CN209512622U - Squeeze inner fin intercooler chip body - Google Patents
Squeeze inner fin intercooler chip body Download PDFInfo
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- CN209512622U CN209512622U CN201821911020.4U CN201821911020U CN209512622U CN 209512622 U CN209512622 U CN 209512622U CN 201821911020 U CN201821911020 U CN 201821911020U CN 209512622 U CN209512622 U CN 209512622U
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- heat
- spoiler
- font
- dissipating pipe
- inner fin
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Abstract
A kind of extruding inner fin intercooler chip body, including two pieces of mainboards, the two sides up and down of two pieces of mainboards are equipped with one block of side plate, several heat-dissipating pipes are equipped between two pieces of mainboards, the heat-dissipating pipe is equipped with outer fin, several groups " V " font spoiler is equipped in the heat-dissipating pipe, the upper and lower ends of " V " the font spoiler are connected with the inner wall of two sides up and down of heat-dissipating pipe respectively；The utility model increases several groups " V " font spoiler in the inner cavity of former heat-dissipating pipe, the quantity of " V " font spoiler is adjusted accordingly according to the width of heat-dissipating pipe, heat-dissipating pipe and " V " font spoiler integrally produce and process out by extrusion die, it is not required in addition place inner fin in heat-dissipating pipe, is also not required to worry the Welding Problems of inner fin and heat-dissipating pipe；Have the advantages that structure is simple, soldering processes requirement is low, simple production process, production cost are low etc..
Description
Technical field
The utility model relates to a kind of intercooler chip body, in particular to a kind of extruding inner fin intercooler chip body.
Background technique
Conventional inner fin structure intercooler inner fin processing technology is complicated in the market, and process equipment specificity is strong.And tradition
Inner fin structure intercooler is very high to brazing requirements, and the machining accuracy cooperation of inner fin and heat-dissipating pipe is even more need to be tally in every detail,
It is also very difficult in heat-dissipating pipe that inner fin is packed into, and blocking also easily occur influences the flowing of interiors of products air, and failure welding is just when soldering
It will appear product heat-dissipating pipe Decrepitation Phenomena in use.
Summary of the invention
Utility model aims to solve the deficiencies in the prior art, the utility model provide a kind of structure it is simple,
The extruding inner fin intercooler chip body that soldering processes requirement is low, simple production process, production cost are low.
The technical scheme adopted by the utility model to solve the technical problem is as follows: a kind of extruding inner fin intercooler chip body,
Including two pieces of mainboards, the two sides up and down of two pieces of mainboards are equipped with one block of side plate, are equipped with several between two pieces of mainboards
Heat-dissipating pipe, the heat-dissipating pipe are equipped with outer fin, are equipped with several groups " V " font spoiler, " V " font in the heat-dissipating pipe
The upper and lower ends of spoiler are connected with the inner wall of two sides up and down of heat-dissipating pipe respectively.
Preferably, " V " the font spoiler with a thickness of 0.2mm~0.4mm, " V " font described in two adjacent groups is disturbed
The spacing of flow is 3.0mm~5.0mm.
Preferably, " V " the font spoiler with a thickness of 0.3mm, between " V " font spoiler described in two adjacent groups
Away from for 4.0mm.
Preferably, the heat-dissipating pipe is integrally machined with " V " font spoiler by extrusion process.
The utility model increases several groups " V " font spoiler in the inner cavity of former heat-dissipating pipe, and " V " font in inner cavity is disturbed
Flow with a thickness of 0.3mm, the quantity of " V " font spoiler is adjusted accordingly according to the width of heat-dissipating pipe, two adjacent groups " V "
The spacing of font spoiler integrally produces and processes out in 4mm or so, heat-dissipating pipe and " V " font spoiler by extrusion die,
It is not required in addition place inner fin in heat-dissipating pipe, is also not required to worry the Welding Problems of inner fin and heat-dissipating pipe；Simple with structure,
The advantages such as soldering processes requirement is low, simple production process, production cost are low.
Detailed description of the invention
Fig. 1 is a kind of main view of the utility model embodiment；
Fig. 2 is a kind of side view of the utility model embodiment；
Fig. 3 is enlarged drawing at the K of the utility model Fig. 2.
Specific embodiment
Below by specific embodiment, and in conjunction with attached drawing, the technical solution of the utility model is made further specifically
It is bright.
Embodiment:
A kind of extruding inner fin intercooler chip body as shown in Figure 1 to Figure 3, including two pieces of mainboards 1, two pieces of mainboards 1
Two sides up and down be equipped with one block of side plate 2, several heat-dissipating pipes 3 are equipped between two pieces of mainboards 1, are set on the heat-dissipating pipe 3
There is outer fin 4, is equipped with several groups " V " font spoiler 5, the upper and lower ends of " V " the font spoiler 5 in the heat-dissipating pipe 3
Be connected respectively with the inner wall of two sides up and down of heat-dissipating pipe 3, " V " the font spoiler 5 with a thickness of 0.3mm, two adjacent groups institute
The spacing for stating " V " font spoiler 5 is 4.0mm, and the heat-dissipating pipe 3 is integrally machined with " V " font spoiler 5 by extrusion process
It forms.
The utility model increases several groups " V " font spoiler 5, " V " font in inner cavity in the inner cavity of former heat-dissipating pipe 3
Spoiler 5 with a thickness of 0.3mm, the quantity of " V " font spoiler 5 is adjusted accordingly according to the width of heat-dissipating pipe 3, adjacent two
In 4mm or so, heat-dissipating pipe 3 and " V " font spoiler 5, by extrusion die, integrally production adds the spacing of group " V " font spoiler 5
Work comes out, and is not required in addition place inner fin in heat-dissipating pipe 3, is also not required to worry the Welding Problems of inner fin and heat-dissipating pipe 3；Have
The advantages such as structure is simple, soldering processes requirement is low, simple production process, production cost are low.
Embodiment described above is a kind of preferable scheme of the utility model, is not made to the utility model any
Formal limitation, there are also other variations and modifications on the premise of not exceeding the technical scheme recorded in the claims.
Claims (4)
1. a kind of extruding inner fin intercooler chip body, including two pieces of mainboards (1), the two sides up and down of two pieces of mainboards (1) are all provided with
There is one piece of side plate (2), several heat-dissipating pipes (3) are equipped between two pieces of mainboards (1), the heat-dissipating pipe (3) is equipped with outer wing
Piece (4), it is characterised in that: several groups " V " font spoiler (5), " V " the font spoiler are equipped in the heat-dissipating pipe (3)
(5) upper and lower ends are connected with the inner wall of two sides up and down of heat-dissipating pipe (3) respectively.
2. extruding inner fin intercooler chip body according to claim 1, it is characterised in that: " V " the font spoiler (5)
With a thickness of 0.2mm~0.4mm, the spacing of " V " font spoiler (5) described in two adjacent groups is 3.0mm~5.0mm.
3. extruding inner fin intercooler chip body according to claim 2, it is characterised in that: " V " the font spoiler (5)
With a thickness of 0.3mm, the spacing of " V " font spoiler (5) described in two adjacent groups is 4.0mm.
4. extruding inner fin intercooler chip body according to claim 1, it is characterised in that: the heat-dissipating pipe (3) and " V " word
Type spoiler (5) is integrally machined by extrusion process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821911020.4U CN209512622U (en) | 2018-11-20 | 2018-11-20 | Squeeze inner fin intercooler chip body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821911020.4U CN209512622U (en) | 2018-11-20 | 2018-11-20 | Squeeze inner fin intercooler chip body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209512622U true CN209512622U (en) | 2019-10-18 |
Family
ID=68189964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821911020.4U Active CN209512622U (en) | 2018-11-20 | 2018-11-20 | Squeeze inner fin intercooler chip body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209512622U (en) |
-
2018
- 2018-11-20 CN CN201821911020.4U patent/CN209512622U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Squeeze inner fin intercooler chip body Effective date of registration: 20191230 Granted publication date: 20191018 Pledgee: Wenzhou Ruian sub branch of Shanghai Pudong Development Bank Co., Ltd Pledgor: ZHEJIANG A-STAR COOLING CO., LTD. Registration number: Y2019330000413 |