CN209517844U - 一种功率单元散热结构 - Google Patents
一种功率单元散热结构 Download PDFInfo
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- CN209517844U CN209517844U CN201920009337.7U CN201920009337U CN209517844U CN 209517844 U CN209517844 U CN 209517844U CN 201920009337 U CN201920009337 U CN 201920009337U CN 209517844 U CN209517844 U CN 209517844U
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- Prior art keywords
- bottom plate
- power cell
- opening
- water
- radiator structure
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- 239000003990 capacitor Substances 0.000 claims abstract description 33
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 239000000498 cooling water Substances 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 239000004519 grease Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920009337.7U CN209517844U (zh) | 2019-01-03 | 2019-01-03 | 一种功率单元散热结构 |
Applications Claiming Priority (1)
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CN201920009337.7U CN209517844U (zh) | 2019-01-03 | 2019-01-03 | 一种功率单元散热结构 |
Publications (1)
Publication Number | Publication Date |
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CN209517844U true CN209517844U (zh) | 2019-10-18 |
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CN201920009337.7U Active CN209517844U (zh) | 2019-01-03 | 2019-01-03 | 一种功率单元散热结构 |
Country Status (1)
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CN (1) | CN209517844U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111988954A (zh) * | 2020-07-13 | 2020-11-24 | 北京理工大学 | 一种用于电动汽车驱动电机控制器的液冷式散热系统 |
CN115038312A (zh) * | 2022-06-24 | 2022-09-09 | 中国第一汽车股份有限公司 | 电机控制器的功率封装模块 |
-
2019
- 2019-01-03 CN CN201920009337.7U patent/CN209517844U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111988954A (zh) * | 2020-07-13 | 2020-11-24 | 北京理工大学 | 一种用于电动汽车驱动电机控制器的液冷式散热系统 |
CN115038312A (zh) * | 2022-06-24 | 2022-09-09 | 中国第一汽车股份有限公司 | 电机控制器的功率封装模块 |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A heat dissipation structure of power unit Effective date of registration: 20210126 Granted publication date: 20191018 Pledgee: Bank of Shanghai Limited by Share Ltd. Pudong branch Pledgor: SHANGHAI YINGHENG ELECTRONIC Co.,Ltd. Registration number: Y2021310000004 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231010 Granted publication date: 20191018 Pledgee: Bank of Shanghai Limited by Share Ltd. Pudong branch Pledgor: SHANGHAI YINGHENG ELECTRONIC Co.,Ltd. Registration number: Y2021310000004 |