CN209472775U - The micro- heating plate of ceramics of multilayer beam type structure - Google Patents
The micro- heating plate of ceramics of multilayer beam type structure Download PDFInfo
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- CN209472775U CN209472775U CN201822238724.6U CN201822238724U CN209472775U CN 209472775 U CN209472775 U CN 209472775U CN 201822238724 U CN201822238724 U CN 201822238724U CN 209472775 U CN209472775 U CN 209472775U
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Abstract
The utility model discloses a kind of micro- heating plates of ceramics of multilayer beam type structure, it includes the insulating ceramic layer stacked gradually, heating layer, thermally conductive insulating layer and test electrode layer, and it is also formed in the micro- heating plate of ceramics and sequentially passes through the test electrode layer, thermally conductive insulating layer, the groove-like structure of heating layer and insulating ceramic layer, make the micro- heating plate of ceramics that there is cantilever beam heat insulation structural.The micro- heating plate of ceramics provided by the utility model it is simple and strong in structure, heating properties are good, high reliablity, and structural stability is good, can be in hot operation, long service life, while its preparation process is simple to operation, controllability is good, and high-precision processing may be implemented, be adapted for industrialized production.
Description
Technical field
The utility model relates to a kind of micro- heating plate, in particular to the micro- heating plate of ceramics of a kind of multilayer beam type structure and its
Production method belongs to semiconductor technical field of micro and nano fabrication.
Background technique
Gas sensor mainly has semiconductor-type, electric chemical formula, catalytic combustion type etc. several at this stage, wherein semiconductor-type
The most practical a kind of gas sensor of gas sensor.It has it is low in cost, be simple to manufacture, high sensitivity, fast response time,
The advantages that service life is long, and circuit low to humidity sensitive is simple.Especially MEMS gas sensor, it is low in energy consumption with its, it is small in size, easily
The advantages that integrated, obtains very big application in recent years.Mature semiconductor-type gas sensor is using micro- heating plate as base at present
Plinth coats sensitive material above it, and sensitive material is made to work at a certain temperature, and semiconductor-type gas sensor may be implemented
Works fine.
Currently used micro- heating plate is mainly based on silicon base or ceramic bases.Wherein the micro- heating plate of silicon substrate is mainly with outstanding
Based on hollow structure, body of overleaf beginning to speak, surface silicon nitride, silica form composite layer, for insulation and thermal insulation layer.For example,
There is researcher to carry out the research of micro- heating plate using SOI silicon as substrate.But that there are yields is low for the current micro- heating plate of silicon substrate MEMS,
It is difficult to the shortcomings that resistant to high temperatures, support film is easily damaged etc..And ceramic bases are mainly used for traditional high temperature sensitive material
Material is heated, and relative volume is larger, for the more of traditional gas sensor.The preparation of the currently used micro- heating plate of ceramics
Technique approximately as: on the ceramics sintered, upper metal heating layer is being deposited above in the way of coating, then again to burn
The mode of knot makes metal heating layer form heating structure；Alternatively, on a ceramic substrate by photoetching, sputtering in the way of, realize
The building of metal heating layer.For example, there is researcher first to form heating layer in a manner of photoetching, sputtering, then heated with laser
Mode form heat-insulated beam.There are probelem in two aspects for such structure, it may be assumed that the on the one hand deposition hot layer gold directly on ceramics
Belong to, will affect its binding force；On the other hand, directly cutting hard ceramics in laser is, is easy to form micro-structure and damage, thus shadow
The yield of Chinese percussion instrument part.
Summary of the invention
The main purpose of the utility model is to provide a kind of micro- heating plate of ceramics of multilayer beam type structure, manufacture crafts
Simply, it can work at high temperature, long service life, to overcome the deficiencies in the prior art.
The another object of the utility model is to provide a kind of micro- heating plate of ceramics for making the multilayer beam type structure
Method.
For realization aforementioned invention purpose, the technical solution adopted in the utility model includes:
The utility model embodiment provides a kind of micro- heating plate of ceramics of multilayer beam type structure comprising stacks gradually
Insulating ceramic layer, heating layer, thermally conductive insulating layer and test electrode layer, and be also formed in the micro- heating plate of ceramics and successively pass through
The test electrode layer, thermally conductive insulating layer, the groove-like structure of heating layer and insulating ceramic layer are worn, the micro- heating plate tool of the ceramics is made
There is cantilever beam heat insulation structural.
In some embodiments, the micro- heating plate of ceramics includes workspace and braced frame area, and the work is distinguished
For cloth in braced frame area, the groove-like structure is annular groove and around being set to around workspace, the workspace and support
It is connected between framework region through cantilever beam.
In some embodiments, the insulating ceramic layer, heating layer, thermally conductive insulating layer and test electrode layer are sintered to
One
The utility model embodiment additionally provides a kind of preparation method of the micro- heating plate of ceramics of multilayer beam type structure, packet
It includes:
The precursor to form insulating ceramic layer is made of thermal insulation ceramics slurry；
Production forms heating layer on the insulating ceramic layer；
The precursor for forming thermally conductive insulating layer is made on the heating layer of heat conductive insulating ceramic slurry；
Production forms test electrode layer on the precursor of the thermally conductive insulating layer；
The green body of precursor comprising insulating ceramic layer, heating layer, the precursor of thermally conductive insulating layer and test electrode layer is carried out
Processing, to obtain the first product with cantilever beam heat insulation structural；
Integral sintered, the obtained micro- heating plate of ceramics is carried out to the first product.
In some embodiments, the preparation method specifically includes: at least using laser cutting and/or precision machinery
Cutting mode processes the green body, formed have cantilever beam heat insulation structural first product, finally to the first product into
Row is integral sintered, and the micro- heating plate of ceramics is made.
The utility model embodiment additionally provides the micro- heating plate of ceramics of the multilayer beam type structure in prepare micro- heating biography
Application in sensor.
Compared with prior art, the structure of the micro- heating plate of ceramics of multilayer beam type structure provided by the utility model is simply firm
Gu heating properties are good, high reliablity, especially there is very high structural stability under the high temperature conditions, can be used in hot operation
Service life is long, while its preparation process is simple to operation, and controllability is good, and high-precision may be implemented and process, be adapted for industrial metaplasia
It produces.
Detailed description of the invention
Fig. 1 is a kind of structural representation of the micro- heating plate of ceramics of multilayer beam type structure in one exemplary embodiments of the utility model
Figure；
Fig. 2 is a kind of top view of the micro- heating plate of ceramics of multilayer beam type structure in one exemplary embodiments of the utility model；
Fig. 3 is a kind of preparation process of the micro- heating plate of ceramics of multilayer beam type structure in one exemplary embodiments of the utility model
Flow chart.
Specific embodiment
As previously mentioned, inventor is studied for a long period of time and largely practiced in view of many defects of the existing technology, obtain
To propose the technical solution of the utility model.The technical solution, its implementation process and principle etc. will further be solved as follows
Release explanation.
A kind of preparation of the micro- heating plate of ceramics for multilayer beam type structure that the one aspect of the utility model embodiment provides
Method includes:
The precursor to form insulating ceramic layer is made of thermal insulation ceramics slurry；
Production forms heating layer on the insulating ceramic layer；
The precursor for forming thermally conductive insulating layer is made on the heating layer of heat conductive insulating ceramic slurry；
Production forms test electrode layer on the precursor of the thermally conductive insulating layer；
The green body of precursor comprising insulating ceramic layer, heating layer, the precursor of thermally conductive insulating layer and test electrode layer is carried out
Processing, to obtain the first product with cantilever beam heat insulation structural；
Integral sintered, the obtained micro- heating plate of ceramics is carried out to the first product.
In some embodiments, the preparation method specifically includes: thermal insulation ceramics slurry is coated in substrate surface,
The precursor of the insulating ceramic layer is formed in 300-700 DEG C of pre-burning 1-5h under vacuum atmosphere later.In this manner,
Facilitate the preparation for fast implementing the precursor of insulating ceramic layer at a lower temperature, and with certain hardness, Neng Gouzhi
Other structures layer is supportted, the later period is especially also reduced for the processing technology difficulty of cantilever beam heat insulation structural, facilitates improvement and add
Work precision and finished product yield.
The thermal insulation ceramics slurry is mainly made of foam class powder and binder.For example, the thermal insulation ceramics slurry packet
Include 80-95wt% foam class powder and 5-25% bonding agent, and in the thermal insulation ceramics slurry all components mass percent
The sum of content is 100wt%.The foam class powder can use but be not limited to foamed alumina, foam aluminium nitride, foam nitrogen
SiClx etc..It is (poly- that polyvinyl alcohol, terpinol, PVB (polyvinyl butyral), PMMA can be selected but be not limited to the bonding agent
Methyl methacrylate) etc..The aforementioned insulating ceramic layer prepared in the present invention because its material itself heat insulation, with
And the porous structure formed during the preparation process, it is integrally formed good heat insulation.
In some embodiments, the preparation method specifically includes: at least can be using photoetching and/or sputtering mode
The deposited metal on the precursor of insulating ceramic layer forms heating layer.
In some embodiments, the preparation method specifically includes: at least will be thermally conductive exhausted using screen printing mode
Edge ceramic slurry covers on heating layer, forms the heat conductive insulating in 300-700 DEG C of pre-burning 1-5h under vacuum atmosphere later
The precursor of layer.In this manner, facilitate the preparation for fast implementing the precursor of insulating ceramic layer at a lower temperature, and make
Have certain hardness, other structures layer can be supported, especially also reduce the later period for cantilever beam heat insulation structural plus
Work technology difficulty helps to improve machining accuracy and finished product yield.
Aforementioned heat conductive insulating ceramic slurry can be bought from market, such as can be aluminium oxide ceramics slurry (Shenzhen good day
The companies such as Feng Tai produce).
In some embodiments, the preparation method specifically includes: at least can be using photoetching and/or sputtering mode
The deposited metal on the precursor of thermally conductive insulating layer forms test electrode layer.
Certainly, the side such as other ways known in the art such as CVD, PVD also can be used in aforementioned heating layer, test electrode layer
Formula preparation.
In addition, aforementioned heating layer, test electrode layer can also be patterned structures, to adapt to the demand of practical application.
In some embodiments, the preparation method specifically includes: at least using laser cutting and/or precision machinery
Cutting mode processes the green body, formed have cantilever beam heat insulation structural first product, finally to the first product into
Row is integral sintered, and sintering temperature is 1000-1500 DEG C, time 1-5h, and the micro- heating plate of ceramics is made.
In the previous embodiment of the utility model, combined by multi-layer ceramics co-firing technology and MEMS processing technology, no
The difficulty of processing of the micro- heating plate of ceramics can be only reduced, machining accuracy is promoted, improves finished product yield, so that gold therein
Belonging to structure sheaf and ceramic material layer has good binding force, is still able to maintain very good structure even if working at high temperature,
To which high comprehensive performance, the high-precision micro- heating plate of ceramics be made.
A kind of micro- heating plate of ceramics for multilayer beam type structure that the other side of the utility model embodiment provides includes
Insulating ceramic layer, heating layer, thermally conductive insulating layer and the test electrode layer stacked gradually, and also shape in the micro- heating plate of ceramics
The test electrode layer, thermally conductive insulating layer, the groove-like structure of heating layer and insulating ceramic layer are sequentially passed through at having, makes the ceramics
Micro- heating plate has cantilever beam heat insulation structural.
In some embodiments, the micro- heating plate of ceramics includes workspace and braced frame area, and the work is distinguished
For cloth in braced frame area, the groove-like structure is annular groove and around being set to around workspace, the workspace and support
It is connected between framework region through cantilever beam.
In some embodiments, the material of the heating layer includes the combination of any one or more in Pt, Mo, W
Or its alloy, but not limited to this.For example, the heating layer can be Pt metal layer, Mo metal layer or W metal layer.
In some embodiments, the heating layer with a thickness of 100 nanometers -1000 nanometers.
In some embodiments, the material of the test electrode layer includes Au, Ag or its alloy.For example, the test
Electrode layer can be with Au metal layer or Ag metal layer.
In some embodiments, it is described test electrode layer with a thickness of 100 nanometers -1000 nanometers.
In some embodiments, the insulating ceramic layer is made of the thermal insulation ceramics material such as aluminium oxide.
In some embodiments, the thermally conductive insulating layer is made of the heat conductive insulatings ceramic material such as aluminium oxide, and unlimited
In this.
In some embodiments, the thermally conductive insulating layer with a thickness of 100 nanometers -5000 nanometers.
In some embodiments, the insulating ceramic layer, heating layer, thermally conductive insulating layer and test electrode layer are sintered to
One.The structure of the micro- heating plate of ceramics of multilayer beam type structure provided by the utility model is simple, high reliablity, at high temperature
Structural stability is good, heating properties are efficient, while its preparation process is simply controllable, and efficiently and yields is high, is adapted for industry
Metaplasia produces.
Clear, complete description is carried out to the technical solution of the utility model below in conjunction with attached drawing and typical case.
Refering to Figure 1, a kind of ceramics of multilayer beam type structure are micro- in an exemplary embodiments of the utility model
Heating plate includes the insulating ceramic layer 2 being cascading from bottom to top, heating layer 3, insulating heat-conductive ceramic layer 4 and test electrode
Layer 5.It is also formed in the micro- heating plate of ceramics and sequentially passes through the test electrode layer, thermally conductive insulating layer, heating layer and heat-insulated
The groove-like structure 6 of ceramic layer.
Further, referring to Fig. 2, the groove-like structure 6 is annular groove, thus by the difference of the micro- heating plate of ceramics
Part is divided into workspace 11 and braced frame area 12, and workspace 11 is distributed in braced frame area 12, and annular groove 6 is around setting
Around workspace, connected between workspace 11 and braced frame area 12 through cantilever beam 13.
Wherein, aforementioned insulating ceramic layer can be made of the thermal insulation ceramics material such as aluminium oxide.
Wherein, aforementioned heating layer can be by the combination of any one or more in Pt, Mo, W or its composition of alloy, but not
It is limited to this.
Wherein, the thickness of aforementioned heating layer is preferably 100 nanometers -1000 nanometers.
Wherein, the material of aforementioned test electrode layer includes Au, Ag or its alloy.
In some embodiments, it is described test electrode layer with a thickness of 100 nanometers -1000 nanometers.
In some embodiments, the thermally conductive insulating layer is made of the heat conductive insulatings ceramic material such as aluminium oxide, and unlimited
In this.
In some embodiments, the thermally conductive insulating layer with a thickness of 100 nanometers -5000 nanometers.
Micro- the simple and strong in structure of heating plate of ceramics of the present embodiment, precision is high, heating properties are good, high reliablity, especially
Be have very high structural stability under the high temperature conditions, while because which employs the heat insulation structural of aforementioned beam type, be allowed to also
With excellent synthetic operation performance.
Micro- heating plate of the embodiment can use MEMS technology and the production of multi-layer ceramics co-firing technology, for example, a kind of system
The method for making micro- heating plate can be refering to shown in Fig. 3.The production method specifically comprises the following steps:
(1) thermal insulation ceramics slurry is provided.The thermal insulation ceramics slurry includes 80-95wt% foam class powder and 5-25% bonding
Agent, wherein foam class powder can be selected from foamed alumina, foam aluminium nitride, foam silicon nitride etc., the optional autohemagglutination second of bonding agent
Enol, terpinol, PVB, PMMA etc..
(2) thermal insulation ceramics slurry is coated on substrate 1, and spontaneously dries or dry, then is carried out in advance at 300-700 DEG C
It burns, (under vacuum atmosphere, being sintered 1-5h) obtains the structure sheaf of certain degree of hardness, and can be considered as insulating ceramic layer (can also be recognized
For ceramic substrate) precursor 2 '.
(3) by photoetching, sputtering in the way of deposit the metals such as Pt, Mo, W on the precursor of insulating ceramic layer and form heating layer
3, thickness can be 100 nanometers -1000 nanometers.The process conditions etc. of the photoetching, sputtering that wherein use are known in the art.
Aforementioned heating layer is also possible to patterned.
(4) commercially available heat conductive insulating ceramic slurry is covered on heating layer by modes such as silk-screen printings, and done naturally
Dry or drying, then 300-700 DEG C of progress pre-burning (under vacuum atmosphere, being sintered 1-5h), the structure sheaf of certain degree of hardness is obtained, it can
It is considered as the precursor 4 ' of thermally conductive insulating layer.The thickness of thermally conductive insulating layer can be 100 nanometers -5000 nanometers.
(5) by photoetching, sputtering in the way of deposit the metals such as Ag, Au on the precursor of thermally conductive insulating layer and form test electrode
Layer 5.Test electrode layer with a thickness of 100 nanometers -1000 nanometers.The process conditions etc. of the photoetching, sputtering that wherein use are abilities
Known to domain.And aforementioned test electrode layer may include patterned test electrode.
(6) using the green body in the way of known to the industries such as laser cutting, precision machinery processing, formed to abovementioned steps
It is processed, forms the first product with aforementioned cantilever beam heat insulation structural.In the step not yet because of the intracorporal ceramic structure layer of base
It is fully cured, hardness is lower, therefore difficulty of processing can be made to reduce, and avoids forming micro-structure and damage, but also can be promoted
Machining accuracy promotes the yield of device.
(7) integral sintered to first product progress, sintering temperature is 1000-1500 DEG C, time 1-5h, is made described
The micro- heating plate of ceramics.In this step, by integral sintered, the good knot of each structured metal layer Yu ceramic structure layer may be implemented
It closes, even if so that the micro- heating plate of ceramics obtained is worked at high temperature still is able to maintain very good structure, and also improves device
The yield of part.
The technology contents and technical characteristic of the utility model have revealed that as above, however those skilled in the art still may be used
Can teaching based on the utility model and announcement and make various replacements and modification without departing substantially from the spirit of the present invention, therefore, this
Utility model protection range should be not limited to the revealed content of embodiment, and should include the various replacements without departing substantially from the utility model
And modification, and covered by present patent application claim.
Claims (8)
1. a kind of micro- heating plate of ceramics of multilayer beam type structure, it is characterised in that including stack gradually insulating ceramic layer, heating
Layer, thermally conductive insulating layer and test electrode layer, and be also formed in the micro- heating plate of ceramics and sequentially pass through the test electrode
Layer, thermally conductive insulating layer, the groove-like structure of heating layer and insulating ceramic layer make the micro- heating plate of ceramics have the heat-insulated knot of cantilever beam
Structure.
2. the micro- heating plate of ceramics as described in claim 1, it is characterised in that: the heating layer is Pt metal layer, Mo metal layer
Or W metal layer.
3. the micro- heating plate of ceramics as described in claim 1, it is characterised in that: the heating layer with a thickness of 100 nanometer -1000
Nanometer.
4. the micro- heating plate of ceramics as described in claim 1, it is characterised in that: the material of the test electrode layer is Au metal layer
Or Ag metal layer.
5. the micro- heating plate of ceramics as described in claim 1, it is characterised in that: the test electrode layer with a thickness of 100 nanometers-
1000 nanometers.
6. the micro- heating plate of ceramics as described in claim 1, it is characterised in that: the thermally conductive insulating layer with a thickness of 100 nanometers-
5000 nanometers.
7. the micro- heating plate of ceramics as described in claim 1, it is characterised in that: the insulating ceramic layer, heating layer, heat conductive insulating
Layer and test electrode layer are sintered to one.
8. the micro- heating plate of ceramics as described in claim 1, it is characterised in that: the micro- heating plate of ceramics includes workspace and branch
Framework region is supportted, the workspace is distributed in braced frame area, and the groove-like structure is annular groove and around being set to workspace
Around, it is connected between the workspace and braced frame area through cantilever beam.
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| CN201822238724.6U CN209472775U (en) | 2018-12-28 | 2018-12-28 | The micro- heating plate of ceramics of multilayer beam type structure |
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| CN201822238724.6U CN209472775U (en) | 2018-12-28 | 2018-12-28 | The micro- heating plate of ceramics of multilayer beam type structure |
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