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " is orientation based on the figure
Or positional relationship, be merely for convenience of describing the present invention and simplifying the description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limit to the utility model
System.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
Referring to Fig.1-2, a kind of semiconductor temperature-lowering device, including shell 1, the bottom of 1 inner cavity of shell, which is fixedly installed with, partly leads
The surface of body chip carrier 2, semiconductor chip carrier 2 is equipped with semiconductor chip 3, and the side of shell 1 is communicated with water inlet pipe 4, semiconductor
The outer sheath of chip 3 is equipped with rectangular water tubes 5, and one end of water inlet pipe 4 extends into the inside of shell 1 and the side with rectangular water tubes 5
Connection, the other side of rectangular water tubes 5 are communicated with outlet pipe 6, and outlet pipe 6 runs through far from one end of rectangular water tubes 5 and extends to outer
The outside of shell 1, the two sides of shell 1 are respectively equipped with opposite air inlet 7 and exhaust outlet 10, detachably connect on the inner sidewall of shell 1
Several baffles 8 are connected to, and air inlet is interspersed up and down in parallel, wind outlet is in horn-like, above semiconductor chip 3
Baffle 8 is tilted to direction of air outlet, and the top of shell 1 is equipped with sealing cover 9, and 1 top open part of shell is equipped with suitable with 9 phase of sealing cover
The groove matched.
1 inner sidewall of shell is equipped with exhaust fan 11 close to the side of air inlet 7, provides better wind energy, exhaust fan for heat dissipation
11 outside is equipped with protective cover 12, preferably protects exhaust fan 11.
1 outside of shell is equipped with filter screen 12 close to the side of air inlet 7, outside by the impurity discharge in air when blowing,
Prevent impurity from entering inside shell 1, filter screen 12 is bolted on the lateral wall of shell 1, facilitates filter screen 12
Replacement.
It is connected by quick coupling 13 between water inlet pipe 4 and outlet pipe 6 and rectangular water tubes, facilitates the replacement of water pipe.
The top surface of semiconductor chip 3 is equipped with radiating fin 14, improves radiating efficiency, and is located at 3 top of semiconductor chip
The inclination angle of baffle 8 be to further improve air quantity between 45 ° -75 ° in the residence time on 3 surface of semiconductor chip, improve
Radiating efficiency.
The top of sealing cover 9 is equipped with handle 15, and when power cut-off, the inside of shell 1 is identical as external pressure, can be direct
Sealing cover 15 is lifted by handle 15, easy to operate, sealing cover 9 and 1 contact position of shell are equipped with sealing ring 16, improve shell 1
Air-tightness.
Filter screen 12 is activated charcoal strainer, and internal component work is caused in the inside for preventing wet air from entering shell 1
It fails, extends the service life of internal component.
In conclusion the semiconductor temperature-lowering device, carried out pair by the way that the wind that exhaust fan 11 is fanned out to by multiple baffles 8 is arranged
Stream, extends wind in the residence time on 3 surface of semiconductor chip, improves radiating efficiency, by the way that filter screen 12 is arranged, by impurity
Foreclose the outside of shell 1, avoids impurity and enters inside shell 1 the case where causing 3 working efficiency of semiconductor chip to reduce, leads to
It crosses setting sealing cover 9 and directly covers shell 1, it at work, will by forming positive and negative pressure inside and outside the blowing shell 1 of exhaust fan 11
Sealing cover 9 compresses, and avoids complicated operation sequence, improves installation effectiveness.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
Stating may not refer to the same embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be
It can be combined in any suitable manner in any one or more embodiment or examples.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (7)
1. a kind of semiconductor temperature-lowering device, including shell, the bottom of the shell inner cavity is fixedly installed with semiconductor chip carrier, institute
The surface for stating semiconductor chip carrier is equipped with semiconductor chip, and the side of the shell is communicated with water inlet pipe, the semiconductor chip
Outer sheath rectangular water tubes are housed, one end of the water inlet pipe extends into the inside of shell and is connected to the side of rectangular water tubes,
The other side of the rectangular water tubes is communicated with outlet pipe, and the outlet pipe runs through far from one end of rectangular water tubes and extends to shell
Outside, the two sides of the shell are respectively equipped with opposite air inlet and exhaust outlet, it is characterised in that: the inner sidewall of the shell
On be removably connected with several baffles, and air inlet is interspersed up and down in parallel, wind outlet is in horn-like, is located at semiconductor core
Baffle above piece is tilted to direction of air outlet, and the top of the shell is equipped with sealing cover, and the cover top portion opening is equipped with
Groove compatible with sealing cover.
2. semiconductor temperature-lowering device according to claim 1, it is characterised in that: the housing interior side-wall is close to air inlet
Side is equipped with exhaust fan, and the outside of the exhaust fan is equipped with protective cover.
3. semiconductor temperature-lowering device according to claim 1, it is characterised in that: the outer side of shell close to air inlet one
Side is equipped with filter screen, and the filter screen is bolted on the lateral wall of shell.
4. semiconductor temperature-lowering device according to claim 1, it is characterised in that: the water inlet pipe and outlet pipe and rectangle water
It is connected by quick coupling between pipe.
5. semiconductor temperature-lowering device according to claim 1, it is characterised in that: the top surface of the semiconductor chip is equipped with
Radiating fin, and the inclination angle for being located at the baffle above semiconductor chip is between 45 ° -75 °.
6. semiconductor temperature-lowering device according to claim 1, it is characterised in that: the top of the sealing cover is equipped with handle,
The sealing cover and shell contact position are equipped with sealing ring.
7. semiconductor temperature-lowering device according to claim 3, it is characterised in that: the filter screen is activated charcoal strainer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920324721.6U CN209526111U (en) | 2019-03-14 | 2019-03-14 | Semiconductor temperature-lowering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920324721.6U CN209526111U (en) | 2019-03-14 | 2019-03-14 | Semiconductor temperature-lowering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209526111U true CN209526111U (en) | 2019-10-22 |
Family
ID=68232418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920324721.6U Expired - Fee Related CN209526111U (en) | 2019-03-14 | 2019-03-14 | Semiconductor temperature-lowering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209526111U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112382468A (en) * | 2020-11-04 | 2021-02-19 | 广东电网有限责任公司 | Air online cooling device and cooling method for large-current transformer |
-
2019
- 2019-03-14 CN CN201920324721.6U patent/CN209526111U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112382468A (en) * | 2020-11-04 | 2021-02-19 | 广东电网有限责任公司 | Air online cooling device and cooling method for large-current transformer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191022 |