CN209447168U - A kind of hub of USB difference shield wiring and power module separated layout - Google Patents

A kind of hub of USB difference shield wiring and power module separated layout Download PDF

Info

Publication number
CN209447168U
CN209447168U CN201920535802.0U CN201920535802U CN209447168U CN 209447168 U CN209447168 U CN 209447168U CN 201920535802 U CN201920535802 U CN 201920535802U CN 209447168 U CN209447168 U CN 209447168U
Authority
CN
China
Prior art keywords
usb
shield wiring
hub
difference shield
hub chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920535802.0U
Other languages
Chinese (zh)
Inventor
陈波
彭雄飞
李现朋
项江龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI FENGTIAN ELECTRONIC CO Ltd
Original Assignee
SHANGHAI FENGTIAN ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI FENGTIAN ELECTRONIC CO Ltd filed Critical SHANGHAI FENGTIAN ELECTRONIC CO Ltd
Priority to CN201920535802.0U priority Critical patent/CN209447168U/en
Application granted granted Critical
Publication of CN209447168U publication Critical patent/CN209447168U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The utility model discloses the hubs of a kind of USB difference shield wiring and power module separated layout, including HSD connector, HUB chip, first USB interface, secondary USB interface, BAT+ connector, EMI filtering, DC-DC module and pcb board, HSD connector is connected by USB difference shield wiring with HUB chip, one of up going port of HUB chip corresponds to mono- group of USB difference shield wiring of D1+ and D1- of HSD connector, one of up going port of HUB chip is connected with HSD connector by USB difference shield wiring, the D1+_TypeC and D1-_TypeC and the first USB interface of one of down going port of HUB chip are connected by USB difference shield wiring, on one of HUB chip Row mouth OTG corresponds to mono- group of USB difference shield wiring of D2+ and D2- of HSD connector, the utility model provides mutually indepedent between a kind of disparate modules circuit, it does not interfere with each other, respective electromagnetic radiation is greatly lowered, higher interference free performance can be provided simultaneously, meets the characteristic needs between disparate modules circuit.

Description

A kind of hub of USB difference shield wiring and power module separated layout
Technical field
The utility model relates to automobile electronics technical field, specially a kind of USB difference shield wiring and power supply mould The hub of block separated layout.
Background technique
Currently, the advantages that digital circuit due to its signal strong antijamming capability, is easy standardization, and circuit structure is simple and by It is widely applied.When digital circuit and analog circuit integrate in use, will appear some unnecessary interference.Although digital electricity Road has very strong anti-interference, but if the energy grade of interference is excessive, also will appear the error code of communication data transfer, so that Actual signal distortion in transmission, so as to cause the unreliable of signal transmission.For example, on automobile, the equipment of user When communication by USB data line and on-vehicle host, the principal phenomena showed is packet loss and high bit-error, is more had very Person, will lead to the disorder of logic function, as a result cannot achieve set function, causes the complaint of user and is discontented with.
On the other hand, in present day analog and Design of Digital Circuit, about analog circuit and digital circuit, or switch The introduction of relationship between power supply and other numbers, analog circuit, and design application example, giving needs between each functional module The overall general direction of processing is separated, but there is also the problem of interfering with each other between different characteristics circuit in practical application, Cause to work steadily in the long term between each characteristic circuit, and the system reliability service under more rigor condition.
Utility model content
The purpose of this utility model is to provide the line concentrations of a kind of USB difference shield wiring and power module separated layout Device, to solve the problems mentioned in the above background technology.
To achieve the above object, the utility model provides the following technical solutions: a kind of USB difference shield wiring and power supply mould The hub of block separated layout, including HSD connector, HUB chip, the first USB interface, secondary USB interface, BAT+ connector, EMI filtering, DC-DC module and pcb board, HSD connector are connected by USB difference shield wiring with HUB chip, HUB chip One of up going port corresponds to mono- group of USB difference shield wiring of D1+ and D1- of HSD connector, in one of them of HUB chip Row mouth is connected with HSD connector by USB difference shield wiring, the D1+_TypeC of one of down going port of HUB chip and D1-_TypeC and the first USB interface are connected by USB difference shield wiring, and a up going port OTG of HUB chip corresponds to HSD company Connect mono- group of USB difference shield wiring of D2+ and D2- of device, and two groups of USB difference of D1+, D1- and D2+ of HSD connector, D2- Shield wiring is individually positioned in two layers of the centre of pcb board, and up going port OTG and HSD a connector of HUB chip is poor by USB Separated-shielding wiring connection, the D2+_TypeA and D2-_TypeA and secondary USB interface of another down going port of HUB chip pass through The connection of USB difference shield wiring, BAT+ connector and EMI filtering connection, EMI filtering are connected with DC-DC module, DC-DC module It is placed on the top layer of pcb board, the V-BUS of DC-DC module and the connection of the first USB interface;The V-BUS2 of DC-DC module and second USB interface connection.
Preferably, HSD connector is connected with external on-vehicle host by shielded cable, and two groups of USB of HSD connector are poor Two groups of up going ports connection that separated-shielding wiring is connect with HUB chip respectively, and one group of USB difference shield wiring is by D1+ and D1- Composition, another group of USB difference shield wiring are made of D2+ and D2-.
Preferably, multiple via holes are provided with around USB difference shield wiring, and the distance values of each via hole are 1-2mm.
Preferably, the top layer of pcb board is covered on the two groups of up going ports and two groups of downlinks of HUB chip by GND monolith floor file Above the USB difference shield wiring of mouth, two groups of down going port USB difference shield wirings of HUB chip are D1+_TypeC, D1-_ Two groups of down going port USB difference shield wirings of TypeC and D2+_TypeA, D2-_TypeA, HUB chip are placed in pcb board Between two layers, be provided with via hole, via hole around two groups of up going ports of HUB chip and two groups of down going port USB difference shield wirings Connect the floor file of GND monolith.
Preferably, the bottom of pcb board includes the GND that the GND floor file connected with HSD connector is connected with the first USB interface The GND floor file that the GND floor file that floor file is connected with secondary USB interface is connected with DC-DC module, HSD connector, the first USB connect The GND floor file that connects with secondary USB interface of mouth is by being placed on via hole provided around USB difference shield wiring and top layer The GND floor file of GND floor file connection, DC-DC module connection is connected with the shielding case with top layer.
Preferably, the ground wire of the shielding earth of two groups of data lines of the up going port of HUB chip and HSD connector screening shell connects It connects, the shielding earth and the first USB interface, secondary USB interface of two groups of data lines of down going port of HUB chip shield the ground of shell Line connection.
Preferably, the GND that the GND ground wire of DC-DC module circuit passes through single-point grounding mode and data communications portion circuit Ground wire connection.
Preferably, it is provided with shielding case on the outside of DC-DC module, the pcb board that shielding case is welded by SMT patch mode Top layer.
Preferably, pcb board is four laminates, and pcb board is divided into top layer, intermediate two layers and bottom.
It is connect compared with prior art, the utility model has the beneficial effects that the utility model can provide two kinds of mainstream USB Mouth TypeA and TypeC, supports USB high speed data transfer and large current charge, realizes the reliable and stable transmission of high speed signal, number Word circuit and switch power module are not interfere with each other, the side that the utility model passes through the placement via hole around USB difference shield wiring Formula forms a complete shielding construction body in pcb board top layer and bottom by these via hole floor file, it is ensured that its differential lines not by Interference is reduced to receivable minimum by extraneous interference, and there is superior eye figure effect and minimum data to transmit The bit error rate carries out uniquely electromagnetic compatibility and thermal design to DC-DC module part and screen is used alone in DC-DC power module The mode for covering cover inhibits radiation interference, DC-DC module formed one and USB difference shield wiring it is relatively independent exist, only Entity is constituted in output port to provide more excellent to realize the hub of difference shield wiring and power module separated layout Different performance, the utility model provide mutually indepedent between a kind of disparate modules circuit, do not interfere with each other, by respective electromagnetism Radiation is greatly lowered, while can provide higher interference free performance, meets the characteristic needs between disparate modules circuit, veritably Shielding and ground connection are combined together, implemented in actual product, this scheme is based on, is provided for similar product design with exploitation One practical road, simultaneously as this scheme can obtain higher property in the case where not using additional electronics Energy.
Detailed description of the invention
Fig. 1 is the hub block diagram of a kind of USB difference shield wiring and power module separated layout;
Fig. 2 is the block diagram of pcb board top layer cabling and layout in the utility model;
Fig. 3 is the block diagram of pcb board bottom cabling and layout in the utility model.
In figure: 1, HSD connector;2, HUB chip;3, the first USB interface;4, secondary USB interface;5, BAT+ connector; 6, EMI is filtered;7, DC-DC module;8, USB difference shield wiring;81, via hole;9, pcb board;10, shielding case.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.
In the description of the present invention, it should be noted that the instructions such as term "vertical", "upper", "lower", "horizontal" Orientation or positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model and simplification Description, rather than the device or element of indication or suggestion meaning must have a particular orientation, constructed and grasped with specific orientation Make, therefore should not be understood as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise clearly defined and limited, term " is set Set ", " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, Or it is integrally connected;It can be mechanical connection, be also possible to be electrically connected;It can be directly connected, intermediary can also be passed through It is indirectly connected, can be the connection inside two elements.It for the ordinary skill in the art, can be according to specific feelings Condition understands the concrete meaning of above-mentioned term in the present invention.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of USB difference shield wiring and power module The hub of separated layout, including HSD connector 1, HUB chip 2, the first USB interface 3, secondary USB interface 4, BAT+ connection Device 5, EMI filtering 6, DC-DC module 7 and pcb board 9, HSD connector 1 are connected by USB difference shield wiring 8 and HUB chip 2 It connects, one of up going port of HUB chip 2 corresponds to mono- group of USB difference shield wiring 8 of D1+ and D1- of HSD connector 1, HUB core The one of up going port and HSD connector of piece 2 are connected by USB difference shield wiring 8, under one of them of HUB chip 2 The D1+_TypeC and D1-_TypeC of row mouth and the first USB interface 3 are connected by USB difference shield wiring 8, and the one of HUB chip 2 A up going port OTG corresponds to mono- group of USB difference shield wiring 8 of D2+ and D2- of HSD connector 1, and the D1+ of HSD connector 1, Two groups of USB difference shield wirings 8 of D1- and D2+, D2- are individually positioned in two layers, one of HUB chip 2 of the centre of pcb board 9 Up going port OTG and HSD connector is connected by USB difference shield wiring 8, the D2+_ of another down going port of HUB chip 2 TypeA and D2-_TypeA and secondary USB interface 4 are connected by USB difference shield wiring 8, BAT+ connector 5 and EMI filtering 6 Connection, EMI filtering 6 and DC-DC module 7 connect, and DC-DC module 7 is placed on the top layer of pcb board 9, the V- of DC-DC module 7 BUS1 and the connection of the first USB interface 3, V-BUS2 and secondary USB interface 4 connection of DC-DC module 7.First USB interface 3 and Two USB interfaces 4 place ESD and protect chip, protect 4 road signal wire of up going port, such as: D1+, D1-, D2+, D2- protect down going port 4 road signal wires, such as: D1+_Type C, D1-_Type C and D2+_Type A, D2-_Type A, effective protection chip and product Not by electrostatic interference.
HSD connector 1 is connected with external on-vehicle host by shielded cable, two groups of USB difference screens of HSD connector 1 Two groups of up going ports connection that wiring 8 is connect with HUB chip 2 respectively is covered, and one group of USB difference shield wiring 8 is by D1+ and D1- group At, i.e. Host mode, based on this pattern definition host, equipment is from another group of USB difference shield wiring 8 is by D2+ and D2- group At that is, OTG mode, this pattern definition host are from based on equipment, Host mode and OTG mode can only have within the same time One mode work, by switching over movement between host and equipment.
Multiple via holes 81 are provided with around USB difference shield wiring 8, and the distance values of each via hole 81 are 1-2mm.It is logical The via hole 81 for crossing PCB, the shielding earth of PCB top layer and bottom is wrapped up, and is wrapped up similar to the external thread of shielded cable, Realize complete shield effectiveness, the spacing between via hole 81 depends on the message transmission rate of differential lines, according to current USB2.0 Transmission rate be 480MHz, cross pitch of holes value be 1-2mm, it is ensured that good shield effectiveness.
The top layer of pcb board 9 is covered on the two groups of up going ports and two groups of down going ports of HUB chip 2 by GND monolith floor file 8 top of USB difference shield wiring, two groups of down going port USB difference shield wirings 8 of HUB chip 2 are D1+_TypeC, D1-_ Two groups of down going port USB difference shield wirings 8 of TypeC and D2+_TypeA, D2-_TypeA, HUB chip 2 are placed on pcb board 9 It is two layers intermediate, via hole is provided with around two groups of up going ports of HUB chip 2 and two groups of down going port USB difference shield wirings 8 81, via hole 81 connects the floor file of GND monolith.
The bottom of pcb board 9 includes the GND paving of the GND floor file connected with HSD connector 1 and the connection of the first USB interface 3 The GND floor file that the GND floor file and DC-DC module 7 that ground and secondary USB interface 4 connect connect, HSD connector 1, the first USB connect The GND floor file that mouth 3 and secondary USB interface 4 connect is by being placed on 81 He of via hole provided around USB difference shield wiring 8 The GND floor file of top layer connects, and the GND floor file and connect with the shielding case 10 of top layer that DC-DC module 7 connects form complete screen Shield structure, meanwhile, it is mutually isolated between 7 shielding construction of shielding construction and DC-DC module of USB differential data transmission part, and Each independent shielding construction of self-forming, the GND floor file that HSD connector 1 connects is by being placed on around USB difference shield wiring 8 The via hole 81 of setting is connected with the GND floor file of top layer, is formed the complete packet ground structure of top layer and bottom, is passed through 2 He of the figures above The top layer and the relatively complete bonding effect of bottom that attached drawing 3 forms, realize USB difference shield wiring 8 and DC-DC module 7 Separated layout, reliability and power module stability for data transmission play the role of vital.
The shielding earth of two groups of data lines of up going port of HUB chip 2 is connected with the ground wire that HSD connector 1 shields shell, The shielding earth and the first USB interface 3, secondary USB interface 4 of two groups of data lines of down going port of HUB chip 2 shield the ground of shell Line connection.To realize HUB chip main circuit module function in such as Fig. 2, excellent USB2.0Hi-Speedhub chip HUB_ is selected USB4925 is internally integrated double Hub, externally possesses 1 uplink port, 1 downlink port inverted and 2 double role's downlinks Charging modes: private downlink port (DCP), charging downlink port (CDP) and standard down port (SDP) are supported in port.
The GND ground wire of 7 circuit of DC-DC module is connected by the GND ground wire of single-point grounding mode and data communications portion circuit It connecing, it is ensured that both numerical portion and switching power supply parts are not interfere with each other, meanwhile, cabling between the two is accomplished separate and vertical as far as possible Straight cabling plays optimal EMC electromagnetic compatibility effect.
Shielding case, the top layer for the pcb board 9 that shielding case is welded by SMT patch mode are provided on the outside of DC-DC module 7. Entire DC-DC module 7 is integrated in shielding case 10, optimal shield effectiveness is played, prevents the circuit outside interference, DC-DC Module 7 belongs to the fever mounting portion in whole system, and DC-DC module 7 uses integrated chip solution, effectively reduces volume, together When, chip interior integrates the switch metal-oxide-semiconductor of low internal resistance, its loss is effectively reduced, to reduce itself temperature rise, it can be ensured that compared with The requirement continued working under adverse circumstances.In conjunction with attached drawing 3, the floor file of 7 bottom of DC-DC module be can be designed as in PCB plate 9 The green paint windowing processing of bottom, and split window segment brush tin cream and reflow ovens excessively in SMT processing procedure, effectively increase overcurrent Ability and increase heat dissipation area, the above two o'clock have all carried out correspondingly thermal design from DC-DC module 7 is inside and outside, so that hair Hot part and the isolation of other parts modular circuit or the temperature for reducing heating device, to effectively obstruct since fuel factor is led The system of cause is unstable.
Pcb board 9 is four laminates, and pcb board 9 divides for top layer, intermediate two layers and bottom.
Working principle: in conjunction with attached Fig. 1 and 2, the top layer wiring of pcb board 9 and layout, two groups of up going ports that HUB chip 2 connects It is connect with 1 two groups of differential lines of HSD connector, one group is made of D1+ and D1-, i.e. Host mode, based on this pattern definition host, Equipment be from, another group is made of D2+ and D2-, i.e. OTG mode, this pattern definition host be from, based on equipment, Host mode There can only be one mode work within the same time with OTG mode, by switching over movement, DC-DC mould between host and equipment Block 7 is placed on the top layer of pcb board 9 and in shielding case 10, and in conjunction with attached drawing 1 and 3, the bottom wiring of pcb board 9 and layout, HSD connect It connects the GND floor file that device 1, the first USB interface 3 and secondary USB interface 4 connect and passes through the mistake around placement USB difference shield wiring 8 Hole 81 is connected with 9 top layer GND floor file of pcb board, forms the complete packet ground structure of top layer and bottom, USB differential data transmission part 7 shielding construction of shielding construction and DC-DC module between mutually isolated, and the independent shielding construction of each self-forming, by above The top layer and the relatively complete bonding effect of bottom that attached drawing 2 and attached drawing 3 form, realize USB difference shield wiring 8 and DC- 7 separated layout of DC module, for data transmission reliability and 7 stability of DC-DC module play the role of it is vital, although The embodiments of the present invention have been shown and described, for the ordinary skill in the art, it is possible to understand that not These embodiments can be carried out with a variety of variations, modification, replacement in the case where being detached from the principles of the present invention and spirit and become Type, the scope of the utility model are defined by the appended claims and the equivalents thereof.

Claims (9)

1. a kind of hub of USB difference shield wiring and power module separated layout, including HSD connector (1), HUB chip (2), the first USB interface (3), secondary USB interface (4), BAT+ connector (5), EMI filtering (6), DC-DC module (7) and PCB Plate (9), it is characterised in that: HSD connector (1) is connected by USB difference shield wiring (8) and HUB chip (2), HUB chip (2) one of up going port corresponds to mono- group of USB difference shield wiring (8) of D1+ and D1- of HSD connector (1), HUB chip (2) one of up going port and HSD connector by USB difference shield wiring (8) connect, HUB chip (2) one of them The D1+_TypeC and D1-_TypeC and the first USB interface (3) of down going port are connected by USB difference shield wiring (8), HUB core One up going port OTG of piece (2) corresponds to mono- group of USB difference shield wiring (8) of D2+ and D2- of HSD connector (1), and HSD connects Two groups of USB difference shield wirings (8) of D1+, D1- and D2+, D2- for connecing device (1) are individually positioned in the centre two of pcb board (9) One up going port OTG and HSD connector of layer, HUB chip (2) is connected by USB difference shield wiring (8), HUB chip (2) Another down going port D2+_TypeA and D2-_TypeA and secondary USB interface (4) pass through USB difference shield wiring (8) even It connects, BAT+ connector (5) and EMI filtering (6) connection, EMI filter (6) and DC-DC module (7) connection, and DC-DC module (7) is put Set the top layer in pcb board (9), V-BUS1 and the first USB interface (3) connection of DC-DC module (7), the V- of DC-DC module (7) BUS2 and secondary USB interface (4) connection.
2. the hub of a kind of USB difference shield wiring and power module separated layout according to claim 1, feature Be: HSD connector (1) is connected with external on-vehicle host by shielded cable, two groups of USB difference screens of HSD connector (1) Cover two groups of up going ports connection that wiring (8) connect with HUB chip (2) respectively, and one group of USB difference shield wiring (8) by D1+ and D1- composition, another group of USB difference shield wiring (8) are made of D2+ and D2-.
3. the hub of a kind of USB difference shield wiring and power module separated layout according to claim 1, feature It is: is provided with multiple via holes (81) around USB difference shield wiring (8), and the distance values of each via hole (81) is 1-2mm.
4. the hub of a kind of USB difference shield wiring and power module separated layout according to claim 1, feature Be: the top layer of pcb board (9) is covered on the two groups of up going ports and two groups of down going ports of HUB chip (2) by GND monolith floor file Above USB difference shield wiring (8), two groups of down going port USB difference shield wirings (8) of HUB chip (2) be D1+_TypeC, Two groups of down going port USB difference shield wirings (8) of D1-_TypeC and D2+_TypeA, D2-_TypeA, HUB chip (2) are placed on Around two layers of the centre of pcb board (9), two groups of up going ports of HUB chip (2) and two groups of down going port USB difference shield wirings (8) It is provided with via hole (81), via hole (81) connects the floor file of GND monolith.
5. the hub of a kind of USB difference shield wiring and power module separated layout according to claim 1, feature It is: the GND of the bottom of pcb board (9) includes and HSD connector (1) connects GND floor file and the first USB interface (3) connection The GND floor file of the GND floor file and DC-DC module (7) connection of floor file and secondary USB interface (4) connection, HSD connector (1), The GND floor file of first USB interface (3) and secondary USB interface (4) connection is by being placed on around USB difference shield wiring (8) The via hole (81) of setting is connected with the GND floor file of top layer, the GND floor file of DC-DC module (7) connection and the shielding case with top layer (10) it connects.
6. the hub of a kind of USB difference shield wiring and power module separated layout according to claim 1, feature Be: the shielding earth of two groups of data lines of up going port of HUB chip (2) is connected with the ground wire of HSD connector (1) shielding shell, The shielding earth and the first USB interface (3), secondary USB interface (4) of two groups of data lines of down going port of HUB chip (2) shield shell Ground wire connection.
7. the hub of a kind of USB difference shield wiring and power module separated layout according to claim 1, feature Be: the GND ground wire of DC-DC module (7) circuit is connected by the GND ground wire of single-point grounding mode and data communications portion circuit It connects.
8. the hub of a kind of USB difference shield wiring and power module separated layout according to claim 1, feature It is: is provided with shielding case, the top layer for the pcb board (9) that shielding case is welded by SMT patch mode on the outside of DC-DC module (7).
9. the hub of a kind of USB difference shield wiring and power module separated layout according to claim 1, feature Be: pcb board (9) is four laminates, and pcb board (9) is divided into top layer, intermediate two layers and bottom.
CN201920535802.0U 2019-04-19 2019-04-19 A kind of hub of USB difference shield wiring and power module separated layout Active CN209447168U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920535802.0U CN209447168U (en) 2019-04-19 2019-04-19 A kind of hub of USB difference shield wiring and power module separated layout

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920535802.0U CN209447168U (en) 2019-04-19 2019-04-19 A kind of hub of USB difference shield wiring and power module separated layout

Publications (1)

Publication Number Publication Date
CN209447168U true CN209447168U (en) 2019-09-27

Family

ID=68034570

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920535802.0U Active CN209447168U (en) 2019-04-19 2019-04-19 A kind of hub of USB difference shield wiring and power module separated layout

Country Status (1)

Country Link
CN (1) CN209447168U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109858199A (en) * 2019-04-19 2019-06-07 上海奉天电子股份有限公司 A kind of hub of USB difference shield wiring and power module separated layout

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109858199A (en) * 2019-04-19 2019-06-07 上海奉天电子股份有限公司 A kind of hub of USB difference shield wiring and power module separated layout
CN109858199B (en) * 2019-04-19 2024-06-07 上海奉天电子股份有限公司 Hub with USB differential shielding wiring and power supply module independently laid out

Similar Documents

Publication Publication Date Title
CN109858199A (en) A kind of hub of USB difference shield wiring and power module separated layout
TWI710183B (en) Circuit board bypass assembly and its components
WO2017123574A1 (en) Routing assembly and system using same
JP2011129534A (en) Completely-integrated-ethernet (r) connector
CN206117648U (en) Novel high integration TR subassembly
CN207410309U (en) A kind of filtering unit
CN206961822U (en) The encapsulating structure and printed circuit board (PCB) of chip
CN209447168U (en) A kind of hub of USB difference shield wiring and power module separated layout
CN205985430U (en) A interconnect equipment and electronic equipment for electronic equipment
CN207265257U (en) PCI E differential signals based on FPC connector extend external member
CN110622402A (en) Network port filter and network equipment
CN108615502A (en) A kind of vehicle-mounted LED display screen with integrated control system
CN210157155U (en) Network port filter and network equipment
CN205693666U (en) A kind of electromagnetic compatibility equipment
CN204578920U (en) A kind of card cage signal access device
CN104105388B (en) A kind of electromagnetic shielding system of measurement ICU
CN208078224U (en) Glass insulation sub-connector and electronic equipment
CN216531954U (en) Integrated subminiature coupler
CN108648859A (en) A kind of Ethernet transmission wire rod and Ethernet Transmission system
WO2021047428A1 (en) Usb signal shielding device and network terminal
CN208188818U (en) The instrument test board of one kind of multiple communication protocols
CN104485981B (en) A kind of 1394 repeaters
CN105047632B (en) One kind miniaturization high-isolation ceramic packaging structure
CN207354425U (en) A kind of multi output end Homeplug
CN106533403A (en) High-performance isolation, distribution and amplification equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant