CN209429287U - A kind of heating wall - Google Patents

Abstract

The utility model proposes a kind of heating wall, the layer structure of the heating wall successively includes: wallboard, insulating layer, surface reforming layer, heat supply layer, oxygen barrier protective layer, heat-conducting layer, CT catalyst layer and decorative layer from inside to outside；Wherein, the heat supply layer includes the heating element that multiple low-melting-point metals by room temperature liquid are formed.Heating wall in the utility model embodiment is by the way that heating structure to be incorporated in wall, save a large amount of traditional space occupied, on the other hand, due to forming heating element using liquid metal, for traditional rigid heating wire, the design difficulty of wall internal structure is substantially reduced, the reduction of thickness of wall body is conducive to；Further more, the heat supply efficiency of unit area is higher compared to for traditional circulation of fluid heating system, and can satisfy it is instant open, that is, close and stop.

Description

A kind of heating wall

Technical field

The utility model belongs to wall protection construction applications more particularly to a kind of heating wall.

Background technique

In daily life, heating is common such as radiator, floor heating mainly using the structure of circulating line formula Deng, first radiator, floor heating is this will have a direct impact on indoor available space；Secondly, for the resident of collective's heating, It will receive the limitation that area heating arranges, can not voluntarily regulate and control；For the resident of self-heating, although can voluntarily heat, But its heating efficiency is low, combustion gas is at high cost.

Utility model content

In view of this, a purpose of the utility model is to propose a kind of heating wall, to solve to heat in the prior art The problem that facility is big for space requirement, heat supply efficiency is low, at high cost.

In some illustrative embodiments, the layer structure of the heating wall, the heating wall is successively wrapped from inside to outside It includes: wallboard, insulating layer, surface reforming layer, heat supply layer, oxygen barrier protective layer, heat-conducting layer, CT catalyst layer and decorative layer；Wherein, described Heat supply layer includes the heating element that multiple low-melting-point metals by room temperature liquid are formed.

In some optionally embodiments, the oxygen barrier protective layer position opposite with the both ends of each heating element Place offers first through hole, and is blocked by pellet electrode, the electrode as heating element.

In some optionally embodiments, the heat-conducting layer is opened at the position opposite with the electrode of each heating element Equipped with the second through-hole, the CT catalyst layer offers third through-hole at the position opposite with the electrode of each heating element； It is provided with power circuit in the decorative layer, the power circuit includes power module and is directed to each heating element Power supply cabling, the power supply cabling is embedded in the decorative layer；The power supply cabling extends to institute from the power module The position for stating the second through-hole and third through-hole is connected the power supply cabling being located in the decorative layer and is located at by conductive plug-in connecting component Pellet electrode on the oxygen barrier protective layer.

In some optionally embodiments, each heating element is in circuitous configuration, is distributed in the heating wall At different location.

In some optionally embodiments, the insulating layer uses cystosepiment, rock wool board or highly foaming polyethylene plate.

In some optionally embodiments, the surface reforming layer uses dimethyl silicone polymer, polyurethane, polyacrylic acid Or epoxy resin；The surface reforming layer with a thickness of 5-160 μm.

In some optionally embodiments, the oxygen barrier protective layer uses polyvinyl dichloride, polyvinyl alcohol or ethylene-acetate Ethylene copolymer；The thickness of the oxygen barrier protective layer is 0-100 μm.

In some optionally embodiments, low conducting metal particles are evenly equipped in the low-melting-point metal.

In some optionally embodiments, the heat-conducting layer uses ceramic plate；It is evenly equipped on the ceramic plate Several stomatas, for being connected to oxygen barrier protective layer and CT catalyst layer.

In some optionally embodiments, the CT catalyst layer is the nonwoven layer that surface is coated with CT catalyst material.

Compared with prior art, the utility model has the advantage that

1. heating structure is incorporated in wall in the utility model, a large amount of space occupied is saved；

2. heating element is formed using liquid metal, for traditional rigid heating wire, for wall internal structure Design difficulty substantially reduce, be conducive to the reduction of thickness of wall body；

3. the heat supply efficiency of unit area is higher, and can satisfy compared to for traditional circulation of fluid heating system It is instant to open.

Detailed description of the invention

Fig. 1 is the side block diagram of the heating wall in the utility model embodiment；

Fig. 2 is the overlooking structure figure of the heating wall in the utility model embodiment.

Specific embodiment

The following description and drawings fully show the specific embodiment of the utility model, so that those skilled in the art Them can be practiced.Other embodiments may include structure, logic, it is electrical, process and other change.It is real It applies example and only represents possible variation.Unless explicitly requested, otherwise individual components and functionality is sequence that is optional, and operating It can change.The part of some embodiments and feature can be included in or replace part and the feature of other embodiments. The range of the embodiments of the present invention includes that the entire scope of claims and all of claims can get Equivalent.Herein, these embodiments of the utility model individually or generally can be used term " utility model " It indicates, this is not meant to automatically to limit just for the sake of convenient, and if in fact disclosing the utility model more than one The range for making the application is that any single utility model or utility model are conceived.

Referring now to fig. 1, Fig. 1 shows the layer structural relation of one of the utility model embodiment heating wall, should Heat wall, comprising: wallboard 1, insulating layer 2, surface reforming layer 3, heat supply layer 4, the oxygen barrier protective layer set gradually from inside to outside 5, heat-conducting layer 6, CT catalyst layer 7 and decorative layer 8；Wherein, the heat supply layer 4 includes multiple low-melting-point metal shapes by room temperature liquid At heating element 41.

Traditional wall body building material, such as cement, timber can be used in wallboard 1, the main support knot as heating wall Structure, thickness select according to actual support strength, and wallboard 1 can be single layer structure, it is possible to have The multilayered structure of several functional layers, functional layer may include sound insulation, warming, framework of steel reinforcement etc..

Insulating layer 2 can be formed using one of cystosepiment, rock wool board or highly foaming polyethylene plate material, for obstructing Temperature inside and outside heating wall；Preferably, insulating layer 2 selects highly foaming polyethylene plate, for cystosepiment, rock wool board, Self-strength is higher, heating wall can be made more stable as layer structure.The thickness range of insulating layer 2 between 1cm-2cm, with The mode that bonding fitting can be used in connection between wallboard 1 is stable in the presence of the surface of wallboard 1.

The effect of surface reforming layer 3 is to improve insulating layer 2 for the adhesive force of the low-melting-point metal of room temperature liquid, and The air contact low-melting-point metal outside isolation wallboard 1 is played, the problem of oxidation deterioration occurs for low-melting-point metal is avoided.Surface One of dimethyl silicone polymer, polyurethane, polyacrylic acid or epoxy resin, thickness range 5- can be selected in modified layer 3 160μm；Preferably, surface reforming layer 3 selects polyurethane as forming material, with a thickness of 100 μm.Surface reforming layer 3 can lead to The surface that insulating layer 2 is sprayed on using polyurethane as spray liniment is crossed, stabilization is attached on insulating layer 2 after its solidification.

Heat supply layer 4 includes the heating element 41 that multiple low-melting-point metals by room temperature liquid are formed.Heating element 41 is line Shape structure also can be planar structure or other planar structures, it is preferable that heating element 41 uses linear structure, can be with Circuitous configuration (such as lattice-shaped structure, helical structure) ad hoc rules pattern arrangement, to increase the heat radiation of heating element 41 Region.The quantity of heating element 41 be it is multiple, be distributed in each position of heat supply wall.Preferably, the distribution of heating element 41 Position may include: up and down both direction be uniformly distributed, so that heat supply layer 4 is can satisfy top for warm lower section heating, to meet Body-sensing demand of the people for different temperatures dispersal direction.It in other embodiments, also can be according to upper and lower, left and right, middle equipotential It sets and is distributed, to realize the heating regulation of more diversification.

In some embodiments, heating element 41 uses circuitous configuration, so that it is same so that the both ends of heating element 41 is in it Side, in order to the connection of subsequent power supply cabling.

The thickness range of heat supply layer 4 is at 50-300 μm, and wherein heating element 41 can coat low melting point by being repeated several times Metal single layer is formed, and the thickness of the low-melting-point metal single layer coated every time passes through 3-4 low melting point of repetitive coatings in 50um or so Metal single layer, to obtain the heating element 41 of 150-200um, which meets the job requirement of heating element 41 first, separately Any avoids the excessively high problem of cost caused by excessively thick heating element 41.

Optionally, the low-melting-point metal in the utility model embodiment can be mercury simple substance, gallium simple substance, gallium-indium alloy, gallium The fusing points such as tin alloy, gallium-indium-tin alloy are lower than one or more of the low-melting-point metal of room temperature.For example, low-melting-point metal is gallium Indium eutectic alloy (15.9 DEG C of fusing point), gallium tin eutectic alloy (20.4 DEG C of fusing point) or gallium indium tin eutectic alloy (11 DEG C of fusing point). Low-melting-point metal can be formed on surface reforming layer by modes such as printing, printing, sprayings, and low-melting-point metal constitutes electric heating member The pattern of part, herein without limiting.

Preferably, in the low-melting-point metal in the utility model embodiment can by uniformly mixing low conducting metal particles, To promote the heat production performance of heating element 41.Low conducting metal particles can such as nickel powder, chromium powder, it is preferred to use nanometer grade gold Metal particles.

Oxygen barrier protective layer 5 is covered on the heating element 41 of heat supply layer 4, for fettering the shape of low-melting-point metal, is prevented The geometric distortion of low-melting-point metal, and prevent to contact from low-melting-point metal with the air on the inside of wall.The oxygen barrier protective layer Polyvinyl dichloride, polyvinyl alcohol or ethene-vinyl acetate copolymer can be used, the thickness of the oxygen barrier protective layer is 10-100 μ m。

Ceramic plate can be used in heat-conducting layer 6；Several stomatas are evenly equipped on the ceramic plate, for being connected to oxygen barrier guarantor Sheath 5 and CT catalyst layer 7.The thickness range of heat-conducting layer 6 is in 0.5-1cm.Ceramic plate has good heat conduction efficiency, can The inside of wall is quickly transferred to the heat for generating heat supply layer 4.

CT catalyst layer 7, CT particle causes molecular structure itself under the heat radiation of heat supply layer 4 and passes through with contaminant particles thereon Charge is mobile, oxidation and reduction reaction is finally generated, by contaminant particles STRUCTURE DECOMPOSITION, to reduce indoor environmental pollution particle Quantity.The nonwoven layer that surface is coated with CT catalyst material can be used in the CT catalyst layer, with a thickness of 200 μm.

Heating wall in the utility model embodiment saves a large amount of biography by the way that heating structure to be incorporated in wall System space occupied is on the other hand, right for traditional rigid heating wire due to forming heating element using liquid metal It is substantially reduced in the design difficulty of wall internal structure, is conducive to the reduction of thickness of wall body；Further more, comparing traditional circulation of fluid For heating system, the heat supply efficiency of unit area is higher, and can satisfy it is instant open, that is, close i.e. stop.

Referring now to Fig. 2, Fig. 2 shows the bindings that is electrically connected of the heat supply layer of the heating wall in the utility model embodiment Structure, wherein the oxygen barrier protective layer 5 offers first through hole at the position opposite with the both ends of each heating element 41 51, and blocked by pellet electrode 52, the electrode as heating element 41.Preferably, it is applied on the inner wall of first through hole 51 It is covered with a small amount of sealant, pellet electrode 52 is consistent with the shape of first through hole 51, consistency of thickness, but the size of pellet electrode 52 It is more slightly larger than first through hole 51, make the interference relationship for having slight between the two.52 one side of pellet electrode after assembly be located at electricity The low-melting-point metal of the end of thermal element 41 contacts, and another side is then contour with the outside of oxygen barrier protective layer 5 (i.e. the two flushes), makees For the electrode of the external connection of heating element 41.

Preferably, it is opened at the heat-conducting layer 6 and the position opposite with the electrode of each heating element 41 of CT catalyst layer 7 Equipped with the second through-hole 61 and third through-hole 71,51 3 the second through-hole 61, third through-hole 71 and first through hole through-holes are in same Straight line connect pellet electrode 52 can by the second through-hole 61 and third through-hole 71 with external power supply cabling.

In some embodiments, power circuit is provided in the decorative layer 8, the power circuit includes power module 82 And it is directed to the power supply cabling 82 of each heating element 41, the power supply cabling 82 is embedded in the decorative layer 8；Institute The position that power supply cabling 82 extends to second through-hole 61 (third through-hole 71) from the power module 81 is stated, is inserted by conduction The connection of fitting 9 is located at the power supply cabling 82 in the decorative layer 8 and the pellet electrode 52 on the oxygen barrier protective layer 5.

User voluntarily can drive desired zone by grafting conductive plug-in connecting component when carrying out heating work using the heating wall Heating element 41 carry out operating mode, when user needs large format heating, only need to make to own by conductive plug-in connecting component Heating element 41 is connected to power module.

In some embodiments, connection status, power circuit can also be connected with control circuit always at conductive plug-in connecting component, control Electrical consumer processed controls the working condition of each heating element 41.

Preferably, it is additionally provided in decorative layer 8 temperature-sensing element (such as temperature sensor), for detecting room temperature, temperature-sensitive Element connects to the control circuit, and user's set temperature is stored in the control circuit, when temperature-sensing element detects that room temperature is lower than When user's set temperature, control circuit drives heating element 41 to be started to work, when temperature-sensing element detects that room temperature is set higher than user When determining temperature, control circuit drives heating element 41 to stop working or the heating work of stop section heating element 41.

It should also be appreciated by one skilled in the art that various illustrative logical boxs, mould in conjunction with the embodiments herein description Electronic hardware, computer software or combinations thereof may be implemented into block, circuit and algorithm steps.In order to clearly demonstrate hardware and Interchangeability between software surrounds its function to various illustrative components, frame, module, circuit and step above and carries out It is generally described.Hardware is implemented as this function and is also implemented as software, depends on specific application and to entire The design constraint that system is applied.Those skilled in the art can be directed to each specific application, be realized in a manner of flexible Described function, still, this realization decision should not be construed as a departure from the scope of protection of this disclosure.

Claims (10)

1. a kind of heating wall, which is characterized in that the layer structure of the heating wall successively includes: wallboard, heat preservation from inside to outside Layer, surface reforming layer, heat supply layer, oxygen barrier protective layer, heat-conducting layer, CT catalyst layer and decorative layer；Wherein, the heat supply layer includes more The heating element that a low-melting-point metal by room temperature liquid is formed.

2. heating wall according to claim 1, which is characterized in that the oxygen barrier protective layer and each heating element The opposite position in both ends at offer first through hole, and blocked by pellet electrode, the electrode as heating element.

3. heating wall according to claim 2, which is characterized in that the electricity of the heat-conducting layer and each heating element The second through-hole is offered at extremely opposite position, at the CT catalyst layer position opposite with the electrode of each heating element Offer third through-hole；

It is provided with power circuit in the decorative layer, the power circuit includes power module and is directed to each electric heating The power supply cabling of element, the power supply cabling are embedded in the decorative layer；

The power supply cabling extends to the position of second through-hole and third through-hole from the power module, passes through conductive grafting Part connection is located at the power supply cabling in the decorative layer and the pellet electrode on the oxygen barrier protective layer.

4. heating wall according to claim 1, which is characterized in that each heating element is in circuitous configuration, distribution At the different location of the heating wall.

5. heating wall according to claim 1, which is characterized in that the insulating layer uses cystosepiment, rock wool board or height Polyethylene foamed plate.

6. heating wall according to claim 1, which is characterized in that the surface reforming layer uses polydimethylsiloxanes Alkane, polyurethane, polyacrylic acid or epoxy resin；The surface reforming layer with a thickness of 5-160 μm.

7. heating wall according to claim 1, which is characterized in that the oxygen barrier protective layer uses polyvinyl dichloride, gathers Vinyl alcohol or ethene-vinyl acetate copolymer；The thickness of the oxygen barrier protective layer is 0-100 μm.

8. heating wall according to claim 1, which is characterized in that be evenly equipped with low conductive metal in the low-melting-point metal Particle.

9. heating wall according to claim 1, which is characterized in that the heat-conducting layer uses ceramic plate；The pottery Several stomatas are evenly equipped on porcelain heat-conducting plate, for being connected to oxygen barrier protective layer and CT catalyst layer.

10. heating wall according to claim 1, which is characterized in that the CT catalyst layer is that surface is coated with CT catalyst The nonwoven layer of material.