CN209395063U - A kind of cutting liquid magnetic absorption diamond wire saw cutting device - Google Patents

A kind of cutting liquid magnetic absorption diamond wire saw cutting device Download PDF

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Publication number
CN209395063U
CN209395063U CN201822060008.3U CN201822060008U CN209395063U CN 209395063 U CN209395063 U CN 209395063U CN 201822060008 U CN201822060008 U CN 201822060008U CN 209395063 U CN209395063 U CN 209395063U
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cutting
diamond wire
nozzle
liquid
magnetic
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CN201822060008.3U
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Chinese (zh)
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张威
裘腾威
仵健磊
金涨军
熊瑞斌
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Ningbo Polytechnic
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Ningbo Polytechnic
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Abstract

The utility model belongs to diamond fretsaw cutting technique field, more particularly to a kind of cutting liquid magnetic absorption diamond wire saw cutting device, including diamond wire, idler wheel, directive wheel and nozzle, diamond wire is arranged to closed hoop on the outside of roller and directive wheel and one direction rotates, there are two directive wheel settings, diamond wire side between two directive wheels is provided with workpiece to be cut and the other side is provided with permanent magnet, workpiece is provided with nozzle in the side cut by diamond wire, and nozzle sprays nano-magnetic cutting liquid.The utility model under the action of high-speed flow from nozzle at spray misty nano-magnetic cutting liquid, finally cutting drop is sprayed onto saw silk table face, reduce the usage amount of cutting liquid, in cutting region, there are more cutting liquids to contact to form lubricant layer with diamond wire and workpiece simultaneously, cutting region is reduced due to the cutting temperature of cutting force and friction generation, be conducive to improve chipping qualities and saws silk service life.

Description

A kind of cutting liquid magnetic absorption diamond wire saw cutting device
Technical field
The utility model belongs to diamond fretsaw cutting technique field, and in particular to a kind of cutting liquid magnetic absorption diamond Saw blade cutting device.
Background technique
Diamond wire saw cut is the mainstream cutting technique of current silicon wafer industry.In diamond fretsaw cutting process, pass through The diamond abrasive grain being fixed on saw silk is directly contacted with workpiece to be achieved the purpose that remove material, belongs to two-body cutting system.Phase Than in free abrasive wire saw cutting technique, diamond wire saw cut has cutting efficiency high, and precision is high, cutting sawdust is easy to back It receives, the advantages such as carrying capacity of environment is low.But when diamond wire saw cut, since joint-cutting is narrow, cutting liquid cannot be effectively entered and be cut Region is cut, cutting heat cannot be eliminated in time, and the broken string of diamond abrasive grain to fall off and saw silk can be caused after being absorbed by saw silk, is fallen off Diamond abrasive grain again be extruded in cutting process, be embedded in silicon chip surface, cause deeper pit, the surface of silicon wafer and Ya Biao The damage of face quality is even more serious.
It is the shortcomings that cutting zone cannot be efficiently entering for cutting liquid in diamond wire saw cut, main by increasing cutting The supply of liquid improves.This is the method generallyd use in current enterprise, but cutting region is brought on diamond wire surface into Cutting liquid it is limited, be difficult to play good lubrication effect.While the serious waste of cutting liquid is caused, at later period waste material Manage increased costs.
Utility model content
The purpose of this utility model is the presence of the above problem in view of the prior art, propose one kind be effectively reduced friction, Cooling velocity is fast, is conducive to the cutting liquid magnetic absorption diamond wire saw cut for improving chipping qualities, extending saw silk service life Device.
The purpose of this utility model can be realized by the following technical scheme: a kind of cutting liquid magnetic absorption diamond fretsaw Cutter device, including diamond wire, idler wheel, directive wheel and nozzle, the diamond wire is along the outside of roller and directive wheel It is arranged to closed hoop and one direction rotates, there are two the directive wheel settings, the diamond wire one between two directive wheels Side is provided with workpiece to be cut and the other side is provided with permanent magnet, and workpiece is arranged in the side cut by diamond wire There is nozzle, the nozzle sprays nano-magnetic cutting liquid.
In a kind of above-mentioned cutting liquid magnetic absorption diamond wire saw cutting device, the nozzle be connected with liquid reserve tank and Air compressor machine, the liquid reserve tank are provided with the nano-magnetic cutting liquid of cutting fluid and the mixing of nanometer ferric oxide particle, the storage Peristaltic pump is provided between liquid case and nozzle.
In a kind of above-mentioned cutting liquid magnetic absorption diamond wire saw cutting device, between the air compressor machine and nozzle according to It is secondary to be provided with regulating valve, flowmeter, pressure gauge, filter and frequency generator.
In a kind of above-mentioned cutting liquid magnetic absorption diamond wire saw cutting device, the frequency generator other end is set It sets and is connected to peristaltic pump.
In a kind of above-mentioned cutting liquid magnetic absorption diamond wire saw cutting device, the idler wheel and each directive wheel it Between be each provided with a nervous wheel.
The utility model under the action of high-speed flow from nozzle at spray misty nano-magnetic cutting liquid, last cutting liquid Drop is sprayed onto saw silk table face, reduces the usage amount of cutting liquid.In cutting region, there are more cutting liquids simultaneously and diamond saw Silk and workpiece contact to form lubricant layer, and as the movement of saw silk realizes lubrication effect to machining area, to improve Saw blade cutting performance, reduce cutting region due to cutting force and friction generate cutting temperature, be conducive to improve chipping qualities and Saw silk service life.
Detailed description of the invention
Fig. 1 is a kind of cutting liquid magnetic absorption diamond wire saw cutting device structural schematic diagram of the utility model.
In figure, diamond wire 1, idler wheel 2, directive wheel 3, nozzle 4, permanent magnet 5, liquid reserve tank 6, air compressor machine 7, peristaltic pump 8, Regulating valve 9, flowmeter 10, pressure gauge 11, filter 12, frequency generator 13, anxiety wheel 14.
Specific embodiment
It is specific embodiment of the utility model and in conjunction with attached drawing below, the technical solution of the utility model is made further Description, but the utility model is not limited to these examples.
As shown in Figure 1, a kind of cutting liquid magnetic absorption diamond wire saw cutting device, including diamond wire 1, idler wheel 2, Directive wheel 3 and nozzle 4, diamond wire 1 is arranged to closed hoop along the outside of roller and directive wheel 3 and one direction rotates, and leads To there are two the settings of wheel 3,1 side of diamond wire between two directive wheels 3 is provided with workpiece to be cut and the other side is set It is equipped with permanent magnet 5, workpiece is provided with nozzle 4 in the side cut by diamond wire 1, and nozzle 4 sprays nano-magnetic and cuts Cut liquid.
Diamond wire 1 carries out one direction rotation, 1 quilt of diamond wire between directive wheel 3 outside roller and directive wheel 3 It is straightened and is in line, workpiece is cut in the diamond saw wires between two directive wheels 3, and the nano-magnetic that nozzle 4 sprays is cut Cutting liquid can be mobile to 1 side of diamond wire in the case where the magnetic force of permanent magnet 5 attracts, and diamond wire is using the foreign-plated fixed gold of bus Hard rock particle is made, and can be magnetized in magnetic field, so that nano-magnetic cutting fluid can be attached on diamond wire 1, is cutting Nano-magnetic cutting liquid enters cutting region with diamond wire 1 during workpiece, reaches lubrication effect.
Preferably, nozzle 4 is connected with liquid reserve tank 6 and air compressor machine 7, and liquid reserve tank 6 is provided with cutting fluid and the oxidation of nanometer three two The nano-magnetic cutting liquid of iron particle mixing, is provided with peristaltic pump 8 between liquid reserve tank 6 and nozzle 4.Nozzle 4 is in liquid reserve tank 6 and sky Cutting liquid is atomized under the action of press 7 and is sprayed, since di-iron trioxide can be attracted by magnet, the oxidation of nanoscale three two Iron particle is uniformly mixed with cutting fluid, in nanometer ferric oxide particle during being attracted by magnet, can be taken cutting fluid Band is attached in diamond saw wires when touching diamond saw wires, and cutting region is carried into cutting process.
Preferably, regulating valve 9, flowmeter 10, pressure gauge 11, filter 12 are disposed between air compressor machine 7 and nozzle 4 With frequency generator 13.Air compressor machine 7 pumps air into its air accumulator, the air in air accumulator by regulating valve 9 decompression after, then By gas flowmeter 10 and pressure gauge 11, regulating valve 9 can be adjusted according to the registration of flowmeter 10 and pressure gauge 11, to obtain The flow needed or air pressure, air is by entering back into nozzle 4 after the drying of filter 12.
It is further preferred that the setting of 13 other end of frequency generator is connected to peristaltic pump 8.Peristaltic pump 8 is for controlling gas supply Frequency.
Preferably, a nervous wheel 14 is each provided between idler wheel 2 and each directive wheel 3.Anxiety wheel 14 is used for Buddha's warrior attendant Stone saw silk 1 is tensioned, and guarantees that there is the diamond wire 1 in cutting part enough dynamics to be cut.
Magnetic nano-particle is added in cutting liquid, and cutting region is entered under the action of externally-applied magnetic field, increases entrance The cutting liquid of cutting region reduces cutting region due to cutting force and friction to effectively improve the lubricating action of cutting region The cutting temperature of generation is conducive to improve chipping qualities and saws silk service life.
Permanent magnet 5 is arranged in diamond wire 1 and workpiece side, space magnetic field is formed in machining area, by cutting fluid, dispersion Agent, surfactant and nanometer-sized Fe2O3 particle form nano-magnetic cutting liquid.Nano-magnetic cutting liquid flows first at nozzle 4, Then it is carried over nozzle 4 under the action of high-speed flow, while forming milli, micron order aerosol in 4 exit of nozzle, finally cuts Drop is sprayed onto saw silk table face.Due to having magnetic nano-particle in cutting drop, the cutting drop flowed out from nozzle 4 can be by The magnetic field force effect in saw silk table face is directed toward to direction;Due to placed externally-applied magnetic field in 1 side of diamond wire, in cutting liquid After magnetic nanoparticle is acted on by magnetic field force, more cutting liquids are moved to saw silk direction, and final uniform adsorption is in saw silk table Face simultaneously brings cutting region into, to increase into the cutting liquid in cutting region, makes more cutting liquids and saw silk and workpiece Contact, plays the role of preferable lubrication, significantly improves cutting processing condition;Effect of the magnetic nanoparticle in magnetic field force Under, it is adsorbed in saw silk table face, and enter cutting region with saw silk, cutting fluid, realizes cutting for cutting region workpiece material Cut grinding and polishing removal.To further increase work piece cut surface quality and cutting efficiency, increase saw silk service life.
Since nanoparticle is easy to reunite, so the dispersing agent DP518 and table of certain mass score are added in cutting liquid Face activating agent LT-601, the addition of dispersing agent DP518 make nanoparticle be dispersed in cutting liquid under the action of ultrasonic vibration In.Wherein, cutting fluid, the mass parts ratio of nanoparticle and dispersing agent DP518: cutting fluid is 60-80 parts, nanoparticle 5- 20 parts, dispersing agent DP518 is 1-5 parts, and surfactant LT-601 is 1-5 parts.
The beneficial effects of the utility model are mainly manifested in: nano-magnetic cutting liquid is carried under the action of high-speed flow Nozzle 4, while milli, micron order aerosol are formed in 4 exit of nozzle, it finally cuts drop and is sprayed onto saw silk table face, reduce and cut Cut the usage amount of liquid;The addition of dispersing agent and surfactant makes nano particle be easy to be acted on by magnetic field force, and saw silk is actively inhaled Attached more cutting liquids enter cutting region;In cutting region, there are more cutting liquids to connect simultaneously with diamond wire 1 and workpiece Touching forms lubricant layer, and as the movement of saw silk realizes lubrication effect to machining area, to improve saw blade cutting Energy;Magnetic nanoparticle in cutting fluid under the action of a magnetic force, along saw silk apparent motion, is adsorbed in saw silk table face, and Enter cutting region with saw silk, cutting fluid, realizes that the cutting and grinding of cutting region workpiece material polishes removal, thus into one Step improves work piece cut surface quality and cutting efficiency, increases saw silk service life;Cutting liquid utilization rate is improved, processing ring is improved Border quality significantly improves cutting processing condition, advantageously reduces cutting cost.
The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute Belonging to those skilled in the art can make various modifications or additions to the described embodiments or using similar Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.

Claims (5)

1. a kind of cutting liquid magnetic absorption diamond wire saw cutting device, which is characterized in that including diamond wire, idler wheel, lead To wheel and nozzle, the diamond wire is arranged to closed hoop on the outside of roller and directive wheel and one direction rotates, described There are two directive wheel settings, and the diamond wire side between two directive wheels is provided with workpiece to be cut and the other side is arranged There is permanent magnet, workpiece is provided with nozzle in the side cut by diamond wire, and the nozzle sprays nano-magnetic cutting Liquid.
2. a kind of cutting liquid magnetic absorption diamond wire saw cutting device according to claim 1, which is characterized in that described Nozzle is connected with liquid reserve tank and air compressor machine, and the liquid reserve tank is provided with the nanometer of cutting fluid and the mixing of nanometer ferric oxide particle Magnetic cutting liquid is provided with peristaltic pump between the liquid reserve tank and nozzle.
3. a kind of cutting liquid magnetic absorption diamond wire saw cutting device according to claim 2, which is characterized in that described Regulating valve, flowmeter, pressure gauge, filter and frequency generator are disposed between air compressor machine and nozzle.
4. a kind of cutting liquid magnetic absorption diamond wire saw cutting device according to claim 3, which is characterized in that described The setting of the frequency generator other end is connected to peristaltic pump.
5. a kind of cutting liquid magnetic absorption diamond wire saw cutting device according to claim 1, which is characterized in that described A nervous wheel is each provided between idler wheel and each directive wheel.
CN201822060008.3U 2018-12-10 2018-12-10 A kind of cutting liquid magnetic absorption diamond wire saw cutting device Active CN209395063U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822060008.3U CN209395063U (en) 2018-12-10 2018-12-10 A kind of cutting liquid magnetic absorption diamond wire saw cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822060008.3U CN209395063U (en) 2018-12-10 2018-12-10 A kind of cutting liquid magnetic absorption diamond wire saw cutting device

Publications (1)

Publication Number Publication Date
CN209395063U true CN209395063U (en) 2019-09-17

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Application Number Title Priority Date Filing Date
CN201822060008.3U Active CN209395063U (en) 2018-12-10 2018-12-10 A kind of cutting liquid magnetic absorption diamond wire saw cutting device

Country Status (1)

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CN (1) CN209395063U (en)

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