CN209462828U - A kind of integrated-type module with buffer protection - Google Patents
A kind of integrated-type module with buffer protection Download PDFInfo
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- CN209462828U CN209462828U CN201822181888.XU CN201822181888U CN209462828U CN 209462828 U CN209462828 U CN 209462828U CN 201822181888 U CN201822181888 U CN 201822181888U CN 209462828 U CN209462828 U CN 209462828U
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- frame
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- plastic middle
- ceramic substrate
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Abstract
The integrated-type module with buffer protection that the utility model discloses a kind of, including plastic middle-frame, epoxy cover board, metal external electrode, cover copper ceramic substrate, electronic component, clamping device, mounting groove, movable plate, hinge and buffer unit, epoxy cover board top plate face is equipped with multiple metal external electrodes, the utility model is scientific and reasonable for structure, it is safe and convenient to use, movable plate is opened by hinge, so as to dismantle to covering copper ceramic substrate, so as to carry out demolition and replacement to electronic component, clamping plate is clamped fixation to copper ceramic substrate two sides are covered, when plastic middle-frame is squeezed, mobile column carries out telescopic moving, compress clamping plate to the first spring, to be protected to copper ceramic substrate two sides are covered, pedestal is installed to fixed plate face, when plastic middle-frame is shaken, connecting plate is to second spring and Three springs are compressed and are stretched, to buffer to plastic middle-frame, are protected.
Description
Technical field
The utility model relates to integrated-type module field, specially a kind of integrated-type module with buffer protection.
Background technique
It says in general sense, integrated-type module just refers to integrated circuit, and integrated-type module is the entity of integrated circuit, and
The popular call of integrated circuit, for literal meaning, integrated circuit is a kind of circuit form, and integrated package is then integrated circuit
Reflection in kind.
But not only structure is complicated for integrated-type module currently on the market, but also has a single function, existing integrated-type module
In technology, cannot effectively it clamp to covering copper ceramic substrate, while being not easy to carry out demolition and replacement to covering copper ceramic substrate, with
And it is not easy to buffer plastic middle-frame.
Utility model content
The integrated-type module with buffer protection that the purpose of this utility model is to provide a kind of, to solve above-mentioned background skill
The problem of being proposed in art.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of integrated-type module with buffer protection, including plastic middle-frame, epoxy cover board, metal external electrode, cover copper pottery
Porcelain substrate, electronic component, clamping device, mounting groove, movable plate, hinge and buffer unit, inside the plastic middle-frame top
Set is embedded with epoxy cover board, and epoxy cover board top plate face is equipped with multiple metal external electrodes, and the plastic middle-frame side opens up
There is mounting groove, the mounting groove is internally provided with movable plate, and is connected by hinge on the outside of movable plate side and plastic middle-frame, institute
It states plastic middle-frame and is internally provided with and cover copper ceramic substrate, the copper ceramic substrate top plate face of covering is fixedly installed with electronics member device
Part, plastic middle-frame two sides inner wall, which is located at, to be covered copper ceramic substrate two sides and is provided with clamping device, the plastic middle-frame bottom end
Buffer unit is installed.
As a further solution of the present invention: the clamping device includes foundation, mobile column, clamping plate and the first bullet
Spring, plastic middle-frame inner wall two sides are fixedly installed with foundation, and two described foundation one end internal sleeves are embedded with mobile column, the shifting
Dynamic column one end is fixedly installed with clamping plate, and clamping plate is socketed on and covers on the outside of copper ceramic substrate, is socketed with first on the outside of the mobile column
Spring, and the first spring one end supports clamping plate side, and the other end supports plastic middle-frame inner wall.
As a further solution of the present invention: the buffer unit includes connecting plate, pedestal, second spring and third
Spring, plastic middle-frame bottom end two sides are fixedly installed with connecting plate, and the connecting plate bottom end is socketed with pedestal, the pedestal
Inner bottom is equipped with third spring, and the third spring other end is connect with connecting plate bottom, the base interior top and company
Fishplate bar bottom is connected by second spring.
As a further solution of the present invention: being provided with reinforcing rib on the outside of the movable plate.
As a further solution of the present invention: being coated with pvc coating on the outside of the epoxy cover board.
As a further solution of the present invention: the clamping plate is internally provided with non-slip mat.
The utility model has the beneficial effects that the utility model is scientific and reasonable for structure, and it is safe and convenient to use, it will be moved by hinge
Movable plate is opened, so as to dismantle to covering copper ceramic substrate, so as to carry out demolition and replacement to electronic component, and clamping plate pair
It covers copper ceramic substrate two sides and is clamped fixation, when plastic middle-frame is squeezed, mobile column carries out telescopic moving, makes clamping plate to the
One spring is compressed, to protect to copper ceramic substrate two sides are covered, pedestal is installed to fixed plate face, plastic middle-frame by
To when vibration, connecting plate is compressed and is stretched to second spring and third spring, to buffer to plastic middle-frame, is carried out
Protection.
Detailed description of the invention
In order to facilitate the understanding of those skilled in the art, the utility model will be further described below with reference to the accompanying drawings.
Fig. 1 is the utility model entirety front view；
Fig. 2 is the utility model plastic middle-frame internal view；
Fig. 3 is the utility model buffer unit internal view；
In figure: 1, plastic middle-frame；2, epoxy cover board；3, metal external electrode；4, copper ceramic substrate is covered；5, electronic component；
6, clamping device；61, foundation；62, mobile column；63, clamping plate；64, the first spring；7, mounting groove；8, movable plate；9, hinge；10,
Buffer unit；101, connecting plate；102, pedestal；103, second spring；104, third spring.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with embodiment, it is clear that described
Embodiment be only the utility model a part of the embodiment, instead of all the embodiments.Based on the reality in the utility model
Example is applied, all other embodiment obtained by those of ordinary skill in the art without making creative efforts all belongs to
In the range of the utility model protection.
As shown in Figure 1-3, a kind of integrated-type module with buffer protection, including plastic middle-frame 1, epoxy cover board 2, metal
External electrode 3 covers copper ceramic substrate 4, electronic component 5, clamping device 6, mounting groove 7, movable plate 8, hinge 9 and buffer unit
10,1 top internal sleeve of plastic middle-frame is embedded with epoxy cover board 2, is coated with pvc coating on the outside of epoxy cover board 2, preferably right
Epoxy cover board 2 is protected, and 2 top plate face of epoxy cover board is equipped with multiple metal external electrodes 3, and 1 side of plastic middle-frame offers
Mounting groove 7, mounting groove 7 are internally provided with movable plate 8, are provided with reinforcing rib on the outside of movable plate 8, preferably enhance the movable plate Final 8
Degree, prolongs its service life, and 8 side of movable plate is connect on the outside of plastic middle-frame 1 by hinge 9, is arranged inside plastic middle-frame 1
Have and cover copper ceramic substrate 4, covers 4 top plate face of copper ceramic substrate and be fixedly installed with electronic component 5,1 two sides inner wall of plastic middle-frame
It is provided with clamping device 6 positioned at 4 two sides of copper ceramic substrate are covered, clamping device 6 includes foundation 61, mobile column 62,63 and of clamping plate
First spring 64,1 inner wall two sides of plastic middle-frame are fixedly installed with foundation 61, and two foundation, 61 one end internal sleeve is embedded with mobile column
62,62 one end of mobile column is fixedly installed with clamping plate 63, and clamping plate 63 is internally provided with non-slip mat, preferably to covering copper ceramic substrate 4
It is clamped, and clamping plate 63 is socketed on and covers 4 outside of copper ceramic substrate, is socketed with the first spring 64, and first on the outside of mobile column 62
63 side of clamping plate is supported in 64 one end of spring, and the other end supports 1 inner wall of plastic middle-frame, and 1 bottom end of plastic middle-frame is equipped with buffering dress
10 are set, buffer unit 10 includes connecting plate 101, pedestal 102, second spring 103 and third spring 104,1 bottom end two of plastic middle-frame
Side is fixedly installed with connecting plate 101, and 101 bottom end of connecting plate is socketed with pedestal 102, and 102 inner bottom of pedestal is equipped with third
Spring 104, and 104 other end of third spring is connect with 101 bottom of connecting plate, 102 inner tip of pedestal and 101 bottom of connecting plate
It is connected by second spring 103.
Working principle of the utility model is: opened movable plate 8 by hinge 9, so as to carry out to covering copper ceramic substrate 4
Disassembly, so as to carry out demolition and replacement to electronic component 5, clamping plate 63 is clamped fixation to 4 two sides of copper ceramic substrate are covered,
When plastic middle-frame 1 is squeezed, mobile column 62 carries out telescopic moving, compresses clamping plate 63 to the first spring 64, thus right
4 two sides of copper ceramic substrate are covered to be protected, in the installation of pedestal 102 to fixed plate face, when plastic middle-frame 1 is shaken, connecting plate
101 pairs of second springs 103 and third spring 104 are compressed and are stretched, to buffer to plastic middle-frame 1, are protected.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (6)
1. a kind of integrated-type module with buffer protection, which is characterized in that including plastic middle-frame (1), epoxy cover board (2), gold
Belong to external electrode (3), covers copper ceramic substrate (4), electronic component (5), clamping device (6), mounting groove (7), movable plate (8), closes
Page (9) and buffer unit (10), plastic middle-frame (1) the top internal sleeve are embedded with epoxy cover board (2), the epoxy cover board (2)
Top plate face is equipped with multiple metal external electrodes (3), and plastic middle-frame (1) side offers mounting groove (7), the mounting groove
(7) it is internally provided with movable plate (8), and movable plate (8) side is connect on the outside of plastic middle-frame (1) by hinge (9), the modeling
Material center (1), which is internally provided with, to be covered copper ceramic substrate (4), and copper ceramic substrate (4) top plate face of covering is fixedly installed with electronics
Component (5), plastic middle-frame (1) the two sides inner wall, which is located at, to be covered copper ceramic substrate (4) two sides and is provided with clamping device (6),
Plastic middle-frame (1) bottom end is equipped with buffer unit (10).
2. a kind of integrated-type module with buffer protection according to claim 1, which is characterized in that the clamping device
It (6) include foundation (61), mobile column (62), clamping plate (63) and the first spring (64), plastic middle-frame (1) the inner wall two sides are solid
Dingan County is equipped with foundation (61), and two foundation (61) one end internal sleeves are embedded with mobile column (62), and described mobile column (62) one end is solid
Dingan County is equipped with clamping plate (63), and clamping plate (63) is socketed on and covers on the outside of copper ceramic substrate (4), is socketed on the outside of the mobile column (62)
First spring (64), and clamping plate (63) side is supported in the first spring (64) one end, and the other end supports plastic middle-frame (1) inner wall.
3. a kind of integrated-type module with buffer protection according to claim 1, which is characterized in that the buffer unit
It (10) include connecting plate (101), pedestal (102), second spring (103) and third spring (104), plastic middle-frame (1) bottom
End two sides are fixedly installed with connecting plate (101), and connecting plate (101) bottom end is socketed with pedestal (102), the pedestal
(102) inner bottom is equipped with third spring (104), and third spring (104) other end is connect with connecting plate (101) bottom,
Pedestal (102) inner tip is connect with connecting plate (101) bottom by second spring (103).
4. a kind of integrated-type module with buffer protection according to claim 1, which is characterized in that the movable plate
(8) outside is provided with reinforcing rib.
5. a kind of integrated-type module with buffer protection according to claim 1, which is characterized in that the epoxy cover board
(2) outside is coated with pvc coating.
6. a kind of integrated-type module with buffer protection according to claim 2, which is characterized in that the clamping plate (63)
It is internally provided with non-slip mat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822181888.XU CN209462828U (en) | 2018-12-25 | 2018-12-25 | A kind of integrated-type module with buffer protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822181888.XU CN209462828U (en) | 2018-12-25 | 2018-12-25 | A kind of integrated-type module with buffer protection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209462828U true CN209462828U (en) | 2019-10-01 |
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ID=68041974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822181888.XU Active CN209462828U (en) | 2018-12-25 | 2018-12-25 | A kind of integrated-type module with buffer protection |
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| Country | Link |
|---|---|
| CN (1) | CN209462828U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112967867A (en) * | 2021-02-26 | 2021-06-15 | 瑞康(广州)实业有限公司 | Inductor with insulating layer |
-
2018
- 2018-12-25 CN CN201822181888.XU patent/CN209462828U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112967867A (en) * | 2021-02-26 | 2021-06-15 | 瑞康(广州)实业有限公司 | Inductor with insulating layer |
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